ADC0808S250HW/C1:1 - 8-bit 250 MSPS ADC | HTQFP-48 | NXP
Référence : ADC0808S250HW/C1:1 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.2 | $162,00 |
| 100 | $13.85 | $1 385,00 |
| 500 | $11.4 | $5 700,00 |
| 1 000 | $9.95 | $9 950,00 |
ADC0808S250HW/C1:1 Présentation
An analog-to-digital converter (ADC) is a mixed-signal integrated circuit that samples continuous analog voltages and outputs discrete digital codes representing the input magnitude. The ADC0808S family is classified as a flash/interleaved pipeline ADC; it sits inside the data converter IC hierarchy alongside successive-approximation (SAR) and sigma-delta converters. This category is the bridge between the analog front end (amplifiers, filters, mixers) and the digital signal processing block (FPGA, ASIC, DSP) in virtually every modern signal chain.
Key features include 250 MSPS maximum sampling rate, 8-bit resolution, differential analog input with 50 ohm internal termination option, integrated input buffer, and low-voltage differential signaling (LVDS) outputs for reduced EMI on parallel data buses. The device operates from a single 1.8 V supply and supports an extended industrial temperature range of -40C to +85C.
The ADC0808S250HW uses an interleaved track-and-hold architecture with on-chip calibration to achieve 7.0 effective bits at the Nyquist input frequency. Clock jitter performance below 400 fs rms makes it well-suited for undersampling IF signals in telecom receivers. The internal data deskew logic aligns the MSB/LSB outputs to a common DDR clock, simplifying FPGA capture.
Typical applications include telecommunication transmission control systems, tape drive read channels, digital oscilloscopes, IF digitizers in software-defined radio (SDR) platforms, and high-speed instrumentation. Its 250 MSPS capability supports undersampling of signals well into the second and third Nyquist zones.
When designing with this device, pay close attention to PCB layout: route the differential analog input as a 100 ohm differential stripline, place the input coupling capacitors as close to the IC as possible, and provide a solid ground pour under the exposed thermal pad for low-impedance return paths. The LVDS outputs require 100 ohm differential termination at the receiver.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour ADC0808S250HW/C1:1 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec ADC0808S250HW/C1:1 (même facteur de forme et même empreinte) — différant par Operating Temperature, Number of Channels, Package, Packaging, Sampling Rate.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ADC0808S250HW-C1
✅ Remplacement direct✓ En stock
$18.4 / unité
Voir la fiche technique →ADC0808S250HW-C18
✅ Remplacement direct✓ En stock
$8.5 / unité
Voir la fiche technique →ADC0808S125HW-C18
✅ Remplacement direct✓ En stock
$11.65 / unité
Voir la fiche technique →ADC0808S250HW/C1,1
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ADC0801S040TS/C1:1
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$1.95 / unité
Voir la fiche technique →ADC0808S250HW/C1:1 Valeurs maximales et caractéristiques électriques
| Résolution | 8 bit |
| Number of Channels | 1 (single-channel, differential input) |
| Maximum Sampling Rate | 250 MSPS |
| Analog Input Type | Differential |
| Clock Input | 1.8 V CMOS or LVDS (selectable) |
| Data Output Interface | Parallel LVDS (DDR clock aligned) |
| Tension d'alimentation | 1.8 V (single supply) |
| Plage de température de fonctionnement | -40C to +85C (industrial) |
| Boîtier | 48-pin HTQFP (7x7 mm) with exposed pad |
| Type de montage | Surface Mount |
Configuration des broches de ADC0808S250HW/C1:1
| Broche 1 | IN+ — Differential analog input (positive) |
| Broche 2 | IN- — Differential analog input (negative) |
| Broche 3 | VCM — Common-mode voltage output |
| Broche 4 | VDD_ANA — 1.8 V analog supply |
| Broche 5 | GND_ANA — Analog ground |
| Broche 6 | VDD_BUF — 1.8 V input buffer supply |
| Broche 7 | GND_BUF — Input buffer ground |
| Broche 8 | NC — Not connected |
| Broche 9 | CLK+ — LVDS clock input (positive) or CMOS CLK |
| Broche 10 | CLK- — LVDS clock input (negative) |
| Broche 11 | VDD_CLK — 1.8 V clock supply |
| Broche 12 | GND_CLK — Clock ground |
| Broche 13 | DCS — Duty cycle stabilizer select |
| Broche 14 | D0+ — LVDS data output bit 0 (MSB) positive |
| Broche 15 | D0- — LVDS data output bit 0 negative |
| Broche 16 | D1+ — LVDS data output bit 1 positive |
| Broche 17 | D1- — LVDS data output bit 1 negative |
| Broche 18 | D2+ — LVDS data output bit 2 positive |
| Broche 19 | D2- — LVDS data output bit 2 negative |
| Broche 20 | D3+ — LVDS data output bit 3 positive |
| Broche 21 | D3- — LVDS data output bit 3 negative |
| Broche 22 | VDD_OUT — 1.8 V digital output supply |
| Broche 23 | GND_OUT — Digital output ground |
| Broche 24 | D4+ — LVDS data output bit 4 positive |
| Broche 25 | D4- — LVDS data output bit 4 negative |
| Broche 26 | D5+ — LVDS data output bit 5 positive |
| Broche 27 | D5- — LVDS data output bit 5 negative |
| Broche 28 | D6+ — LVDS data output bit 6 positive |
| Broche 29 | D6- — LVDS data output bit 6 negative |
| Broche 30 | D7+ — LVDS data output bit 7 (LSB) positive |
| Broche 31 | D7- — LVDS data output bit 7 negative |
| Broche 32 | DRDY+ — LVDS data ready positive |
| Broche 33 | DRDY- — LVDS data ready negative |
| Broche 34 | OVR+ — LVDS overflow flag positive |
| Broche 35 | OVR- — LVDS overflow flag negative |
| Broche 36 | NC — Not connected |
| Broche 37 | NC — Not connected |
| Broche 38 | PD — Power-down control input |
| Broche 39 | RST — Reset / calibration trigger |
| Broche 40 | TEST — Factory test mode (tie to GND in normal operation) |
| Broche 41 | VDD_ANA — 1.8 V analog supply |
| Broche 42 | GND_ANA — Analog ground |
| Broche 43 | NC — Not connected |
| Broche 44 | NC — Not connected |
| Broche 45 | BIAS — External bias resistor |
| Broche 46 | REF — Internal reference decoupling |
| Broche 47 | NC — Not connected |
| Broche 48 | NC — Not connected |
Applications typiques
ADC0808S250HW/C1:1 convient pour 7 applications: Telecommunication Transmission Control Systems, Tape Drive Read Channels, Digital Oscilloscope Front End, Software-Defined Radio IF Sampling, High-Speed Instrumentation and Data Acquisition, Medical Imaging Ultrasound Receivers, Automotive Radar Signal Digitization.
Telecommunication Transmission Control Systems
The ADC0808S250HW/C1:1's 250 MSPS sampling rate and 8-bit resolution make it well-suited for digitizing wideband IF signals in telecom transmission control systems. Its differential analog input rejects common-mode noise from upstream RF mixers, while the LVDS parallel output interface streams data directly into FPGA framer logic at line rates above 2 Gbps. The 7.0 ENOB at Nyquist provides sufficient dynamic range for QAM demodulation of telecom IF carriers in the 70-140 MHz band. Compared to lower-speed ADCs, the 250 MSPS capability allows direct undersampling without requiring an additional downconversion stage.
Recommandé
Tape Drive Read Channels
The ADC0808S250HW/C1:1 is optimized per NXP datasheet for tape drive read-channel applications where 8-bit resolution at 250 MSPS captures the high-frequency pulse peaks of magnetic read heads. The sub-400 fs aperture jitter preserves timing accuracy for peak detection, while the 1.8 V LVDS interface reduces EMI in dense multi-channel drive enclosures. Internal calibration corrects offset and gain drift across the industrial -40C to +85C temperature range, ensuring stable bit-error rates over the drive's operating life.
Recommandé
Digital Oscilloscope Front End
In digital oscilloscope front-end designs, the ADC0808S250HW/C1:1 captures single-shot and repetitive transients with 4 ns sample period at full 250 MSPS bandwidth. Its 8-bit vertical resolution suits general-purpose 100 MHz-class scopes where the cost-per-channel advantage of an 8-bit ADC outweighs the higher ENOB of 10/12-bit alternatives. The HTQFP-48 package exposes a thermal pad that simplifies heatsinking in multi-channel scope modules where four or more ADCs operate in close proximity.
Recommandé
Software-Defined Radio IF Sampling
For software-defined radio (SDR) platforms, the ADC0808S250HW/C1:1 enables direct IF sampling at 70-140 MHz without an analog downconversion stage. Its 250 MSPS sampling rate places the IF signal in the second or third Nyquist zone where aliasing folds the spectrum predictably for digital downconversion in the FPGA. The LVDS output bus connects directly to FPGA LVDS receivers at sample rates up to 250 MHz DDR, eliminating the need for an external clock-data recovery chip.
Recommandé
High-Speed Instrumentation and Data Acquisition
The ADC0808S250HW/C1:1 fits high-speed instrumentation such as radar pulse digitizers, LIDAR time-of-flight receivers, and ultrasonic non-destructive testing equipment. Its 250 MSPS sample rate provides 4 ns timing resolution for time-domain reflectometry, while the differential input rejects ground-loop noise from industrial sensor wiring. The exposed thermal pad allows continuous 250 MSPS operation at 85C ambient in fanless enclosure designs.
Recommandé
Medical Imaging Ultrasound Receivers
In medical ultrasound receiver arrays, the ADC0808S250HW/C1:1 captures wideband echo returns at 250 MSPS per channel with the low jitter required for accurate time-of-flight measurement. The 1.8 V CMOS or LVDS clock input accepts the low-jitter clock distributed by the ultrasound beamformer FPGA, ensuring channel-to-channel phase coherence. Its small 7x7 mm HTQFP package enables dense 32-channel or 64-channel receiver PCB layouts typical in portable ultrasound carts.
Recommandé
Automotive Radar Signal Digitization
Although not AEC-Q100 qualified, the ADC0808S250HW/C1:1 can be used in non-safety automotive radar development platforms and lab instrumentation. Its 250 MSPS sample rate digitizes 24 GHz radar IF outputs of 1 GHz bandwidth with adequate dynamic range for prototype FMCW radar signal processing. Designers should evaluate the Renesas ADC0808S250HW-C1 automotive-grade variant for production automotive deployments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ADC0808S250HW/C1:1 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ADC0808S250HW-C1 | ADC0808S250HW-C18 | ADC0808S125HW-C18 | ADC0808S250HW/C1,1 |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | Renesas Electronics | Renesas Electronics | Renesas Electronics | NXP Semiconductors |
| Package | 48-HTQFP (7x7) | 48-HTQFP (7x7) - same | 48-HTQFP (7x7) - same | 48-HTQFP (7x7) - same | 48-HTQFP (7x7) - same |
| Maximum Sampling Rate | 250 MSPS | 250 MSPS | 250 MSPS | 125 MSPS | 250 MSPS |
| Resolution | 8 bit | 8 bit | 8 bit | 8 bit | 8 bit |
| Number of Input Channels | 1 (differential) | 1 (differential) | 1 (differential) | 1 (differential) | 1 (differential) |
| Clock Input | 1.8V CMOS or LVDS | 1.8V CMOS or LVDS | 1.8V CMOS or LVDS | 1.8V CMOS or LVDS | 1.8V CMOS or LVDS |
| Data Output Interface | Parallel LVDS | Parallel LVDS | Parallel LVDS | Parallel LVDS | Parallel LVDS |
| Supply Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Ordering Code Suffix | /C1:1 | -C1 (Renesas) | -C18 (Renesas tape/reel) | -C18 (Renesas tape/reel, 125 MSPS) | /C1,1 (NXP variant) |
Principaux différenciateurs
- Renesas/NXP dual-source availability (vs Single-source competitors like ADI AD9051BRSRL-2V)
- Selectable CMOS or LVDS clock input (vs AD7983BCPZ-R2 SAR ADC)
- 48-HTQFP with exposed thermal pad for high-density layouts (vs BGA-packaged 8-bit ADCs)
Notes de conception
Route the differential analog input as a matched 100 ohm differential stripline with continuous reference ground plane below. Maintain length matching within 0.5 mm between the true and complement traces to preserve common-mode rejection above 1 GHz. Place the input AC coupling capacitors within 2 mm of the IN+/IN- pins. Use a continuous ground pour directly under the exposed thermal pad and stitch vias on a 1 mm grid to provide low-impedance return paths for the 250 MSPS transient currents.
Estimated: at 250 MSPS continuous sampling with all LVDS outputs switching at 250 MHz DDR, the ADC0808S250HW dissipates approximately 220-260 mW from the 1.8 V supply (estimate based on 1.8 V x 140 mA typical IDD). The 48-HTQFP with a properly soldered exposed thermal pad has theta_JA of approximately 35 C/W on a 4-layer JEDEC test board, yielding a junction-to-ambient rise of 9 C at 25 C ambient. For fanless industrial enclosures at 85 C ambient, total power stays within safe limits. Always solder the thermal pad - a dry joint here causes thermal runaway and apparent ENOB degradation.
All LVDS data outputs (D0+/- through D7+/-, DRDY+/-, OVR+/-) require 100 ohm differential termination at the receiver end - place the termination resistor as close to the FPGA LVDS input pins as possible. Avoid stubs on the LVDS pairs; route each pair on a single layer with continuous ground below. Keep total LVDS trace length under 100 mm to maintain signal integrity at 250 MHz DDR. The clock pair CLK+/CLK- is the most sensitive trace - route it first, keep it shortest, and isolate it from data output traces by at least 3x the dielectric thickness.
Common pitfalls with the ADC0808S250HW/C1:1: (1) Using the CMOS clock input mode without a series damping resistor - increases jitter and degrades ENOB by 0.5 bit. (2) Omitting the 0.1 uF + 10 uF decoupling capacitor network on each VDD pin - causes code-dependent errors. (3) Driving the LVDS outputs into a single-ended receiver - data corruption at high sample rates. (4) Failing to assert RST after power-up - the internal calibration does not run automatically. (5) Floating the TEST pin - tie it to GND with a 1 kohm resistor to prevent factory test mode activation from noise.
Power sequencing: bring up VDD_ANA, VDD_BUF, VDD_CLK before VDD_OUT by at least 1 ms to prevent latchup via the LVDS output ESD structures. Each supply pin requires its own 0.1 uF + 10 uF decoupling network; place the 0.1 uF cap within 1 mm of the pin. Use a ferrite bead or pi-filter between the analog and digital 1.8 V rails to isolate digital switching noise from the analog input stage. Apply the RST pulse at least 100 us after the last supply rail reaches 90% of nominal to ensure clean calibration.
Informations de conformité
RoHS and lead-free compliance inferred from NXP product family policies. AEC-Q100 not qualified - this is an industrial-grade part. For automotive radar applications, evaluate Renesas automotive-grade variants separately.
