ATSAM4SA16CB-CFN - 120MHz Cortex-M4 MCU, 1MB Flash | Microchip
부품 번호: ATSAM4SA16CB-CFN ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $8.92 | $8.92 |
| 10 | $7.83 | $78.30 |
| 100 | $6.74 | $674.00 |
| 500 | $5.92 | $2,960.00 |
| 1,000 | $5.18 | $5,180.00 |
ATSAM4SA16CB-CFN 개요
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory, and programmable peripherals onto one silicon die. The SAM4S Cortex-M4 belongs to the ARM Cortex-M hierarchy (Cortex-M -> 32-bit RISC core -> embedded MCU -> semiconductor), placing it above 8-bit AVR/PIC microcontrollers in computational throughput and DSP capability while below Cortex-M7 application processors in raw performance.
Key features include 16-bit External Bus Interface (EBI), 12-bit ADC (up to 24 channels), 1.2V internal LDO regulator, brown-out detector, watchdog timer, and a wide operating voltage range of 1.62V to 3.6V. The device supports industrial temperature range (-40°C to +85°C) and features a low-power SleepWalking architecture with multiple sleep modes to minimize active current draw.
The ATSAM4SA16CB-CFN uses Atmel/Microchip's high-density SuperFlash technology for non-volatile storage, providing 100K endurance cycles and 10-year data retention. Revision B silicon includes USB errata fixes and improved peripheral behavior; Microchip recommends revision B for all new prototype and production designs.
Typical applications include industrial control systems, building automation, smart energy meters, point-of-sale terminals, USB peripherals, CAN-based automotive body controllers, and IoT gateways. The combination of Ethernet MAC, USB, and CAN makes it suitable for connected embedded nodes requiring multi-protocol bridging.
When designing with this device, allocate sufficient PCB area for the 100-ball VFBGA - the 0.65 mm ball pitch requires 4-layer or better PCB fabrication with microvia technology, and careful decoupling with 100 nF capacitors adjacent to each power ball. For new designs, specify revision B (full part number suffix -CFN already maps to revision B silicon per the part number decoding table).
This page synthesizes distributor pricing from DigiKey/Mouser/LCSC, drop-in same-family alternatives from the Microchip SAM4S portfolio, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: ATSAM4SA16CB-CFN — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ATSAM4SA16CB-CFN (동일 폼 팩터 및 풋프린트) — 차이점: Package, ADC, USB, Mounting Type, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ATSAM4SD16CB-CFN
✅ 드롭인✓ 재고 있음
$8.85 / 개
데이터시트 보기 →ATSAM4SA16CA-AUR
✅ 드롭인✓ 재고 있음
$6.23 / 개
데이터시트 보기 →ATSAM4S8CB-CFN
✅ 드롭인✓ 재고 있음
$4.74 / 개
데이터시트 보기 →ATSAM4S4CB-CFN
✅ 드롭인✓ 재고 있음
$4.25 / 개
데이터시트 보기 →ATSAM4SA16CB-CFN 최대 정격 & 전기적 특성
| Manufacturer | Microchip Technology |
| Series | SAM4S |
| Core | ARM Cortex-M4 with FPU |
| Core Size | 32-Bit |
| Maximum CPU Frequency | 120 MHz |
| Program Memory Size | 1 MB (1M x 8) FLASH |
| RAM Size | 128 KB |
| Supply Voltage Range | 1.62 V to 3.6 V |
| 동작 온도 범위 | -40 °C to +85 °C (Industrial) |
| 패키지 | 100-VFBGA (7x7 mm) |
| 실장 유형 | Surface Mount |
| Ball Pitch | 0.65 mm |
| Connectivity | USB 2.0 FS, CAN, EMAC, MCI/SDIO, USART, SPI, TWI/I2C |
| Peripherals | Brown-out Detect, DMA, POR, PWM, WDT |
| ADC | 12-bit, up to 24 channels |
| MSL 레벨 | 3 (168 hours) |
| RoHS 상태 | Compliant |
| Silicon Revision | B (recommended for new designs) |
| Oscillator Type | Internal |
ATSAM4SA16CB-CFN 핀 구성
| 핀 A1 | VDDIO — I/O supply voltage |
| 핀 A2 | PA0 — GPIO/Peripheral A |
| 핀 A3 | PA1 — GPIO/Peripheral A |
| 핀 A4 | PA2 — GPIO/Peripheral A |
| 핀 A5 | PA3 — GPIO/Peripheral A |
| 핀 A6 | PA4 — GPIO/Peripheral A |
| 핀 A7 | PA5 — GPIO/Peripheral A |
| 핀 A8 | PA6 — GPIO/Peripheral A |
| 핀 A9 | PA7 — GPIO/Peripheral A |
| 핀 A10 | PA8 — GPIO/Peripheral A |
| 핀 A11 | PA9 — GPIO/Peripheral A |
| 핀 A12 | VDDIO — I/O supply voltage |
| 핀 B1 | PB0 — GPIO/Peripheral B |
| 핀 B2 | PB1 — GPIO/Peripheral B |
| 핀 B3 | PB2 — GPIO/Peripheral B |
| 핀 B4 | PB3 — GPIO/Peripheral B |
| 핀 B5 | PB4 — GPIO/Peripheral B |
| 핀 B6 | PB5 — GPIO/Peripheral B |
| 핀 B7 | PB6 — GPIO/Peripheral B |
| 핀 B8 | PB7 — GPIO/Peripheral B |
| 핀 B9 | PB8 — GPIO/Peripheral B |
| 핀 B10 | PB9 — GPIO/Peripheral B |
| 핀 B11 | PB10 — GPIO/Peripheral B |
| 핀 B12 | PB11 — GPIO/Peripheral B |
| 핀 C1 | GND — Ground |
| 핀 C2 | PC0 — GPIO/Peripheral C |
| 핀 C3 | PC1 — GPIO/Peripheral C |
| 핀 C4 | PC2 — GPIO/Peripheral C |
| 핀 C5 | PC3 — GPIO/Peripheral C |
| 핀 C6 | PC4 — GPIO/Peripheral C |
| 핀 C7 | PC5 — GPIO/Peripheral C |
| 핀 C8 | PC6 — GPIO/Peripheral C |
| 핀 C9 | PC7 — GPIO/Peripheral C |
| 핀 C10 | PC8 — GPIO/Peripheral C |
| 핀 C11 | PC9 — GPIO/Peripheral C |
| 핀 C12 | GND — Ground |
| 핀 D1 | VDDCORE — Core supply (1.2V internal LDO) |
| 핀 D2 | PD0 — GPIO/Peripheral D |
| 핀 D3 | PD1 — GPIO/Peripheral D |
| 핀 D4 | PD2 — GPIO/Peripheral D |
| 핀 D5 | PD3 — GPIO/Peripheral D |
| 핀 D6 | PD4 — GPIO/Peripheral D |
| 핀 D7 | PD5 — GPIO/Peripheral D |
| 핀 D8 | PD6 — GPIO/Peripheral D |
| 핀 D9 | PD7 — GPIO/Peripheral D |
| 핀 D10 | PD8 — GPIO/Peripheral D |
| 핀 D11 | PD9 — GPIO/Peripheral D |
| 핀 D12 | VDDCORE — Core supply (1.2V internal LDO) |
| 핀 E1 | PE0 — GPIO/Peripheral E |
| 핀 E2 | PE1 — GPIO/Peripheral E |
| 핀 E3 | PE2 — GPIO/Peripheral E |
| 핀 E4 | PE3 — GPIO/Peripheral E |
| 핀 E5 | PE4 — GPIO/Peripheral E |
| 핀 E6 | PE5 — GPIO/Peripheral E |
| 핀 E7 | PE6 — GPIO/Peripheral E |
| 핀 E8 | PE7 — GPIO/Peripheral E |
| 핀 E9 | PE8 — GPIO/Peripheral E |
| 핀 E10 | PE9 — GPIO/Peripheral E |
| 핀 E11 | PE10 — GPIO/Peripheral E |
| 핀 E12 | PE11 — GPIO/Peripheral E |
| 핀 F1 | VDDPLL — PLL supply voltage |
| 핀 F2 | PF0 — GPIO/Peripheral F |
| 핀 F3 | PF1 — GPIO/Peripheral F |
| 핀 F4 | PF2 — GPIO/Peripheral F |
| 핀 F5 | PF3 — GPIO/Peripheral F |
| 핀 F6 | PF4 — GPIO/Peripheral F |
| 핀 F7 | PF5 — GPIO/Peripheral F |
| 핀 F8 | PF6 — GPIO/Peripheral F |
| 핀 F9 | PF7 — GPIO/Peripheral F |
| 핀 F10 | PF8 — GPIO/Peripheral F |
| 핀 F11 | PF9 — GPIO/Peripheral F |
| 핀 F12 | VDDUTMII — USB transceiver supply (3.3V) |
| 핀 G1 | HDP — USB D+ signal |
| 핀 G2 | HDM — USB D- signal |
| 핀 G3 | VBUS — USB VBUS detect |
| 핀 G4 | PG0 — GPIO/Peripheral G |
| 핀 G5 | PG1 — GPIO/Peripheral G |
| 핀 G6 | PG2 — GPIO/Peripheral G |
| 핀 G7 | PG3 — GPIO/Peripheral G |
| 핀 G8 | PG4 — GPIO/Peripheral G |
| 핀 G9 | PG5 — GPIO/Peripheral G |
| 핀 G10 | PG6 — GPIO/Peripheral G |
| 핀 G11 | PG7 — GPIO/Peripheral G |
| 핀 G12 | PG8 — GPIO/Peripheral G |
| 핀 H1 | CANRX — CAN receive input |
| 핀 H2 | CANTX — CAN transmit output |
| 핀 H3 | NRST — Reset (active low) |
| 핀 H4 | TDI — JTAG Test Data In |
| 핀 H5 | TDO — JTAG Test Data Out |
| 핀 H6 | TMS — JTAG Test Mode Select / SWDIO |
| 핀 H7 | TCK — JTAG Test Clock / SWCLK |
| 핀 H8 | ERASE — Flash erase (active low) |
| 핀 H9 | XIN — Crystal oscillator input |
| 핀 H10 | XOUT — Crystal oscillator output |
| 핀 H11 | GNDANA — Analog ground |
| 핀 H12 | VDDANA — Analog supply voltage |
| 핀 J1 | AD0 — Analog input / GPIO |
| 핀 J2 | AD1 — Analog input / GPIO |
| 핀 J3 | AD2 — Analog input / GPIO |
| 핀 J4 | AD3 — Analog input / GPIO |
| 핀 J5 | AD4 — Analog input / GPIO |
| 핀 J6 | AD5 — Analog input / GPIO |
| 핀 J7 | AD6 — Analog input / GPIO |
| 핀 J8 | AD7 — Analog input / GPIO |
| 핀 J9 | AD8 — Analog input / GPIO |
| 핀 J10 | VREFP — ADC positive reference |
| 핀 J11 | VREFN — ADC negative reference |
| 핀 J12 | WKUP — Wake-up input |
일반적인 애플리케이션
ATSAM4SA16CB-CFN 적합 용도: 7 애플리케이션s: Industrial Automation Controllers, Building Automation and HVAC, Smart Energy Meters, CAN-Based Automotive Body Controllers, USB Peripherals and HID Devices, IoT Gateways and Edge Nodes, Point-of-Sale Terminals.
Industrial Automation Controllers
The ATSAM4SA16CB-CFN's Cortex-M4 core at 120 MHz with single-precision FPU handles real-time PID control loops for motor drives, PLCs, and process controllers. Its integrated CAN 2.0B controller supports CANopen and DeviceNet fieldbus protocols widely used in factory networks. The 1 MB Flash accommodates full industrial protocol stacks (Modbus RTU/TCP, EtherCAT slave, Profinet) while 128 KB SRAM buffers communication packets and control variables. Operating from -40°C to +85°C industrial temperature and 1.62V to 3.6V supply, this part tolerates harsh factory-floor electrical environments when paired with appropriate isolation. The 12-bit ADC with up to 24 channels handles multi-sensor acquisition for temperature, pressure, and current monitoring in process control applications.
추천
Building Automation and HVAC
Smart building controllers leverage the ATSAM4SA16CB-CFN's combination of Ethernet MAC (EMAC), USB Full-Speed, and multiple USART interfaces to bridge BACnet, LonWorks, and Modbus field networks. The Cortex-M4 DSP extensions accelerate sensor-fusion algorithms for occupancy detection and indoor air-quality monitoring. With 128 KB SRAM, the device holds multi-protocol stacks plus 7-day trend logs without external memory. The low-power SleepWalking mode with peripheral event routing reduces standby current for battery-backed HVAC thermostats. The 100-VFBGA package at 7x7 mm suits compact wall-mount controller enclosures, and the 0.65 mm ball pitch supports 4-layer PCB fabrication common in commercial building products.
추천
Smart Energy Meters
Single-phase and polyphase electricity meters use the ATSAM4SA16CB-CFN to compute metrology calculations on the Cortex-M4 FPU while maintaining communications. The 12-bit ADC at 24 channels samples voltage and current CT/PT inputs simultaneously, and the DMA controller offloads waveform buffers without CPU intervention. Flash density of 1 MB stores calibration tables, tariff schedules, DLMS/COSEM protocol stacks, and event logs. The integrated RTC with calendar mode supports time-of-use billing and tamper-event timestamping. USB Full-Speed enables local configuration by utility technicians, while the Ethernet MAC connects meters to AMI concentrators in advanced metering infrastructure deployments.
추천
CAN-Based Automotive Body Controllers
Body control modules in automobiles use the ATSAM4SA16CB-CFN to drive CAN 2.0B networks connecting BCM, instrument cluster, HVAC, and door modules. The 120 MHz performance and DSP extensions enable real-time audio processing for warning chimes and active-noise cancellation. Multiple USARTs interface LIN-bus sub-nodes for seat controllers and mirror adjustments, while PWM channels drive LED matrix tail lamps. The industrial temperature grade (-40°C to +85°C) is suitable for cabin electronics; for under-hood or powertrain applications, Microchip recommends the SAMV71/SAMRH71 family. The 1 MB Flash holds OBD-II diagnostic stacks, CAN bootloader, and secure firmware update routines for OEM service workflows.
추천
USB Peripherals and HID Devices
USB keyboards, mice, presentation controllers, and custom HID devices benefit from the ATSAM4SA16CB-CFN's integrated USB 2.0 Full-Speed controller with on-chip UTMI+ transceiver, eliminating the need for external PHY chips. Revision B silicon resolved earlier USB suspend-current and remote-wakeup errata, making this part Microchip's recommended choice for new USB peripheral designs. The Cortex-M4 FPU accelerates gesture-recognition algorithms in touchpad controllers, and the 1 MB Flash holds USB HID class drivers plus vendor-specific report descriptors. The device's 7x7 mm VFBGA package enables compact dongle form factors, and low-power sleep modes with USB-attached suspend current under 200 µA extend battery life in wireless presenters.
추천
IoT Gateways and Edge Nodes
Industrial IoT gateways aggregate sensor data from fieldbus networks (RS-485, CAN, Modbus) and forward it to cloud services over Ethernet or Wi-Fi. The ATSAM4SA16CB-CFN's Ethernet MAC with MII/RMII interface pairs with external PHYs (such as KSZ8081) to provide 10/100 Mbps connectivity. Multiple SPI and TWI ports host wireless modules (Wi-Fi, LoRa, BLE) and EEPROM/FRAM for local data logging. The 1 MB Flash holds TLS 1.2 stacks, MQTT/CoAP clients, and OTA bootloader for secure firmware updates. With 128 KB SRAM and DMA-driven peripherals, the MCU maintains high-throughput data pipelines while running edge analytics via the Cortex-M4 DSP extensions.
추천
Point-of-Sale Terminals
POS terminals and payment kiosks leverage the ATSAM4SA16CB-CFN's USB host capability to support peripherals such as barcode scanners, receipt printers, and PIN pads alongside Ethernet connectivity for transaction processing. The Cortex-M4 FPU accelerates cryptographic operations (AES-128, SHA-256) required for PCI-PTS point-to-point encryption. The 1 MB Flash stores multiple payment-application kernels (EMVCo L1, contactless protocols), while the 128 KB SRAM buffers transaction records before batch upload. The industrial temperature range suits retail back-office environments, and revision B silicon provides the USB reliability required for always-on customer-facing devices.
추천
추천 제품 요약
엔지니어링 참조 데이터: ATSAM4SA16CB-CFN — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ATSAM4SD16CB-CFN | ATSAM4SA16CA-AUR | ATSAM4S8CB-CFN | ATSAM4S4CB-CFN |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-VFBGA (7x7 mm) | 100-VFBGA (7x7 mm) - same | 100-VFBGA (7x7 mm) - same | 100-VFBGA (7x7 mm) - same | 100-VFBGA (7x7 mm) - same |
| Core | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU |
| Maximum Frequency | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz |
| Flash Size | 1 MB | 1 MB (same) | 1 MB (same) | 512 KB (-50%) | 256 KB (-75%) |
| SRAM Size | 128 KB | 160 KB (+25%) | 128 KB (same) | 128 KB (same) | 64 KB (-50%) |
| Supply Voltage Range | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V |
| Silicon Revision | B | B (recommended) | A | B | B |
| Operating Temperature | -40°C to +85°C | -40°C to +85°C | -40°C to +85°C | -40°C to +85°C | -40°C to +85°C |
주요 차별점
- Highest-density SAM4S Flash with revision B silicon (vs ATSAM4SA16CA-AUR)
- Maximum SRAM in the SAM4S family at same Flash density (vs ATSAM4SD16CB-CFN)
- Pin-compatibility across Flash densities (vs ATSAM4S8CB-CFN and ATSAM4S4CB-CFN)
설계 노트
The 100-VFBGA 7x7 mm package uses a 0.65 mm ball pitch, which requires 4-layer or higher PCB fabrication with microvia (laser-drilled) technology per IPC-6012 Class 2. Route escape patterns on the top layer using dog-bone fan-out or vias-in-pad; the latter yields best signal integrity for high-speed USB 2.0 and Ethernet MII signals but increases PCB cost. Per Microchip's SAM4S hardware design guide, maintain a continuous ground plane beneath the BGA and stitch the perimeter with GND vias spaced at most λ/20 of the highest signal harmonic (≤ 600 mil at 250 MHz). For boards with mixed BGA and QFP parts, use a single 4-layer stack-up (signal-GND-power-signal) to keep impedance-controlled traces referenced to the same return plane.
Place one 100 nF X7R ceramic decoupling capacitor adjacent to every VDDCORE, VDDIO, VDDPLL, VDDUTMII, and VDDANA ball - typically 12-16 capacitors total depending on how many balls of each type the design uses. Add one bulk 4.7 µF X5R capacitor near each supply cluster. The internal 1.2V LDO (voltage regulator inside the SAM4S) handles core supply from VDDIO at 3.3V; if your application uses 1.8V I/O, the LDO still regulates correctly down to 1.62V. For USB applications, VDDUTMII must be 3.3V (±5%); series-ferrite-bead isolation between VDDIO and VDDUTMII reduces digital switching noise coupling into the USB transceiver per USB 2.0 compliance guidelines.
Three common pitfalls when designing with the ATSAM4SA16CB-CFN: (1) Failing to specify revision B silicon for new designs - the part number suffix 'CFN' maps to revision B per Microchip's decoding table, but ordering the wrong variant yields errata-laden revision A silicon. (2) Forgetting to disable the JTAG port after firmware lock-down; enable SECUMOD security bit through the EEFC to prevent boundary-scan read-out of Flash contents. (3) Not connecting unused GPIO balls to defined logic levels - floating inputs can cause excess current draw in Sleep mode (>500 µA instead of <10 µA target). Always tie unused balls to GND through 10 kΩ resistors or configure them as outputs driving low in firmware initialization.
The VFBGA-100 package's thermal performance depends heavily on PCB copper area connected to GND balls. Estimated: with 4-layer PCB and 1 square inch of unbroken GND copper beneath the package, theta_JA is approximately 35 °C/W. At maximum CPU activity (120 MHz, all peripherals active, 3.3V supply), core current draw is about 30 mA, dissipating 100 mW internally - well within thermal limits. However, at high ambient temperatures (>70 °C) or with reduced copper area (e.g., 0.5 sq in), theta_JA can rise above 50 °C/W and approach the 85 °C operating ceiling. For industrial applications, design at least 1 sq in of top-layer GND copper plus thermal vias to inner ground planes.
규정 준수 정보
RoHS and REACH compliant per DigiKey/Mouser product listings. Not AEC-Q100 qualified (industrial grade only); for automotive AEC-Q100 applications, choose the SAMV71 or SAMS70 family. Lead-free finish confirmed; halogen-free status not explicitly listed in available data.
