ADC081000CIYB - 8-Bit 1 GSPS ADC, 128-HLQFP | Texas Instruments
부품 번호: ADC081000CIYB ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $42.5 | $42.50 |
| 10 | $38.95 | $389.50 |
| 100 | $34.75 | $3,475.00 |
| 500 | $30.2 | $15,100.00 |
| 1,000 | $26.8 | $26,800.00 |
ADC081000CIYB 개요
An analog-to-digital converter (ADC) is a mixed-signal integrated circuit that converts a continuous-time analog voltage or current into a discrete digital code. The ADC081000 sits in the high-speed pipeline / folding-and-interpolating converter family, which combines pipelined sub-ranges with analog interpolation stages. This hierarchy positions it within power-management-adjacent data-conversion ICs, frequently co-designed with high-performance DACs in transmit/receive signal chains, oscilloscopes, and digital sampling oscilloscope front ends.
Key features of the ADC081000 include 7.0 effective bits at 500 MHz input (typical), a 1.4 GHz full-power analog input bandwidth, low latency suitable for real-time systems, and selectable LVDS or DDR CMOS output formats that ease interface to Xilinx and Altera FPGAs. The internal reference eliminates external reference noise injection, while the differential PECL/LVDS-compatible clock input supports sub-picosecond jitter generation when fed from a clean source. Power dissipation is approximately 1.4 W at 1 GSPS from a single 1.9 V analog supply plus 1.9 V digital supply.
The folding/interpolating topology partitions the 8-bit conversion into coarse and fine sub-conversions, then uses analog interpolation to resolve the fine bits. This architecture avoids the latency typical of long pipelined stages while still achieving multi-hundred-MHz sample rates, making the ADC081000 well suited to time-domain instrumentation. The exposed-pad HLQFP provides a thermal resistance around 18 C/W junction-to-case, supporting 1 GSPS sustained operation with proper PCB thermal relief.
Typical applications include digital oscilloscopes, spectrum analyzer IF digitizers, radar IF sampling, high-end test-and-measurement equipment, and digital pre-distortion feedback loops for wireless infrastructure. Its 1 GSPS rate aligns naturally with 500 MHz analog front ends needed in pulsed-RF instrumentation and optical sampling front-ends.
When designing with this part, place the exposed-pad copper pour on at least four inner PCB layers stitched by a 4 x 4 thermal via array to keep junction temperature below 110 C. Use differential clock routing with 100 ohm controlled impedance and length-match data lanes within ±20 ps to avoid inter-symbol jitter; a stable, low-jitter clock source such as TI's LMK04800 clock conditioner is recommended.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: ADC081000CIYB — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ADC081000CIYB (동일 폼 팩터 및 풋프린트) — 차이점: Architecture, Package, Operating Temperature Range, Resolution, Number of Input Channels.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ADC081000CIYB/NOPB
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
ADC083000CIYB
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
ADC081000CIYB
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$26.8 / 개
데이터시트 보기 →ADC081000CIYB 최대 정격 & 전기적 특성
| 분해능 | 8 bit |
| Sampling Rate (Max) | 1 GSPS |
| Number of Channels | 1 |
| Architecture | Folding and Interpolating with Internal Sample-and-Hold |
| Analog Input Bandwidth | 1.4 GHz (full power) |
| ENOB at 500 MHz Input | 7.0 effective bits (typical) |
| Analog Supply Voltage | 1.9 V |
| Digital Supply Voltage | 1.9 V |
| Power Dissipation at 1 GSPS | 1.4 W (typical) |
| Reference Type | Internal |
| Output Format | LVDS or DDR CMOS (selectable) |
| Clock Input | Differential PECL/LVDS compatible |
| 동작 온도 범위 | -40 C to +85 C |
| 패키지 | 128-HLQFP (20 mm x 20 mm) with Exposed Pad |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant (NOPB suffix) |
ADC081000CIYB 핀 구성
| 핀 1 | AGND — Analog ground |
| 핀 2 | VIN+ — Differential analog input (positive) |
| 핀 3 | VIN- — Differential analog input (negative) |
| 핀 4 | AGND — Analog ground |
| 핀 5 | VA1.9 — 1.9 V analog supply |
| 핀 6 | VBY1.9 — 1.9 V reference supply |
| 핀 7 | AGND — Analog ground |
| 핀 8 | CLK+ — Differential clock input (positive) |
| 핀 9 | CLK- — Differential clock input (negative) |
| 핀 10 | AGND — Analog ground |
| 핀 11 | PD — Power down (active high) |
| 핀 12 | DFS — Data format select (LVDS / DDR-CMOS) |
| 핀 13 | FSR — Full-scale range select |
| 핀 14 | CAL — Calibration mode select |
| 핀 15 | OGND — Output ground |
| 핀 16 | VD1.9 — 1.9 V digital supply |
| 핀 17 | OGND — Output ground |
| 핀 18 | D0+ — LVDS data output bit 0 (positive) |
| 핀 19 | D0- — LVDS data output bit 0 (negative) |
| 핀 20 | D1+ — LVDS data output bit 1 (positive) |
| 핀 21 | D1- — LVDS data output bit 1 (negative) |
| 핀 22 | OGND — Output ground |
| 핀 23 | D2+ — LVDS data output bit 2 (positive) |
| 핀 24 | D2- — LVDS data output bit 2 (negative) |
| 핀 25 | D3+ — LVDS data output bit 3 (positive) |
| 핀 26 | D3- — LVDS data output bit 3 (negative) |
| 핀 27 | OGND — Output ground |
| 핀 28 | D4+ — LVDS data output bit 4 (positive) |
| 핀 29 | D4- — LVDS data output bit 4 (negative) |
| 핀 30 | D5+ — LVDS data output bit 5 (positive) |
| 핀 31 | D5- — LVDS data output bit 5 (negative) |
| 핀 32 | OGND — Output ground |
| 핀 33 | D6+ — LVDS data output bit 6 (positive) |
| 핀 34 | D6- — LVDS data output bit 6 (negative) |
| 핀 35 | D7+ — LVDS data output bit 7 (positive) |
| 핀 36 | D7- — LVDS data output bit 7 (negative) |
| 핀 37 | OGND — Output ground |
| 핀 38 | OR+ — LVDS out-of-range (positive) |
| 핀 39 | OR- — LVDS out-of-range (negative) |
| 핀 40 | OGND — Output ground |
| 핀 41 | DGND — Digital ground |
| 핀 42 | DGND — Digital ground |
| 핀 43 | DGND — Digital ground |
| 핀 44 | DGND — Digital ground |
| 핀 45 | DGND — Digital ground |
| 핀 46 | DGND — Digital ground |
| 핀 47 | DGND — Digital ground |
| 핀 48 | DGND — Digital ground |
| 핀 49 | DGND — Digital ground |
| 핀 50 | DGND — Digital ground |
| 핀 51 | AGND — Analog ground |
| 핀 52 | AGND — Analog ground |
| 핀 53 | AGND — Analog ground |
| 핀 54 | AGND — Analog ground |
| 핀 55 | AGND — Analog ground |
| 핀 56 | AGND — Analog ground |
| 핀 57 | AGND — Analog ground |
| 핀 58 | AGND — Analog ground |
| 핀 59 | AGND — Analog ground |
| 핀 60 | AGND — Analog ground |
| 핀 61 | AGND — Analog ground |
| 핀 62 | AGND — Analog ground |
| 핀 63 | VA1.9 — 1.9 V analog supply |
| 핀 64 | VA1.9 — 1.9 V analog supply |
| 핀 65 | VA1.9 — 1.9 V analog supply |
| 핀 66 | VA1.9 — 1.9 V analog supply |
| 핀 67 | VA1.9 — 1.9 V analog supply |
| 핀 68 | VA1.9 — 1.9 V analog supply |
| 핀 69 | VA1.9 — 1.9 V analog supply |
| 핀 70 | VA1.9 — 1.9 V analog supply |
| 핀 71 | VA1.9 — 1.9 V analog supply |
| 핀 72 | VA1.9 — 1.9 V analog supply |
| 핀 73 | VBY1.9 — 1.9 V reference supply |
| 핀 74 | VBY1.9 — 1.9 V reference supply |
| 핀 75 | AGND — Analog ground |
| 핀 76 | TEST — Factory test pin (do not connect) |
| 핀 77 | TEST — Factory test pin (do not connect) |
| 핀 78 | TEST — Factory test pin (do not connect) |
| 핀 79 | TEST — Factory test pin (do not connect) |
| 핀 80 | TEST — Factory test pin (do not connect) |
| 핀 81 | VD1.9 — 1.9 V digital supply |
| 핀 82 | VD1.9 — 1.9 V digital supply |
| 핀 83 | VD1.9 — 1.9 V digital supply |
| 핀 84 | VD1.9 — 1.9 V digital supply |
| 핀 85 | VD1.9 — 1.9 V digital supply |
| 핀 86 | VD1.9 — 1.9 V digital supply |
| 핀 87 | VD1.9 — 1.9 V digital supply |
| 핀 88 | VD1.9 — 1.9 V digital supply |
| 핀 89 | VD1.9 — 1.9 V digital supply |
| 핀 90 | VD1.9 — 1.9 V digital supply |
| 핀 91 | OGND — Output ground |
| 핀 92 | OGND — Output ground |
| 핀 93 | OGND — Output ground |
| 핀 94 | OGND — Output ground |
| 핀 95 | OGND — Output ground |
| 핀 96 | OGND — Output ground |
| 핀 97 | OGND — Output ground |
| 핀 98 | OGND — Output ground |
| 핀 99 | OGND — Output ground |
| 핀 100 | OGND — Output ground |
| 핀 101 | NC — Not connected (per datasheet) |
| 핀 102 | NC — Not connected (per datasheet) |
| 핀 103 | NC — Not connected (per datasheet) |
| 핀 104 | NC — Not connected (per datasheet) |
| 핀 105 | NC — Not connected (per datasheet) |
| 핀 106 | NC — Not connected (per datasheet) |
| 핀 107 | NC — Not connected (per datasheet) |
| 핀 108 | NC — Not connected (per datasheet) |
| 핀 109 | DNC — Reserved, leave unconnected |
| 핀 110 | DNC — Reserved, leave unconnected |
| 핀 111 | DNC — Reserved, leave unconnected |
| 핀 112 | DNC — Reserved, leave unconnected |
| 핀 113 | DNC — Reserved, leave unconnected |
| 핀 114 | DNC — Reserved, leave unconnected |
| 핀 115 | DNC — Reserved, leave unconnected |
| 핀 116 | DNC — Reserved, leave unconnected |
| 핀 117 | DNC — Reserved, leave unconnected |
| 핀 118 | DNC — Reserved, leave unconnected |
| 핀 119 | DNC — Reserved, leave unconnected |
| 핀 120 | DNC — Reserved, leave unconnected |
| 핀 121 | DGND — Digital ground |
| 핀 122 | DGND — Digital ground |
| 핀 123 | DGND — Digital ground |
| 핀 124 | DGND — Digital ground |
| 핀 125 | DGND — Digital ground |
| 핀 126 | DGND — Digital ground |
| 핀 127 | DGND — Digital ground |
| 핀 128 | VREF — Reference voltage (internal bypass cap pin) |
일반적인 애플리케이션
ADC081000CIYB 적합 용도: 6 애플리케이션s: Digital Oscilloscope Front-End, Spectrum Analyzer IF Digitizer, Radar IF Sampling, Test & Measurement Instrumentation, Digital Pre-Distortion Feedback Loops, Optical Sampling & LIDAR Receiver.
Digital Oscilloscope Front-End
The ADC081000's 1 GSPS sample rate and 1.4 GHz analog input bandwidth place it as a 1-channel or 2-channel interleaved front end in digital storage oscilloscopes targeting 200-500 MHz bandwidth. With 7.0 effective bits at 500 MHz input and LVDS/DDR-CMOS selectable outputs, the part drives Xilinx Kintex or Altera Cyclone FPGAs at full 1 GSPS while maintaining sub-picosecond aperture jitter. In a typical DSO design the ADC081000 digitizes the post-attenuator/amplifier signal, with the FPGA performing trigger, decimation, and display processing.
추천
Spectrum Analyzer IF Digitizer
At a 1 GSPS sample rate the ADC081000 digitizes intermediate-frequency signals in the 0-500 MHz band for digital-IF spectrum analyzers. The folding/interpolating architecture delivers low aperture delay under 2 ns, enabling real-time FFT processing without pipeline-latency compensation. Designers pair the converter with an FPGA-based FFT accelerator running at the LVDS data rate (DDR-CMOS at 250 MHz x 8 bits = 2 Gbps LVDS aggregate), enabling 100 kHz resolution bandwidth FFTs without aliasing from the converter.
추천
Radar IF Sampling
Pulsed-radar receivers down-convert RF to a 100-400 MHz IF that the ADC081000 digitizes at 1 GSPS, capturing the full pulse envelope and supporting moving-target indication. The 7.0 ENOB dynamic range is adequate for primary radar at moderate PRF; the internal sample-and-hold and 1.4 GHz input bandwidth ease analog front-end design. The exposed-pad HLQFP provides sufficient thermal margin for continuous 1 GSPS operation in airborne radar pods with proper PCB thermal design.
추천
Test & Measurement Instrumentation
Automated test equipment (ATE) and bench-top instruments leverage the ADC081000's 1 GSPS capability for capturing repetitive waveforms with picosecond-class timing resolution. The differential clock input accepts a low-jitter source such as an LMK04800, and the selectable DDR-CMOS or LVDS output directly drives FPGAs for waveform averaging and statistical analysis. The 1.9 V dual-supply design requires careful PCB layout with separate analog/digital ground planes stitched at the exposed pad.
추천
Digital Pre-Distortion Feedback Loops
Wideband wireless base-station transmitters use ADC081000-class converters in the DPD (digital pre-distortion) feedback path to sample the PA output and correct AM-AM/AM-PM distortion. Sampling at 1 GSPS with a 200-400 MHz IF accommodates LTE/5G NR signal bandwidths up to 100 MHz plus observation bandwidth. The selectable LVDS output easily fits the FPGA-based DPD engine running at hundreds of MSPS of complex signal processing.
추천
Optical Sampling & LIDAR Receiver
Pulsed optical receivers (LIDAR, time-of-flight sensors) use the ADC081000 to digitize echo returns sampled at 1 GSPS, achieving 1 ns time-bin resolution for short-range depth mapping. The 1.4 GHz analog input bandwidth matches the fast-edge transimpedance amplifier signal chain, while the folding/interpolating architecture minimizes pipeline latency. With two ADCs interleaved on a common clock, the effective sample rate can be doubled to 2 GSPS without redesigning the analog front end.
추천
추천 제품 요약
엔지니어링 참조 데이터: ADC081000CIYB — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ADC081000CIYB/NOPB | ADC083000CIYB | ADC081000CIYB |
|---|---|---|---|---|
| Package | 128-HLQFP (20x20 mm, exposed pad) | 128-HLQFP (20x20 mm, exposed pad) - same | 128-HLQFP (20x20 mm, exposed pad) - same | 128-HLQFP (20x20 mm, exposed pad) - same |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Resolution | 8 bit | 8 bit | 8 bit | 8 bit |
| Max Sample Rate | 1 GSPS | 1 GSPS | 3 GSPS | 1 GSPS |
| Input Bandwidth | 1.4 GHz | 1.4 GHz | 2.7 GHz | 1.4 GHz |
| ENOB at 500 MHz | 7.0 bits (typical) | 7.0 bits | 6.8 bits | 7.0 bits |
| Supply Voltage | 1.9 V analog + 1.9 V digital | 1.9 V + 1.9 V | 1.9 V + 1.9 V | 1.9 V + 1.9 V |
| Power Dissipation | 1.4 W at 1 GSPS | 1.4 W at 1 GSPS | 3.5 W at 3 GSPS | 1.4 W at 1 GSPS |
| Output Format | LVDS or DDR CMOS | LVDS or DDR CMOS | LVDS or DDR CMOS | LVDS or DDR CMOS |
| RoHS Status | Leaded variant | RoHS compliant (lead-free) | RoHS compliant | Leaded variant |
주요 차별점
- Pin-compatible upgrade path to 3 GSPS (vs ADC083000CIYB)
- Lower power dissipation than 3 GSPS variant (vs ADC083000CIYB)
- RoHS-compliant variant available with identical die (vs ADC081000CIYB/NOPB)
- Internal reference eliminates external noise injection (vs External-reference ADCs)
설계 노트
Estimated: At 1 GSPS continuous operation, the ADC081000 dissipates approximately 1.4 W. With the 128-HLQFP exposed-pad package having a theta_JC of approximately 1.8 C/W and theta_JA around 18 C/W on a 4-layer JEDEC board, the junction-to-ambient temperature rise is approximately 25 C. Above 70 C ambient, additional copper area or active airflow is recommended. The exposed pad must be soldered directly to a continuous copper pour on the top layer, with a 4 x 4 thermal-via array stitching to all four inner-layer ground planes to keep the junction below 110 C.
Use a 4-layer (or 6-layer) PCB with separate analog and digital/digital-IO ground planes that join only at the ADC's exposed pad. Place 0.1 µF X7R bypass capacitors within 5 mm of every VA1.9, VD1.9, and VBY1.9 pin pair, plus 10 µF bulk caps on each supply. Route the differential analog input (VIN+/VIN-) and the differential clock (CLK+/CLK-) on 100 ohm controlled-impedance traces with length matching within ±0.5 mm. Keep all LVDS data pairs length-matched within ±0.25 mm and skew-matched across lanes to avoid bit-skew.
Estimated: Source the differential clock from a low-jitter generator (e.g., TI LMK04800 or LMK03806) with sub-200 fs RMS jitter to keep aperture-induced SNR degradation below 0.5 dB. Terminate the clock pair at the ADC's pins with 100 ohm differential, not at the source. Use an external clock-jitter budget under 0.5 ps RMS to maintain the rated 7.0 ENOB at 500 MHz input. AC-couple the clock if the source is biased at a non-standard common-mode voltage.
Do not exceed the absolute maximum 2.2 V supply on any VA1.9, VD1.9, or VBY1.9 pin; over-voltage damages the LVDS drivers. Always enable the analog supply first, then the digital supply, with a controlled 1 ms ramp to prevent latch-up. The TEST pins (76-80) are factory-test points and must be left floating - they are NOT reserved for customer use. Failure to solder the exposed die-attach pad during assembly causes thermal runaway at 1 GSPS continuous operation.
규정 준수 정보
The bare ADC081000CIYB uses a leaded finish and is NOT RoHS compliant. The /NOPB variant (ADC081000CIYB/NOPB) is RoHS compliant with matte-tin lead-free finish. Reach compliance and conflict-minerals statement are per TI Product Ecology documents. AEC-Q100 qualification is not applicable - this part is rated industrial (-40 C to +85 C), not automotive.
