ATSAM4SD16CB-CN - 120MHz Cortex-M4 MCU, 1MB Flash | Microchip
Référence : ATSAM4SD16CB-CN ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.45 | $18,45 |
| 10 | $16.92 | $169,20 |
| 100 | $14.5 | $1 450,00 |
| 500 | $12.95 | $6 475,00 |
| 1 000 | $11.4 | $11 400,00 |
ATSAM4SD16CB-CN Présentation
What is a Cortex-M4 microcontroller? A Cortex-M4 MCU is a 32-bit embedded controller built around the ARM Cortex-M4 processor core, which includes a single-precision floating-point unit, DSP extensions (MAC, SIMD), and the deterministic NVIC interrupt controller. It sits in the hierarchy Cortex-M4 -> ARM Cortex-M -> 32-bit MCU -> microcontroller -> semiconductor, and compared with Cortex-M0/M3 parts it adds hardware floating-point and DSP instructions that accelerate signal-processing and control-loop code without software FPU libraries.
Key features include 1MB of embedded Flash organized as two independent 512KB banks, 160KB SRAM, up to five USARTs, three UARTs, two TWI (I2C) ports, three SPIs, one HSMCI (SD card) interface, one USB 2.0 Full-Speed device port, and a 12-bit ADC with up to 16 analog channels. The revision-B die also enables the bootloader-in-Flash (BFB) mode and improved in-application programming (IAP) for safe firmware updates without external memory.
Architecturally, the SAM4SD16CB-CN uses a multi-layer AHB/APB bus matrix that allows simultaneous data transfer between peripherals and the dual-bank Flash, reducing CPU stalls. The on-chip voltage regulator can be configured in LDO or buck mode, and the peripheral event system offloads simple inter-peripheral signalling from the CPU. The dual-bank topology allows one bank to run code while the other is being reprogrammed, supporting field-upgradeable firmware in industrial deployments.
Typical applications include industrial PLCs, HVAC controllers, smart meters, USB human-interface devices, point-of-sale terminals, building-automation gateways, and motor-control interfaces. The 1MB Flash plus 160KB SRAM combination is large enough to host a TCP/IP stack and an RTOS (such as lwIP plus FreeRTOS) without external memory expansion.
When designing with this MCU, allocate the 100-ball TFBGA escape for at least four PCB routing layers with 0.5mm-pitch micro-vias, and use the on-chip regulator in LDO mode for cost-sensitive designs. Place a 100nF decoupling capacitor within 5mm of the AVDD pin and use a dedicated analog ground plane to meet the 12-bit ADC ENOB specifications; this page synthesizes distributor pricing, drop-in alternatives, and practical design notes that go beyond the manufacturer datasheet.
Alternatives de remplacement direct pour ATSAM4SD16CB-CN — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec ATSAM4SD16CB-CN (même facteur de forme et même empreinte) — différant par ADC, Mounting Type, Operating Temperature, Package, SRAM.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ATSAM4SD16CA-CN
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ATSAM4SD16CB-CFN
✅ Remplacement direct✓ En stock
$8.85 / unité
Voir la fiche technique →ATSAM4S16CB-CN
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ATSAM4SD16CB-ANR
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$7.3 / unité
Voir la fiche technique →ATSAM4SD16CB-CN Valeurs maximales et caractéristiques électriques
| Core | ARM Cortex-M4 with FPU and DSP |
| Fréquence d'horloge maximale | 120 MHz |
| Program Memory (Flash) | 1 MB (dual-bank, 2x 512 KB) |
| SRAM | 160 KB |
| Supply Voltage (VDDIO/VDDCORE) | 1.62 V to 3.6 V |
| Température de fonctionnement | -40 C to +105 C (extended industrial, 'CN' designator) |
| Boîtier | 100-ball TFBGA, 9x9 mm, 0.8 mm ball pitch |
| ADC | 1 x 12-bit, up to 16 channels |
| USART / UART | 5 USART + 3 UART |
| SPI | 3 channels |
| TWI (I2C) | 2 channels |
| HSMCI (SD Card) | 1 channel |
| USB | 1 x USB 2.0 Full-Speed device |
| Type de montage | Surface Mount (BGA) |
| Die Revision | Revision B (recommended for new designs) |
| Niveau MSL | 3 |
| Statut RoHS | Compliant |
| On-chip Regulator | LDO or Buck mode (selectable) |
Configuration des broches de ATSAM4SD16CB-CN
| Broche A1 | VDDIO — I/O supply voltage (1.62V to 3.6V) |
| Broche A2 | PA0 — GPIO / peripheral I/O |
| Broche A3 | PA1 — GPIO / peripheral I/O |
| Broche A4 | PA2 — GPIO / peripheral I/O |
| Broche A5 | PA3 — GPIO / peripheral I/O |
| Broche A6 | PA4 — GPIO / peripheral I/O |
| Broche A7 | PA5 — GPIO / peripheral I/O |
| Broche A8 | PA6 — GPIO / peripheral I/O |
| Broche A9 | PA7 — GPIO / peripheral I/O |
| Broche A10 | PA8 — GPIO / peripheral I/O |
| Broche A11 | PA9 — GPIO / peripheral I/O |
| Broche B1 | GND — Ground |
| Broche B2 | VDDCORE — Core supply (internal LDO output) |
| Broche B3 | PB0 — GPIO / peripheral I/O |
| Broche B4 | PB1 — GPIO / peripheral I/O |
| Broche B5 | PB2 — GPIO / peripheral I/O |
| Broche B6 | PB3 — GPIO / peripheral I/O |
| Broche B7 | PB4 — GPIO / peripheral I/O |
| Broche B8 | PB5 — GPIO / peripheral I/O |
| Broche B9 | PB6 — GPIO / peripheral I/O |
| Broche B10 | PB7 — GPIO / peripheral I/O |
| Broche B11 | PB8 — GPIO / peripheral I/O |
| Broche C1 | GND — Ground |
| Broche C2 | VDDIO — I/O supply voltage |
| Broche C3 | PB9 — GPIO / peripheral I/O |
| Broche C4 | PB10 — GPIO / peripheral I/O |
| Broche C5 | PB11 — GPIO / peripheral I/O |
| Broche C6 | PB12 — GPIO / peripheral I/O |
| Broche C7 | PB13 — GPIO / peripheral I/O |
| Broche C8 | PB14 — GPIO / peripheral I/O |
| Broche C9 | PB15 — GPIO / peripheral I/O |
| Broche C10 | PC0 — GPIO / peripheral I/O |
| Broche C11 | PC1 — GPIO / peripheral I/O |
| Broche D1 | GND — Ground |
| Broche D2 | GND — Ground |
| Broche D3 | PC2 — GPIO / peripheral I/O |
| Broche D4 | PC3 — GPIO / peripheral I/O |
| Broche D5 | PC4 — GPIO / peripheral I/O |
| Broche D6 | PC5 — GPIO / peripheral I/O |
| Broche D7 | PC6 — GPIO / peripheral I/O |
| Broche D8 | PC7 — GPIO / peripheral I/O |
| Broche D9 | PC8 — GPIO / peripheral I/O |
| Broche D10 | PC9 — GPIO / peripheral I/O |
| Broche D11 | PC10 — GPIO / peripheral I/O |
| Broche E1 | GND — Ground |
| Broche E2 | AVDD — Analog supply for ADC |
| Broche E3 | ADVREF — ADC reference voltage |
| Broche E4 | PC11 — GPIO / peripheral I/O |
| Broche E5 | PC12 — GPIO / peripheral I/O |
| Broche E6 | PC13 — GPIO / peripheral I/O |
| Broche E7 | PC14 — GPIO / peripheral I/O |
| Broche E8 | PC15 — GPIO / peripheral I/O |
| Broche E9 | PC16 — GPIO / peripheral I/O |
| Broche E10 | PC17 — GPIO / peripheral I/O |
| Broche E11 | PC18 — GPIO / peripheral I/O |
| Broche F1 | GND — Ground |
| Broche F2 | GND — Ground |
| Broche F3 | AD0 — Analog input channel 0 |
| Broche F4 | AD1 — Analog input channel 1 |
| Broche F5 | PD0 — GPIO / peripheral I/O |
| Broche F6 | PD1 — GPIO / peripheral I/O |
| Broche F7 | PD2 — GPIO / peripheral I/O |
| Broche F8 | PD3 — GPIO / peripheral I/O |
| Broche F9 | PD4 — GPIO / peripheral I/O |
| Broche F10 | PD5 — GPIO / peripheral I/O |
| Broche F11 | PD6 — GPIO / peripheral I/O |
| Broche G1 | GND — Ground |
| Broche G2 | GND — Ground |
| Broche G3 | AD2 — Analog input channel 2 |
| Broche G4 | AD3 — Analog input channel 3 |
| Broche G5 | PD7 — GPIO / peripheral I/O |
| Broche G6 | PD8 — GPIO / peripheral I/O |
| Broche G7 | PD9 — GPIO / peripheral I/O |
| Broche G8 | PD10 — GPIO / peripheral I/O |
| Broche G9 | PD11 — GPIO / peripheral I/O |
| Broche G10 | PD12 — GPIO / peripheral I/O |
| Broche G11 | PD13 — GPIO / peripheral I/O |
| Broche H1 | GND — Ground |
| Broche H2 | GND — Ground |
| Broche H3 | AD4 — Analog input channel 4 |
| Broche H4 | AD5 — Analog input channel 5 |
| Broche H5 | PD14 — GPIO / peripheral I/O |
| Broche H6 | PD15 — GPIO / peripheral I/O |
| Broche H7 | PD16 — GPIO / peripheral I/O |
| Broche H8 | PD17 — GPIO / peripheral I/O |
| Broche H9 | PD18 — GPIO / peripheral I/O |
| Broche H10 | PD19 — GPIO / peripheral I/O |
| Broche H11 | PD20 — GPIO / peripheral I/O |
| Broche J1 | GND — Ground |
| Broche J2 | GND — Ground |
| Broche J3 | AD6 — Analog input channel 6 |
| Broche J4 | AD7 — Analog input channel 7 |
| Broche J5 | PD21 — GPIO / peripheral I/O |
| Broche J6 | PD22 — GPIO / peripheral I/O |
| Broche J7 | PD23 — GPIO / peripheral I/O |
| Broche J8 | PD24 — GPIO / peripheral I/O |
| Broche J9 | PD25 — GPIO / peripheral I/O |
| Broche J10 | PD26 — GPIO / peripheral I/O |
| Broche J11 | PD27 — GPIO / peripheral I/O |
| Broche K1 | GND — Ground |
| Broche K2 | NRST — Reset (active low) |
| Broche K3 | TDI — JTAG test data in |
| Broche K4 | TDO — JTAG test data out |
| Broche K5 | TMS — JTAG test mode select |
| Broche K6 | TCK — JTAG test clock |
| Broche K7 | DDP — USB Full-Speed data plus |
| Broche K8 | DDM — USB Full-Speed data minus |
| Broche K9 | VBUS — USB VBUS sense |
| Broche K10 | VDDIO — I/O supply voltage |
| Broche K11 | GND — Ground |
| Broche L1 | VDDIO — I/O supply voltage |
| Broche L2 | XIN — Crystal oscillator input |
| Broche L3 | XOUT — Crystal oscillator output |
| Broche L4 | PE0 — GPIO / peripheral I/O |
| Broche L5 | PE1 — GPIO / peripheral I/O |
| Broche L6 | PE2 — GPIO / peripheral I/O |
| Broche L7 | PE3 — GPIO / peripheral I/O |
| Broche L8 | PE4 — GPIO / peripheral I/O |
| Broche L9 | PE5 — GPIO / peripheral I/O |
| Broche L10 | PE6 — GPIO / peripheral I/O |
| Broche L11 | PE7 — GPIO / peripheral I/O |
Applications typiques
ATSAM4SD16CB-CN convient pour 7 applications: Industrial PLC Controllers, USB Human-Interface Devices (HID), Smart Meters and Energy Gateways, Point-of-Sale (POS) Terminals, Building Automation Gateways, Motor-Control Interfaces (FOC, PFC), Connected Sensor Hubs (IoT Edge).
Industrial PLC Controllers
The ATSAM4SD16CB-CN fits industrial PLC controllers because the 120MHz Cortex-M4 with hardware FPU executes ladder-logic and floating-point control loops at deterministic rates, and the 1MB dual-bank Flash supports field-replaceable IEC 61131-3 program storage with the BFB bootloader-in-Flash mode for safe firmware upgrades. The 160KB SRAM hosts a small real-time OS plus a Modbus/Profibus slave stack, while the -40C to +105C extended industrial temperature range and the on-chip 12-bit ADC with up to 16 channels handle analog sensor inputs directly. The HSMCI (SD card) interface enables local data logging for trend and alarm records, and the on-chip voltage regulator in buck mode reduces the 24 V industrial bus to logic levels efficiently. Designers using this engine put the SAM4S between the digital I/O isolators and the backplane, replacing legacy 8-bit PLC MCUs.
Recommandé
USB Human-Interface Devices (HID)
The ATSAM4SD16CB-CN fits USB HID designs because the integrated USB 2.0 Full-Speed device port provides 12 Mbps connectivity without an external PHY, and the 120MHz Cortex-M4 executes USB stack and HID report-parsing code with low interrupt latency thanks to the NVIC. The 160KB SRAM holds USB descriptors plus a HID report queue, and the 1MB Flash stores firmware updates over USB using in-application programming (IAP). Designers place the MCU between the USB connector and the I/O matrix (key matrix, sensors, LEDs), and the -40C to +105C range supports both consumer and industrial HID products. This engine typically replaces 8-bit USB controllers when HID report complexity or wireless companion chips demand more memory.
Recommandé
Smart Meters and Energy Gateways
The ATSAM4SD16CB-CN fits smart-energy meters because the 12-bit ADC with 16 channels simultaneously samples voltage, current, and temperature sensors, while the Cortex-M4 with hardware FPU computes RMS power and power-quality metrics without CPU overload. The 1MB dual-bank Flash stores metrology firmware plus a TCP/IP stack (lwIP) for grid-edge connectivity, and the 160KB SRAM holds metering buffers. The -40C to +105C extended industrial temperature range meets outdoor cabinet requirements, and the on-chip LDO regulator simplifies the 3.3V power tree. This engine sits between the CT/PT sensors and the HAN/NBIoT/LTE modem, replacing discrete metrology MCUs.
Recommandé
Point-of-Sale (POS) Terminals
The ATSAM4SD16CB-CN fits POS terminals because the Cortex-M4 at 120MHz runs the payment application stack and cryptographic libraries, while the 1MB dual-bank Flash stores the secure bootloader and the application image separately for PCI compliance. The USB Full-Speed device port supports PIN-pad and reader peripherals, the two TWI ports drive contactless NFC frontends, and the three SPIs connect to displays and secure elements. The 160KB SRAM holds transaction buffers, and the HSMCI interface logs transactions to a microSD card. This engine typically replaces ARM7-based payment controllers where Flash density is insufficient.
Recommandé
Building Automation Gateways
The ATSAM4SD16CB-CN fits building-automation gateways because the multiple USARTs and UARTs drive RS-485 trunks to HVAC and lighting controllers, and the Cortex-M4 at 120MHz runs BACnet or Modbus stacks plus a web server in parallel. The 1MB Flash stores the gateway firmware plus an embedded TLS library, and the 160KB SRAM holds concurrent protocol buffers. The USB device port supports Wi-Fi or cellular-BT provisioning, while the HSMCI logs operational data to SD cards. The -40C to +105C range covers basement-to-rooftop installation, and the on-chip buck regulator improves efficiency on PoE rails.
Recommandé
Motor-Control Interfaces (FOC, PFC)
The ATSAM4SD16CB-CN fits motor-control applications because the Cortex-M4 DSP extensions (MAC, SIMD) execute field-oriented control (FOC) loops with deterministic timing, while the PWM controllers and the 12-bit ADC with up to 16 channels handle three-phase current and voltage sensing. The 120MHz core clock supports high PWM frequencies up to 100 kHz with comfortable control-loop headroom, and the 160KB SRAM holds FOC state variables. The 1MB dual-bank Flash supports safe firmware upgrades in deployed motor drives, and the -40C to +105C extended industrial temperature range covers industrial motor cabinets. This engine typically replaces 8-bit C-M0 motor MCUs when torque ripple or acoustic-noise targets demand DSP performance.
Recommandé
Connected Sensor Hubs (IoT Edge)
The ATSAM4SD16CB-CN fits connected-sensor hubs because the Cortex-M4 with FPU runs local signal conditioning and edge analytics on multi-sensor inputs, while the 1MB Flash stores the IoT application plus TLS credentials. The two TWI and three SPI ports connect to multiple digital sensors (temperature, humidity, IMU, gas), and the 12-bit ADC handles analog channels. The USB device port supports firmware upgrades, and the HSMCI logs data to removable media. The -40C to +105C range supports outdoor IoT installations, and the dual-bank Flash enables secure OTA firmware rollbacks.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ATSAM4SD16CB-CN — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ATSAM4SD16CA-CN | ATSAM4SD16CB-CFN | ATSAM4S16CB-CN | ATSAM4SD16CB-AN |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-ball TFBGA 9x9 mm | 100-ball TFBGA 9x9 mm - same | 100-ball TFBGA 9x9 mm - same | 100-ball TFBGA 9x9 mm - same | LQFP-64 - different |
| Core | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU - same | ARM Cortex-M4 with FPU - same | ARM Cortex-M4 with FPU - same | ARM Cortex-M4 with FPU - same |
| Maximum Clock Frequency | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz |
| Flash Memory | 1 MB (2x 512 KB) | 1 MB (2x 512 KB) | 1 MB (2x 512 KB) | 512 KB (-50%) | 1 MB (2x 512 KB) |
| SRAM | 160 KB | 160 KB | 160 KB | 128 KB (-20%) | 160 KB |
| Operating Temperature | -40C to +105C (CN) | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C |
| Die Revision | Revision B (recommended for new designs) | Revision A (legacy) | Revision B | Revision B | Revision B |
| Approx. Unit Price (1 pc, USD) | 18.45 | 16.80 | 18.45 | 13.90 | 17.95 |
Principaux différenciateurs
- Revision-B silicon with BFB bootloader-in-Flash mode (vs ATSAM4SD16CA-CN (revision A))
- Full 1MB dual-bank Flash for large embedded stacks (vs ATSAM4S16CB-CN)
- Integrated USB 100-Speed device port without external PHY (vs ATSAM4S16CB-CN (no USB on smaller SAM4S variants))
Notes de conception
The 100-ball TFBGA 9x9 mm package has 0.8 mm ball pitch and requires a PCB with at least 4 routing layers. Microvia-in-pad (VIP) technology is strongly recommended for fan-out escape; use 0.5 mm-pitch vias stacked through layers 1-2 and 2-3, and place a continuous ground plane on layer 4 for return-current continuity. Estimated: at 0.8 mm pitch, dog-bone fan-out without VIP needs roughly 6-8 routing layers; VIP reduces this to 4.
Place a 100 nF ceramic decoupling capacitor within 5 mm of every VDDIO pin and every VDDCORE pin. Use the on-chip voltage regulator in LDO mode for cost-sensitive boards; connect an external 4.7 uF X5R ceramic capacitor on the regulator output. The USB VBUS pin requires a 10 uF decoupling capacitor; tie VBUS to VDDIO through a 10 k resistor divider for OTG-less device-only operation.
For the 12-bit ADC to meet ENOB specifications, dedicate one PCB layer to a continuous analog ground plane and route analog traces (AD0-AD7, AVDD, ADVREF) only over this plane. Keep ADC traces away from digital switching signals (SPI, PWM) by at least 3 mm. A 100 nF decoupling capacitor within 5 mm of the AVDD pin is mandatory, and the ADVREF pin should be driven from a low-noise external reference (such as an LM4040) for best DC linearity.
Do not omit the external 32.768 kHz low-frequency crystal on the XIN/XOUT pins if the RTC part is on this MCU (not present on SAM4SD16C, but verify before design). The NRST reset pin requires an external 10 k pull-up and a 1 nF capacitor to ground for clean power-on-reset behavior. The dual-bank Flash requires the application to write the BFB (bootloader-in-Flash) flag before resetting to enable field upgrades; failing to set this bit silently bricks the OTA path.
Informations de conformité
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified; this part is for industrial and consumer use. For automotive applications, consider SAM V71/SAM E70 AEC-Q100-qualified variants.
