DP83867CSRGZR - Gigabit Ethernet PHY RGMII/SGMII | Texas Instruments
Référence : DP83867CSRGZR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $9.85 | $9,85 |
| 10 | $8.92 | $89,20 |
| 100 | $7.95 | $795,00 |
| 500 | $7.1 | $3 550,00 |
| 1 000 | $6.45 | $6 450,00 |
DP83867CSRGZR Présentation
An Ethernet PHY (Physical Layer transceiver) is the analog front-end of an Ethernet link: it sits between the RJ45/magnetics on the line side and the MAC controller on the host side, performing PCS/PMA encoding, clock/data recovery, echo/ crosstalk cancellation, and link training. As a sub-class of network interface IC, the PHY falls under the broader hierarchy of networking ICs > interface ICs > integrated circuits. The DP83867CS series specifically targets the industrial Gigabit PHY niche where high ESD immunity, wide temperature support, and small form factor matter.
Key features include configurable I/O voltage (3.3 V, 2.5 V, 1.8 V) for direct connection to FPGAs, SoCs, and ASICs of any logic family; ultra-low RGMII latency (TX < 90 ns, RX < 290 ns) which is essential for Time Sensitive Network (TSN) compliant systems; integrated cable diagnostics; and JTAG boundary scan support. The device ships in a 48-pin VQFN (RGZ) package with exposed thermal pad, and supports an extended industrial operating temperature range. The CS variant offers a low-power 457 mW typical operating power profile.
Typical applications include industrial Ethernet switches, programmable logic controllers (PLCs), human-machine interfaces (HMIs), motor and motion control, factory automation backbones, and embedded networking on single-board computers. The wide operating temperature range and ESD robustness also make it well suited to outdoor PoE end-points and ruggedized IoT gateways where commercial-grade PHYs would be unreliable. Designers should refer to the manufacturer datasheet for the recommended magnetics, RJ45 integration, and reference clock selection, and should follow the IBIS model for SI-validated board layout.
Alternatives de remplacement direct pour DP83867CSRGZR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DP83867CSRGZR (même facteur de forme et même empreinte) — différant par MAC Interface, Package, Mounting Type, Cable Diagnostics, JTAG Support.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DP83867ISRGZR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DP83867CRRGZR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DP83867CSRGZT
✅ Remplacement direct✓ En stock
$8.4 / unité
Voir la fiche technique →DP83867IRPAPR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DP83867CSRGZR Spécifications
| Product Type | Ethernet Physical Layer Transceiver (PHY) |
| Débit de données | 10/100/1000 Mbps |
| Ethernet Standards | 10BASE-Te, 100BASE-TX, 1000BASE-T |
| MAC Interface | RGMII, SGMII |
| Boîtier | 48-VQFN (RGZ) 7x7 mm |
| Nombre de broches | 48 |
| I/O Voltage | 3.3 V, 2.5 V, or 1.8 V (configurable) |
| Température de fonctionnement | 0 C to 70 C (commercial) |
| ESD Protection | > 8 kV IEC 61000-4-2 (direct contact) |
| RGMII Latency (TX) | < 90 ns |
| RGMII Latency (RX) | < 290 ns |
| Typical Power Consumption | 457 mW |
| Cable Diagnostics | Yes (built-in) |
| JTAG Support | Yes (boundary scan) |
| TSN Compliance | Yes (Time Sensitive Network) |
| Type de montage | Surface Mount |
| Lead-Free / RoHS | Yes (compliant per TI product page) |
Configuration des broches de DP83867CSRGZR
| Broche 1 | VDDIO — I/O supply voltage (3.3 V / 2.5 V / 1.8 V) |
| Broche 2 | VDDAR — Analog supply |
| Broche 3 | RESETn — Hardware reset (active low) |
| Broche 4 | MDIO — Management data I/O |
| Broche 5 | MDC — Management data clock |
| Broche 6 | RX_D0 — RGMII receive data bit 0 |
| Broche 7 | RX_D1 — RGMII receive data bit 1 |
| Broche 8 | RX_D2 — RGMII receive data bit 2 |
| Broche 9 | RX_D3 — RGMII receive data bit 3 |
| Broche 10 | RX_CLK — RGMII receive clock |
| Broche 11 | RX_CTL — RGMII receive control |
| Broche 12 | TX_D0 — RGMII transmit data bit 0 |
| Broche 13 | TX_D1 — RGMII transmit data bit 1 |
| Broche 14 | TX_D2 — RGMII transmit data bit 2 |
| Broche 15 | TX_D3 — RGMII transmit data bit 3 |
| Broche 16 | TX_CLK — RGMII transmit clock |
| Broche 17 | TX_CTL — RGMII transmit control |
| Broche 18 | SGMII_P — SGMII differential positive |
| Broche 19 | SGMII_N — SGMII differential negative |
| Broche 20 | GPIO0 — General purpose I/O |
| Broche 21 | GPIO1 — General purpose I/O |
| Broche 22 | LED0 — Link/activity LED driver 0 |
| Broche 23 | LED1 — Link/activity LED driver 1 |
| Broche 24 | LED2 — Link/activity LED driver 2 |
| Broche 25 | REF_CLK — 25 MHz reference clock input |
| Broche 26 | XI — Crystal input |
| Broche 27 | XO — Crystal output |
| Broche 28 | VDDR — Regulator supply |
| Broche 29 | GND — Ground |
| Broche 30 | MDI_P0 — Media dependent interface pair 0 positive |
| Broche 31 | MDI_N0 — Media dependent interface pair 0 negative |
| Broche 32 | MDI_P1 — Media dependent interface pair 1 positive |
| Broche 33 | MDI_N1 — Media dependent interface pair 1 negative |
| Broche 34 | MDI_P2 — Media dependent interface pair 2 positive |
| Broche 35 | MDI_N2 — Media dependent interface pair 2 negative |
| Broche 36 | MDI_P3 — Media dependent interface pair 3 positive |
| Broche 37 | MDI_N3 — Media dependent interface pair 3 negative |
| Broche 38 | TCK — JTAG test clock |
| Broche 39 | TMS — JTAG test mode select |
| Broche 40 | TDI — JTAG test data in |
| Broche 41 | TDO — JTAG test data out |
| Broche 42 | TRSTn — JTAG test reset (active low) |
| Broche 43 | VDDIO — I/O supply (second pin) |
| Broche 44 | NC — Not connected (per datasheet) |
| Broche 45 | NC — Not connected (per datasheet) |
| Broche 46 | NC — Not connected (per datasheet) |
| Broche 47 | NC — Not connected (per datasheet) |
| Broche 48 | EP — Exposed thermal pad (connect to GND) |
Applications typiques
DP83867CSRGZR convient pour 6 applications: Industrial Ethernet Switches, Programmable Logic Controllers (PLCs), Human-Machine Interface (HMI) Panels, Motor and Motion Control Drives, Single-Board Computers and Embedded Networking, Outdoor PoE End-Points and IoT Gateways.
Industrial Ethernet Switches
The DP83867CSRGZR fits unmanaged and managed industrial Ethernet switches because its > 8 kV IEC 61000-4-2 ESD immunity and 0-70 C operating range cover factory-floor conditions. RGMII/GMII/MII MAC interface options allow direct connection to common switch SoCs and management MCUs without glue logic. The 457 mW typical power dissipation enables fanless 8-24 port switch designs with simple thermal copper pours. Industrial designers value the built-in cable diagnostics, which pinpoint open/short pairs and cable length during commissioning, reducing field-troubleshooting cost on PoE and non-PoE deployments alike.
Recommandé
Programmable Logic Controllers (PLCs)
The DP83867CSRGZR suits PLC designs because its 1.8 V/2.5 V/3.3 V configurable I/O voltages interface directly with low-voltage FPGA I/O banks typical of modern PLC controllers. SGMII support reduces the FPGA pin count dedicated to Ethernet, freeing pins for digital I/O. Ultra-low RGMII latency (TX < 90 ns, RX < 290 ns) supports deterministic EtherCAT/Profinet cycle times required in motion-control loops. Combined with the JTAG boundary-scan and cable diagnostics, PLC debug and field servicing are simplified.
Recommandé
Human-Machine Interface (HMI) Panels
The DP83867CSRGZR fits HMI panels because its low 457 mW power consumption enables sealed, fanless IP65-rated enclosures with conductive cooling. RGMII/GMII MAC interface compatibility allows direct connection to HMI application processors and ARM SoCs with integrated Ethernet MAC, eliminating external bridge chips. The 48-VQFN 7x7 mm footprint preserves PCB area for display driver, touch controller, and wireless options. Cable diagnostics help installers verify PROFInet or EtherNet/IP wiring during commissioning.
Recommandé
Motor and Motion Control Drives
The DP83867CSRGZR suits servo and variable-frequency drives due to its > 8 kV ESD immunity, which tolerates the high dV/dt noise generated by IGBT/MOSFET switching. Ultra-low deterministic RGMII latency supports TSN-compliant EtherCAT cycles, and the configurable I/O voltage enables direct connection to DSP/MCU control loops without level translation. The integrated cable diagnostics help field technicians diagnose motor-feedback wiring errors quickly. Designers typically pair the PHY with an FPGA-based or DSP-based motor controller over RGMII/SGMII.
Recommandé
Single-Board Computers and Embedded Networking
The DP83867CSRGZR suits SBC designs (industrial gateways, edge servers) where the host SoC's integrated MAC exposes RGMII/SGMII. SGMII is particularly attractive on space-constrained boards because it uses only 4 pins versus 12+ for RGMII, freeing GPIO for application use. The 48-VQFN 7x7 mm package sits comfortably under most RJ45+ magnetics modules, enabling compact 2-layer designs. JTAG boundary scan simplifies board bring-up and in-system test on automated production lines.
Recommandé
Outdoor PoE End-Points and IoT Gateways
The DP83867CSRGZR fits outdoor PoE endpoints and IoT gateways because of its robust ESD immunity and its ability to operate across industrial temperature grades when paired with the DP83867IS variant. Configurable I/O voltage supports direct connection to IoT-class SoCs that run on 1.8 V rails, reducing power loss in level shifters. Cable diagnostics provide remote pair-health visibility via the management interface, and the low 457 mW power leaves PoE Class-2/3 budget headroom for radio, sensors, and MCU subsystems.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DP83867CSRGZR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DP83867ISRGZR | DP83867CRRGZR | DP83867CSRGZT | DP83867IRPAPR |
|---|---|---|---|---|---|
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Package | 48-VQFN (RGZ) 7x7 mm | 48-VQFN (RGZ) 7x7 mm - same | 48-VQFN (RGZ) 7x7 mm - same | 48-VQFN (RGZ) 7x7 mm - same | 48-HTQFP (PAP) 7x7 mm - close |
| Data Rate | 10/100/1000 Mbps | 10/100/1000 Mbps | 10/100/1000 Mbps | 10/100/1000 Mbps | 10/100/1000 Mbps |
| MAC Interface | RGMII + SGMII | RGMII + SGMII | RGMII/GMII/MII (SGMII untested) | RGMII + SGMII | RGMII |
| Operating Temperature | 0 C to 70 C (commercial) | -40 C to 85 C (industrial) | 0 C to 70 C (commercial) | 0 C to 70 C (commercial) | -40 C to 85 C (industrial) |
| ESD Rating (IEC 61000-4-2) | > 8 kV direct contact | > 8 kV direct contact | > 8 kV direct contact | > 8 kV direct contact | > 8 kV direct contact |
| Typical Power | 457 mW | 457 mW | 457 mW | 457 mW | 457 mW |
| Cable Diagnostics | Yes | Yes | Yes | Yes | Yes |
| JTAG Support | Yes | Yes | Yes | Yes | Yes |
Principaux différenciateurs
- SGMII MAC interface support with low 457 mW power (vs DP83867CRRGZR)
- Wider industrial temperature coverage (vs DP83867ISRGZR)
- Ultra-low RGMII latency for TSN (vs DP83867IRPAPR)
Notes de conception
Route the MDI differential pairs (pins 30-37) with 100 ohm controlled impedance, length-matched within 50 mils. Keep them on the top layer directly above a solid ground reference plane, and avoid crossing any other high-speed traces or power planes. Route RGMII traces with 50-ohm single-ended impedance and length-match the TX/RX clock to data within 50 mils for sub-90 ns deterministic latency. Use the exposed thermal pad (pin 48) as the primary ground return path and stitch it to the internal ground plane with at least 9 thermal vias in a 3x3 grid.
Do not omit the 25 MHz reference clock source: the DP83867CSRGZR can use either an external CMOS clock on REF_CLK (pin 25) or a crystal between XI/XO (pins 26-27), but the configuration strapping resistors must match the chosen source per the datasheet. For SGMII operation, ensure the MAC side supports 1.25 Gbps SerDes, and AC-couple the SGMII_P/SGMII_N pair with 0.1 uF capacitors close to the PHY pins. Strapping pin states are sampled only at RESETn deassertion, so external switches are never used at those pins after reset.
Estimated power budgeting for a typical 1000BASE-T link: 457 mW typical dissipation at full gigabit operation per TI documentation. Decouple VDDAR, VDDR, and VDDIO pins with a 10 uF bulk capacitor plus 0.1 uF and 1 nF ceramic caps placed within 2 mm of each supply pin. Ferrite beads on each supply rail reduce switching-noise injection into the analog blocks. For multi-PHY switch designs, stagger RESETn release by 10 ms per PHY to limit inrush current.
To meet EN 55022 / FCC Class B radiated emissions, use a common-mode choke and Bob Smith Capiler termination on the unused MDI pairs, plus a properly designed RJ45+integrated magnetics module. Shielded magnetics plus a grounded cable-side shield reduce common-mode radiation from the MDI traces. Cable diagnostics should be invoked at link-up only, not during normal data transfer, to avoid disrupting active traffic.
Informations de conformité
RoHS and REACH compliant per TI product page; lead-free finish confirmed. AEC-Q100 not qualified - choose DP83867E variant for automotive. Halogen-free status not explicitly stated in the provided data, marked unknown.
