DSPIC33EP128GM604T-I/ML - 70 MIPS 16-bit DSC, 128KB Flash | Microchip
Référence : DSPIC33EP128GM604T-I/ML ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $6.84 | $6,84 |
| 10 | $6.16 | $61,60 |
| 100 | $5.5 | $550,00 |
| 500 | $4.95 | $2 475,00 |
| 1 000 | $4.4 | $4 400,00 |
DSPIC33EP128GM604T-I/ML Présentation
A digital signal controller combines the computational core of a microcontroller with DSP-style multiply-accumulate hardware, single-cycle MAC, and DSP addressing modes. Within the power-management hierarchy of embedded processors, a DSC sits between general-purpose MCUs and dedicated DSPs, making it the natural choice for closed-loop control systems that need both fast math and deterministic I/O behavior.
Key differentiating features include twelve motor-control PWM channels (12 MCPWM) with complementary outputs and dead-time control, eight input capture and eight output capture/compare channels, two quadrature encoder interfaces (QEI), four integrated operational amplifiers, a Charge Time Measurement Unit (CTMU) for capacitive touch and precision timing, and a Pattern Generator (PTG) for autonomous sequencing. A Controller Area Network (CAN) module supports automotive and industrial networking.
The dsPIC33EP core is pipelined and engineered for single-cycle DSP instructions at 70 MIPS, allowing FOC (field-oriented control) loops and digital filters to execute well within PWM periods. Flexible clocking with internal PLL removes the need for an external crystal in cost-sensitive designs.
Typical applications include brushless DC and PMSM motor drives, digital power conversion (PFC, LLC), sensorless FOC compressors, and industrial automation nodes that combine CAN communication with real-time control.
For design, decouple all VDD/VDDCORE pins with 0.1uF ceramics placed at the pin, and budget Flash/RAM margins before selecting the 128KB density versus the 64KB/256KB family members in the same 44-QFN footprint.
This page synthesizes distributor pricing tiers, drop-in family alternatives, design notes, and comparison data not consolidated in the manufacturer datasheet.
Alternatives de remplacement direct pour DSPIC33EP128GM604T-I/ML — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33EP128GM604T-I/ML (même facteur de forme et même empreinte) — différant par Package, Core, Operating Temperature, Input Capture / Output Compare, Packaging.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33EP128GM604-I/ML
✅ Remplacement direct✓ En stock
$5.95 / unité
Voir la fiche technique →DSPIC33EP128GM304T-I/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.62 / unité
Voir la fiche technique →DSPIC33EP256GM604T-I/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.98 / unité
Voir la fiche technique →DSPIC33EP64GM604T-I/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33EP128GM604-I/PT
✅ Remplacement direct✓ En stock
$3.88 / unité
Voir la fiche technique →DSPIC33EP128GM604T-I/ML Valeurs maximales et caractéristiques électriques
| Core | 16-bit dsPIC33EP DSC |
| Maximum CPU Speed | 70 MIPS |
| Program Memory Size | 128 KB (43K x 24) Flash |
| RAM Size | 16 KB |
| Motor Control PWM Channels | 12 MCPWM |
| Input Capture / Output Compare | 8 IC / 8 OC |
| Quadrature Encoder Interfaces | 2 QEI |
| On-chip Operational Amplifiers | 4 |
| Charge Time Measurement Unit | CTMU (yes) |
| Pattern Generator | PTG (yes) |
| CAN Module | Yes |
| Plage de température de fonctionnement | -40C to +85C (I grade) |
| Boîtier | 44-QFN (ML) |
| Type de montage | Surface Mount |
| Packaging | Tape & Reel (T suffix) |
| Statut RoHS | Compliant |
Guide de configuration des broches du DSPIC33EP128GM604T-I/ML 44-qfn (ml)
Configuration des broches du DSPIC33EP128GM604T-I/ML (boîtier 44-qfn (ml)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour DSPIC33EP128GM604T-I/ML.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
DSPIC33EP128GM604T-I/ML convient pour 6 applications: BLDC / PMSM Motor Drives, Digital Power Conversion, Industrial Automation Nodes, HVAC Compressor Control, Capacitive Touch and Measurement Interfaces, Signal Processing and Sensor Conditioning.
BLDC / PMSM Motor Drives
The DSPIC33EP128GM604T-I/ML is purpose-built for precision motor control: its 12 motor-control PWM channels provide complementary outputs with hardware dead-time insertion, the two quadrature encoder interfaces accept position feedback directly, and the four on-chip op-amps amplify low-level shunt-resistor current signals without external amplifier ICs. The 70 MIPS DSP core executes field-oriented control (FOC) loops well within one PWM period, enabling sensorless or sensored drives for pumps, fans, compressors, and servo axes. Placed between the gate-driver input network and the current-sense shunts, the DSC digitizes phase currents each PWM cycle through its ADC; the main trade-off versus a dedicated ASIC is firmware development effort, repaid by full flexibility across motor types and power stages.
Recommandé
Digital Power Conversion
In digital power supplies - PFC stages, LLC resonant converters, and bidirectional DC-DC chargers - the DSPIC33EP128GM604T-I/ML closes fast voltage and current loops in firmware using its 70 MIPS single-cycle MAC engine for the compensator math. The 12 MCPWM channels generate phase-shifted or complementary PWM with programmable dead time, essential for half-bridge and full-bridge topologies, while the CTMU supports precise time measurements for zero-crossing detection. Typical use places the DSC between the voltage/current sense dividers and the gate drivers, sampling each switching cycle; because the control law is firmware-defined, one PCB can be retuned across output voltages. The key design consideration is ADC-to-PWM latency budgeting, which the high core speed helps minimize.
Recommandé
Industrial Automation Nodes
For industrial automation endpoints - conveyor controllers, actuator drivers, and machine sub-modules - the DSPIC33EP128GM604T-I/ML combines a hardware CAN (ECAN) module with the motor-control and capture peripherals needed for local real-time behavior. The ECAN interface connects the node to factory fieldbuses through a transceiver, while 8 input captures and 8 output compares handle encoder, ultrasonic, and timing-critical I/O locally without burdening a supervisory PLC. The PTG (pattern generator) autonomously sequences peripherals in hardware, offloading the CPU. Typical deployments run the DSC at 70 MIPS from an internal PLL, -40C to +85C industrial rating covering cabinet environments; the trade-off versus an MCU-plus-FPGA split is lower cost and simpler single-chip firmware maintenance.
Recommandé
HVAC Compressor Control
Variable-speed HVAC and refrigeration compressors use sensorless FOC, and the DSPIC33EP128GM604T-I/ML fits this role with its 4 on-chip op-amps for three-shunt current sensing, 12 MCPWM channels for the inverter bridge, and 70 MIPS of DSP headroom for sliding-mode or MRAS rotor-position observers. Operating from the industrial -40C to +85C range, the controller processes phase currents each PWM cycle and adjusts the space-vector modulation output in real time, improving seasonal efficiency versus fixed-speed compressors. The CTMU can also support capacitive-touch user interfaces on the same chip. Design consideration: provide adequate heatsinking/copper for the QFN thermal pad and filter the op-amp inputs against switching noise from the IGBT bridge.
Recommandé
Capacitive Touch and Measurement Interfaces
The CTMU (Charge Time Measurement Unit) on the DSPIC33EP128GM604T-I/ML enables capacitive-touch keys and precision time-interval or resistance measurement without a dedicated touch controller. Combined with the 70 MIPS core for debounce and multi-key gesture processing, a single 44-QFN DSC can run a machine's HMI (touch slider, buttons) while simultaneously controlling a motor or power stage on the same silicon. The CTMU's constant-current charge method supports capacitive sensing and, per the family datasheet, time-domain measurement applications; 16KB of RAM buffers scan results and running averages. The main design consideration is electrode PCB layout and grounding discipline so switching-noise from co-resident PWM outputs does not couple into touch sense lines.
Recommandé
Signal Processing and Sensor Conditioning
With single-cycle MAC, DSP addressing modes, and four integrated op-amps, the DSPIC33EP128GM604T-I/ML performs front-end signal conditioning and real-time DSP - FIR/IIR filtering, RMS computation, FFT-based diagnostics - directly on 16-bit sensor data. The op-amps can be configured as programmable-gain amplifiers ahead of the ADC, removing external amplifier stages in vibration, acoustic, and current-signature monitoring products. At 70 MIPS the core sustains meaningful sampling-and-filter throughput at kilohertz-to-tens-of-kilohertz rates, while 128KB Flash holds both the DSP code and communication stacks. Typical architecture: sensor -> on-chip op-amp gain stage -> ADC -> firmware filter -> CAN/UART output. Trade-off versus an external DSP is modest numeric throughput, offset by integration and BOM reduction.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33EP128GM604T-I/ML — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33EP128GM604-I/ML | DSPIC33EP128GM304T-I/ML | DSPIC33EP256GM604T-I/ML | DSPIC33EP64GM604T-I/ML |
|---|---|---|---|---|---|
| Package | 44-QFN (ML) | 44-QFN (ML) - same | 44-QFN (ML) - same | 44-QFN (ML) - same | 44-QFN (ML) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Flash Program Memory | 128 KB (43K x 24) | 128 KB | 128 KB | 256 KB | 64 KB |
| Motor Control PWM | 12 MCPWM | 12 MCPWM | 12 MCPWM | 12 MCPWM | 12 MCPWM |
| On-chip Op-Amps | 4 | 4 | Fewer than GM604 | 4 | 4 |
| Packaging Format | Tape & Reel (T suffix) | Tube / Cut Tape | Tape & Reel | Tape & Reel | Tape & Reel |
Principaux différenciateurs
- Four on-chip operational amplifiers for current sensing (vs DSPIC33EP128GM304T-I/ML)
- 256KB Flash upgrade in the identical footprint (vs DSPIC33EP256GM604T-I/ML)
- Best value if 64KB suffices (vs DSPIC33EP64GM604T-I/ML)
- Tape-and-reel production packaging (vs DSPIC33EP128GM604-I/ML)
Notes de conception
The dsPIC33EP core requires a stable VDDCORE supply - follow the family datasheet's mandatory minimum pin connections list (VDD, VSS, VDDCORE capacitor, MCLR pull-up, AVDD/AVSS) exactly, as stated in document 70000689. Place a 0.1uF ceramic capacitor within 2 mm of every VDD pin and a bulk 10uF per power domain. Estimated: a 70 MIPS dsPIC33EP draws on the order of tens of milliamps - budget supply rails with margin for peripheral loads (CAN transceiver ~ up to 50 mA) on the shared 3.3V rail.
The 44-QFN (ML) has a central exposed pad that must be soldered to a grounded or appropriately tied thermal array - verify the die-pad connection requirement in the family datasheet before finalizing the footprint. For the four on-chip op-amps used with shunt current sensing, route the shunt Kelvin connections directly to the op-amp input pins, keep the loops small, and guard the analog traces away from MCPWM output lines. Use 1oz copper with a solid ground plane; QFN peripheral pads benefit from via stitching to the plane for both thermal and signal-integrity reasons.
Three frequent mistakes with the GM6xx family: (1) forgetting that most digital pins are remappable via Peripheral Pin Select (PPS) - lock the PPS mapping early in firmware and document it against the schematic; (2) assuming analog pins are remappable - op-amp and ADC inputs are fixed, so the schematic must match the fixed analog pin map; (3) ignoring the ERRATA/clarification documents when picking a Flash revision - always download errata from the Microchip product page alongside datasheet 70000689. Also budget Flash margin: 128KB fills quickly with CAN stacks plus FOC math.
Estimated: at typical DSC currents (tens of mA at 3.3V, roughly 0.15W), a 44-QFN with a solid ground-plane copper pour keeps junction temperature well below the +125C absolute limit even at +85C ambient. Thermal risk only becomes relevant when co-located drivers or regulators dissipate onto shared copper - separate gate-driver heat paths from the MCU zone, and verify the package theta-JA value in the family datasheet rather than assuming QFN-44 generic figures.
Informations de conformité
RoHS compliant per Microchip product status for standard-production parts. REACH, halogen-free and conflict-minerals declarations should be confirmed on the official Microchip product page environmental documentation.
