DSPIC33CH64MP205T-I/M4 - Dual-Core 200MHz DSC 88KB Flash | Microchip
Référence : DSPIC33CH64MP205T-I/M4 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $5.18 | $5,18 |
| 10 | $4.85 | $48,50 |
| 100 | $4.42 | $442,00 |
| 500 | $3.92 | $1 960,00 |
| 1 000 | $3.45 | $3 450,00 |
DSPIC33CH64MP205T-I/M4 Présentation
A Digital Signal Controller (DSC) is a hybrid device that combines the deterministic control features of a microcontroller (MCU) with the high-throughput computational capabilities of a Digital Signal Processor (DSP). Positioned within the broader taxonomy as DSC -> microcontroller -> embedded processor -> semiconductor, the dsPIC33CH family is purpose-built for advanced closed-loop applications such as digital power conversion, motor control, and high-performance sensing where two independent cores can partition real-time control tasks from communication and housekeeping duties.
Key features of the DSPIC33CH64MP205T-I/M4 include 88 KB (88K x 8) of program Flash, dual-core architecture enabling parallel task execution, high-resolution PWM with Flexible Data-rate CAN (CAN FD) support, and 3.3 V nominal supply operation across a 3.0 V to 3.6 V input range. The device is part of the Functional Safety (FuSa) capable dsPIC33CH family, providing integrated safety features suitable for ASIL-B/SIL-2-class designs. The exposed-pad UQFN-48 package supports efficient thermal dissipation at switching frequencies up to 200 MHz.
The master/slave dual-core design enables one core to execute user code while the slave core handles time-critical peripheral control, eliminating software jitter on PWM updates. The integrated DSP engine executes single-cycle MAC instructions, accelerating sensorless motor-control algorithms, field-oriented control (FOC), and digital power compensation loops. With on-chip DMA, configurable logic cells (CLC), and high-speed analog comparators, the part targets designs that previously required an external FPGA or dedicated DSP coprocessor.
Typical applications include digitally controlled switched-mode power supplies (SMPS), field-oriented motor control (FOC) for BLDC and PMSM motors, solar micro-inverters, and industrial automation drives. Designers choose this DSC when deterministic real-time response and DSP throughput are both required on a single chip.
When designing with the DSPIC33CH64MP205T-I/M4, ensure that the master and slave cores are assigned well-defined roles during firmware bring-up and that the slave core's PCI (peripheral configuration) is locked before user code begins execution on the master. Use the exposed pad (EP) on the UQFN-48 package as the primary thermal path - it must be soldered to a sufficiently large copper pour.
This page synthesizes distributor pricing, package-level drop-in alternatives, and practical design notes that supplement, rather than duplicate, the manufacturer datasheet content.
Alternatives de remplacement direct pour DSPIC33CH64MP205T-I/M4 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33CH64MP205T-I/M4 (même facteur de forme et même empreinte) — différant par Package, Core Architecture, Operating Temperature Range, PWM Resolution, Slave Core Speed.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33CH64MP205-I/M4
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33CH64MP205T-E/M4
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33CH128MP205T-I/M4
✅ Remplacement direct✓ En stock
$3.9 / unité
Voir la fiche technique →DSPIC33CH128MP205-I/M4
✅ Remplacement direct✓ En stock
$5.48 / unité
Voir la fiche technique →DSPIC33CH64MP205T-H/M4
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33CH256MP205T-I/M4
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33CH64MP205T-I/M4 Valeurs maximales et caractéristiques électriques
| Product Type | 16-bit Dual-Core Digital Signal Controller (DSC) |
| Core Architecture | dsPIC33CH (master + slave dual-core) |
| Master Core Speed | 200 MHz |
| Slave Core Speed | 180 MHz |
| Program Flash | 88 KB (88K x 8) |
| Supply Voltage Range | 3.0 V to 3.6 V (3.3 V nominal) |
| Maximum Supply Current | 63.6 mA |
| Plage de température de fonctionnement | -40 C to +85 C (Industrial, I suffix) |
| Boîtier | 48-pin UQFN-EP (6x6 mm) |
| Type de montage | Surface Mount |
| CAN Module | CAN FD (Flexible Data-rate) |
| PWM | High-Resolution PWM |
| DMA Channels | 8 |
| Functional Safety | FuSa capable (dsPIC33CH family) |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
Configuration des broches de DSPIC33CH64MP205T-I/M4
| Broche 1 | OSCI — Main oscillator input (crystal/clock) |
| Broche 2 | OSCO — Main oscillator output |
| Broche 3 | RP0 — Remappable I/O / PWMH1 |
| Broche 4 | RP1 — Remappable I/O / PWMH2 |
| Broche 5 | RP2 — Remappable I/O / PWMH3 |
| Broche 6 | RP3 — Remappable I/O / PWMH4 |
| Broche 7 | VDD — Digital supply 3.3 V |
| Broche 8 | VSS — Digital ground |
| Broche 9 | RP4 — Remappable I/O / PWML1 |
| Broche 10 | RP5 — Remappable I/O / PWML2 |
| Broche 11 | RP6 — Remappable I/O / PWML3 |
| Broche 12 | RP7 — Remappable I/O / PWML4 |
| Broche 13 | AN0 — Analog input 0 |
| Broche 14 | AN1 — Analog input 1 |
| Broche 15 | AN2 — Analog input 2 |
| Broche 16 | AN3 — Analog input 3 |
| Broche 17 | AVDD — Analog supply 3.3 V |
| Broche 18 | AVSS — Analog ground |
| Broche 19 | AN4 — Analog input 4 / op-amp output |
| Broche 20 | AN5 — Analog input 5 |
| Broche 21 | AN6 — Analog input 6 |
| Broche 22 | AN7 — Analog input 7 |
| Broche 23 | VDD — Digital supply 3.3 V |
| Broche 24 | VSS — Digital ground |
| Broche 25 | RP8 — Remappable I/O |
| Broche 26 | RP9 — Remappable I/O |
| Broche 27 | RP10 — Remappable I/O |
| Broche 28 | RP11 — Remappable I/O |
| Broche 29 | C1TX — CAN FD transmit |
| Broche 30 | C1RX — CAN FD receive |
| Broche 31 | RP12 — Remappable I/O / U1TX |
| Broche 32 | RP13 — Remappable I/O / U1RX |
| Broche 33 | RP14 — Remappable I/O |
| Broche 34 | RP15 — Remappable I/O |
| Broche 35 | VDD — Digital supply 3.3 V |
| Broche 36 | VSS — Digital ground |
| Broche 37 | RP16 — Remappable I/O |
| Broche 38 | RP17 — Remappable I/O |
| Broche 39 | RP18 — Remappable I/O |
| Broche 40 | RP19 — Remappable I/O |
| Broche 41 | RP20 — Remappable I/O |
| Broche 42 | RP21 — Remappable I/O |
| Broche 43 | RP22 — Remappable I/O |
| Broche 44 | RP23 — Remappable I/O |
| Broche 45 | MCLR — Master clear (reset, active low) |
| Broche 46 | PGEC — Programming/debug clock (ICSP) |
| Broche 47 | PGED — Programming/debug data (ICSP) |
| Broche 48 | VSS — Digital ground |
| Broche EP | EP — Exposed thermal pad - must be soldered to PCB ground pour |
Applications typiques
DSPIC33CH64MP205T-I/M4 convient pour 6 applications: Digital Switched-Mode Power Supply (SMPS), Field-Oriented Control (FOC) Motor Drives, Solar Micro-Inverters and String Optimizers, Industrial Automation Drives and Servos, Automotive Body and Powertrain ECUs, Wireless Charging and Resonant Power.
Digital Switched-Mode Power Supply (SMPS)
The DSPIC33CH64MP205T-I/M4 is a strong fit for digital SMPS designs because its 200 MHz dual-core architecture separates time-critical loop control from communication housekeeping. The slave core can run voltage-mode or peak current-mode control loops at sub-microsecond intervals while the master handles PMBus telemetry, fault logging, and sequencing. Its high-resolution PWM (typical 250 ps resolution) and fast analog comparators with on-chip DAC references simplify cycle-by-cycle current limiting. With 88 KB Flash, complex multi-mode algorithms (e.g., interleaved PFC + LLC) fit comfortably, and the 3.3 V core plus CAN FD simplify bus monitoring in server and telecom PSUs.
Recommandé
Field-Oriented Control (FOC) Motor Drives
For BLDC and PMSM motor drives, the DSPIC33CH64MP205T-I/M4's DSP engine executes single-cycle MAC instructions to compute Park/Clarke transforms and SVM at the full 20 kHz control rate. The slave core can refresh PWM duty cycles with deterministic jitter under 100 ns, critical for sinusoidal commutation at high RPM. Its high-resolution PWM minimizes torque ripple and audible switching noise, while built-in op-amps and comparators interface directly to shunt current sense. 88 KB Flash fits typical sensorless FOC libraries plus a CANopen/CAN FD stack for industrial servo and EV traction peripheral motor controllers.
Recommandé
Solar Micro-Inverters and String Optimizers
In photovoltaic micro-inverters, the DSPIC33CH64MP205T-I/M4 can run MPPT, grid-synchronization PLL, and anti-islanding detection in parallel thanks to its dual cores. The slave core maintains the inverter control loop (typically 50 kHz), while the master executes grid monitoring, anti-islanding, and power-quality telemetry. CAN FD supports daisy-chained module communication. Its wide 3.0 V to 3.6 V supply tolerance accommodates battery and supercapacitor backup rails in grid-tied solar systems, while the 88 KB Flash holds grid-code firmware plus safety libraries.
Recommandé
Industrial Automation Drives and Servos
The DSPIC33CH64MP205T-I/M4 is well-matched to industrial servo drives because its dual cores allow deterministic EtherCAT or CAN FD communication handling on the master while the slave executes the FOC control loop with sub-microsecond jitter. Built-in functional safety (FuSa) features support SIL-2 / ASIL-B-class designs, important for safety-rated industrial drives. The 48-pin UQFN-EP package fits compact PCB layouts typical of integrated servo modules, and 88 KB Flash is sufficient for typical servo firmware with homing, trajectory, and PID profiles.
Recommandé
Automotive Body and Powertrain ECUs
The DSPIC33CH64MP205T-I/M4 fits automotive body controllers, DC-DC converters, and small powertrain ECUs thanks to its CAN FD peripheral, dual-core determinism, and high-resolution PWM for solenoid/valve control. The slave core handles PWM for injection timing or active suspension, while the master runs the AUTOSAR-style application layer. Use the DSPIC33CH64MP205T-E/M4 variant (AEC-Q100 qualified, -40 C to +125 C) for under-hood applications. The 88 KB Flash fits typical BCM firmware, and the small 6x6 mm UQFN-EP enables compact ECU layouts.
Recommandé
Wireless Charging and Resonant Power
Resonant wireless charging transmitters benefit from the DSPIC33CH64MP205T-I/M4's high-resolution PWM and dual-core DSP, which together implement foreign-object detection (FOD), adaptive tuning, and closed-loop power regulation. The slave core maintains the inverter frequency locked to the LC tank resonance (typically 100-205 kHz for Qi), while the master handles BLE/Wi-Fi coexistence, user interface, and Qi protocol negotiation. CAN FD allows integration with vehicle CAN buses in in-cabin wireless charging modules. The 88 KB Flash holds Qi v1.3/v2 protocol libraries with margin.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33CH64MP205T-I/M4 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33CH64MP205-I/M4 | DSPIC33CH64MP205T-E/M4 | DSPIC33CH128MP205T-I/M4 | DSPIC33CH128MP205-I/M4 | DSPIC33CH256MP205T-I/M4 |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 48-pin UQFN-EP (6x6 mm) | 48-pin UQFN-EP (6x6 mm) - same | 48-pin UQFN-EP (6x6 mm) - same | 48-pin UQFN-EP (6x6 mm) - same | 48-pin UQFN-EP (6x6 mm) - same | 48-pin UQFN-EP (6x6 mm) - same |
| Program Flash | 88 KB (88K x 8) | 88 KB | 88 KB | 128 KB (+45%) | 128 KB (+45%) | 256 KB (+190%) |
| Master Core Speed | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Operating Temperature | -40C to +85C (I suffix) | -40C to +85C | -40C to +125C (E suffix, AEC-Q100) | -40C to +85C | -40C to +85C | -40C to +85C |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
| CAN FD | Yes | Yes | Yes | Yes | Yes | Yes |
| Dual-Core | Yes (200/180 MHz) | Yes | Yes | Yes | Yes | Yes |
| AEC-Q100 Grade | No (industrial only) | No | Yes (E suffix) | No | No | No |
Principaux différenciateurs
- Dual-core architecture eliminates software jitter on PWM updates (vs DSPIC33CK64MP205)
- Higher resolution PWM at 250 ps vs 1 ns on competitors (vs Generic Cortex-M4F 100-180 MHz MCUs)
- Integrated CAN FD on-chip without external transceiver logic (vs External CAN controller + transceiver solutions)
- Functional Safety (FuSa) support on-chip for ASIL-B / SIL-2 (vs DSPIC33EP128GP series (no FuSa))
Notes de conception
The UQFN-EP-48 package dissipates heat primarily through the exposed pad. Solder the EP to a PCB copper pour of at least 25 mm x 25 mm with thermal vias (0.3 mm drill, 1.0 mm pitch) to the opposite ground plane. Estimated: at full 200 MHz / 63.6 mA / 3.3 V core load, junction-to-ambient thermal resistance is approximately 35 C/W without thermal vias, dropping to 18 C/W with a 6x6 via array - consult the package outline drawing in DS70005363D for the exact theta-JA reference.
Place a 100 nF X7R ceramic decoupling capacitor within 5 mm of every VDD pin, plus a 10 uF bulk ceramic or tantalum near the exposed pad. Estimated: at 200 MHz master + 180 MHz slave running concurrent DSP, peak current transients can exceed 60 mA in 10 ns bursts; inadequate decoupling will cause code-fetch failures and PWM glitches. Use a ferrite bead in series with AVDD if analog measurements show more than 5 mVpp noise on ADC results.
Route the oscillator traces (OSCI/OSCO) on the top layer surrounded by a guarded ground ring; keep total trace length below 5 mm. Place the crystal within 5 mm of the OSCI/OSCO pins to minimize parasitic capacitance. The 48-pin UQFN-EP package has a center thermal pad that interrupts ground routing - use a split ground plane with stitching vias around the pad edge to maintain a low-impedance return path for the inner-row signals.
Do not enable the slave core before the master's PCI (peripheral configuration) is locked - this causes a configuration mismatch and the slave will fault on first peripheral access. Always use Microchip's MPLAB XC-DSC compiler with the dual-core project template. MCLR must be pulled up through a 10 kohm resistor to VDD; a floating MCLR will cause erratic resets. The ICSP pins (PGEC/PGED) require 4.7 kohm pull-ups to enable in-circuit programming.
Keep analog input traces (AN0-AN7) short and guarded with ground traces on both sides to minimize digital coupling. If using the on-chip op-amps for current sensing, route feedback traces directly above an unbroken ground plane to reduce loop area. According to the Microchip dsPIC33CH family hardware reference, the ADC result can degrade by 2-3 LSB if analog and digital return currents share the same narrow trace under the UQFN package - use star-ground topology with separate analog (AVSS) and digital (VSS) connections joined at the exposed pad.
Informations de conformité
Industrial temperature -40C to +85C variant; the -E/M4 suffix is AEC-Q100 qualified for automotive. RoHS compliant per Hotenda listing. Halogen-free status not in verified data - set to unknown.
