AFS600-2FGG256 - 600K-Gate Mixed-Signal FPGA | Microchip
Référence : AFS600-2FGG256 ✓ ActifAFS600-2FGG256 Présentation
A mixed-signal FPGA is an FPGA that combines configurable digital logic with programmable analog blocks and embedded flash memory. Within the electronics hierarchy, it belongs to the FPGA and CPLD class, then to programmable-logic devices, and ultimately to semiconductors and embedded processing platforms. The Fusion architecture allows designers to implement control logic, interface functions, analog signal conditioning, and nonvolatile configuration within one monolithic device.
The verified family information identifies approximately 600,000 system gates and 13,824 configurable logic blocks. A related listing reports 7,000 logic elements, so published aggregations may use different counting conventions. The device supports 700 Mbps DDR operation and provides hot-swappable I/O, programmable output slew rate, programmable drive strength, and weak pull-up or pull-down resources.
The AFS600 family uses an advanced 130 nm, seven-layer-metal, flash-based CMOS process. Its nonvolatile flash configuration retains the programmed design when power is removed and supports Live at Power-Up. This architecture is useful when predictable startup behavior, field-reprogrammability, and consolidation of multiple fixed-function peripherals are more important than the power efficiency or logic density of a newer FPGA process.
Typical uses include industrial control and automation, industrial networking, sensor acquisition, data acquisition, communication equipment, and embedded control platforms that require configurable analog and digital resources. The 119 available I/O support external interfaces, while the 256-LBGA package provides dense board integration. Designers must still verify every power rail, differential interface, and high-speed memory connection against the complete manufacturer documentation before layout release.
The primary design consideration is package and power-rail planning. A 256-ball BGA demands careful escape routing, continuous ground planes, and assembly-process validation. Because no complete pin table is included in the supplied evidence, designers should use the official AFS600 datasheet and package drawing rather than inferring ball assignments from generic BGA conventions. The verified data also does not establish the exact meaning of the -2 speed suffix for this ordering code.
This page consolidates verified distributor pricing, same-package family alternatives, package details, and practical selection guidance that are not presented together on a single distributor listing. It distinguishes confirmed target-specific values from specifications published for related AFS600 members, helping engineers make a safer sourcing and design decision.
Alternatives de remplacement direct pour AFS600-2FGG256 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec AFS600-2FGG256 (même facteur de forme et même empreinte) — différant par Process Technology, Package, System Gates, Mounting Type, Configuration Memory.
P1AFS600-2FGG256
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
M7AFS600-FGG256
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →M7AFS600-FGG256I
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →M7AFS600-FG256I
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Voir la fiche technique →AFS600-2FG256C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
AFS600-2FGG256 Valeurs maximales et caractéristiques électriques
| Product Type | Fusion mixed-signal FPGA |
| System Gates | Approximately 600,000 gates |
| Configurable Logic Blocks | 13,824 CLBs |
| Reported Logic Elements | 7,000 LE |
| Number of I/O | 119 I/O |
| Boîtier | 256-LBGA |
| Package Pin Count | 256 balls |
| Package Pitch | 1.0 mm |
| Tension d'alimentation de fonctionnement | 1.5 V |
| Température de fonctionnement | 0°C to +70°C |
| Process Technology | 130 nm CMOS |
| Metal Layers | 7 layers |
| Configuration Memory | Nonvolatile flash |
| Power-Up Feature | Live at Power-Up |
| Maximum DDR Data Rate | 700 Mbps |
| I/O Features | Hot-swappable I/O, programmable slew rate, programmable drive strength, weak pull-up/pull-down |
| Type de montage | SMD/SMT |
| Packaging | Tray |
| Statut RoHS | RoHS compliant |
| Lead-Free Status | Lead free |
Guide de configuration des broches du AFS600-2FGG256 1.0 mm
Configuration des broches du AFS600-2FGG256 (boîtier 1.0 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour AFS600-2FGG256.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
AFS600-2FGG256 convient pour 6 applications: Industrial Automation Controllers, Sensor Acquisition and Signal Conditioning, Industrial Networking Equipment, Data Acquisition Instruments, Communications and Protocol Bridges, Embedded Control and Data Storage.
Industrial Automation Controllers
The AFS600-2FGG256 fits industrial automation controllers that combine deterministic control logic with configurable analog and data-capture functions. Its 600,000-equivalent-gate Fusion architecture, 119 I/O, nonvolatile flash configuration, and Live at Power-Up behavior support compact controllers that must retain their programmed logic through power interruptions. The 256-LBGA package also allows a high pin count without using a large leaded package. In a controller, the FPGA can implement machine-control sequencing, communication interfaces, status decoding, and peripheral bridging while retaining configuration after power removal. The verified 0°C to 70°C commercial range is appropriate for indoor industrial equipment, but enclosure temperature must remain within the rated limits.
Recommandé
Sensor Acquisition and Signal Conditioning
AFS600-2FGG256 is appropriate for sensor-acquisition systems where sensor outputs require programmable filtering, control, and interface conversion. The Fusion family's configurable analog resources allow selected analog functions to be integrated with digital logic, while 119 I/O provide connections to sensors, switches, and external converters. Its 1.5 V operating supply and flash-based configuration support compact embedded instruments that retain calibration or control configuration when powered down. The verified family data also identifies hot-swappable I/O and programmable drive strength, useful when system requirements demand controlled transitions. Engineers should still verify the exact analog block capabilities and supported acquisition rates in the manufacturer documentation before assigning inputs.
Recommandé
Industrial Networking Equipment
The AFS600-2FGG256 can support protocol conversion, packet handling, and embedded network-interface control in industrial communication equipment. Its 600,000-equivalent-gate logic capacity and 119 I/O offer substantial integration for interfaces that would otherwise require separate programmable logic and fixed-function devices. Flash-based configuration supports Live at Power-Up, allowing the device to become operational quickly after power restoration. The 256-LBGA footprint is suitable for multilayer boards with dense escape routing. For networking designs, engineers should evaluate the family's verified 700 Mbps DDR capability against the required data rate, confirm transceiver I/O standards, and budget careful routing for high-speed differential interfaces.
Recommandé
Data Acquisition Instruments
AFS600-2FGG256 is well suited to programmable data-acquisition instruments that require flexible timing, control, and data movement. The Fusion architecture combines configurable analog circuitry with flash-based programmable logic, allowing acquisition sequencing, digital filtering, and communication functions to share one device. The 119 I/O and 700 Mbps DDR capability cited for the family provide resources for parallel data paths and moderate-speed memory interfaces. Its nonvolatile configuration also preserves setup parameters when the instrument is powered down. Designers should derive external analog front-end requirements separately, because the verified evidence does not specify resolution, sampling rate, input bandwidth, or the precise ADC functions available in this ordering code.
Recommandé
Communications and Protocol Bridges
AFS600-2FGG256 is suitable for legacy-to-modern protocol bridges because it provides substantial programmable logic, 119 I/O, and nonvolatile configuration in a compact 256-ball package. A bridge can map parallel and serial interfaces, implement framing and error handling, and preserve its configuration through power cycles without a separate configuration PROM. The programmable output slew rate, drive strength, and weak pull-up or pull-down features documented for the family help engineers tailor interfaces to particular board-level conditions. Before selecting the device, verify that the required protocol rate, I/O standard, clock topology, and pin assignments are supported by the exact -2 speed and package combination.
Recommandé
Embedded Control and Data Storage
The AFS600-2FGG256 fits embedded control platforms that combine logic-intensive sequencing with local nonvolatile data handling. The Fusion family integrates large flash-memory blocks with programmable logic, enabling configuration, tables, or application data to be retained without an external memory device. Its 600,000-equivalent-gate capacity and 119 I/O provide room for multiple embedded peripherals, while Live at Power-Up supports deterministic initialization after power restoration. The 256-LBGA package improves functional density but requires exact ball assignment, multilayer routing, and assembly-process control. This is not a general-purpose processor replacement; software and hardware teams should determine whether the available logic and memory architecture meet the workload before committing to the device.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour AFS600-2FGG256 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Use AFS600-FGG256I or AFS600-FG256I when an industrial-grade ordering option is required, after confirming the exact temperature and qualification limits. AFS600-2FG256C provides a published 0°C-to-85°C range, 15°C above the target. No verified cross-brand, pin-compatible replacement was found, so Lattice ECP5, Xilinx Artix-7, or Intel Cyclone V should not be treated as drop-in replacements. For any substitution, validate pinout, power rails, timing, configuration memory, licensing, and PCB assembly constraints.
Comparaison avec les alternatives
| Paramètre | Ce produit | P1AFS600-2FGG256 | AFS600-FGG256 | AFS600-FGG256I | AFS600-FG256I | AFS600-2FG256C |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 256-LBGA | 256-LBGA | 256-LBGA | 256-LBGA | 256-LBGA | 256-FBGA |
| System Gates | 600,000 gates | 600,000 gates | 600,000 gates | 600,000 gates | 600,000 gates | 600,000 gates |
| Operating Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Configuration Memory | Nonvolatile flash | Nonvolatile flash | Nonvolatile flash | Nonvolatile flash | Nonvolatile flash | Nonvolatile flash |
| Maximum DDR Data Rate | 700 Mbps | 700 Mbps | 700 Mbps | 700 Mbps | 700 Mbps | 700 Mbps |
| Process Technology | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS |
| Special Ordering Feature | -2FGG256 suffix | P1 designation with matching -2FGG256 suffix | FGG256 suffix without -2 | I suffix denotes industrial grade | I suffix denotes industrial grade | C suffix with 0°C to +85°C rating |
Principaux différenciateurs
- Highest-confidence same-ordering-code match (vs P1AFS600-2FGG256)
- Higher published upper temperature limit (vs AFS600-2FG256C)
- Lower verified unit price for the comparable non-2 ordering code (vs AFS600-FGG256)
Notes de conception
Use the manufacturer package drawing and ball map as the controlling PCB footprint authority. The 256-LBGA package uses a verified 1.0 mm pitch, so fanout should be verified against the exact mechanical drawing rather than inferred from a generic BGA library. Reserve continuous ground-reference planes, inspect all escape routes with the assembly house, and confirm solder-mask, paste, and via-in-pad rules before fabrication release.
The verified listing identifies a 1.5 V operating supply, but it does not provide the complete core, analog, and I/O power-rail table. Design the power distribution network from the current AFS600 datasheet, including required sequencing, tolerances, decoupling values, and startup-current behavior. Do not assume that every 256-ball power ball can be connected solely through the same plane because return-current and package-ball assignments must follow the verified pinout.
Preserve controlled return paths beneath high-speed, clock, and sensitive analog routing. The family is documented for 700 Mbps DDR operation, so length matching, reference-plane continuity, and clock-routing topology require constraint-driven signoff. Where programmable I/O standards differ, review slew rate, drive strength, weak pull-up or pull-down settings, and termination against the attached device rather than applying one termination strategy to every interface.
Do not treat a same-family ordering code as an automatic substitute. AFS600-FGG256, AFS600-FGG256I, AFS600-FG256I, AFS600-2FG256C, and P1AFS600-2FGG256 all appear in the supplied evidence, but their suffixes may encode different speed, temperature, qualification, or commercial conditions. Validate the exact speed grade, temperature grade, timing, configuration, package, and lifecycle status against the manufacturer before substitution.
Informations de conformité
The supplied AFS600-2FGG256 specifications identify RoHS-compliant and lead-free status. No explicit REACH, halogen-free, conflict-minerals, or automotive-qualification evidence was provided. AEC-Q100 is marked not applicable because this industrial/commercial FPGA is not identified as an automotive-qualified ordering code.
