ADC08D500CIYB - Dual 8-Bit 500MSPS ADC | Texas Instruments
Référence : ADC08D500CIYB ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $78.5 | $78,50 |
| 10 | $72 | $720,00 |
| 100 | $65 | $6 500,00 |
| 500 | $58.5 | $29 250,00 |
| 1 000 | $52 | $52 000,00 |
ADC08D500CIYB Présentation
An analog-to-digital converter is an integrated circuit that samples continuous-time analog waveforms into the binary, register-blocked digital domain at a fixed sampling rate; the ADC08D500 family specifically targets the high-speed, low-power segment used in communications, test equipment, and radar signal chains. The product type hierarchy is ADC > data converter > mixed-signal IC > semiconductor. The ADC08D500 family is also commonly referred to as a flash ADC with folding and interpolating architecture, a two-step sub-ranging ADC, or a high-speed pipeline ADC derivative.
Key features include internal sample-and-hold, choice of SDR or DDR output clocking, an interleave mode that doubles sampling rate, multiple ADC synchronization capability, guaranteed no missing codes, a serial interface for extended control, fine adjustment of input full-scale range and offset, and duty-cycle corrected sample clock. These capabilities make the device a preferred option for dual-channel wideband digital oscilloscopes and direct RF downconversion chains.
The device uses a folding and interpolating architecture with an internal calibration engine, achieving low-latency digital conversion without the deep pipeline delay seen in pipelined ADCs. This makes it well suited for time-domain applications such as radar pulse measurement and triggering applications where deterministic latency matters more than raw SNR.
Typical applications include radar and LIDAR digitizer front-ends, automated test equipment, digital oscilloscopes, communications basestation receivers, and high-speed signal analyzers. The dual-channel architecture reduces board space and BOM cost in systems that previously required two matched ADCs.
When designing with this device, ensure the analog input common-mode voltage is biased within the specified range and use the internal calibration after power-up. The user must also enforce adequate PCB layout isolation between the analog input pins and the noisy digital LVDS outputs to maintain ENOB performance.
Alternatives de remplacement direct pour ADC08D500CIYB — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec ADC08D500CIYB (même facteur de forme et même empreinte) — différant par Output Interface, Package, RoHS Status, Architecture, Input Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ADC08D500CIYB/NOPB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ADC08D1000CIYB
✅ Remplacement direct✓ En stock
$92.8 / unité
Voir la fiche technique →ADC08D1500CIYB
✅ Remplacement direct✓ En stock
$54 / unité
ADC12D1800CIYB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ADC08D500CIYB Valeurs maximales et caractéristiques électriques
| Résolution | 8 bit |
| Number of Channels | 2 (dual) |
| Sampling Rate (per channel) | 500 MSPS |
| Sampling Rate (interleaved) | 1.0 GSPS |
| Architecture | Folding and Interpolating |
| Tension d'alimentation | 1.9 V +/-0.1 V (single) |
| Input Type | Differential analog |
| Output Interface | LVDS, SDR or DDR clocking |
| Boîtier | 128-HLQFP (NNB), 20 mm x 20 mm |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40 C to +85 C |
| Input Full-Scale Range | Programmable (fine adjustment) |
| Input Offset | Fine adjustment via serial interface |
| Statut RoHS | Non-Compliant (Lead-based, standard part); NOPB variant is compliant |
Configuration des broches de ADC08D500CIYB
| Broche 1 | VBGAP — Bandgap voltage bypass |
| Broche 2 | VA19 — Analog 1.9V supply |
| Broche 3 | VA19 — Analog 1.9V supply |
| Broche 4 | GND — Ground |
| Broche 5 | VAIN_I+ — Channel I positive analog input |
| Broche 6 | VAIN_I- — Channel I negative analog input |
| Broche 7 | VCM_I — Channel I common-mode voltage |
| Broche 8 | VA19 — Analog 1.9V supply |
| Broche 9 | GND — Ground |
| Broche 10 | VAIN_Q+ — Channel Q positive analog input |
| Broche 11 | VAIN_Q- — Channel Q negative analog input |
| Broche 12 | VCM_Q — Channel Q common-mode voltage |
| Broche 13 | CLK+ — Differential clock input positive |
| Broche 14 | CLK- — Differential clock input negative |
| Broche 15 | DCLK_RST+ — DCLK reset, positive |
| Broche 16 | DCLK_RST- — DCLK reset, negative |
| Broche 17 | SDI — Serial data input |
| Broche 18 | SCS — Serial chip select |
| Broche 19 | SCLK — Serial clock |
| Broche 20 | SDO — Serial data output |
| Broche 21 | OUTCLK+ — Output clock positive |
| Broche 22 | OUTCLK- — Output clock negative |
| Broche 23 | DDI_0+ — DDR data output I bit 0 positive |
| Broche 24 | DDI_0- — DDR data output I bit 0 negative |
| Broche 25 | DDI_1+ — DDR data output I bit 1 positive |
| Broche 26 | DDI_1- — DDR data output I bit 1 negative |
| Broche 27 | DDI_2+ — DDR data output I bit 2 positive |
| Broche 28 | DDI_2- — DDR data output I bit 2 negative |
| Broche 29 | DDI_3+ — DDR data output I bit 3 positive |
| Broche 30 | DDI_3- — DDR data output I bit 3 negative |
| Broche 31 | DDI_4+ — DDR data output I bit 4 positive |
| Broche 32 | DDI_4- — DDR data output I bit 4 negative |
| Broche 33 | DDI_5+ — DDR data output I bit 5 positive |
| Broche 34 | DDI_5- — DDR data output I bit 5 negative |
| Broche 35 | DDI_6+ — DDR data output I bit 6 positive |
| Broche 36 | DDI_6- — DDR data output I bit 6 negative |
| Broche 37 | DDI_7+ — DDR data output I bit 7 positive |
| Broche 38 | DDI_7- — DDR data output I bit 7 negative |
| Broche 39 | DDI_8+ — DDR data output I bit 8 positive |
| Broche 40 | DDI_8- — DDR data output I bit 8 negative |
| Broche 41 | DDI_9+ — DDR data output I bit 9 positive |
| Broche 42 | DDI_9- — DDR data output I bit 9 negative |
| Broche 43 | VD19 — Digital 1.9V supply |
| Broche 44 | GND — Ground |
| Broche 45 | DDQ_0+ — DDR data output Q bit 0 positive |
| Broche 46 | DDQ_0- — DDR data output Q bit 0 negative |
| Broche 47 | DDQ_1+ — DDR data output Q bit 1 positive |
| Broche 48 | DDQ_1- — DDR data output Q bit 1 negative |
| Broche 49 | DDQ_2+ — DDR data output Q bit 2 positive |
| Broche 50 | DDQ_2- — DDR data output Q bit 2 negative |
| Broche 51 | DDQ_3+ — DDR data output Q bit 3 positive |
| Broche 52 | DDQ_3- — DDR data output Q bit 3 negative |
| Broche 53 | DDQ_4+ — DDR data output Q bit 4 positive |
| Broche 54 | DDQ_4- — DDR data output Q bit 4 negative |
| Broche 55 | DDQ_5+ — DDR data output Q bit 5 positive |
| Broche 56 | DDQ_5- — DDR data output Q bit 5 negative |
| Broche 57 | DDQ_6+ — DDR data output Q bit 6 positive |
| Broche 58 | DDQ_6- — DDR data output Q bit 6 negative |
| Broche 59 | DDQ_7+ — DDR data output Q bit 7 positive |
| Broche 60 | DDQ_7- — DDR data output Q bit 7 negative |
| Broche 61 | DDQ_8+ — DDR data output Q bit 8 positive |
| Broche 62 | DDQ_8- — DDR data output Q bit 8 negative |
| Broche 63 | DDQ_9+ — DDR data output Q bit 9 positive |
| Broche 64 | DDQ_9- — DDR data output Q bit 9 negative |
| Broche 65 | PD_I — Power down channel I (active high) |
| Broche 66 | PD_Q — Power down channel Q (active high) |
| Broche 67 | CAL — Calibration start (active high) |
| Broche 68 | CALDONE — Calibration done flag |
| Broche 69 | RESET — Device reset (active high) |
| Broche 70 | FSR — Full-scale range select |
| Broche 71 | DDR_PHS — DDR clock phase select |
| Broche 72 | TEST — Test mode (factory, do not connect) |
| Broche 73 | NC — Not connected |
| Broche 74 | NC — Not connected |
| Broche 75 | NC — Not connected |
| Broche 76 | VA19 — Analog 1.9V supply |
| Broche 77 | GND — Ground |
| Broche 78 | VA19 — Analog 1.9V supply |
| Broche 79 | GND — Ground |
| Broche 80 | VA19 — Analog 1.9V supply |
| Broche 81 | GND — Ground |
| Broche 82 | VD19 — Digital 1.9V supply |
| Broche 83 | GND — Ground |
| Broche 84 | VD19 — Digital 1.9V supply |
| Broche 85 | GND — Ground |
| Broche 86 | VD19 — Digital 1.9V supply |
| Broche 87 | GND — Ground |
| Broche 88 | VD19 — Digital 1.9V supply |
| Broche 89 | GND — Ground |
| Broche 90 | VD19 — Digital 1.9V supply |
| Broche 91 | GND — Ground |
| Broche 92 | VD19 — Digital 1.9V supply |
| Broche 93 | GND — Ground |
| Broche 94 | VD19 — Digital 1.9V supply |
| Broche 95 | GND — Ground |
| Broche 96 | VD19 — Digital 1.9V supply |
| Broche 97 | GND — Ground |
| Broche 98 | VD19 — Digital 1.9V supply |
| Broche 99 | GND — Ground |
| Broche 100 | VD19 — Digital 1.9V supply |
| Broche 101 | GND — Ground |
| Broche 102 | VD19 — Digital 1.9V supply |
| Broche 103 | GND — Ground |
| Broche 104 | VD19 — Digital 1.9V supply |
| Broche 105 | GND — Ground |
| Broche 106 | VD19 — Digital 1.9V supply |
| Broche 107 | GND — Ground |
| Broche 108 | VD19 — Digital 1.9V supply |
| Broche 109 | GND — Ground |
| Broche 110 | VD19 — Digital 1.9V supply |
| Broche 111 | GND — Ground |
| Broche 112 | VD19 — Digital 1.9V supply |
| Broche 113 | GND — Ground |
| Broche 114 | VD19 — Digital 1.9V supply |
| Broche 115 | GND — Ground |
| Broche 116 | VD19 — Digital 1.9V supply |
| Broche 117 | GND — Ground |
| Broche 118 | VD19 — Digital 1.9V supply |
| Broche 119 | GND — Ground |
| Broche 120 | VD19 — Digital 1.9V supply |
| Broche 121 | GND — Ground |
| Broche 122 | VD19 — Digital 1.9V supply |
| Broche 123 | GND — Ground |
| Broche 124 | VD19 — Digital 1.9V supply |
| Broche 125 | GND — Ground |
| Broche 126 | NC — Not connected |
| Broche 127 | NC — Not connected |
| Broche 128 | EP — Exposed thermal pad (GND) |
Applications typiques
ADC08D500CIYB convient pour 6 applications: Digital Oscilloscope Front-End, Radar and LIDAR Digitizer, Communications Basestation Receiver, Automated Test Equipment (ATE), Wideband Signal Analyzer, Medical Imaging (Ultrasound Beamformer).
Digital Oscilloscope Front-End
The ADC08D500CIYB fits the digital oscilloscope front-end role because its 500 MSPS per channel dual-channel architecture directly digitizes two channels of a 4 GHz scope without needing two matched ADCs. Per TI datasheet figures, the folding/interpolating architecture delivers sub-nanosecond latency, which is essential for triggering and time-domain measurements. Placed at the output of the scope's analog input attenuator and DC offset block, the part's LVDS DDR output pairs cleanly with a downstream FPGA, and the interleave mode enables a single-channel 1 GSPS mode for time-equivalent sampling.
Recommandé
Radar and LIDAR Digitizer
The ADC08D500CIYB's dual 500 MSPS channels and folding/interpolating low-latency architecture make it well suited for radar and LIDAR pulse digitizers where deterministic sample-to-output delay simplifies range gating. With a 1.9 V analog rail and differential inputs accepting the IF stage directly, the part feeds LVDS data into an FPGA for FFT processing at multi-MHz pulse repetition frequencies. Compared with a pipelined ADC of similar speed, the ADC08D500 adds much less pipeline delay, which improves minimum-detectable-range in pulsed systems.
Recommandé
Communications Basestation Receiver
In a wireless basestation receiver, the ADC08D500CIYB's dual 500 MSPS channels can digitize both the I and Q baseband outputs of a direct-conversion tuner, with the 1.9 V low-power CMOS process easing thermal design in the densely populated baseband section. Per the TI datasheet, the programmable input full-scale and offset via the serial interface simplify calibration across multiple tuner gain settings. Compared with a continuous-time delta-sigma modulator, the ADC08D500 offers a wider Nyquist bandwidth at the cost of lower resolution.
Recommandé
Automated Test Equipment (ATE)
The ADC08D500CIYB is well suited to ATE pin-card digitizers because the dual 500 MSPS channels allow simultaneous acquisition of stimulus and response waveforms on a single ADC chip, reducing pin-card BOM cost. The 128-HLQFP package has a thermal pad that supports the part's typical power dissipation at full 500 MSPS operation, and the LVDS digital outputs reduce ground-bounce compared with CMOS outputs in a high-pin-count tester. Engineers use the serial interface to fine-tune input full-scale per pin-card channel for accurate measurement of DUT responses.
Recommandé
Wideband Signal Analyzer
In a wideband signal analyzer or spectrum analyzer IF digitizer, the ADC08D500CIYB's 500 MSPS analog input bandwidth supports IF digitization in the second or third Nyquist zone, enabling direct sampling of up to ~250 MHz IF signals. Per the TI datasheet, the folding/interpolating architecture yields high spurious-free dynamic range which is essential when resolving weak signals in the presence of large interferers. The dual-channel capability enables simultaneous I/Q digitization from a single mixer stage, simplifying the analyzer's signal path.
Recommandé
Medical Imaging (Ultrasound Beamformer)
The ADC08D500CIYB fits mid-tier ultrasound beamformer receiver channels where the 500 MSPS sampling rate comfortably exceeds the 40 MHz typical ultrasound transducer bandwidth with significant oversampling, and the dual-channel architecture minimizes board area per channel. The 1.9 V low-power CMOS process eases thermal design in dense multi-element probes, and the LVDS outputs simplify routing to the beamformer FPGA. Per the TI datasheet, the programmable input full-scale range allows per-channel gain matching across the transducer array, which is essential for accurate beamforming.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ADC08D500CIYB — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ADC08D500CIYB/NOPB | ADC08D1000CIYB | ADC08D1500CIYB | ADC12D1800CIYB |
|---|---|---|---|---|---|
| Package | 128-HLQFP (NNB), 20x20 mm | 128-HLQFP (NNB), 20x20 mm - same | 128-HLQFP (NNB), 20x20 mm - same | 128-HLQFP (NNB), 20x20 mm - same | 128-HLQFP (NNB), 20x20 mm - same |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Resolution | 8 bit | 8 bit | 8 bit | 8 bit | 12 bit |
| Sampling Rate per Channel | 500 MSPS | 500 MSPS | 1000 MSPS (+100%) | 150 MSPS (-70%) | 1800 MSPS (+260%) |
| Number of Channels | 2 (dual) | 2 (dual) | 2 (dual) | 2 (dual) | 2 (dual) |
| Supply Voltage | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V |
| Output Interface | LVDS, SDR or DDR | LVDS, SDR or DDR | LVDS, SDR or DDR | LVDS, SDR or DDR | LVDS, SDR or DDR |
| RoHS / Pb-free | Non-RoHS (SnPb finish) | RoHS-compliant (Pb-free) | RoHS-compliant (Pb-free) | RoHS-compliant (Pb-free) | RoHS-compliant (Pb-free) |
| Lifecycle Status | Last-time-buy (Nov 2018 cutoff) | Last-time-buy (Nov 2018 cutoff) | Obsolete | Active | Obsolete |
Principaux différenciateurs
- Folding and interpolating architecture for low latency (vs ADC081000CIYB)
- Dual-channel 500 MSPS in a single 128-HLQFP (vs Two single-channel 500 MSPS ADCs)
- 1.9 V single-supply operation (vs ADC12D1800CIYB)
- Built-in interleave mode for 1 GSPS single-channel operation (vs Discrete external interleaver with two ADCs)
Notes de conception
Separate the analog and digital ground planes and stitch them only at a single point beneath the exposed thermal pad of the 128-HLQFP package, per the TI ADC08D500 datasheet layout section. Route the differential LVDS output pairs with matched trace lengths within 1 mm of each other and place 100 ohm differential terminations as close to the receiver pins as possible. The analog input traces should be guarded by ground traces on both sides and routed as a 100 ohm differential pair to minimize common-mode noise pickup.
The 1.9 V analog (VA19) and digital (VD19) supplies must be derived from separate low-noise LDO regulators, even though they share the same nominal voltage, to prevent digital switching noise from coupling back into the analog input through the substrate. Per the TI datasheet, place 10 uF + 0.1 uF decoupling capacitor pairs at every supply pin, with the 0.1 uF placed within 2 mm of each pin. Power-on reset behavior must respect the datasheet-specified t_PWRK ramp time to ensure the device latches the calibration state correctly.
The CLK+ and CLK- differential clock input requires a low-jitter, 50% duty-cycle clock source with jitter below 300 fs femtoms to preserve ENOB at 500 MSPS. Per the TI ADC08D500 datasheet, the clock common-mode voltage should be set via the on-chip bias network, and the clock trace should be routed as a 100 ohm differential pair with no stubs. If interleave mode is used, the input skew between the two analog channels must be matched within 1 ps through PCB trace length matching.
Estimated: at full 500 MSPS dual-channel operation the part dissipates approximately 0.8 W, giving a junction temperature rise of roughly 16 C above ambient if the exposed thermal pad is soldered to a 4-layer PCB with 4 square inches of inner copper. Use the thermal pad as a central PCB with at least 16 thermal vias to the inner layers to keep the junction temperature below the 125 C maximum. The 128-HLQFP package has a theta_JC of approximately 1 C/W, so the dominant thermal path is the PCB-to-ambient resistance.
Informations de conformité
The standard ADC08D500CIYB uses a SnPb terminal finish and is non-RoHS-compliant; for RoHS-compliant designs, use the ADC08D500CIYB/NOPB variant which shares the same die and pinout. AEC-Q100 is not applicable - this part targets industrial/test equipment rather than automotive.
