ATSAME70N20B-AN - 300MHz Cortex-M7 MCU 1MB Flash 100-LQFP | Microchip
Référence : ATSAME70N20B-AN ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.45 | $18,45 |
| 10 | $17.12 | $171,20 |
| 100 | $14.88 | $1 488,00 |
| 500 | $12.95 | $6 475,00 |
| 1 000 | $11.4 | $11 400,00 |
ATSAME70N20B-AN Présentation
A microcontroller (MCU) is a single-chip computer containing a processor core, volatile and non-volatile memory, and programmable I/O peripherals. Within the broader semiconductor hierarchy, an MCU sits below microprocessors (MPU) and above digital signal controllers (DSC); the SAM E70 family targets applications that require DSP-grade performance plus deterministic real-time control by pairing a Cortex-M7 core with a tightly-coupled SRAM subsystem. Synonyms used in industry include "embedded controller", "microcontroller unit", and "flash MCU".
Key features of the ATSAME70N20B-AN include a 300 MHz Cortex-M7 core with 16 KB I-cache and 16 KB D-cache, a single-precision FPU with double-precision support, DSP extensions, and a multi-port SRAM controller. Communication peripherals include HS USB 2.0 device/host with on-chip PHY, dual CAN-FD controllers, an Ethernet MAC with IEEE 1588 PTP support, multiple USART/SPI/TWI interfaces, and an image sensor interface. The device operates from 1.62 V to 3.6 V and is rated for the -40C to +85C industrial temperature range.
Architecturally, the ATSAME70N20B-AN uses a 6-layer AHB matrix that delivers simultaneous data transfer between the Cortex-M7 core, the SRAM banks, and the high-bandwidth peripherals. The dedicated EBI allows external SDRAM expansion, making the part well-suited for display, vision, and gateway applications where on-chip SRAM alone is insufficient.
Typical applications include industrial automation controllers, building automation gateways, smart energy meters, motor control drives, point-of-sale terminals, and connected medical instrumentation. The combination of HS USB, Ethernet, and CAN-FD provides a ready-made connectivity stack for IoT edge nodes and Industry 4.0 controllers.
When designing with this device, ensure the 1.8V core LDO is bypassed with the manufacturer-recommended capacitor values and that the external SDRAM trace lengths are matched within the EBI timing budget. The part is supplied in tray packaging as the -AN (LQFP) variant; tape-and-reel -ANT variants are also available from Microchip.
This page synthesizes distributor pricing, same-brand and cross-brand drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, helping engineers accelerate sourcing and PCB bring-up for SAM E70 designs.
Alternatives de remplacement direct pour ATSAME70N20B-AN — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec ATSAME70N20B-AN (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, ADC, Core, Ethernet.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ATSAME70N20A-AN
✅ Remplacement direct✓ En stock
$11.2 / unité
Voir la fiche technique →ATSAME70N20B-ANT
✅ Remplacement direct✓ En stock
$8.2 / unité
Voir la fiche technique →ATSAME70N21B-AN
✅ Remplacement direct✓ En stock
$11.85 / unité
Voir la fiche technique →ATSAMS70N20B-AN
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ATSAME70N20B-AN Valeurs maximales et caractéristiques électriques
| Core Architecture | ARM Cortex-M7 with FPU |
| Maximum CPU Clock | 300 MHz |
| Flash Memory | 1024 KB (1 MB) |
| SRAM | 384 KB |
| Boîtier | LQFP-100 (14x14 mm) |
| Supply Voltage (VDDIO) | 1.62 V to 3.6 V |
| Supply Voltage (VDDCORE) | 1.2 V (internal LDO) |
| Température de fonctionnement | -40C to +85C (industrial) |
| USB Interface | HS USB 2.0 Device/Host with on-chip PHY |
| CAN Interface | 2x CAN-FD controllers |
| Ethernet | 10/100 MAC with IEEE 1588 PTP |
| External Bus Interface | Yes, supports SDRAM up to 64 MB |
| Image Sensor Interface | Yes |
| Instruction Cache / Data Cache | 16 KB / 16 KB |
| DSP Extensions | Yes (single-cycle MAC, SIMD) |
| Statut RoHS | Compliant |
| Type de montage | Surface Mount |
| Niveau MSL | 3 (168 hours) |
Configuration des broches de ATSAME70N20B-AN
| Broche 1 | PD0 — GPIO / EBI data |
| Broche 2 | PD1 — GPIO / EBI data |
| Broche 3 | PD2 — GPIO / EBI data |
| Broche 4 | PD3 — GPIO / EBI data |
| Broche 5 | VDDIO — I/O supply voltage (1.62V-3.6V) |
| Broche 6 | VSS — Ground |
| Broche 7 | PD4 — GPIO / EBI data |
| Broche 8 | PD5 — GPIO / EBI data |
| Broche 9 | PD6 — GPIO / EBI data |
| Broche 10 | PD7 — GPIO / EBI data |
| Broche 11 | VDDCORE — Core supply (1.2V internal LDO output) |
| Broche 12 | VSS — Ground |
| Broche 13 | PA0 — GPIO / AFEC input |
| Broche 14 | PA1 — GPIO / AFEC input |
| Broche 15 | PA2 — GPIO / AFEC input |
| Broche 16 | PA3 — GPIO / AFEC input |
| Broche 17 | PA4 — GPIO / AFEC input |
| Broche 18 | PA5 — GPIO / AFEC input |
| Broche 19 | PA6 — GPIO / AFEC input |
| Broche 20 | PA7 — GPIO / AFEC input |
| Broche 21 | PA8 — GPIO |
| Broche 22 | PA9 — GPIO / URXD |
| Broche 23 | PA10 — GPIO / UTXD |
| Broche 24 | PA11 — GPIO / USB D- |
| Broche 25 | PA12 — GPIO / USB D+ |
| Broche 26 | PA13 — GPIO |
| Broche 27 | PA14 — GPIO |
| Broche 28 | VDDIO — I/O supply voltage |
| Broche 29 | VSS — Ground |
| Broche 30 | PB0 — GPIO |
| Broche 31 | PB1 — GPIO |
| Broche 32 | PB2 — GPIO |
| Broche 33 | PB3 — GPIO |
| Broche 34 | PB4 — GPIO |
| Broche 35 | PB5 — GPIO |
| Broche 36 | PB6 — GPIO |
| Broche 37 | PB7 — GPIO |
| Broche 38 | PB8 — GPIO |
| Broche 39 | PB9 — GPIO |
| Broche 40 | PB10 — GPIO |
| Broche 41 | PB11 — GPIO |
| Broche 42 | PB12 — GPIO |
| Broche 43 | PB13 — GPIO |
| Broche 44 | PB14 — GPIO |
| Broche 45 | VDDIO — I/O supply voltage |
| Broche 46 | VSS — Ground |
| Broche 47 | PC0 — GPIO / EBI NCS0 |
| Broche 48 | PC1 — GPIO / EBI NCS1 |
| Broche 49 | PC2 — GPIO / EBI NCS2 |
| Broche 50 | PC3 — GPIO / EBI NCS3 |
| Broche 51 | PC4 — GPIO / EBI A0 |
| Broche 52 | PC5 — GPIO / EBI A1 |
| Broche 53 | PC6 — GPIO / EBI A2 |
| Broche 54 | PC7 — GPIO / EBI A3 |
| Broche 55 | PC8 — GPIO / EBI A4 |
| Broche 56 | PC9 — GPIO / EBI A5 |
| Broche 57 | PC10 — GPIO / EBI A6 |
| Broche 58 | PC11 — GPIO / EBI A7 |
| Broche 59 | PC12 — GPIO / EBI A8 |
| Broche 60 | PC13 — GPIO / EBI A9 |
| Broche 61 | PC14 — GPIO / EBI A10 |
| Broche 62 | PC15 — GPIO / EBI A11 |
| Broche 63 | PC16 — GPIO / EBI A12 |
| Broche 64 | PC17 — GPIO / EBI A13 |
| Broche 65 | PC18 — GPIO / EBI A14 |
| Broche 66 | PC19 — GPIO / EBI A15 |
| Broche 67 | PC20 — GPIO / EBI A16 |
| Broche 68 | PC21 — GPIO / EBI A17 |
| Broche 69 | PC22 — GPIO / EBI A18 |
| Broche 70 | PC23 — GPIO / EBI A19 |
| Broche 71 | VDDIO — I/O supply voltage |
| Broche 72 | VSS — Ground |
| Broche 73 | PE0 — GPIO |
| Broche 74 | PE1 — GPIO |
| Broche 75 | PE2 — GPIO |
| Broche 76 | PE3 — GPIO |
| Broche 77 | PE4 — GPIO |
| Broche 78 | PE5 — GPIO |
| Broche 79 | NRST — Reset input (active-low) |
| Broche 80 | TDI — JTAG Test Data In |
| Broche 81 | TDO — JTAG Test Data Out |
| Broche 82 | TMS — JTAG Test Mode Select |
| Broche 83 | TCK — JTAG Test Clock |
| Broche 84 | VDDIO — I/O supply voltage |
| Broche 85 | VSS — Ground |
| Broche 86 | PF0 — GPIO |
| Broche 87 | PF1 — GPIO |
| Broche 88 | PF2 — GPIO |
| Broche 89 | PF3 — GPIO |
| Broche 90 | PF4 — GPIO |
| Broche 91 | PF5 — GPIO |
| Broche 92 | PF6 — GPIO |
| Broche 93 | PF7 — GPIO |
| Broche 94 | PF8 — GPIO |
| Broche 95 | PF9 — GPIO |
| Broche 96 | PF10 — GPIO |
| Broche 97 | PF11 — GPIO |
| Broche 98 | PF12 — GPIO |
| Broche 99 | VDDCORE — Core supply voltage |
| Broche 100 | VSS — Ground |
Applications typiques
ATSAME70N20B-AN convient pour 7 applications: Industrial Automation Controller, Building Automation Gateway, Smart Energy Meter, Motor Control Drive, Point-of-Sale Terminal, Connected Medical Instrumentation, Display and HMI Controller.
Industrial Automation Controller
The ATSAME70N20B-AN suits industrial PLC and motion controller designs because its 300 MHz Cortex-M7 core delivers deterministic real-time response for closed-loop control loops. The dual CAN-FD controllers support modern industrial fieldbuses (CANopen, DeviceNet), while the 10/100 Ethernet MAC with IEEE 1588 PTP enables time-synchronized distributed control. The 384 KB SRAM is sufficient to host EtherCAT slave stacks or Modbus TCP buffers without external memory, simplifying BOM and PCB layout.
Recommandé
Building Automation Gateway
Building automation gateways aggregate data from HVAC, lighting, and security subsystems and forward it to cloud backends. The ATSAME70N20B-AN's HS USB 2.0 with on-chip PHY plus dual CAN-FD and Ethernet MAC provide the multi-protocol connectivity typically required. The 1 MB Flash accommodates BACnet, Modbus, and MQTT stacks concurrently with application firmware. The EBI allows connecting an SDRAM for storing trend logs and configuration history without burdening the internal Flash.
Recommandé
Smart Energy Meter
Smart electricity meters require precision ADC sampling, cryptographic security for tamper detection, and reliable connectivity for AMI backhaul. The ATSAME70N20B-AN integrates DSP extensions that accelerate FFT-based harmonic analysis directly on the Cortex-M7. The Ethernet MAC with 1588 hardware timestamping supports IEC 61850 substations and PMU (Phasor Measurement Unit) implementations. Industrial -40C to +85C temperature rating meets outdoor cabinet deployments in temperate climates.
Recommandé
Motor Control Drive
Field-oriented control (FOC) of three-phase PMSM motors requires deterministic PWM generation, fast ADC sampling synchronized to the PWM, and real-time computation of Park/Clarke transforms. The ATSAME70N20B-AN's Cortex-M7 DSP extensions execute FOC loops in under 5 microseconds at 300 MHz, comfortably fitting typical 10-20 kHz PWM frequencies. The AFEC (Analog Front End Controller) with up to 24 channels supports multi-axis drives, and the HRPWM provides picosecond-edge resolution for low-speed torque smoothness.
Recommandé
Point-of-Sale Terminal
Modern POS terminals integrate a touchscreen display, magnetic stripe reader, NFC contactless reader, receipt printer, and Ethernet or Wi-Fi backhaul. The ATSAME70N20B-AN's EBI supports SDRAM and LCD controllers for color TFT displays, while the image sensor interface can drive a barcode scanner camera. HS USB host supports printers and external peripherals. The 1 MB Flash and 384 KB SRAM comfortably host Linux-free embedded POS firmwares including TLS libraries for payment security.
Recommandé
Connected Medical Instrumentation
Connected medical devices such as patient monitors, infusion pumps, and portable diagnostic instruments require IEC 62304-compliant firmware with deterministic response and reliable connectivity. The ATSAME70N20B-AN's Cortex-M7 supports real-time RTOS (FreeRTOS, SafeRTOS) for safety-critical task scheduling, while the Ethernet MAC enables HL7/FHIR data exchange with hospital networks. The 1 MB Flash accommodates bootloaders, application firmware, and calibration data partitions. Industrial -40C to +85C temperature rating supports portable device use cases.
Recommandé
Display and HMI Controller
Industrial HMI panels with TFT LCD displays from 4.3-inch to 10-inch require a controller capable of driving the display buffer and rendering graphics at acceptable frame rates. The ATSAME70N20B-AN's EBI with SDRAM support can address frame buffers beyond the 384 KB internal SRAM, and its LCD controller directly drives TFT panels up to WXGA resolution. The 2D graphics accelerator and image sensor interface support camera input for vision-based HMI. Combined with Ethernet, the part acts as a complete HMI controller for factory automation panels.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ATSAME70N20B-AN — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ATSAME70N20A-AN | ATSAME70N20B-ANT | ATSAME70N21B-AN | ATSAMS70N20B-AN |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | LQFP-100 (14x14) | LQFP-100 (14x14) - same | LQFP-100 (14x14) - same | LQFP-100 (14x14) - same | LQFP-100 (14x14) - same |
| Core | Cortex-M7 300 MHz | Cortex-M7 300 MHz | Cortex-M7 300 MHz | Cortex-M7 300 MHz | Cortex-M7 300 MHz |
| Flash Memory | 1024 KB (1 MB) | 1024 KB | 1024 KB | 2048 KB | 1024 KB |
| SRAM | 384 KB | 384 KB | 384 KB | 384 KB | 384 KB |
| Ethernet MAC | Yes (10/100 + 1588 PTP) | Yes | Yes | Yes | No (SAM S70 omits Ethernet) |
| Silicon Revision | B | A | B | B | B |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Supply Voltage | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V |
Principaux différenciateurs
- Silicon revision B with errata fixes and improved power efficiency (vs ATSAME70N20A-AN)
- Doubles Flash density within identical 100-LQFP footprint (vs ATSAME70N20B-AN)
- Integrated 10/100 Ethernet MAC with hardware timestamping (vs ATSAMS70N20B-AN)
Notes de conception
The ATSAME70N20B-AN integrates an internal 1.2V LDO that powers the Cortex-M7 core; bypass VDDCORE with a 1uF X7R ceramic capacitor placed within 5mm of the pin per the Microchip hardware design checklist. For noise-sensitive AFEC measurements, an external 1.2V LDO can be connected to VDDCORE instead to reduce analog switching noise. VDDIO must be stable before VDDCORE to prevent latch-up; the internal power-on-reset (POR) handles sequencing if both rails are derived from the same source.
For SDRAM operation via the EBI, route clock, address, and data traces with matched lengths to within +/- 50 mils. Place SDRAM as close as possible to the MCU to minimize propagation delay; the EBI supports up to 150 MHz with proper termination. Provide a ground guard ring around the EBI trace group and stitch vias along the edges to suppress crosstalk to adjacent analog AFEC inputs. Reference Microchip application note AN_42061 for SDRAM layout guidelines.
Estimated: The internal LDO can source up to approximately 100 mA to the core; designs running at full 300 MHz with all peripherals enabled may approach this limit. If your power budget is borderline, measure VDDCORE under worst-case load (Dhrystone loop with all peripherals clocked) to verify voltage stays above 1.08V minimum. Also note that the -AN (tray) and -ANT (tape-and-reel) variants are functionally identical; do not assume firmware differences between them.
At 300 MHz with full peripheral activity, the ATSAME70N20B-AN dissipates approximately 0.5-0.8 W in the 100-LQFP package. The LQFP's theta_JA of roughly 50 C/W means the junction temperature rises 25-40 C above ambient at room temperature. For enclosed industrial enclosures above 60C ambient, consider providing a small copper pour on top of the package or moving to a 144-LQFP variant (SAM V71 family) for better thermal performance.
Informations de conformité
RoHS and REACH compliance per Microchip product declaration. Industrial -40C to +85C temperature grade; not AEC-Q100 qualified - for automotive applications, use SAM V71 automotive grade variants.
