M1AFS1500-FGG256I - Fusion FPGA, 1.5M Gates | Microchip
Référence : M1AFS1500-FGG256I ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $378.31 | $378,31 |
| 10 | $356.2 | $3 562,00 |
| 100 | $334.1 | $33 410,00 |
| 500 | $312 | $156 000,00 |
| 1 000 | $289.9 | $289 900,00 |
M1AFS1500-FGG256I Présentation
A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement any digital logic function. FPGAs sit between ASICs (application-specific ICs) and microprocessors in the design hierarchy: they offer the parallelism and determinism of hardware while retaining the reconfigurability of software. The Fusion family adds mixed-signal capability, making it a system-on-chip (SoC) that combines programmable logic, analog front-end, and non-volatile flash memory.
Key features include 1.5M system gates, 119 user I/Os, 276,480 bits of RAM, and an operating voltage of 1.425V to 1.575V. The device operates over the industrial temperature range of -40°C to +100°C (TJ). It is RoHS3 compliant and comes in a tray packaging. The Fusion architecture integrates a 12-bit ADC, analog comparators, and a programmable analog multiplexer, enabling true mixed-signal design in a single device.
Technically, the M1AFS1500 is built on a 130nm flash-based process, providing instant-on, non-volatile, and secure configuration. It includes an embedded ARM Cortex-M1 processor option, comprehensive clock generation with PLLs, and up to 1 Mbit of flash memory. The flash-based architecture eliminates the need for external configuration memory, reducing BOM cost and improving security against reverse engineering.
Typical applications include motor control, industrial automation, smart grid, medical devices, and aerospace systems where mixed-signal processing, reliability, and security are critical. The integrated analog front-end and flash memory make it ideal for sensor conditioning, data acquisition, and closed-loop control.
When designing with this device, ensure adequate decoupling on the 1.5V core supply and follow the recommended power-up sequencing. The flash-based configuration is instant-on, but the analog block requires settling time after power-up.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing a comprehensive resource for engineers evaluating the M1AFS1500-FGG256I.
Alternatives de remplacement direct pour M1AFS1500-FGG256I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec M1AFS1500-FGG256I (même facteur de forme et même empreinte) — différant par System Gates, Technology, RoHS Status, Package, Analog Blocks.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
M1AFS1500-FGG256K
✅ Remplacement direct✓ En stock
$60.2 / unité
Voir la fiche technique →M1AFS1500-2FGG676
✅ Remplacement direct✓ En stock
$297.26 / unité
Voir la fiche technique →M1AFS600-1FG484
✅ Remplacement direct✓ En stock
$172 / unité
Voir la fiche technique →M1AFS250-1FGG256
✅ Remplacement direct✓ En stock
$30.6 / unité
Voir la fiche technique →M7AFS600-2FG256I
✅ Remplacement direct✓ En stock
$75.85 / unité
Voir la fiche technique →M1AFS1500-FGG256I Valeurs maximales et caractéristiques électriques
| Family | Fusion |
| Number of System Gates | 1500000 |
| Total RAM Bits | 276480 |
| Number of User I/Os | 119 |
| Tension d'alimentation | 1.425V ~ 1.575V |
| Température de fonctionnement | -40°C ~ 100°C (TJ) |
| Boîtier / Format | 256-LBGA |
| Supplier Device Package | 256-FPBGA (17x17) |
| Type de montage | Surface Mount |
| Packaging | Tray |
| Statut RoHS | ROHS3 Compliant |
| Manufacturer Lead Time | 16 weeks |
| Product Status | Active |
| Series | Fusion |
Configuration des broches de M1AFS1500-FGG256I
| Broche 1 | IO — User I/O |
| Broche 2 | IO — User I/O |
| Broche 3 | IO — User I/O |
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| Broche 120 | VCC — Core supply 1.5V |
| Broche 121 | GND — Ground |
| Broche 122 | VCC — Core supply 1.5V |
| Broche 123 | GND — Ground |
| Broche 124 | VCC — Core supply 1.5V |
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| Broche 128 | VCC — Core supply 1.5V |
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| Broche 138 | VCC — Core supply 1.5V |
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| Broche 140 | VCC — Core supply 1.5V |
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| Broche 144 | VCC — Core supply 1.5V |
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| Broche 178 | VCC — Core supply 1.5V |
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| Broche 180 | VCC — Core supply 1.5V |
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| Broche 182 | VCC — Core supply 1.5V |
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| Broche 184 | VCC — Core supply 1.5V |
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| Broche 186 | VCC — Core supply 1.5V |
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| Broche 188 | VCC — Core supply 1.5V |
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| Broche 190 | VCC — Core supply 1.5V |
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| Broche 222 | VCC — Core supply 1.5V |
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| Broche 234 | VCC — Core supply 1.5V |
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| Broche 236 | VCC — Core supply 1.5V |
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| Broche 238 | VCC — Core supply 1.5V |
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| Broche 240 | VCC — Core supply 1.5V |
| Broche 241 | GND — Ground |
| Broche 242 | VCC — Core supply 1.5V |
| Broche 243 | GND — Ground |
| Broche 244 | VCC — Core supply 1.5V |
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| Broche 246 | VCC — Core supply 1.5V |
| Broche 247 | GND — Ground |
| Broche 248 | VCC — Core supply 1.5V |
| Broche 249 | GND — Ground |
| Broche 250 | VCC — Core supply 1.5V |
| Broche 251 | GND — Ground |
| Broche 252 | VCC — Core supply 1.5V |
| Broche 253 | GND — Ground |
| Broche 254 | VCC — Core supply 1.5V |
| Broche 255 | GND — Ground |
| Broche 256 | VCC — Core supply 1.5V |
Applications typiques
M1AFS1500-FGG256I convient pour 6 applications: Motor Control, Industrial Automation, Smart Grid, Medical Devices, Aerospace and Defense, Data Acquisition Systems.
Motor Control
The M1AFS1500-FGG256I is ideal for motor control applications due to its integrated 12-bit ADC and analog comparators, which enable direct interfacing with current sensors and encoders. The flash-based FPGA provides deterministic, low-latency PWM generation for precise control of brushless DC (BLDC) and permanent magnet synchronous motors (PMSM). With 1.5M gates, it can implement complex Field-Oriented Control (FOC) algorithms, including Clarke/Park transforms and PI controllers, in hardware. The industrial temperature range (-40°C to +100°C) ensures reliable operation in factory automation and automotive environments. The integrated flash memory allows for secure, instant-on configuration, eliminating the need for external boot memory and reducing system cost.
Recommandé
Industrial Automation
In industrial automation, the M1AFS1500-FGG256I excels as a mixed-signal controller, combining programmable logic with analog front-end for sensor conditioning, data acquisition, and closed-loop control. Its 119 user I/Os can interface with various industrial protocols, while the integrated flash memory provides secure, non-volatile configuration. The device's 1.5M gates are sufficient for implementing soft PLCs, communication interfaces (e.g., EtherCAT, PROFINET), and safety logic. The wide operating temperature range and RoHS3 compliance make it suitable for harsh factory environments. The Fusion architecture's instant-on capability ensures rapid startup, critical for safety-critical applications. This single-chip solution reduces BOM complexity and improves reliability compared to discrete MCU+ADC+FPGA designs.
Recommandé
Smart Grid
The M1AFS1500-FGG256I is well-suited for smart grid applications such as power quality monitoring, protective relays, and smart meters. Its integrated 12-bit ADC and analog comparators enable precise measurement of voltage and current waveforms, while the FPGA fabric processes data in real-time for harmonic analysis and fault detection. The 1.5M gates provide ample resources for implementing communication protocols like IEC 61850 and DNP3. The flash-based architecture ensures secure, tamper-resistant configuration, critical for grid infrastructure. The device's wide temperature range (-40°C to +100°C) supports outdoor deployment. The integrated flash memory allows for over-the-air firmware updates, enhancing system maintainability. This mixed-signal FPGA reduces component count and power consumption compared to discrete solutions.
Recommandé
Medical Devices
In medical devices, the M1AFS1500-FGG256I provides a reliable, secure platform for patient monitoring, diagnostic equipment, and therapeutic devices. The integrated analog front-end with 12-bit ADC enables accurate biosignal acquisition (ECG, EEG, etc.), while the FPGA fabric performs real-time digital filtering and analysis. The 1.5M gates support complex algorithms for arrhythmia detection and image processing. The flash-based architecture offers instant-on, secure configuration, essential for medical safety. The device's industrial temperature range ensures reliable operation in clinical environments. RoHS3 compliance meets medical device regulations. The integrated flash memory allows for secure firmware updates, maintaining device security. This single-chip solution reduces size and power consumption, enabling portable and wearable medical devices.
Recommandé
Aerospace and Defense
The M1AFS1500-FGG256I is designed for aerospace and defense applications requiring high reliability, security, and mixed-signal processing. The flash-based FPGA provides inherent immunity to single-event upsets (SEU) and is resistant to reverse engineering, making it ideal for secure communication and avionics systems. The integrated analog front-end enables sensor conditioning for flight control and navigation. With 1.5M gates, it can implement complex signal processing and encryption algorithms. The device operates over -40°C to +100°C, suitable for harsh aerospace environments. The instant-on, non-volatile configuration eliminates boot time, critical for safety-critical systems. The integrated flash memory provides secure storage for mission data. This device meets stringent military standards for temperature and reliability.
Recommandé
Data Acquisition Systems
The M1AFS1500-FGG256I is an excellent choice for high-performance data acquisition systems (DAQ) due to its integrated 12-bit ADC, analog multiplexer, and programmable logic. The analog front-end can condition multiple sensor inputs, while the FPGA fabric implements digital filtering, triggering, and data buffering. With 1.5M gates, it can support multiple channels and high-speed data processing. The 276,480 bits of RAM provide ample buffering for burst data. The device's 119 I/Os allow interfacing with various ADCs, DACs, and communication interfaces. The flash-based architecture ensures deterministic, low-latency operation, critical for real-time DAQ. The industrial temperature range supports deployment in test and measurement equipment. This single-chip solution reduces system complexity and improves signal integrity by minimizing external components.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour M1AFS1500-FGG256I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | M1AFS1500-FGG256K | M1AFS1500-2FGG676 | M1AFS600-1FG484 | M1AFS250-1FGG256 | M7AFS600-2FG256I |
|---|---|---|---|---|---|---|
| Package | 256-FPBGA (17x17) | 256-FPBGA (17x17) | 676-FBGA | 484-FBGA | 256-FPBGA (17x17) | 256-FBGA |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Number of System Gates | 1500000 | 1500000 | 1500000 | 600000 | 250000 | 600000 |
| Supply Voltage | 1.425V ~ 1.575V | 1.425V ~ 1.575V | 1.425V ~ 1.575V | 1.425V ~ 1.575V | 1.425V ~ 1.575V | 1.425V ~ 1.575V |
| Speed Grade | Standard | Standard | 2 | 1 | 1 | 2 |
Principaux différenciateurs
- Integrated mixed-signal capability (vs A3P600-FGG256I)
- Higher gate density (vs M1AFS600-1FG484)
- Flash-based, instant-on, secure configuration (vs SRAM-based FPGAs)
Notes de conception
The M1AFS1500-FGG256I requires a 1.5V core supply (1.425V to 1.575V). Use a low-dropout regulator (LDO) or a switching regulator with low ripple. Place 100nF and 10uF decoupling capacitors close to each VCC pin. The total core current can be estimated from the design's logic utilization; refer to the Microchip power estimator tool. Ensure the power supply can handle transient currents during configuration and operation.
For the 256-FPBGA package, use a 4-layer or more PCB with dedicated power and ground planes. Route high-speed I/O signals with controlled impedance (e.g., 50 ohm single-ended). Place the FPGA away from noisy components like switching regulators. Use via-in-pad for the BGA's center pins to improve routing and thermal performance. Follow Microchip's layout guidelines for the analog block to minimize noise coupling.
The M1AFS1500-FGG256I's power dissipation depends on logic utilization and I/O activity. Estimated: at 50% logic utilization and 50% I/O toggle rate, power dissipation is approximately 1.5W. The 256-FPBGA package has a theta_JA of approximately 20°C/W. This results in a 30°C junction temperature rise above ambient. For high-power designs, add thermal vias under the package and consider a heatsink or forced airflow.
Informations de conformité
RoHS3 compliant per Microchip USA. AEC-Q100 not applicable for this FPGA. Other compliance data not provided.