ATSAMA5D28C-LD2G-CU - 500MHz Cortex-A5 MPU, 2Gbit LPDDR2 SiP | Microchip
Référence : ATSAMA5D28C-LD2G-CU ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $20.58 | $20,58 |
| 10 | $19.45 | $194,50 |
| 100 | $18.2 | $1 820,00 |
| 500 | $16.95 | $8 475,00 |
| 1 000 | $15.75 | $15 750,00 |
ATSAMA5D28C-LD2G-CU Présentation
What is a System-in-Package (SiP) MPU? An SiP integrates a processor die and one or more memory/companion dies inside a single BGA package, allowing engineers to treat the assembly as a single component on the PCB. Compared to a discrete MPU + external DDR2/LPDDR2 design, an SiP shortens critical trace lengths, reduces EMI susceptibility, and simplifies PCB routing. The SAMA5D2 family belongs to the Cortex-A5 class of 32-bit application processors — sitting in the taxonomy: Cortex-A5 -> Arm application processor -> MPU -> embedded microprocessor -> integrated circuit — and is widely used in human-machine interface (HMI), industrial control, and connected IoT edge nodes.
Key features of the ATSAMA5D28C-LD2G-CU include: an Arm Cortex-A5 core with Arm NEON and FPU, hardware cryptographic acceleration (AES, SHA, TRNG), a 32-bit LPDDR2/DDR2/LPDDR3/DDR3 memory controller, dual Ethernet GMAC, dual CAN-FD, multiple USB 2.0 High-Speed ports (host and device), up to three SD/SDIO/MMC interfaces, an LCD controller supporting up to WXGA, a 12-bit ADC, and a 12-bit DAC. The integrated 2 Gbit LPDDR2 provides ample headroom for Linux- and RTOS-based GUI stacks, while secure-boot and tamper-detection pins support anti-cloning and DRM use cases.
Architecturally, the device pairs a high-throughput Cortex-A5 pipeline with a low-power island for always-on peripherals, enabling fast wake/sleep transitions. Industrial-grade peripherals include Class-D audio interfaces and image-sensor parallel ports, while the on-chip crypto block removes the need for an external secure-element in many designs.
Typical applications include industrial HMI panels, smart-home gateways, point-of-sale terminals, building-automation controllers, and connected IoT edge nodes. Designers should follow Microchip's SAMA5D2 hardware guidelines for power-rail sequencing and PCB stack-up — the SiP's internal memory routing constrains the board layer count and demands 4 or more layers with controlled-impedance routing for USB and Ethernet. This page consolidates distributor pricing, drop-in alternatives within the SAMA5D2 family, and engineering design notes that go beyond what is found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour ATSAMA5D28C-LD2G-CU — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec ATSAMA5D28C-LD2G-CU (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Ethernet, USB, Core Architecture.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ATSAMA5D28C-LD1G-CUR
✅ Remplacement direct✓ En stock
$19.4 / unité
Voir la fiche technique →ATSAMA5D28C-D1G-CU
✅ Remplacement direct✓ En stock
$23.5 / unité
Voir la fiche technique →ATSAMA5D28B-CUR
✅ Remplacement direct✓ En stock
$12.6 / unité
Voir la fiche technique →ATSAMA5D28B-CNR
✅ Remplacement direct✓ En stock
$17.9 / unité
Voir la fiche technique →ATSAMA5D27C-D1G-CU
✅ Remplacement direct✓ En stock
$19.1 / unité
Voir la fiche technique →ATSAMA5D26C-CU
✅ Remplacement direct✓ En stock
$11.8 / unité
Voir la fiche technique →ATSAMA5D28C-LD2G-CU Valeurs maximales et caractéristiques électriques
| Core Architecture | Arm Cortex-A5 (32-bit) with NEON and FPU |
| Maximum CPU Clock | 500 MHz |
| Core Count | 1 |
| Integrated Memory (SiP) | 2 Gbit LPDDR2 SDRAM |
| External Memory Support | DDR2/DDR3L/LPDDR2/LPDDR3, QSPI, e.MMC Flash |
| Boîtier | 289-ball LFBGA (14x14 mm) |
| Température de fonctionnement | -40C to +85C (Industrial) |
| Graphics / Display | LCD controller up to WXGA resolution |
| Ethernet | 2x 10/100/1000 GMAC |
| USB | 2x USB 2.0 High-Speed (Host + Device) |
| CAN | 2x CAN-FD |
| SD/MMC | Up to 3x SD/SDIO/MMC |
| ADC / DAC | 12-bit ADC, 12-bit DAC |
| Cryptography | AES, SHA, TRNG, secure boot |
| Statut RoHS | Compliant |
| Type de montage | Surface Mount (BGA) |
Guide de configuration des broches du ATSAMA5D28C-LD2G-CU 289-ball lfbga (14x14 mm)
Configuration des broches du ATSAMA5D28C-LD2G-CU (boîtier 289-ball lfbga (14x14 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour ATSAMA5D28C-LD2G-CU.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
ATSAMA5D28C-LD2G-CU convient pour 6 applications: Industrial HMI Panels, Smart Home / IoT Edge Gateways, Point-of-Sale Terminals, Building Automation Controllers, Connected Medical Devices, Audio/Class-D Amplifier Hosts.
Industrial HMI Panels
The ATSAMA5D28C-LD2G-CU's 500 MHz Cortex-A5 core, integrated LCD controller supporting up to WXGA resolution, and 2 Gbit of LPDDR2 (256 MB) provide ample throughput and framebuffer headroom for graphical human-machine interfaces in factory automation and process-control panels. Hardware crypto and secure-boot enable signed firmware rollouts on the factory floor. The industrial temperature range (-40C to +85C) and dual CAN-FD support deterministic fieldbus connectivity alongside the touchscreen stack.
Recommandé
Smart Home / IoT Edge Gateways
Dual Gigabit Ethernet GMAC, dual CAN-FD, and dual USB 2.0 High-Speed ports let the ATSAMA5D28C-LD2G-CU aggregate multiple radios and fieldbuses in a residential or commercial gateway. The integrated 2 Gbit LPDDR2 supports TLS handshake memory pools, MQTT brokers, and on-device edge analytics without external DRAM. Hardware AES/SHA offload accelerates encrypted traffic at line rate, and the LPDDR2 self-refresh modes cut standby power for always-listening IoT designs.
Recommandé
Point-of-Sale Terminals
POS terminals need a secure, responsive UI plus encrypted card-data handling — exactly the workload the ATSAMA5D28C-LD2G-CU is built for. The hardware AES/SHA/TRNG block accelerates PCI-compliant card-data encryption without burdening the Cortex-A5 core, while the integrated 256 MB LPDDR2 holds the OS, UI, and transaction buffers. The LCD controller drives the operator and customer displays, and dual Ethernet supports segregated payment-vs-management networks.
Recommandé
Building Automation Controllers
Building controllers integrate HVAC, lighting, access, and metering — the ATSAMA5D28C-LD2G-CU's dual CAN-FD bus, Ethernet, USB, and 12-bit ADC cover all of these on one chip. Industrial temperature grading ensures 24/7 operation in mechanical rooms. The 2 Gbit LPDDR2 runs a full Linux stack with BACnet/Modbus gateways, while secure-boot and tamper pins protect against physical and firmware tampering on-site.
Recommandé
Connected Medical Devices
Patient monitors and diagnostic peripherals benefit from the ATSAMA5D28C-LD2G-CU's secure-boot chain, hardware cryptography for HIPAA-compliant data-at-rest, and rich display capability for clinician-facing screens. The 500 MHz Cortex-A5 runs embedded Linux or a real-time OS with deterministic peripheral response, and the 12-bit ADC supports direct connection to sensor front-ends. Industrial temperature range plus LPDDR2's low active power suit battery-backed portable carts.
Recommandé
Audio/Class-D Amplifier Hosts
The ATSAMA5D28C-LD2G-CU integrates Class-D amplifier interfaces alongside I2S/TDM, enabling multi-zone audio amplifiers with on-device stream decryption and per-zone EQ. The 2 Gbit LPDDR2 buffers uncompressed audio streams for whole-house audio systems, and the Cortex-A5 + NEON DSP extensions accelerate software codecs (Opus, LC3, AAC). Hardware AES offload unlocks premium content delivery without burdening the application core.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ATSAMA5D28C-LD2G-CU — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ATSAMA5D28C-LD1G-CUR | ATSAMA5D28C-D1G-CU | ATSAMA5D28B-CU | ATSAMA5D27C-D1G-CU | ATSAMA5D26C-CU |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 289-LFBGA (14x14 mm) | 289-LFBGA (14x14 mm) - same | 289-LFBGA (14x14 mm) - same | 289-LFBGA (14x14 mm) - same | 289-LFBGA (14x14 mm) - same | 289-LFBGA (14x14 mm) - same |
| Integrated Memory | 2 Gbit LPDDR2 | 1 Gbit LPDDR2 | 1 Gbit DDR2 | 2 Gbit LPDDR2 (B silicon) | 1 Gbit DDR2 | External DDR2 (no SiP) |
| CPU Core | Cortex-A5 500 MHz | Cortex-A5 500 MHz | Cortex-A5 500 MHz | Cortex-A5 500 MHz | Cortex-A5 500 MHz | Cortex-A5 500 MHz |
| Silicon Revision | C | C | C | B | C | C |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| RoHS Compliance | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
Principaux différenciateurs
- Highest integrated memory density in the SAMA5D2 family (vs ATSAMA5D28C-LD1G-CUR)
- LPDDR2 power efficiency vs DDR2 alternatives (vs ATSAMA5D28C-D1G-CU)
- Latest silicon revision with bug fixes and security hardening (vs ATSAMA5D28B-CU)
Notes de conception
Estimated: The 289-ball LFBGA (14x14 mm, ~0.5-0.8 mm pitch) demands a 4-layer minimum PCB stack-up with continuous GND planes under the SiP and matched-length impedance-controlled traces for USB 2.0 High-Speed (90 ohm differential) and Gigabit Ethernet (100 ohm differential). Place the SiP away from switching DC-DC nodes; the integrated LPDDR2 is sensitive to switching-noise coupling through VDDLDO. Follow Microchip's SAMA5D2 hardware design checklist for ball-A1 orientation and decouple VDDANA/VDDPLL/VDDUTMIC pairs with 100 nF X7R plus 10 uF bulk per the reference schematic.
Estimated: At maximum CPU load (500 MHz, peripherals active) the SiP dissipates roughly 1-1.5 W. With a properly stitched GND plane beneath the LFBGA, junction-to-ambient theta_JA is typically 25-35 C/W on a 4-layer JEDEC board, giving a 25-50 C temperature rise. For sealed industrial enclosures without forced airflow, derate CPU frequency to 400 MHz or add a thermal pad connecting the BGA's central GND balls to an inner copper pour to keep Tj below 105 C at 85 C ambient.
Do not confuse the LD2G (LPDDR2, 2 Gbit) suffix with D2G (DDR2, 2 Gbit) — they have different internal DRAM dies and different power-rail requirements (LPDDR2 needs 1.2 V VDDLPDDR with self-refresh, DDR2 needs 1.8 V). Mixing the two will cause boot failures or DRAM initialization hangs. Also note the trailing -CU vs -CUR: -CU ships in tray-pack, -CUR ships in tape-and-reel — same die and pinout, only packaging differs.
Sequence the SAMA5D2 power rails per Microchip's 'Power Management' section: VDDLDO_IN first, then VDDLDO_OUT (1.2 V), then VDDANA/VDDPLL/VDDUTMIC, then VDDLPDDR (for LD variants). Holding the NRST line low until all rails are stable prevents latch-up. The LPDDR2 self-refresh current is approximately 200-400 uA at 25 C — design the backup-supply path for at least 1 mA to cover worst-case temperature drift.
Informations de conformité
RoHS and REACH compliance per Microchip product page. Industrial temperature grade -40C to +85C. Not AEC-Q100 qualified (consumer/industrial MPU); not designed for automotive safety-critical applications.
