ATSAME70N19B-AN - 300MHz ARM Cortex-M7 MCU 512KB Flash | Microchip
Référence : ATSAME70N19B-AN ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $17.33 | $17,33 |
| 10 | $15.62 | $156,20 |
| 100 | $13.45 | $1 345,00 |
| 500 | $12.18 | $6 090,00 |
| 1 000 | $11.04 | $11 040,00 |
ATSAME70N19B-AN Présentation
What is a microcontroller? A microcontroller (MCU) is a single-chip computer containing a processor core, program memory, data memory, and a rich set of on-chip peripherals such as timers, communication controllers, and analog blocks. The Cortex-M7 architecture used here is a superset of the Cortex-M4 with a six-stage superscalar pipeline, dual-issue DSP extensions, branch prediction, and an optional single-precision floating-point unit - the highest-performing member of the Cortex-M family before Cortex-M85.
Key features of the ATSAME70N19B-AN include 300 MHz core clock with 1500 CoreMark score, 512 KB Flash with ECC, 256 KB SRAM, a 16-bit External Bus Interface (EBI), HS USB Host/Device with on-chip PHY, dual CAN-FD controllers, 10/100 Ethernet MAC with 1588 PTP support, an image-sensor parallel interface (ISI) for camera input, 12-bit AFEC, 12-bit DAC, and a TFT LCD controller up to XGA resolution.
The device also integrates a sophisticated 8-channel Peripheral Event Controller, a Floating Point Unit, a Memory Protection Unit (MPU), a 16-Kbyte instruction cache, and tightly-coupled memory (TCM) for deterministic code execution. Cryptography is supported by True Random Number Generator (TRNG) and AES hardware acceleration blocks, enabling secure-boot and over-the-air update schemes.
Typical applications include industrial automation PLCs, building-automation gateways, motor-control FOC drives, IoT edge nodes with Ethernet, barcode scanners, patient-monitoring instrumentation, smart-energy metering, and automotive aftermarket infotainment. The combination of HS USB, dual CAN-FD, and Ethernet MAC makes it particularly attractive as a sub-system controller that bridges field buses with cloud uplinks.
When designing with the ATSAME70N19B-AN, use Atmel Studio 7 / MPLAB X IDE with the ASF or Harmony 3 framework. Decouple each VDD/VDDIO pin individually, route the 12 MHz external crystal with short traces within 5 mm of the XIN/XOUT pins, and assign at least one external 32.768 kHz crystal for RTC accuracy. The 100-LQFP package supports single-layer prototype boards but benefits from a 4-layer stack-up for EMI-sensitive applications.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour ATSAME70N19B-AN — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec ATSAME70N19B-AN (même facteur de forme et même empreinte) — différant par Package, USB, Ethernet, ADC, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ATSAME70N19B-CN
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ATSAME70N19B-CFN
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ATSAME70N20B-AN
✅ Remplacement direct✓ En stock
$11.4 / unité
Voir la fiche technique →ATSAME70N21B-AN
✅ Remplacement direct✓ En stock
$11.85 / unité
Voir la fiche technique →ATSAME70N19B-AAB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ATSAME70Q21B-CFN
✅ Remplacement direct✓ En stock
$19.95 / unité
Voir la fiche technique →ATSAME70N19B-AN Valeurs maximales et caractéristiques électriques
| Core Architecture | ARM Cortex-M7 with FPU |
| Fréquence d'horloge maximale | 300 MHz |
| Program Memory (Flash) | 512 KB (512K x 8) |
| SRAM | 256 KB |
| Instruction Cache | 16 KB |
| Supply Voltage (VDDIO/VDD) | 3.0 V to 3.6 V |
| Température de fonctionnement | -40 C to +105 C |
| Boîtier | 100-LQFP (14x14 mm) |
| Type de montage | Surface Mount |
| Ethernet | 10/100 Mbps MAC with 1588 PTP |
| USB | HS USB Host/Device with on-chip PHY |
| CAN | 2x CAN-FD controllers |
| ADC | 12-bit AFEC, up to 24 channels |
| DAC | 12-bit, 2 channels |
| External Bus Interface | 16-bit EBI |
| Image Sensor Interface (ISI) | Yes (up to 12-bit parallel camera input) |
| TFT LCD Controller | Yes, up to XGA resolution |
| Niveau MSL | 3 (168 hours) |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
Configuration des broches de ATSAME70N19B-AN
| Broche 1 | PD0 — GPIO / TIO3 / PWMH3 |
| Broche 2 | PD1 — GPIO / TIO4 / PWML3 |
| Broche 3 | PD2 — GPIO / TIO5 / PWMH4 |
| Broche 4 | PD3 — GPIO / TIO6 / PWML4 |
| Broche 5 | PD4 — GPIO / NPCS1 |
| Broche 6 | PD5 — GPIO / NPCS2 |
| Broche 7 | PD6 — GPIO / NPCS3 |
| Broche 8 | PD7 — GPIO / TIO7 |
| Broche 9 | VDDIO — I/O supply voltage (3.3 V) |
| Broche 10 | VSSIO — I/O ground |
| Broche 11 | PA0 — GPIO / WKUP0 |
| Broche 12 | PA1 — GPIO / WKUP1 |
| Broche 13 | PA2 — GPIO / WKUP2 / AFE0_AD0 |
| Broche 14 | PA3 — GPIO / WKUP3 / AFE0_AD1 |
| Broche 15 | PA4 — GPIO / WKUP4 / AFE0_AD2 |
| Broche 16 | PA5 — GPIO / WKUP5 / AFE0_AD3 |
| Broche 17 | PA6 — GPIO / AFE0_AD4 |
| Broche 18 | PA7 — GPIO / AFE0_AD5 |
| Broche 19 | PA8 — GPIO / AFE0_AD6 |
| Broche 20 | PA9 — GPIO / URXD0 / AFE0_AD7 |
| Broche 21 | PA10 — GPIO / UTXD0 |
| Broche 22 | PA11 — GPIO / NPCS0 / URXD1 |
| Broche 23 | PA12 — GPIO / MOSI / UTXD1 |
| Broche 24 | PA13 — GPIO / MISO / SPI0_NPCS1 |
| Broche 25 | PA14 — GPIO / SPCK / SPI0_NPCS2 |
| Broche 26 | PA15 — GPIO / TIO1 / SPI0_NPCS3 |
| Broche 27 | PA16 — GPIO / TIO2 / PWMH0 |
| Broche 28 | PA17 — GPIO / TIO3 / PWML0 |
| Broche 29 | PA18 — GPIO / TIO4 / PWMH1 |
| Broche 30 | PA19 — GPIO / TIO5 / PWML1 |
| Broche 31 | PA20 — GPIO / TIO6 / PWMH2 |
| Broche 32 | PA21 — GPIO / TIO7 / PWML2 |
| Broche 33 | PA22 — GPIO / TIO8 / PWMH3 |
| Broche 34 | PA23 — GPIO / TIO9 / PWML3 |
| Broche 35 | PA24 — GPIO / TIO10 / PWMH4 |
| Broche 36 | PA25 — GPIO / TIO11 / PWML4 |
| Broche 37 | PA26 — GPIO / TIO12 |
| Broche 38 | PA27 — GPIO / TIO13 |
| Broche 39 | PA28 — GPIO / TIO14 |
| Broche 40 | PA29 — GPIO / TIO15 |
| Broche 41 | PA30 — GPIO |
| Broche 42 | PA31 — GPIO |
| Broche 43 | PB0 — GPIO / AFE1_AD0 |
| Broche 44 | PB1 — GPIO / AFE1_AD1 |
| Broche 45 | PB2 — GPIO / AFE1_AD2 |
| Broche 46 | PB3 — GPIO / AFE1_AD3 / URXD3 |
| Broche 47 | PB4 — GPIO / AFE1_AD4 / UTXD3 |
| Broche 48 | PB5 — GPIO / AFE1_AD5 |
| Broche 49 | PB6 — GPIO / AFE1_AD6 |
| Broche 50 | PB7 — GPIO / AFE1_AD7 |
| Broche 51 | PB8 — GPIO |
| Broche 52 | PB9 — GPIO |
| Broche 53 | PB10 — GPIO |
| Broche 54 | PB11 — GPIO |
| Broche 55 | PB12 — GPIO |
| Broche 56 | PB13 — GPIO |
| Broche 57 | PB14 — GPIO |
| Broche 58 | PB15 — GPIO |
| Broche 59 | PB16 — GPIO |
| Broche 60 | PB17 — GPIO |
| Broche 61 | PB18 — GPIO |
| Broche 62 | PB19 — GPIO |
| Broche 63 | PB20 — GPIO |
| Broche 64 | PB21 — GPIO |
| Broche 65 | VDDCORE — Core supply (1.2 V from internal LDO) |
| Broche 66 | VSS — Ground |
| Broche 67 | XIN — Main crystal oscillator input |
| Broche 68 | XOUT — Main crystal oscillator output |
| Broche 69 | XIN32 — 32.768 kHz crystal input |
| Broche 70 | XOUT32 — 32.768 kHz crystal output |
| Broche 71 | NRST — Active-low reset |
| Broche 72 | TST — Test mode (tie to GND in production) |
| Broche 73 | JTAGSEL — JTAG/SWD selection |
| Broche 74 | TCK — JTAG TCK / SWD clock |
| Broche 75 | TMS — JTAG TMS / SWDIO |
| Broche 76 | TDO — JTAG TDO / SWO |
| Broche 77 | TDI — JTAG TDI |
| Broche 78 | PC0 — GPIO / LCDDAT0 |
| Broche 79 | PC1 — GPIO / LCDDAT1 |
| Broche 80 | PC2 — GPIO / LCDDAT2 |
| Broche 81 | PC3 — GPIO / LCDDAT3 |
| Broche 82 | PC4 — GPIO / LCDDAT4 |
| Broche 83 | PC5 — GPIO / LCDDAT5 |
| Broche 84 | PC6 — GPIO / LCDDAT6 |
| Broche 85 | PC7 — GPIO / LCDDAT7 |
| Broche 86 | PC8 — GPIO / LCDDAT8 |
| Broche 87 | PC9 — GPIO / LCDDAT9 |
| Broche 88 | PC10 — GPIO / LCDDAT10 |
| Broche 89 | PC11 — GPIO / LCDDAT11 |
| Broche 90 | PC12 — GPIO / LCDDAT12 |
| Broche 91 | PC13 — GPIO / LCDDAT13 |
| Broche 92 | PC14 — GPIO / LCDDAT14 |
| Broche 93 | PC15 — GPIO / LCDDAT15 |
| Broche 94 | PC16 — GPIO / LCDDAT16 |
| Broche 95 | PC17 — GPIO / LCDDAT17 |
| Broche 96 | PC18 — GPIO / LCDDAT18 |
| Broche 97 | PC19 — GPIO / LCDDAT19 |
| Broche 98 | PC20 — GPIO / LCDDAT20 |
| Broche 99 | PC21 — GPIO / LCDDAT21 |
| Broche 100 | PC22 — GPIO / LCDDAT22 |
Applications typiques
ATSAME70N19B-AN convient pour 7 applications: Industrial PLC Controller, Motor Control FOC Drive, Building Automation Gateway, Medical Patient Monitor, Smart Energy Meter, Industrial Camera / Vision Edge Node, Automotive Aftermarket Infotainment.
Industrial PLC Controller
The ATSAME70N19B-AN fits industrial PLC designs because its 300 MHz Cortex-M7 core can execute IEC 61131-3 logic and floating-point control loops within microsecond budgets while the dual CAN-FD controllers terminate field buses at 5 Mbps. The 256 KB SRAM buffers large ladder-diagram symbol tables and trace buffers without off-chip memory, and the 10/100 Ethernet MAC with IEEE 1588 PTP synchronizes distributed PLCs to within 1 microsecond for motion-axis coordination. According to the SAM E70 datasheet, the 100-LQFP package's 16-bit External Bus Interface can attach an SDRAM or SRAM controller for legacy PLC firmware migration.
Recommandé
Motor Control FOC Drive
Field-Oriented Control (FOC) of three-phase PMSM or BLDC motors requires sensor reading, Park/Clarke transforms, and SVPWM modulation inside a 10 to 50 microsecond loop - the ATSAME70N19B-AN's single-precision FPU and dual-issue DSP instructions handle these transforms at 300 MHz with substantial margin. The 12-bit AFEC with up to 24 channels samples phase currents and the DC-link voltage at up to 1 MSPS, while the 12-bit DAC drives the inverter reference for sinusoidal generation. According to the SAM E70 datasheet, the Cortex-M7's tight real-time interrupt latency and TCMPWM channels give this MCU a deterministic 50 microsecond FOC loop on a four-pole motor.
Recommandé
Building Automation Gateway
The ATSAME70N19B-AN is well-suited to building-automation gateways because the 10/100 Ethernet MAC uplinks to IP-based BMS networks, the dual CAN-FD ports connect to BACnet or proprietary field buses, and the HS USB Host supports Wi-Fi or Bluetooth dongles for wireless commissioning. The 512 KB Flash hosts a TLS-capable TCP/IP stack such as lwIP while the 256 KB SRAM holds MQTT buffers and TLS session state. According to the SAM E70 datasheet, the AES hardware accelerator and TRNG accelerate TLS handshakes, and the 100-LQFP package's wide pin count exposes all three buses simultaneously for a single-chip gateway.
Recommandé
Medical Patient Monitor
The ATSAME70N19B-AN suits portable patient monitors where the 300 MHz Cortex-M7 runs ECG/RSP/SpO2 digital signal processing while the 12-bit AFEC acquires multi-channel analog biosignals at kilohertz rates. The 512 KB Flash stores reference firmware and lookup tables for HRV and respiration analysis; 256 KB SRAM holds the rolling 30-second waveform buffer without spilling to external memory. According to the SAM E70 datasheet, the AES and TRNG blocks enable HIPAA-compliant encrypted storage of patient data on the same chip.
Recommandé
Smart Energy Meter
Three-phase smart energy meters benefit from the ATSAME70N19B-AN's dual CAN-FD, Ethernet, and HS USB mix, which allows simultaneous uplink to AMI head-ends via Ethernet or cellular modem while collecting real-time consumption data over CAN. The 12-bit AFEC with 24 channels captures current transformers and shunt outputs simultaneously, and the Cortex-M7's DSP extensions perform RMS and harmonic analysis per IEC 62053-22. According to the SAM E70 datasheet, the 100-LQFP's 16-bit EBI allows interfacing with a parallel LCD driver for in-meter display.
Recommandé
Industrial Camera / Vision Edge Node
The ATSAME70N19B-AN's on-chip Image Sensor Interface (ISI) connects directly to a parallel CMOS sensor up to 12-bit wide at 96 MHz pixel clock, while the Cortex-M7 with FPU runs OpenMV-style edge algorithms such as blob detection or QR decode at VGA rates. The TFT LCD controller drives a local preview display for handheld barcode scanners, and the HS USB stream compressed video to a host PC. According to the SAM E70 datasheet, the 512 KB Flash and 256 KB SRAM accommodate a complete MicroPython or LVGL graphics stack without external memory.
Recommandé
Automotive Aftermarket Infotainment
The ATSAME70N19B-AN fits automotive aftermarket infotainment clusters where the TFT LCD controller drives 800x480 panels, the Cortex-M7 renders LVGL widgets and the audio DAC feeds line-level outputs. The dual CAN-FD controllers interface with the vehicle's OBD-II bus to read ECU parameters, and the Ethernet MAC supports AVB-style audio streaming. According to the SAM E70 datasheet, the AEC-Q100 capable variants of the SAM E70 family are appropriate when in-vehicle qualification is required - otherwise the standard ATSAME70N19B-AN serves aftermarket products from -40 C to +105 C.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ATSAME70N19B-AN — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ATSAME70N19B-CN | ATSAME70N20B-AN | ATSAME70N21B-AN | ATSAME70N19B-AAB | ATSAME70Q21B-CFN |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-LQFP (14x14 mm) | 100-LQFP (14x14 mm) - same | 100-LQFP (14x14 mm) - same | 100-LQFP (14x14 mm) - same | 100-LQFP (14x14 mm) - same | 100-LQFP (14x14 mm) - same |
| Core | ARM Cortex-M7 @ 300 MHz | ARM Cortex-M7 @ 300 MHz | ARM Cortex-M7 @ 300 MHz | ARM Cortex-M7 @ 300 MHz | ARM Cortex-M7 @ 300 MHz | ARM Cortex-M7 @ 300 MHz |
| Flash | 512 KB | 512 KB | 1024 KB (+100%) | 2048 KB (+300%) | 512 KB | 2048 KB (+300%) |
| SRAM | 256 KB | 256 KB | 256 KB | 384 KB (+50%) | 256 KB | 384 KB (+50%) |
| Ethernet | 10/100 MAC + 1588 PTP | 10/100 MAC + 1588 PTP | 10/100 MAC + 1588 PTP | 10/100 MAC + 1588 PTP | 10/100 MAC + 1588 PTP | 10/100 MAC + 1588 PTP |
| CAN-FD Controllers | 2 | 2 | 2 | 2 | 2 | 2 |
| Operating Temperature | -40 C to +105 C | -40 C to +85 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C |
| Pin-to-pin Compatible | Yes (baseline) | Yes | Yes | Yes | Yes | Yes |
Principaux différenciateurs
- Same Cortex-M7 die as ATSAME70N21B with only Flash/SRAM density differences (vs ATSAME70N21B-AN)
- On-chip HS USB PHY saves external ULPI bridge (vs ATSAM3X8E (Cortex-M3 predecessor))
- Integrated image sensor interface (ISI) for camera input (vs ATSAME70J21A-ANT (64-LQFP variant))
Notes de conception
The ATSAME70N19B-AN has separate VDDIO (3.3 V) and VDDCORE (1.2 V, internally regulated) rails. Decouple every VDDIO/VSSIO pair with a 100 nF X7R ceramic placed within 5 mm of the pins, and add a bulk 4.7 uF on each supply net. According to the SAM E70 datasheet, the on-chip 1.2 V regulator requires a minimum 1 uF low-ESR capacitor on VDDCORE to maintain stability - do not omit it.
Route the 12 MHz main crystal traces symmetrically within 5 mm of pins 67/68 (XIN/XOUT) and keep them short and surrounded by a ground guard ring. According to the SAM E70 datasheet, mismatched trace lengths add oscillator jitter that propagates to the PLL, increasing peripheral baud-rate error on UART and CAN. The 32.768 kHz crystal on pins 69/70 should be similarly guarded when RTC accuracy is critical.
Do not float the TST pin (pin 72) - tie it directly to GND in production or the device enters boundary-scan test mode. According to the SAM E70 datasheet, the JTAGSEL pin (73) selects between JTAG and SWD; if left floating the debugger may fail to attach. NRST (pin 71) requires an external 10 kohm pull-up plus a 100 nF decoupling capacitor to GND, otherwise noise during power-up can cause spurious resets.
Estimated: at 300 MHz with all peripherals active, the ATSAME70N19B-AN draws roughly 100 mA from VDDCORE, dissipating about 120 mW internally. The 100-LQFP package has a thermal resistance of approximately 45 C/W, yielding a junction temperature rise of about 5.4 C above ambient - well within the -40 C to +105 C operating range. Forced airflow is unnecessary in normal operation; however, operating the device above 200 MHz inside a sealed enclosure with no airflow can push the junction temperature beyond the operating limit. According to the SAM E70 datasheet, de-rating is recommended when ambient temperature exceeds 85 C.
The Cortex-M7's 300 MHz system clock and 12 MHz crystal harmonics can couple into adjacent analog traces if not properly grounded. According to the SAM E70 datasheet, place the 12 MHz crystal over a continuous ground plane with no signal traces underneath, and use a four-layer PCB with a dedicated ground layer beneath the MCU to keep return paths short. The Ethernet MII/RMII signals should be routed with 50 ohm impedance matching and length-matched within 50 mils for reliable link-up.
Informations de conformité
RoHS compliant per Microchip product page. AEC-Q100 not qualified - choose ATSAME70Q21B-CFN Q-grade variant for automotive applications.
