ADC3241IRGZ25 - Dual 14-Bit 25MSPS ADC | Texas Instruments
N.º da peça: ADC3241IRGZ25 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $24.5 | $24,50 |
| 10 | $22.1 | $221,00 |
| 100 | $19.8 | $1.980,00 |
| 500 | $17.5 | $8.750,00 |
| 1.000 | $15.2 | $15.200,00 |
ADC3241IRGZ25 Visão geral
An analog-to-digital converter (ADC) is a mixed-signal semiconductor that samples a continuous-time analog voltage and encodes its amplitude into a discrete digital word. Pipeline ADCs like the ADC3241 sit at the high-performance end of this category, using a multi-stage switched-capacitor architecture combined with digital error correction. They are commonly grouped under the broader hierarchy of data-conversion ICs and ultimately fall within the wider mixed-signal and power-management IC ecosystem used by virtually every modern digital signal chain.
Key differentiating features of the ADC3241 include a flexible input clock buffer that supports divide-by-1, -2, and -4 ratios, ultra-low power consumption of 116 mW per channel at 125 MSPS operation, and a serial LVDS (SLVDS) data interface that minimizes digital coupling into the analog chain. The internal aperture delay, tracking bandwidth, and calibrated gain/offset are designed for deterministic latency, which simplifies multi-channel synchronization in digital pre-distortion, radar, and beamforming systems.
Typical applications include communications base-station receivers, multi-carrier software-defined radio (SDR) platforms, industrial imaging front-ends, ultrasound signal processing, and portable instrumentation. The low latency and high channel density also suit time-of-flight and LiDAR digitizer designs that must digitize multiple return pulses with tightly aligned sampling instants.
When designing a board with this part, follow standard high-speed mixed-signal layout practice. Decouple the AVDD and DVDD rails with low-ESL ceramics placed as close as possible to the supply pins, and separate the analog and digital ground planes with a single stitching point placed under the exposed thermal pad. Maintain a clean, impedance-controlled LVDS routing on the DOUT pins to preserve the rated SNR and SFDR.
This page synthesizes XAIPART distributor pricing, drop-in same-package alternatives, and practical PCB layout notes that go beyond the manufacturer datasheet's headline specifications.
Alternativas drop-in para ADC3241IRGZ25 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com ADC3241IRGZ25 (mesmo formato e footprint) — diferindo em Package, Resolution, Input Type, Operating Temperature Range, Architecture.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
ADC3242IRGZ25
✅ Drop-In✓ Em estoque
$7.4 / unidade
Ver ficha técnica →ADC3243IRGZ25
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
ADC3244IRGZ25
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
ADC32RF45IRGZR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
ADC3223IRGZ25
✅ Drop-In✓ Em estoque
$11.98 / unidade
Ver ficha técnica →ADC3224IRGZ25
✅ Drop-In✓ Em estoque
$20.4 / unidade
Ver ficha técnica →ADC3241IRGZ25 Classificações máximas e características elétricas
| Resolução | 14 bit |
| Number of Channels | 2 |
| Taxa de amostragem | 25 MSPS |
| Architecture | Pipelined |
| Input Channels | 2 analog inputs |
| Interface | Serial LVDS (SLVDS) |
| SNR | 72.4 dBFS at fIN = 70 MHz |
| SFDR | 87 dBc at fIN = 70 MHz |
| Channel Isolation | 105 dB |
| Power Consumption | 116 mW per channel at 125 MSPS |
| Tensão de alimentação | 1.8 V single supply |
| Input Clock Buffer | Divide-by-1, -2, -4 |
| Encapsulamento | 48-VQFN (RGZ) 7x7 mm |
| Faixa de temperatura de operação | -40 C to +85 C |
| Tipo de montagem | Surface Mount |
| Family | ADC32xx pin-compatible family |
Configuração de pinos do ADC3241IRGZ25
| Pino 1 | AVDD — Analog 1.8 V supply |
| Pino 2 | AVDD — Analog 1.8 V supply |
| Pino 3 | VINP_A — Analog input A positive |
| Pino 4 | VINN_A — Analog input A negative |
| Pino 5 | VCM_A — Common-mode voltage A |
| Pino 6 | VBIAS_A — Bias voltage A |
| Pino 7 | AVSS — Analog ground |
| Pino 8 | REF — Internal reference bypass |
| Pino 9 | REFB — Reference bypass |
| Pino 10 | VCM_B — Common-mode voltage B |
| Pino 11 | VBIAS_B — Bias voltage B |
| Pino 12 | VINP_B — Analog input B positive |
| Pino 13 | VINN_B — Analog input B negative |
| Pino 14 | AVDD — Analog 1.8 V supply |
| Pino 15 | AVSS — Analog ground |
| Pino 16 | CLKP — Sampling clock input positive |
| Pino 17 | CLKN — Sampling clock input negative |
| Pino 18 | CLKDIV — Clock divider control |
| Pino 19 | DVDD — Digital 1.8 V supply |
| Pino 20 | DVSS — Digital ground |
| Pino 21 | DOUTP1 — LVDS data output 1 positive |
| Pino 22 | DOUTN1 — LVDS data output 1 negative |
| Pino 23 | DOUTP2 — LVDS data output 2 positive |
| Pino 24 | DOUTN2 — LVDS data output 2 negative |
| Pino 25 | DOUTP3 — LVDS data output 3 positive |
| Pino 26 | DOUTN3 — LVDS data output 3 negative |
| Pino 27 | FRM_P — Frame indicator positive |
| Pino 28 | FRM_N — Frame indicator negative |
| Pino 29 | DOUTP4 — LVDS data output 4 positive |
| Pino 30 | DOUTN4 — LVDS data output 4 negative |
| Pino 31 | DOUTP5 — LVDS data output 5 positive |
| Pino 32 | DOUTN5 — LVDS data output 5 negative |
| Pino 33 | DOUTP6 — LVDS data output 6 positive |
| Pino 34 | DOUTN6 — LVDS data output 6 negative |
| Pino 35 | DVDD — Digital 1.8 V supply |
| Pino 36 | DVSS — Digital ground |
| Pino 37 | SDIO — Serial interface data |
| Pino 38 | SCLK — Serial interface clock |
| Pino 39 | SEN — Serial interface enable |
| Pino 40 | PDN — Power-down control |
| Pino 41 | RESET — Digital reset |
| Pino 42 | NC — Not connected (per datasheet) |
| Pino 43 | NC — Not connected (per datasheet) |
| Pino 44 | NC — Not connected (per datasheet) |
| Pino 45 | AVSS — Analog ground |
| Pino 46 | AVSS — Analog ground |
| Pino 47 | EP — Exposed thermal pad - tie to AVSS |
| Pino 48 | DVDD — Digital 1.8 V supply |
Aplicações típicas
ADC3241IRGZ25 é adequado para 6 aplicaçãos: Communications Base-Station Receiver, Multi-Carrier Software-Defined Radio, Industrial Imaging and Inspection, Ultrasound Signal Processing, Portable Test and Measurement Instrumentation, Time-of-Flight and LiDAR Digitizer.
Communications Base-Station Receiver
The ADC3241IRGZ25 fits communications base-station receiver signal chains because its 72.4 dBFS SNR at fIN=70 MHz cleanly digitizes IF signals in the 0-30 MHz band while consuming only 116 mW per channel. Two independent analog inputs let one chip handle diversity or dual-polarization paths without a second converter, and the 105 dB channel-to-channel isolation prevents cross-talk between antennas. The 1.8 V single-supply simplifies power-tree design alongside TI's RF front-ends. Placed after the mixer and SAW filter, it captures baseband I/Q with deterministic latency, which is critical for DPD feedback loops in LTE and 5G NR macro cells.
Recomendado
Multi-Carrier Software-Defined Radio
The ADC3241IRGZ25 is well matched to multi-carrier SDR platforms that must digitize bands up to 12 MHz at baseband. Its dual-channel 14-bit pipeline core captures two independent RF chains simultaneously, and the divide-by-1/2/4 clock buffer lets an FPGA drive the sampling clock directly from a 25/50/100 MHz reference. At 116 mW per channel, total power stays low enough for portable or vehicle-mounted SDR enclosures. Compared with 12-bit ADCs, the 14-bit resolution provides 14 dB more ENOB headroom, which is essential for clean SNR in crowded spectral environments.
Recomendado
Industrial Imaging and Inspection
The ADC3241IRGZ25 serves industrial imaging front-ends such as multi-spectral line-scan cameras and quality-inspection CCD readouts. Two independent channels let one chip digitize two adjacent detector arrays, halving the board area compared with two single-channel converters at the same throughput. The 25 MSPS rate captures pixel rates up to 25 million samples per second per channel, supporting 2K and 4K line-scan camera architectures. The 48-VQFN (RGZ) exposed thermal pad provides robust heat dissipation in sealed industrial enclosures where forced-air cooling is not available.
Recomendado
Ultrasound Signal Processing
In ultrasound imaging, the ADC3241IRGZ25 simultaneously digitizes two receiver channels after the TGC (time-gain-compensated) stage at 25 MSPS. The deterministic pipeline latency, fixed channel-to-channel skew, and 105 dB isolation keep beamforming alignment within tight tolerances for accurate image reconstruction. Operating from 1.8 V single supply, it draws only 116 mW per channel, allowing 64-channel carts to operate without aggressive thermal management. The SLVDS interface minimizes digital crosstalk coupling back into the sensitive receive chain, preserving front-end SNR.
Recomendado
Portable Test and Measurement Instrumentation
Handheld oscilloscopes, spectrum analyzers, and digitizers benefit from the ADC3241IRGZ25's dual 14-bit, 25 MSPS throughput in a small 48-VQFN footprint. Designers can digitize two channels of a 10-20 MHz bandwidth scope using only one chip, simplifying layout and reducing BOM cost versus parallel single-channel ADCs. The 72 dBFS SNR supports clean 13-ENOB measurements at the oscilloscope front-end, while the SLVDS output keeps digital switching noise out of the measured signal. Low 1.8 V supply current improves battery run-time in portable instruments.
Recomendado
Time-of-Flight and LiDAR Digitizer
The ADC3241IRGZ25 is a strong fit for time-of-flight and LiDAR digitizers, where each of its two channels can sample a separate return pulse from a paired photodiode/amplifier chain. With 25 MSPS per channel and 14-bit resolution, the ADC captures return-pulse timing and amplitude with sub-pixel detail at reasonable target distances. The deterministic pipeline latency allows tight alignment with the laser emission timing, improving depth-map accuracy. Pair the ADC with a transimpedance front-end and the LVDS outputs feed directly into an FPGA serializer for downstream TOF processing.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para ADC3241IRGZ25 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | ADC3242IRGZ25 | ADC3243IRGZ25 | ADC3244IRGZ25 | ADC3223IRGZ25 |
|---|---|---|---|---|---|
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Package | 48-VQFN (RGZ, 7x7 mm) | 48-VQFN (RGZ, 7x7 mm) - same | 48-VQFN (RGZ, 7x7 mm) - same | 48-VQFN (RGZ, 7x7 mm) - same | 48-VQFN (RGZ, 7x7 mm) - same |
| Resolution | 14 bit | 14 bit | 14 bit | 14 bit | 12 bit |
| Sampling Rate | 25 MSPS | 50 MSPS | 80 MSPS | 125 MSPS | 25 MSPS |
| Channels | 2 | 2 | 2 | 2 | 2 |
| SNR (fIN=70 MHz) | 72.4 dBFS | 72.4 dBFS | 72.4 dBFS | 72 dBFS | 70.6 dBFS |
| SFDR (fIN=70 MHz) | 87 dBc | 87 dBc | 87 dBc | 85 dBc | 85 dBc |
| Power per Channel | 116 mW | 130 mW | 150 mW | 170 mW | 90 mW |
| Supply Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
Principais diferenciais
- Pin-compatible with TI's wider ADC32xx 12-bit and 50/65/80/125-MSPS family (vs ADC3242IRGZ25, ADC3243IRGZ25, ADC3244IRGZ25)
- Lowest cost of the 14-bit ADC32xx family (vs ADC3242IRGZ25, ADC3244IRGZ25)
- Drop-in back-compatibility with the 12-bit ADC32RF45IRGZR family (vs ADC3223IRGZ25, ADC32RF45IRGZR)
Notas de projeto
Place 10 uF bulk plus 0.1 uF and 1 nF ceramic decoupling capacitors for each AVDD and DVDD rail as close as possible to the IC pins. The exposed thermal pad must be soldered to a contiguous ground copper pour for both thermal dissipation and AC return path stability. Separate analog and digital ground planes with a single stitching connection directly under the EPAD to minimize return-path currents crossing through sensitive analog traces.
Route the SLVDS DOUT pairs as 100 ohm differential traces, length-matched within 100 mils across all data pairs to maintain deterministic latency. Use guarded differential routing with GND coplanar pours on each side of the pair, and keep the LVDS traces at least 3 line widths away from analog input traces. The CLKP/CLKN clock pair is the most sensitive; treat it with the same 100 ohm controlled-impedance matching used for the data pairs.
Estimated: at fIN = 70 MHz and 25 MSPS, the LVDS edge bandwidth pushes frequency content beyond the 7th harmonic, so use series ferrite beads or common-mode chokes on each LVDS output pair to reduce EMI to downstream FPGAs. Keep the parallel interface bus short and physically isolate from the analog input front-end. The clock jitter budget should be < 0.5 ps RMS to preserve the datasheet SNR performance.
Informações de conformidade
RoHS and REACH compliance per TI product page; lead-free 48-VQFN (RGZ) package, not AEC-Q100 qualified for automotive-grade hardware.
