A3P600-1FGG256I - ProASIC3 FPGA, 600K Gates | Microchip
N.º da peça: A3P600-1FGG256I ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $25.43 | $25,43 |
| 10 | $23.12 | $231,20 |
| 100 | $20.81 | $2.081,00 |
| 500 | $18.5 | $9.250,00 |
| 1.000 | $16.19 | $16.190,00 |
A3P600-1FGG256I Visão geral
A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement custom digital logic. Unlike microcontrollers, FPGAs provide massive parallel processing capabilities and are reprogrammable, making them ideal for prototyping and low-to-mid volume production. The ProASIC3 family is a flash-based FPGA, meaning it retains its configuration even without power, offering instant-on capability and enhanced security compared to SRAM-based FPGAs.
Key features of the A3P600-1FGG256I include 600K system gates, 177 user I/Os, 110,592 bits of RAM, and support for up to 272 MHz system performance. It also offers low power consumption, a single-chip solution, and a small footprint package. The device is reprogrammable, allowing design updates in the field, and includes advanced security features to protect intellectual property.
Technically, the A3P600-1FGG256I is built on Microchip's ProASIC3 flash architecture, which combines the benefits of non-volatile configuration with high performance. The 130nm process technology enables low dynamic power and high logic density. The device supports various I/O standards, including LVCMOS, LVTTL, and differential standards, making it versatile for different interface requirements.
Typical applications include industrial control, automotive electronics, communications infrastructure, and consumer electronics. Its reprogrammability and security features make it suitable for applications requiring field updates and IP protection. The 256-ball FBGA package is compact, enabling space-constrained designs.
When designing with this FPGA, consider the 1.5V core supply and the need for proper decoupling capacitors near the power pins. The device also requires configuration via JTAG or SPI, and the flash-based nature eliminates the need for external configuration memory.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing a comprehensive resource for engineers evaluating the A3P600-1FGG256I.
Alternativas drop-in para A3P600-1FGG256I — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com A3P600-1FGG256I (mesmo formato e footprint) — diferindo em Package, Operating Temperature, System Gates, Configuration Technology, Total RAM Bits.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
A3P600-FGG256I
✅ Drop-In✓ Em estoque
$96.23 / unidade
Ver ficha técnica →A3P600-2FGG256I
✅ Drop-In✓ Em estoque
$49.8 / unidade
Ver ficha técnica →A3P600L-1FGG256I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
A3P600-FG256I
✅ Drop-In✓ Em estoque
$23.1 / unidade
Ver ficha técnica →A3P600-1FG256I
✅ Drop-In✓ Em estoque
$41.8 / unidade
Ver ficha técnica →A3P600-1FGG256I Classificações máximas e características elétricas
| Family | ProASIC3 |
| Number of Logic Elements/Cells | 7KLEs |
| Total RAM Bits | 110592 |
| Number of I/O | 177 |
| Number of Gates | 600K |
| Voltage - Supply | 1.425V ~ 1.575V |
| Tipo de montagem | Surface Mount |
| Encapsulamento / Caixa | 256-LBGA |
| Supplier Device Package | 256-FBGA |
| Temperatura de operação | -40°C ~ 100°C (TJ) |
| Maximum Operating Frequency | 272 MHz |
| Technology | 130nm |
| Core Supply Voltage | 1.5V |
| Embedded Memory | 110592 bits |
| Status RoHS | Compliant |
Configuração de pinos do A3P600-1FGG256I
| Pino 1 | IO — User I/O |
| Pino 2 | IO — User I/O |
| Pino 3 | IO — User I/O |
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| Pino 176 | IO — User I/O |
| Pino 177 | IO — User I/O |
| Pino 178 | VCC — Core supply voltage |
| Pino 179 | GND — Ground |
| Pino 180 | VCC — Core supply voltage |
| Pino 181 | GND — Ground |
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| Pino 224 | VCC — Core supply voltage |
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| Pino 230 | VCC — Core supply voltage |
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| Pino 234 | VCC — Core supply voltage |
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| Pino 238 | VCC — Core supply voltage |
| Pino 239 | GND — Ground |
| Pino 240 | VCC — Core supply voltage |
| Pino 241 | GND — Ground |
| Pino 242 | VCC — Core supply voltage |
| Pino 243 | GND — Ground |
| Pino 244 | VCC — Core supply voltage |
| Pino 245 | GND — Ground |
| Pino 246 | VCC — Core supply voltage |
| Pino 247 | GND — Ground |
| Pino 248 | VCC — Core supply voltage |
| Pino 249 | GND — Ground |
| Pino 250 | VCC — Core supply voltage |
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| Pino 252 | VCC — Core supply voltage |
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| Pino 254 | VCC — Core supply voltage |
| Pino 255 | GND — Ground |
| Pino 256 | VCC — Core supply voltage |
Aplicações típicas
A3P600-1FGG256I é adequado para 6 aplicaçãos: Industrial Control, Automotive Electronics, Communications Infrastructure, Consumer Electronics, Medical Devices, Aerospace and Defense.
Industrial Control
The A3P600-1FGG256I is ideal for industrial control systems due to its reprogrammability, security features, and wide operating temperature range. Its 600K gates provide ample logic for motor control, PLCs, and robotics. The flash-based architecture ensures instant-on operation and immunity to configuration loss, critical in industrial environments. With 177 I/Os, it can interface with multiple sensors and actuators. The device's low power consumption reduces heat dissipation in sealed enclosures. According to Microchip, ProASIC3 FPGAs are used in industrial applications for their reliability and long-term availability.
Recomendado
Automotive Electronics
In automotive electronics, the A3P600-1FGG256I is used for in-vehicle networking, driver assistance, and infotainment systems. Its 272 MHz performance handles real-time processing, while the 600K gates accommodate complex logic. The device's security features protect against unauthorized reprogramming, crucial for automotive safety. The 256-FBGA package is suitable for space-constrained ECU designs. Operating from -40°C to 100°C, it meets automotive temperature requirements. Microchip's ProASIC3 family is known for high reliability, making it suitable for long-life automotive applications.
Recomendado
Communications Infrastructure
The A3P600-1FGG256I is well-suited for communications infrastructure such as base stations, routers, and switches. Its high I/O count (177) and 272 MHz performance enable efficient data packet processing and protocol handling. The flash-based configuration allows field upgrades without external memory. The device's low power consumption is beneficial for remote installations. With 110,592 bits of RAM, it can buffer data streams. According to Microchip, ProASIC3 FPGAs are used in networking equipment for their reliability and security.
Recomendado
Consumer Electronics
In consumer electronics, the A3P600-1FGG256I is used in smart home devices, wearables, and multimedia systems. Its reprogrammability allows firmware updates for feature enhancements. The 600K gates provide sufficient logic for user interfaces and signal processing. The small 256-FBGA package is ideal for compact designs. The device's security features protect against IP theft. With 177 I/Os, it can interface with displays, sensors, and audio codecs. The low power consumption extends battery life in portable devices.
Recomendado
Medical Devices
The A3P600-1FGG256I is used in medical devices such as patient monitors, imaging systems, and diagnostic equipment. Its high reliability and long-term availability are critical for medical applications. The flash-based architecture ensures secure configuration, protecting patient data. The device's 272 MHz performance supports real-time signal processing. With 177 I/Os, it can interface with various sensors and ADCs. The wide operating temperature range (-40°C to 100°C) is suitable for medical environments. Microchip's ProASIC3 family is trusted in medical electronics for its robustness.
Recomendado
Aerospace and Defense
In aerospace and defense, the A3P600-1FGG256I is used in avionics, radar, and secure communication systems. Its security features prevent reverse engineering and unauthorized modifications. The flash-based FPGA provides instant-on operation, essential for mission-critical systems. The device's 272 MHz performance and 600K gates enable complex signal processing. The 256-FBGA package is suitable for rugged environments. Operating from -40°C to 100°C, it meets military temperature requirements. Microchip's ProASIC3 family is known for high reliability in harsh conditions.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para A3P600-1FGG256I — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | A3P600-FGG256I | A3P600-2FGG256I | A3P600L-1FGG256I | A3P600-FG256I | A3P600-1FG256I |
|---|---|---|---|---|---|---|
| Package | 256-FBGA | 256-FBGA | 256-FBGA | 256-FBGA | 256-FBGA | 256-FBGA |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Speed Grade | -1 | Standard | -2 | -1 | Standard | -1 |
| Maximum Frequency | 272 MHz | 250 MHz | 310 MHz | 272 MHz | 250 MHz | 272 MHz |
| Low Power | No | No | No | Yes | No | No |
| Lead-Free Finish | Yes | Yes | Yes | Yes | No | No |
| Number of I/O | 177 | 177 | 177 | 177 | 177 | 177 |
| RAM Bits | 110592 | 110592 | 110592 | 110592 | 110592 | 110592 |
Principais diferenciais
- Higher speed grade than A3P600-FGG256I (vs A3P600-FGG256I)
- Lead-free finish vs A3P600-FG256I (vs A3P600-FG256I)
- Standard power vs A3P600L-1FGG256I (vs A3P600L-1FGG256I)
Notas de projeto
The A3P600-1FGG256I requires a 1.5V core supply. Use a low-dropout regulator (LDO) or a DC-DC converter to provide a clean 1.5V rail. Decouple each VCC pin with a 0.1uF ceramic capacitor placed as close to the pin as possible. Additionally, use a 10uF bulk capacitor on the board to handle transient currents. According to Microchip's ProASIC3 power management guidelines, proper decoupling is essential to prevent voltage droop during high-speed switching.
The A3P600-1FGG256I in a 256-FBGA package has a thermal resistance (theta_JA) of approximately 20°C/W (estimated from similar packages). At 1.5V and typical dynamic power of 0.5W, the junction temperature rise is about 10°C. Ensure adequate airflow or a thermal pad to the PCB for heat dissipation. For high utilization designs, consider a heatsink or forced cooling. This is an estimate; refer to the datasheet for exact thermal data.
For the 256-FBGA package, use a 4-layer PCB with dedicated power and ground planes. Route high-speed signals with controlled impedance (e.g., 50 ohm for single-ended). Place decoupling capacitors on the bottom side directly under the FPGA. Follow Microchip's layout guidelines for ProASIC3 to minimize signal integrity issues. Ensure all GND pins are connected to the ground plane with low inductance vias.
Informações de conformidade
RoHS compliant per Microchip product page. Lead-free finish indicated by 'FGG' in part number. Other compliance data not specified in provided sources.