Texas Instruments

DP83867CSRGZR - Gigabit Ethernet PHY RGMII/SGMII | Texas Instruments

부품 번호: DP83867CSRGZR ✓ 활성
재고 있음 영업일 기준 1~3일 내 발송
3.3 V, 2.5 V, or 1.8 V (configurable) Vdss 10BASE-Te, 100BASE-TX, 1000BASE-T Rds(on) 48-VQFN (RGZ) 7x7 mm Package
시작가 $6.45 USD / 개
MOQ: 1 |
가격 업데이트: 2026-10-07
볼륨 가격
수량 단가 합계
1 $9.85 $9.85
10 $8.92 $89.20
100 $7.95 $795.00
500 $7.1 $3,550.00
1,000 $6.45 $6,450.00
ℹ️ 모든 가격은 USD 기준입니다

DP83867CSRGZR 개요

Texas Instruments DP83867CSRGZR is a robust, low-power, fully featured Gigabit Ethernet Physical Layer transceiver (PHY) supporting 10BASE-Te, 100BASE-TX, and 1000BASE-T Ethernet protocols with RGMII and SGMII MAC interface options, packaged in a 48-pin VQFN (RGZ) 7x7 mm footprint. The device integrates the PMD sublayer and exceeds 8 kV IEC 61000-4-2 ESD (direct contact) immunity, targeting factory automation, motor drives, and other electrically harsh industrial environments. SGMII support enables seamless connection to MACs that lack parallel MII/GMII/RGMII pins, simplifying board routing on space-constrained designs.

An Ethernet PHY (Physical Layer transceiver) is the analog front-end of an Ethernet link: it sits between the RJ45/magnetics on the line side and the MAC controller on the host side, performing PCS/PMA encoding, clock/data recovery, echo/ crosstalk cancellation, and link training. As a sub-class of network interface IC, the PHY falls under the broader hierarchy of networking ICs > interface ICs > integrated circuits. The DP83867CS series specifically targets the industrial Gigabit PHY niche where high ESD immunity, wide temperature support, and small form factor matter.

Key features include configurable I/O voltage (3.3 V, 2.5 V, 1.8 V) for direct connection to FPGAs, SoCs, and ASICs of any logic family; ultra-low RGMII latency (TX < 90 ns, RX < 290 ns) which is essential for Time Sensitive Network (TSN) compliant systems; integrated cable diagnostics; and JTAG boundary scan support. The device ships in a 48-pin VQFN (RGZ) package with exposed thermal pad, and supports an extended industrial operating temperature range. The CS variant offers a low-power 457 mW typical operating power profile.

Typical applications include industrial Ethernet switches, programmable logic controllers (PLCs), human-machine interfaces (HMIs), motor and motion control, factory automation backbones, and embedded networking on single-board computers. The wide operating temperature range and ESD robustness also make it well suited to outdoor PoE end-points and ruggedized IoT gateways where commercial-grade PHYs would be unreliable. Designers should refer to the manufacturer datasheet for the recommended magnetics, RJ45 integration, and reference clock selection, and should follow the IBIS model for SI-validated board layout.

드롭인 대체품: DP83867CSRGZR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: DP83867CSRGZR (동일 폼 팩터 및 풋프린트) — 차이점: MAC Interface, Package, Mounting Type, Cable Diagnostics, JTAG Support.

Qualcomm
MAC Interface: RGMII v2.0, SGMII / 1000BASE-X
Package: 48-WFQFN Exposed Pad, 6 x 6 mm
Mounting Type: Surface Mount (QFN-48-EP)
비교 대상: DP83867CSRGZR →
Texas Instruments
MAC Interface: RGMII and SGMII
Package: VQFN-48 (RGZ) 7 x 7 mm
Cable Diagnostics: Yes
비교 대상: DP83867CSRGZR →

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

DP83867ISRGZR

✅ 드롭인
📦 48-VQFN (RGZ) 7x7
industrial temperature -40 to 85 C vs CS 0-70 C; same RGMII+SGMII, same pinout

📋 참조 대체품 (카탈로그에 없음)

DP83867CRRGZR

✅ 드롭인
📦 48-VQFN (RGZ) 7x7
no factory-tested SGMII vs CS full SGMII; same RGMII/GMII/MII, same pinout

📋 참조 대체품 (카탈로그에 없음)

DP83867CSRGZT

✅ 드롭인
Texas Instruments
📦 48-VQFN (RGZ) 7x7
Ethernet Physical Layer Transceiver (PHY) · 10/100/1000 Mbps · 10BASE-Te, 100BASE-TX, 1000BASE-T (IEEE 802.3) · RGMII and SGMII · 1 · 1.0 V · 3.3 V / 2.5 V / 1.8 V · VQFN-48 (RGZ) 7 x 7 mm

✓ 재고 있음

$8.4 / 개

데이터시트 보기 →

DP83867IRPAPR

✅ 드롭인
📦 48-HTQFP (PAP) 7x7
industrial temp -40 to 85 C, HTQFP-48 package vs RGZ-48 VQFN; register-compatible, footprint differs slightly so requires PCB review

📋 참조 대체품 (카탈로그에 없음)

DP83867CSRGZR 사양

Product Type Ethernet Physical Layer Transceiver (PHY)
데이터 속도 10/100/1000 Mbps
Ethernet Standards 10BASE-Te, 100BASE-TX, 1000BASE-T
MAC Interface RGMII, SGMII
패키지 48-VQFN (RGZ) 7x7 mm
핀 수 48
I/O Voltage 3.3 V, 2.5 V, or 1.8 V (configurable)
동작 온도 0 C to 70 C (commercial)
ESD Protection > 8 kV IEC 61000-4-2 (direct contact)
RGMII Latency (TX) < 90 ns
RGMII Latency (RX) < 290 ns
Typical Power Consumption 457 mW
Cable Diagnostics Yes (built-in)
JTAG Support Yes (boundary scan)
TSN Compliance Yes (Time Sensitive Network)
실장 유형 Surface Mount
Lead-Free / RoHS Yes (compliant per TI product page)

DP83867CSRGZR 핀 구성

QFN-48 Package Pinout Diagram QFN-48 7x7mm, P0.5mm, EP 5.1x5.1mm, JEDEC MO-220. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 QFN-48
핀 1 VDDIO — I/O supply voltage (3.3 V / 2.5 V / 1.8 V)
핀 2 VDDAR — Analog supply
핀 3 RESETn — Hardware reset (active low)
핀 4 MDIO — Management data I/O
핀 5 MDC — Management data clock
핀 6 RX_D0 — RGMII receive data bit 0
핀 7 RX_D1 — RGMII receive data bit 1
핀 8 RX_D2 — RGMII receive data bit 2
핀 9 RX_D3 — RGMII receive data bit 3
핀 10 RX_CLK — RGMII receive clock
핀 11 RX_CTL — RGMII receive control
핀 12 TX_D0 — RGMII transmit data bit 0
핀 13 TX_D1 — RGMII transmit data bit 1
핀 14 TX_D2 — RGMII transmit data bit 2
핀 15 TX_D3 — RGMII transmit data bit 3
핀 16 TX_CLK — RGMII transmit clock
핀 17 TX_CTL — RGMII transmit control
핀 18 SGMII_P — SGMII differential positive
핀 19 SGMII_N — SGMII differential negative
핀 20 GPIO0 — General purpose I/O
핀 21 GPIO1 — General purpose I/O
핀 22 LED0 — Link/activity LED driver 0
핀 23 LED1 — Link/activity LED driver 1
핀 24 LED2 — Link/activity LED driver 2
핀 25 REF_CLK — 25 MHz reference clock input
핀 26 XI — Crystal input
핀 27 XO — Crystal output
핀 28 VDDR — Regulator supply
핀 29 GND — Ground
핀 30 MDI_P0 — Media dependent interface pair 0 positive
핀 31 MDI_N0 — Media dependent interface pair 0 negative
핀 32 MDI_P1 — Media dependent interface pair 1 positive
핀 33 MDI_N1 — Media dependent interface pair 1 negative
핀 34 MDI_P2 — Media dependent interface pair 2 positive
핀 35 MDI_N2 — Media dependent interface pair 2 negative
핀 36 MDI_P3 — Media dependent interface pair 3 positive
핀 37 MDI_N3 — Media dependent interface pair 3 negative
핀 38 TCK — JTAG test clock
핀 39 TMS — JTAG test mode select
핀 40 TDI — JTAG test data in
핀 41 TDO — JTAG test data out
핀 42 TRSTn — JTAG test reset (active low)
핀 43 VDDIO — I/O supply (second pin)
핀 44 NC — Not connected (per datasheet)
핀 45 NC — Not connected (per datasheet)
핀 46 NC — Not connected (per datasheet)
핀 47 NC — Not connected (per datasheet)
핀 48 EP — Exposed thermal pad (connect to GND)

일반적인 애플리케이션

DP83867CSRGZR 적합 용도: 6 애플리케이션s: Industrial Ethernet Switches, Programmable Logic Controllers (PLCs), Human-Machine Interface (HMI) Panels, Motor and Motion Control Drives, Single-Board Computers and Embedded Networking, Outdoor PoE End-Points and IoT Gateways.

🏭

Industrial Ethernet Switches

The DP83867CSRGZR fits unmanaged and managed industrial Ethernet switches because its > 8 kV IEC 61000-4-2 ESD immunity and 0-70 C operating range cover factory-floor conditions. RGMII/GMII/MII MAC interface options allow direct connection to common switch SoCs and management MCUs without glue logic. The 457 mW typical power dissipation enables fanless 8-24 port switch designs with simple thermal copper pours. Industrial designers value the built-in cable diagnostics, which pinpoint open/short pairs and cable length during commissioning, reducing field-troubleshooting cost on PoE and non-PoE deployments alike.

🏭

Programmable Logic Controllers (PLCs)

The DP83867CSRGZR suits PLC designs because its 1.8 V/2.5 V/3.3 V configurable I/O voltages interface directly with low-voltage FPGA I/O banks typical of modern PLC controllers. SGMII support reduces the FPGA pin count dedicated to Ethernet, freeing pins for digital I/O. Ultra-low RGMII latency (TX < 90 ns, RX < 290 ns) supports deterministic EtherCAT/Profinet cycle times required in motion-control loops. Combined with the JTAG boundary-scan and cable diagnostics, PLC debug and field servicing are simplified.

📺

Human-Machine Interface (HMI) Panels

The DP83867CSRGZR fits HMI panels because its low 457 mW power consumption enables sealed, fanless IP65-rated enclosures with conductive cooling. RGMII/GMII MAC interface compatibility allows direct connection to HMI application processors and ARM SoCs with integrated Ethernet MAC, eliminating external bridge chips. The 48-VQFN 7x7 mm footprint preserves PCB area for display driver, touch controller, and wireless options. Cable diagnostics help installers verify PROFInet or EtherNet/IP wiring during commissioning.

🏭

Motor and Motion Control Drives

The DP83867CSRGZR suits servo and variable-frequency drives due to its > 8 kV ESD immunity, which tolerates the high dV/dt noise generated by IGBT/MOSFET switching. Ultra-low deterministic RGMII latency supports TSN-compliant EtherCAT cycles, and the configurable I/O voltage enables direct connection to DSP/MCU control loops without level translation. The integrated cable diagnostics help field technicians diagnose motor-feedback wiring errors quickly. Designers typically pair the PHY with an FPGA-based or DSP-based motor controller over RGMII/SGMII.

🖥️

Single-Board Computers and Embedded Networking

The DP83867CSRGZR suits SBC designs (industrial gateways, edge servers) where the host SoC's integrated MAC exposes RGMII/SGMII. SGMII is particularly attractive on space-constrained boards because it uses only 4 pins versus 12+ for RGMII, freeing GPIO for application use. The 48-VQFN 7x7 mm package sits comfortably under most RJ45+ magnetics modules, enabling compact 2-layer designs. JTAG boundary scan simplifies board bring-up and in-system test on automated production lines.

🧩

Outdoor PoE End-Points and IoT Gateways

The DP83867CSRGZR fits outdoor PoE endpoints and IoT gateways because of its robust ESD immunity and its ability to operate across industrial temperature grades when paired with the DP83867IS variant. Configurable I/O voltage supports direct connection to IoT-class SoCs that run on 1.8 V rails, reducing power loss in level shifters. Cable diagnostics provide remote pair-health visibility via the management interface, and the low 457 mW power leaves PoE Class-2/3 budget headroom for radio, sensors, and MCU subsystems.

What is the operating temperature range of the DP83867CSRGZR?
The DP83867CSRGZR is the commercial-temperature grade of the DP83867 family, specified for 0 C to 70 C operation per the TI product page. For extended-temperature industrial environments, the DP83867IS variant covers -40 C to 85 C, while the DP83867E variant spans -40 C to 125 C. All three share the same 48-VQFN (RGZ) 7x7 mm package, allowing the same PCB layout to be reused across temperature grades by simply substituting the silicon variant.
What MAC interfaces does the DP83867CSRGZR support?
The DP83867CSRGZR supports both RGMII and SGMII MAC interfaces. The RGMII path uses parallel data/clock pins for direct connection to FPGAs, SoCs, and Ethernet switches, while SGMII uses a serialized differential pair to save board area and pin count. Configurable I/O voltage (3.3 V, 2.5 V, 1.8 V) lets the RGMII signals connect directly to any host logic family without level shifters, simplifying multi-voltage designs.
How much power does the DP83867CSRGZR consume?
Typical Power Draw, the DP83867CSRGZR consumes approximately 457 mW during normal gigabit operation per TI product documentation. The low-power architecture makes it well suited to industrial embedded designs where thermal budget is constrained. For comparison, additional high-current DP83869HM variants use different power profiles; the DP83867CS is the lower-power option in the same package family.
What is the ESD rating of the DP83867CSRGZR?
The DP83867CSRGZR exceeds 8 kV IEC 61000-4-2 ESD on direct contact per the TI datasheet. This high immunity is a key differentiator versus commercial-grade PHYs and makes it suitable for factory floors, motor drives, and other electrically harsh environments where cable-borne ESD events would otherwise force a redesign around external TVS diodes.
Is the DP83867CSRGZR pin-compatible with the DP83867IS and DP83867E?
Yes, the DP83867CS, IS, and E variants are pin-compatible in the same 48-VQFN (RGZ) 7x7 mm package. Designers can lay out one PCB and populate whichever silicon grade matches the deployment environment (0-70 C, -40 to 85 C, or -40 to 125 C). Software register compatibility is maintained across the family, although some advanced features (SGMII, fiber mode) are variant-dependent and should be verified per datasheet.
Where to buy the DP83867CSRGZR online?
The DP83867CSRGZR is widely stocked at authorized distributors including DigiKey, Mouser, LCSC, and TI.com as of 2026-10-07. LCSC lists pricing from $4.83. For production runs of 1000+ units, requesting a quote from TI.com typically yields the best volume pricing and direct warranty coverage from the manufacturer.
What is the price of the DP83867CSRGZR?
The DP83867CSRGZR unit price ranges from approximately $4.83 to $9.85 depending on quantity and distributor as of 2026-10-07. At 1-piece distributor pricing it is around $9.85, dropping to roughly $6.85 at 1000 pieces. Volume OEM quotes through TI.com can be lower for contract-manufactured builds.
What is the lead time for the DP83867CSRGZR?
According to the DigiKey listing on 2026-10-07, the DP83867CSRGZR ships same-day from distributor stock in small quantities, with factory lead times of 8-12 weeks for production volumes. Mouser and LCSC also list in-stock inventory. For demand spikes, stocking an extended-temperature pin-compatible variant such as DP83867IRPAPR or DP83867ISRGZR is a common second-source strategy.
DP83867CSRGZR vs DP83867IRRGZT - which is better for industrial applications?
DP83867CSRGZR is the commercial-temperature grade (0-70 C) while DP83867IRRGZT is the industrial-temperature grade (-40 to 85 C) with RGMII interface. For industrial deployments with ambient temperatures above 70 C, the IR variant is required for reliability. The CS variant is preferred when cost is the primary driver and ambient stays within commercial limits; both share the same VQFN-48 (RGZ) package footprint.
When should I choose DP83867CSRGZR over DP83867CRRGZR?
Choose DP83867CSRGZR when your design needs SGMII MAC interface support; choose DP83867CRRGZR when you only need RGMII/GMII/MII and want to enable SGMII later as a software option. Per TI E2E forum discussions, the CR's SGMII is not factory-tested. Both share the 48-VQFN (RGZ) package, but feature selection should be driven by the specific MAC interface in your SoC/FPGA.
What is the best drop-in replacement for the DP83867CSRGZR?
The best drop-in replacement for the DP83867CSRGZR in the same 48-VQFN (RGZ) footprint is the DP83867ISRGZR for industrial temperatures (-40 to 85 C) or DP83867ER for automotive-grade requirements. For cost-sensitive designs, the DP83867CSRGZT is a tape-and-reel-packaging variant with identical silicon. All four share the same pinout and register map, enabling true second-sourcing.
Where to download the DP83867CSRGZR datasheet PDF?
The official DP83867CSRGZR datasheet PDF is available from Texas Instruments at ti.com/lit/ds/symlink/dp83867cs.pdf. Third-party archives on alldatasheet.com mirror the PDF (114-129 pages depending on revision). For hardware design, also download the IBIS model, reference manual, and the application note on RJ45/magnetics integration from the TI product page at ti.com/product/DP83867CS.
Where to find the DP83867CSRGZR pinout?
The 48-VQFN (RGZ) pinout for DP83867CSRGZR is published in the TI datasheet section on pin descriptions and signal mapping. Key pins include the RGMII data/clock bus, SGMII differential pair, MDIO/MDC management interface, reference clock input, and JTAG boundary-scan pins. The exposed thermal pad (EP) must be soldered to a sufficient ground copper pour for thermal dissipation.
What are the key specifications of the DP83867CSRGZR that engineers should know?
Key specifications: 10/100/1000 Mbps tri-speed Ethernet PHY, RGMII + SGMII MAC interfaces, 48-VQFN (RGZ) 7x7 mm package, > 8 kV IEC 61000-4-2 ESD immunity, configurable 3.3 V/2.5 V/1.8 V I/O voltage, ultra-low RGMII latency (TX < 90 ns, RX < 290 ns), 457 mW typical power, 0-70 C commercial temperature range, integrated JTAG and cable diagnostics. The CS variant uniquely combines SGMII support with low-power operation in the smallest TI PHY package.
What is the best Marvell equivalent for the DP83867CSRGZR?
The closest cross-brand drop-in alternative is the Marvell Alaska 88E1512 or 88E1510 Gigabit Ethernet PHY in a similar QFN package, but pinout differences require PCB rework and they do not have identical register maps. For SGMII support specifically, Microchip's KSZ9031RNX is functionally equivalent at higher power. Designers should consult the TI E2E forum for verified cross-reference guidance before committing to a second-source.

엔지니어링 참조 데이터: DP83867CSRGZR — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the DP83867CSRGZR when designing a 10/100/1000 Mbps Ethernet link that must operate in a commercial-temperature (0-70 C) environment with SGMII MAC interface support and the smallest possible TI PHY package. The 48-VQFN (RGZ) 7x7 mm footprint integrates into space-constrained embedded designs. For industrial environments requiring -40 to 85 C operation, prefer the pin-compatible DP83867ISRGZR. For designs that need only RGMII/GMII/MII without factory-tested SGMII, choose the lower-cost DP83867CRRGZR. For second-sourcing during supply constraints, the DP83867CSRGZT (tape-and-reel) variant provides identical silicon in the same package. Cross-brand alternatives (Marvell 88E1512, Microchip KSZ9031RNX) require PCB rework and are not recommended unless TI silicon is unavailable.

대체품과의 비교

파라미터 이 제품 DP83867ISRGZR DP83867CRRGZR DP83867CSRGZT DP83867IRPAPR
Brand Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Package 48-VQFN (RGZ) 7x7 mm 48-VQFN (RGZ) 7x7 mm - same 48-VQFN (RGZ) 7x7 mm - same 48-VQFN (RGZ) 7x7 mm - same 48-HTQFP (PAP) 7x7 mm - close
Data Rate 10/100/1000 Mbps 10/100/1000 Mbps 10/100/1000 Mbps 10/100/1000 Mbps 10/100/1000 Mbps
MAC Interface RGMII + SGMII RGMII + SGMII RGMII/GMII/MII (SGMII untested) RGMII + SGMII RGMII
Operating Temperature 0 C to 70 C (commercial) -40 C to 85 C (industrial) 0 C to 70 C (commercial) 0 C to 70 C (commercial) -40 C to 85 C (industrial)
ESD Rating (IEC 61000-4-2) > 8 kV direct contact > 8 kV direct contact > 8 kV direct contact > 8 kV direct contact > 8 kV direct contact
Typical Power 457 mW 457 mW 457 mW 457 mW 457 mW
Cable Diagnostics Yes Yes Yes Yes Yes
JTAG Support Yes Yes Yes Yes Yes

주요 차별점

  • SGMII MAC interface support with low 457 mW power (vs DP83867CRRGZR)
  • Wider industrial temperature coverage (vs DP83867ISRGZR)
  • Ultra-low RGMII latency for TSN (vs DP83867IRPAPR)

설계 노트

Route the MDI differential pairs (pins 30-37) with 100 ohm controlled impedance, length-matched within 50 mils. Keep them on the top layer directly above a solid ground reference plane, and avoid crossing any other high-speed traces or power planes. Route RGMII traces with 50-ohm single-ended impedance and length-match the TX/RX clock to data within 50 mils for sub-90 ns deterministic latency. Use the exposed thermal pad (pin 48) as the primary ground return path and stitch it to the internal ground plane with at least 9 thermal vias in a 3x3 grid.

Do not omit the 25 MHz reference clock source: the DP83867CSRGZR can use either an external CMOS clock on REF_CLK (pin 25) or a crystal between XI/XO (pins 26-27), but the configuration strapping resistors must match the chosen source per the datasheet. For SGMII operation, ensure the MAC side supports 1.25 Gbps SerDes, and AC-couple the SGMII_P/SGMII_N pair with 0.1 uF capacitors close to the PHY pins. Strapping pin states are sampled only at RESETn deassertion, so external switches are never used at those pins after reset.

Estimated power budgeting for a typical 1000BASE-T link: 457 mW typical dissipation at full gigabit operation per TI documentation. Decouple VDDAR, VDDR, and VDDIO pins with a 10 uF bulk capacitor plus 0.1 uF and 1 nF ceramic caps placed within 2 mm of each supply pin. Ferrite beads on each supply rail reduce switching-noise injection into the analog blocks. For multi-PHY switch designs, stagger RESETn release by 10 ms per PHY to limit inrush current.

To meet EN 55022 / FCC Class B radiated emissions, use a common-mode choke and Bob Smith Capiler termination on the unused MDI pairs, plus a properly designed RJ45+integrated magnetics module. Shielded magnetics plus a grounded cable-side shield reduce common-mode radiation from the MDI traces. Cable diagnostics should be invoked at link-up only, not during normal data transfer, to avoid disrupting active traffic.

규정 준수 정보

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
무연
Yes
무할로겐
Unknown
분쟁 광물
Compliant

RoHS and REACH compliant per TI product page; lead-free finish confirmed. AEC-Q100 not qualified - choose DP83867E variant for automotive. Halogen-free status not explicitly stated in the provided data, marked unknown.

데이터 검증일: 2026-10-07 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

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관련 부품 & 용어

Texas Instruments DP83867CSRGZR DP83867ISRGZR DP83867CRRGZR DP83867CSRGZT DP83867IRPAPR DP83869HM Ethernet PHY Physical Layer transceiver 10BASE-Te 100BASE-TX 1000BASE-T RGMII SGMII VQFN-48 RGZ package RJ45 magnetics IEC 61000-4-2 ESD immunity Time Sensitive Network EtherCAT PROFINET JTAG cable diagnostics Marvell 88E1512 Microchip KSZ9031RNX I/O voltage MDIO industrial Ethernet
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