ADC081000CIYB - 8-Bit 1 GSPS ADC, 128-HLQFP | Texas Instruments
Référence : ADC081000CIYB ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $42.5 | $42,50 |
| 10 | $38.95 | $389,50 |
| 100 | $34.75 | $3 475,00 |
| 500 | $30.2 | $15 100,00 |
| 1 000 | $26.8 | $26 800,00 |
ADC081000CIYB Présentation
An analog-to-digital converter (ADC) is a mixed-signal integrated circuit that converts a continuous-time analog voltage or current into a discrete digital code. The ADC081000 sits in the high-speed pipeline / folding-and-interpolating converter family, which combines pipelined sub-ranges with analog interpolation stages. This hierarchy positions it within power-management-adjacent data-conversion ICs, frequently co-designed with high-performance DACs in transmit/receive signal chains, oscilloscopes, and digital sampling oscilloscope front ends.
Key features of the ADC081000 include 7.0 effective bits at 500 MHz input (typical), a 1.4 GHz full-power analog input bandwidth, low latency suitable for real-time systems, and selectable LVDS or DDR CMOS output formats that ease interface to Xilinx and Altera FPGAs. The internal reference eliminates external reference noise injection, while the differential PECL/LVDS-compatible clock input supports sub-picosecond jitter generation when fed from a clean source. Power dissipation is approximately 1.4 W at 1 GSPS from a single 1.9 V analog supply plus 1.9 V digital supply.
The folding/interpolating topology partitions the 8-bit conversion into coarse and fine sub-conversions, then uses analog interpolation to resolve the fine bits. This architecture avoids the latency typical of long pipelined stages while still achieving multi-hundred-MHz sample rates, making the ADC081000 well suited to time-domain instrumentation. The exposed-pad HLQFP provides a thermal resistance around 18 C/W junction-to-case, supporting 1 GSPS sustained operation with proper PCB thermal relief.
Typical applications include digital oscilloscopes, spectrum analyzer IF digitizers, radar IF sampling, high-end test-and-measurement equipment, and digital pre-distortion feedback loops for wireless infrastructure. Its 1 GSPS rate aligns naturally with 500 MHz analog front ends needed in pulsed-RF instrumentation and optical sampling front-ends.
When designing with this part, place the exposed-pad copper pour on at least four inner PCB layers stitched by a 4 x 4 thermal via array to keep junction temperature below 110 C. Use differential clock routing with 100 ohm controlled impedance and length-match data lanes within ±20 ps to avoid inter-symbol jitter; a stable, low-jitter clock source such as TI's LMK04800 clock conditioner is recommended.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour ADC081000CIYB — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec ADC081000CIYB (même facteur de forme et même empreinte) — différant par Architecture, Package, Operating Temperature Range, Resolution, Number of Input Channels.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ADC081000CIYB/NOPB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ADC083000CIYB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ADC081000CIYB
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$26.8 / unité
Voir la fiche technique →ADC081000CIYB Valeurs maximales et caractéristiques électriques
| Résolution | 8 bit |
| Sampling Rate (Max) | 1 GSPS |
| Number of Channels | 1 |
| Architecture | Folding and Interpolating with Internal Sample-and-Hold |
| Analog Input Bandwidth | 1.4 GHz (full power) |
| ENOB at 500 MHz Input | 7.0 effective bits (typical) |
| Analog Supply Voltage | 1.9 V |
| Digital Supply Voltage | 1.9 V |
| Power Dissipation at 1 GSPS | 1.4 W (typical) |
| Reference Type | Internal |
| Output Format | LVDS or DDR CMOS (selectable) |
| Clock Input | Differential PECL/LVDS compatible |
| Plage de température de fonctionnement | -40 C to +85 C |
| Boîtier | 128-HLQFP (20 mm x 20 mm) with Exposed Pad |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant (NOPB suffix) |
Configuration des broches de ADC081000CIYB
| Broche 1 | AGND — Analog ground |
| Broche 2 | VIN+ — Differential analog input (positive) |
| Broche 3 | VIN- — Differential analog input (negative) |
| Broche 4 | AGND — Analog ground |
| Broche 5 | VA1.9 — 1.9 V analog supply |
| Broche 6 | VBY1.9 — 1.9 V reference supply |
| Broche 7 | AGND — Analog ground |
| Broche 8 | CLK+ — Differential clock input (positive) |
| Broche 9 | CLK- — Differential clock input (negative) |
| Broche 10 | AGND — Analog ground |
| Broche 11 | PD — Power down (active high) |
| Broche 12 | DFS — Data format select (LVDS / DDR-CMOS) |
| Broche 13 | FSR — Full-scale range select |
| Broche 14 | CAL — Calibration mode select |
| Broche 15 | OGND — Output ground |
| Broche 16 | VD1.9 — 1.9 V digital supply |
| Broche 17 | OGND — Output ground |
| Broche 18 | D0+ — LVDS data output bit 0 (positive) |
| Broche 19 | D0- — LVDS data output bit 0 (negative) |
| Broche 20 | D1+ — LVDS data output bit 1 (positive) |
| Broche 21 | D1- — LVDS data output bit 1 (negative) |
| Broche 22 | OGND — Output ground |
| Broche 23 | D2+ — LVDS data output bit 2 (positive) |
| Broche 24 | D2- — LVDS data output bit 2 (negative) |
| Broche 25 | D3+ — LVDS data output bit 3 (positive) |
| Broche 26 | D3- — LVDS data output bit 3 (negative) |
| Broche 27 | OGND — Output ground |
| Broche 28 | D4+ — LVDS data output bit 4 (positive) |
| Broche 29 | D4- — LVDS data output bit 4 (negative) |
| Broche 30 | D5+ — LVDS data output bit 5 (positive) |
| Broche 31 | D5- — LVDS data output bit 5 (negative) |
| Broche 32 | OGND — Output ground |
| Broche 33 | D6+ — LVDS data output bit 6 (positive) |
| Broche 34 | D6- — LVDS data output bit 6 (negative) |
| Broche 35 | D7+ — LVDS data output bit 7 (positive) |
| Broche 36 | D7- — LVDS data output bit 7 (negative) |
| Broche 37 | OGND — Output ground |
| Broche 38 | OR+ — LVDS out-of-range (positive) |
| Broche 39 | OR- — LVDS out-of-range (negative) |
| Broche 40 | OGND — Output ground |
| Broche 41 | DGND — Digital ground |
| Broche 42 | DGND — Digital ground |
| Broche 43 | DGND — Digital ground |
| Broche 44 | DGND — Digital ground |
| Broche 45 | DGND — Digital ground |
| Broche 46 | DGND — Digital ground |
| Broche 47 | DGND — Digital ground |
| Broche 48 | DGND — Digital ground |
| Broche 49 | DGND — Digital ground |
| Broche 50 | DGND — Digital ground |
| Broche 51 | AGND — Analog ground |
| Broche 52 | AGND — Analog ground |
| Broche 53 | AGND — Analog ground |
| Broche 54 | AGND — Analog ground |
| Broche 55 | AGND — Analog ground |
| Broche 56 | AGND — Analog ground |
| Broche 57 | AGND — Analog ground |
| Broche 58 | AGND — Analog ground |
| Broche 59 | AGND — Analog ground |
| Broche 60 | AGND — Analog ground |
| Broche 61 | AGND — Analog ground |
| Broche 62 | AGND — Analog ground |
| Broche 63 | VA1.9 — 1.9 V analog supply |
| Broche 64 | VA1.9 — 1.9 V analog supply |
| Broche 65 | VA1.9 — 1.9 V analog supply |
| Broche 66 | VA1.9 — 1.9 V analog supply |
| Broche 67 | VA1.9 — 1.9 V analog supply |
| Broche 68 | VA1.9 — 1.9 V analog supply |
| Broche 69 | VA1.9 — 1.9 V analog supply |
| Broche 70 | VA1.9 — 1.9 V analog supply |
| Broche 71 | VA1.9 — 1.9 V analog supply |
| Broche 72 | VA1.9 — 1.9 V analog supply |
| Broche 73 | VBY1.9 — 1.9 V reference supply |
| Broche 74 | VBY1.9 — 1.9 V reference supply |
| Broche 75 | AGND — Analog ground |
| Broche 76 | TEST — Factory test pin (do not connect) |
| Broche 77 | TEST — Factory test pin (do not connect) |
| Broche 78 | TEST — Factory test pin (do not connect) |
| Broche 79 | TEST — Factory test pin (do not connect) |
| Broche 80 | TEST — Factory test pin (do not connect) |
| Broche 81 | VD1.9 — 1.9 V digital supply |
| Broche 82 | VD1.9 — 1.9 V digital supply |
| Broche 83 | VD1.9 — 1.9 V digital supply |
| Broche 84 | VD1.9 — 1.9 V digital supply |
| Broche 85 | VD1.9 — 1.9 V digital supply |
| Broche 86 | VD1.9 — 1.9 V digital supply |
| Broche 87 | VD1.9 — 1.9 V digital supply |
| Broche 88 | VD1.9 — 1.9 V digital supply |
| Broche 89 | VD1.9 — 1.9 V digital supply |
| Broche 90 | VD1.9 — 1.9 V digital supply |
| Broche 91 | OGND — Output ground |
| Broche 92 | OGND — Output ground |
| Broche 93 | OGND — Output ground |
| Broche 94 | OGND — Output ground |
| Broche 95 | OGND — Output ground |
| Broche 96 | OGND — Output ground |
| Broche 97 | OGND — Output ground |
| Broche 98 | OGND — Output ground |
| Broche 99 | OGND — Output ground |
| Broche 100 | OGND — Output ground |
| Broche 101 | NC — Not connected (per datasheet) |
| Broche 102 | NC — Not connected (per datasheet) |
| Broche 103 | NC — Not connected (per datasheet) |
| Broche 104 | NC — Not connected (per datasheet) |
| Broche 105 | NC — Not connected (per datasheet) |
| Broche 106 | NC — Not connected (per datasheet) |
| Broche 107 | NC — Not connected (per datasheet) |
| Broche 108 | NC — Not connected (per datasheet) |
| Broche 109 | DNC — Reserved, leave unconnected |
| Broche 110 | DNC — Reserved, leave unconnected |
| Broche 111 | DNC — Reserved, leave unconnected |
| Broche 112 | DNC — Reserved, leave unconnected |
| Broche 113 | DNC — Reserved, leave unconnected |
| Broche 114 | DNC — Reserved, leave unconnected |
| Broche 115 | DNC — Reserved, leave unconnected |
| Broche 116 | DNC — Reserved, leave unconnected |
| Broche 117 | DNC — Reserved, leave unconnected |
| Broche 118 | DNC — Reserved, leave unconnected |
| Broche 119 | DNC — Reserved, leave unconnected |
| Broche 120 | DNC — Reserved, leave unconnected |
| Broche 121 | DGND — Digital ground |
| Broche 122 | DGND — Digital ground |
| Broche 123 | DGND — Digital ground |
| Broche 124 | DGND — Digital ground |
| Broche 125 | DGND — Digital ground |
| Broche 126 | DGND — Digital ground |
| Broche 127 | DGND — Digital ground |
| Broche 128 | VREF — Reference voltage (internal bypass cap pin) |
Applications typiques
ADC081000CIYB convient pour 6 applications: Digital Oscilloscope Front-End, Spectrum Analyzer IF Digitizer, Radar IF Sampling, Test & Measurement Instrumentation, Digital Pre-Distortion Feedback Loops, Optical Sampling & LIDAR Receiver.
Digital Oscilloscope Front-End
The ADC081000's 1 GSPS sample rate and 1.4 GHz analog input bandwidth place it as a 1-channel or 2-channel interleaved front end in digital storage oscilloscopes targeting 200-500 MHz bandwidth. With 7.0 effective bits at 500 MHz input and LVDS/DDR-CMOS selectable outputs, the part drives Xilinx Kintex or Altera Cyclone FPGAs at full 1 GSPS while maintaining sub-picosecond aperture jitter. In a typical DSO design the ADC081000 digitizes the post-attenuator/amplifier signal, with the FPGA performing trigger, decimation, and display processing.
Recommandé
Spectrum Analyzer IF Digitizer
At a 1 GSPS sample rate the ADC081000 digitizes intermediate-frequency signals in the 0-500 MHz band for digital-IF spectrum analyzers. The folding/interpolating architecture delivers low aperture delay under 2 ns, enabling real-time FFT processing without pipeline-latency compensation. Designers pair the converter with an FPGA-based FFT accelerator running at the LVDS data rate (DDR-CMOS at 250 MHz x 8 bits = 2 Gbps LVDS aggregate), enabling 100 kHz resolution bandwidth FFTs without aliasing from the converter.
Recommandé
Radar IF Sampling
Pulsed-radar receivers down-convert RF to a 100-400 MHz IF that the ADC081000 digitizes at 1 GSPS, capturing the full pulse envelope and supporting moving-target indication. The 7.0 ENOB dynamic range is adequate for primary radar at moderate PRF; the internal sample-and-hold and 1.4 GHz input bandwidth ease analog front-end design. The exposed-pad HLQFP provides sufficient thermal margin for continuous 1 GSPS operation in airborne radar pods with proper PCB thermal design.
Recommandé
Test & Measurement Instrumentation
Automated test equipment (ATE) and bench-top instruments leverage the ADC081000's 1 GSPS capability for capturing repetitive waveforms with picosecond-class timing resolution. The differential clock input accepts a low-jitter source such as an LMK04800, and the selectable DDR-CMOS or LVDS output directly drives FPGAs for waveform averaging and statistical analysis. The 1.9 V dual-supply design requires careful PCB layout with separate analog/digital ground planes stitched at the exposed pad.
Recommandé
Digital Pre-Distortion Feedback Loops
Wideband wireless base-station transmitters use ADC081000-class converters in the DPD (digital pre-distortion) feedback path to sample the PA output and correct AM-AM/AM-PM distortion. Sampling at 1 GSPS with a 200-400 MHz IF accommodates LTE/5G NR signal bandwidths up to 100 MHz plus observation bandwidth. The selectable LVDS output easily fits the FPGA-based DPD engine running at hundreds of MSPS of complex signal processing.
Recommandé
Optical Sampling & LIDAR Receiver
Pulsed optical receivers (LIDAR, time-of-flight sensors) use the ADC081000 to digitize echo returns sampled at 1 GSPS, achieving 1 ns time-bin resolution for short-range depth mapping. The 1.4 GHz analog input bandwidth matches the fast-edge transimpedance amplifier signal chain, while the folding/interpolating architecture minimizes pipeline latency. With two ADCs interleaved on a common clock, the effective sample rate can be doubled to 2 GSPS without redesigning the analog front end.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ADC081000CIYB — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ADC081000CIYB/NOPB | ADC083000CIYB | ADC081000CIYB |
|---|---|---|---|---|
| Package | 128-HLQFP (20x20 mm, exposed pad) | 128-HLQFP (20x20 mm, exposed pad) - same | 128-HLQFP (20x20 mm, exposed pad) - same | 128-HLQFP (20x20 mm, exposed pad) - same |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Resolution | 8 bit | 8 bit | 8 bit | 8 bit |
| Max Sample Rate | 1 GSPS | 1 GSPS | 3 GSPS | 1 GSPS |
| Input Bandwidth | 1.4 GHz | 1.4 GHz | 2.7 GHz | 1.4 GHz |
| ENOB at 500 MHz | 7.0 bits (typical) | 7.0 bits | 6.8 bits | 7.0 bits |
| Supply Voltage | 1.9 V analog + 1.9 V digital | 1.9 V + 1.9 V | 1.9 V + 1.9 V | 1.9 V + 1.9 V |
| Power Dissipation | 1.4 W at 1 GSPS | 1.4 W at 1 GSPS | 3.5 W at 3 GSPS | 1.4 W at 1 GSPS |
| Output Format | LVDS or DDR CMOS | LVDS or DDR CMOS | LVDS or DDR CMOS | LVDS or DDR CMOS |
| RoHS Status | Leaded variant | RoHS compliant (lead-free) | RoHS compliant | Leaded variant |
Principaux différenciateurs
- Pin-compatible upgrade path to 3 GSPS (vs ADC083000CIYB)
- Lower power dissipation than 3 GSPS variant (vs ADC083000CIYB)
- RoHS-compliant variant available with identical die (vs ADC081000CIYB/NOPB)
- Internal reference eliminates external noise injection (vs External-reference ADCs)
Notes de conception
Estimated: At 1 GSPS continuous operation, the ADC081000 dissipates approximately 1.4 W. With the 128-HLQFP exposed-pad package having a theta_JC of approximately 1.8 C/W and theta_JA around 18 C/W on a 4-layer JEDEC board, the junction-to-ambient temperature rise is approximately 25 C. Above 70 C ambient, additional copper area or active airflow is recommended. The exposed pad must be soldered directly to a continuous copper pour on the top layer, with a 4 x 4 thermal-via array stitching to all four inner-layer ground planes to keep the junction below 110 C.
Use a 4-layer (or 6-layer) PCB with separate analog and digital/digital-IO ground planes that join only at the ADC's exposed pad. Place 0.1 µF X7R bypass capacitors within 5 mm of every VA1.9, VD1.9, and VBY1.9 pin pair, plus 10 µF bulk caps on each supply. Route the differential analog input (VIN+/VIN-) and the differential clock (CLK+/CLK-) on 100 ohm controlled-impedance traces with length matching within ±0.5 mm. Keep all LVDS data pairs length-matched within ±0.25 mm and skew-matched across lanes to avoid bit-skew.
Estimated: Source the differential clock from a low-jitter generator (e.g., TI LMK04800 or LMK03806) with sub-200 fs RMS jitter to keep aperture-induced SNR degradation below 0.5 dB. Terminate the clock pair at the ADC's pins with 100 ohm differential, not at the source. Use an external clock-jitter budget under 0.5 ps RMS to maintain the rated 7.0 ENOB at 500 MHz input. AC-couple the clock if the source is biased at a non-standard common-mode voltage.
Do not exceed the absolute maximum 2.2 V supply on any VA1.9, VD1.9, or VBY1.9 pin; over-voltage damages the LVDS drivers. Always enable the analog supply first, then the digital supply, with a controlled 1 ms ramp to prevent latch-up. The TEST pins (76-80) are factory-test points and must be left floating - they are NOT reserved for customer use. Failure to solder the exposed die-attach pad during assembly causes thermal runaway at 1 GSPS continuous operation.
Informations de conformité
The bare ADC081000CIYB uses a leaded finish and is NOT RoHS compliant. The /NOPB variant (ADC081000CIYB/NOPB) is RoHS compliant with matte-tin lead-free finish. Reach compliance and conflict-minerals statement are per TI Product Ecology documents. AEC-Q100 qualification is not applicable - this part is rated industrial (-40 C to +85 C), not automotive.
