DSPIC33EP16GS504T-E/PT - 16-bit DSC, 16KB Flash, TQFP-44 | Microchip
Référence : DSPIC33EP16GS504T-E/PT ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1 000 | $0 | $0,00 |
DSPIC33EP16GS504T-E/PT Présentation
A digital signal controller combines the computational throughput of a digital signal processor with the peripheral integration and control-oriented architecture of a microcontroller. Within the power-management hierarchy, the DSC sits above a general-purpose MCU for switch-mode power conversion tasks, providing deterministic interrupt latency and dedicated PWM hardware that a standard microcontroller cannot match. The dsPIC33EP GS family is Microchip's SMPS-focused DSC line, purpose-built for digital power supplies.
Key features include 16-bit modified Harvard architecture execution, a high-speed PWM module with complementary outputs, dead-time insertion and fault protection tailored for switched-mode power supplies, a 10-bit high-speed ADC for current- and voltage-loop feedback, and standard serial connectivity. The device is qualified to AEC-Q100 for automotive use and supports Functional Safety (FuSa) development, as listed by distributors.
Technically, the GS504 core delivers 16-bit DSP instruction support with hardware multiply-accumulate, enabling Proportional-Integral compensation loops in software at switching frequencies well above 100 kHz. In-Circuit Serial Programming (ICSP) via MPLAB SNAP allows field programming using two device I/O pins and the reset line.
Typical applications include interleaved power factor correction (Microchip's 350W interleaved PFC reference design targets this family), LLC and flyback converters, digital AC-DC power supplies, automotive power modules, and industrial motor-control front ends.
Design consideration: budget the 2KB SRAM carefully when running multiple control loops with ADC buffering; the 16KB FLASH constrains complex compensation algorithms, so consider 32GS/64GS variants if code growth is expected.
This page synthesizes distributor stock and pricing signals, drop-in same-family alternatives, and practical design notes not consolidated in the manufacturer datasheet.
Alternatives de remplacement direct pour DSPIC33EP16GS504T-E/PT — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33EP16GS504T-E/PT (même facteur de forme et même empreinte) — différant par Core Architecture, Operating Temperature, Package, Analog Peripherals, Communication Interfaces.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33EP16GS504-I/PT
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →DSPIC33EP32GS504-E/PT
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33EP64GS504-E/PT
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$5.61 / unité
Voir la fiche technique →DSPIC33EP16GS504T-E/PT Valeurs maximales et caractéristiques électriques
| Core Architecture | 16-bit dsPIC33EP DSC |
| Flash Program Memory | 16 KB (16K x 8) |
| SRAM | 2 KB |
| Max Core Speed | 60 MIPS (listed up to 70 MIPS by Mouser) |
| Operating Voltage | 3.0 V to 3.6 V (3.3 V nominal) |
| Boîtier | 44-TQFP (10 x 10 mm, 0.8 mm pitch) |
| Température de fonctionnement | -40C to +125C (E, extended) |
| Qualification | AEC-Q100, Automotive, Functional Safety (FuSa) |
| Type de montage | Surface Mount |
| Packaging Suffix | /T (Tape & Reel) |
| PWM | High-speed SMPS PWM module |
| Communication Interfaces | UART, SPI, I2C |
| Programming Interface | ICSP (2-wire) via MPLAB SNAP |
| Family Series | dsPIC33EP 33EP (GS, SMPS-oriented) |
| Statut RoHS | Compliant |
Configuration des broches de DSPIC33EP16GS504T-E/PT
| Broche 1 | MCLR — Master clear reset / programming voltage input |
| Broche 2 | AN0/VREF+/RB0 — Analog input 0 / ADC positive reference / port B |
| Broche 3 | AN1/VREF-/RB1 — Analog input 1 / ADC negative reference / port B |
| Broche 4 | AN2/PGD/RB2 — Analog input 2 / In-Circuit Debug data / port B |
| Broche 5 | AN3/PGC/RB3 — Analog input 3 / In-Circuit Debug clock / port B |
| Broche 6 | AN4/RB4 — Analog input 4 / port B |
| Broche 7 | AN5/RB5 — Analog input 5 / port B |
| Broche 8 | VSS — Ground reference |
| Broche 9 | OSC1/CLKI — Crystal oscillator input / external clock input |
| Broche 10 | OSC2/CLKO — Crystal oscillator output / clock output |
| Broche 11 | VDD — Positive supply (3.0V-3.6V) |
| Broche 12 | RB6 — General purpose I/O / peripheral pin (PPS) |
| Broche 13 | RB7 — General purpose I/O / peripheral pin (PPS) |
| Broche 14 | RB8 — General purpose I/O / peripheral pin (PPS) |
| Broche 15 | RB9 — General purpose I/O / peripheral pin (PPS) |
| Broche 16 | VDD — Positive supply (3.0V-3.6V) |
| Broche 17 | VSS — Ground reference |
| Broche 18 | RB10 — General purpose I/O / peripheral pin (PPS) |
| Broche 19 | RB11 — General purpose I/O / peripheral pin (PPS) |
| Broche 20 | RB12 — General purpose I/O / peripheral pin (PPS) |
| Broche 21 | RB13 — General purpose I/O / peripheral pin (PPS) |
| Broche 22 | RB14 — General purpose I/O / peripheral pin (PPS) |
| Broche 23 | RB15 — General purpose I/O / peripheral pin (PPS) |
| Broche 24 | VSS — Ground reference |
| Broche 25 | VDD — Positive supply (3.0V-3.6V) |
| Broche 26 | RC0 — General purpose I/O / peripheral pin (PPS) |
| Broche 27 | RC1 — General purpose I/O / peripheral pin (PPS) |
| Broche 28 | RC2 — General purpose I/O / peripheral pin (PPS) |
| Broche 29 | RC3 — General purpose I/O / peripheral pin (PPS) |
| Broche 30 | RC4 — General purpose I/O / peripheral pin (PPS) |
| Broche 31 | RC5 — General purpose I/O / peripheral pin (PPS) |
| Broche 32 | RC6 — General purpose I/O / peripheral pin (PPS) |
| Broche 33 | RC7 — General purpose I/O / peripheral pin (PPS) |
| Broche 34 | RC8 — General purpose I/O / peripheral pin (PPS) |
| Broche 35 | RC9 — General purpose I/O / peripheral pin (PPS) |
| Broche 36 | PWM1L1 — High-speed PWM 1 low-side output 1 |
| Broche 37 | VDD — Positive supply (3.0V-3.6V) |
| Broche 38 | VSS — Ground reference |
| Broche 39 | PWM1H1 — High-speed PWM 1 high-side output 1 |
| Broche 40 | PWM1L2 — High-speed PWM 1 low-side output 2 |
| Broche 41 | PWM1H2 — High-speed PWM 1 high-side output 2 |
| Broche 42 | PWM1L3 — High-speed PWM 1 low-side output 3 |
| Broche 43 | PWM1H3 — High-speed PWM 1 high-side output 3 |
| Broche 44 | FLTA — PWM fault input A |
Applications typiques
DSPIC33EP16GS504T-E/PT convient pour 6 applications: Interleaved Power Factor Correction, Digital AC-DC Power Supplies, Automotive Power Modules, Industrial Motor Control Front Ends, LED Driver Ballasts and Lighting Power, Embedded Digital Power Development Platforms.
Interleaved Power Factor Correction
Microchip's Interleaved PFC reference design targets the dsPIC33EP GS family and delivers up to 350W from a universal AC input range. The DSPIC33EP16GS504T-E/PT fits this role because its high-speed SMPS PWM module generates phase-shifted complementary outputs with hardware dead-time insertion, while the fast ADC samples inductor current and bus voltage for average-current-mode control at switching frequencies beyond 100 kHz. The 16-bit DSP core executes PI compensation loops with multiply-accumulate instructions deterministically, avoiding the jitter of software-timed control. The -40C to +125C extended grade and AEC-Q100 qualification allow deployment in automotive and industrial front ends. Two interleaved boost legs share one 44-pin TQFP controller, reducing BOM count versus analog-control solutions.
Recommandé
Digital AC-DC Power Supplies
Flyback, forward, and LLC AC-DC converters benefit from the DSPIC33EP16GS504T-E/PT's combination of a 60-70 MIPS DSP core and dedicated SMPS PWM hardware. The controller closes voltage and current loops digitally, enabling adaptive burst mode, proprietary startup sequencing, and precise output regulation that analog controllers cannot reconfigure in firmware. The 2KB SRAM accommodates ADC result buffering and loop state variables for dual-loop control, while ICSP programming via MPLAB SNAP lets manufacturers update firmware in production. The 3.0V-3.6V supply range simplifies bias generation from an auxiliary winding. Extended -40C to +125C operation suits sealed adapters and industrial supplies where ambient temperatures inside enclosures exceed +85C regularly.
Recommandé
Automotive Power Modules
With AEC-Q100 qualification, Functional Safety (FuSa) support, and the extended E temperature grade, the DSPIC33EP16GS504T-E/PT is positioned for automotive DC-DC converters, LED headlamp drivers, and 48V mild-hybrid subsystems. The high-speed PWM provides cycle-by-cycle current limiting with hardware fault shutdown, a requirement for protecting automotive power stages during load-dump or short-circuit events. The 10x10 mm TQFP withstands the vibration and thermal cycling of under-hood electronics better than larger packages due to compliant lead frames. Designers should implement Microchip's safety libraries and follow the family's functional-safety documentation to satisfy ISO 26262-aligned development flows applicable to the end system.
Recommandé
Industrial Motor Control Front Ends
The DSPIC33EP16GS504T-E/PT serves as the power-conversion controller in industrial drives, handling PFC or DC bus stages that feed Microchip's motor-control DSCs. Its 16-bit DSP core runs current-loop compensation at high bandwidth while the SMPS PWM drives half-bridge stages with hardware dead time, keeping switching losses predictable. The 44-pin count leaves sufficient GPIO for gate-driver enable sequencing, fault aggregation, and UART or CAN-adjacent serial links for supervisory communication. In factory environments with ambient temperatures up to +70C inside cabinets, the +125C junction capability provides wide derating margin. Firmware-updatable control parameters enable one PCB platform to serve multiple motor power ratings through configuration.
Recommandé
LED Driver Ballasts and Lighting Power
High-power LED luminaires and automotive lighting require constant-current converters with dimming control, a task matched to the DSPIC33EP16GS504T-E/PT's PWM resolution and ADC sampling speed. The SMPS PWM module drives buck or boost LED stages while a second PWM channel generates dimming waveforms free of visible flicker at frequencies above the camera-audibility thresholds. Digital control enables thermal foldback: the ADC reads an NTC sensor and firmware scales output current as temperature rises, extending LED lifetime. The extended -40C to +125C rating covers sealed outdoor luminaires exposed to solar heating, and AEC-Q100 qualification supports automotive exterior lighting modules where quality audits demand automotive-qualified silicon.
Recommandé
Embedded Digital Power Development Platforms
The DSPIC33EP16GS504T-E/PT is an excellent learning and prototyping vehicle for digital power engineering because Microchip publishes reference designs, SMPS libraries, and MPLAB X toolchain support for the GS family. Engineers can iterate compensation firmware in minutes using ICSP in-circuit reprogramming through MPLAB SNAP, which needs only two I/O pins plus reset - no socketed parts or external programmers beyond the low-cost SNAP tool. The 44-pin TQFP is hand-solderable for prototype boards and universally available on assembly lines. Its parameter set (16KB FLASH, 2KB SRAM) also disciplines code size early, with a seamless upgrade path to the pin-compatible 32GS504 and 64GS504 when control algorithms grow more complex.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33EP16GS504T-E/PT — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33EP16GS504-I/PT | DSPIC33EP32GS504-E/PT | DSPIC33EP64GS504-E/PT |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-TQFP (10x10 mm) | 44-TQFP (10x10 mm) - same | 44-TQFP (10x10 mm) - same | 44-TQFP (10x10 mm) - same |
| Flash Memory | 16 KB | 16 KB | 32 KB | 64 KB |
| Core Speed | 60-70 MIPS | 60-70 MIPS | 60-70 MIPS | 60-70 MIPS |
| Operating Temperature | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) | -40C to +125C (E) |
| Operating Voltage | 3.0 V - 3.6 V | 3.0 V - 3.6 V | 3.0 V - 3.6 V | 3.0 V - 3.6 V |
| PCB Rework Required | - | None - same footprint | None - same footprint | None - same footprint |
Principaux différenciateurs
- Extended temperature range for automotive and sealed power supplies (vs DSPIC33EP16GS504-I/PT)
- Upgrade headroom without PCB rework (vs DSPIC33EP32GS504-E/PT)
- SMPS-optimized peripheral set vs general-purpose MCUs (vs PIC16LF1787-E/ML (site catalog MCU))
Notes de conception
Place a 100nF ceramic capacitor at every VDD/VSS pin pair (pins 11/8, 16/17, 25/24, 37/38 on the 44-TQFP) with traces under 5 mm, plus one 4.7uF-10uF bulk capacitor near the package. The 3.0V-3.6V rail must stay within range during PWM transients; in digital power designs the controller rail is often derived from an auxiliary flyback winding, so verify minimum bias voltage at light load before the main converter starts. Estimated: four decoupling capacitors plus local bulk keeps high-frequency supply impedance low enough for 60-70 MIPS core operation.
Use a solid ground plane on layer 2 beneath the 10x10 mm TQFP and return each VSS pin directly with multiple vias. Keep the PWM gate-drive traces (PWM1H/L outputs) short and away from ADC input traces to prevent switching noise coupling into current-sense feedback; the SMPS PWM module's dead-time depends on clean edge timing. Land pattern per Microchip family datasheet: 0.8 mm pitch, 10x10 mm body. Expose no thermal pad - the PT TQFP dissipates heat through the leads, so provide adequate copper on outer layers.
Watch the memory budget: 16KB FLASH and 2KB SRAM fill quickly with floating-point compensation code; use fixed-point math and the DSP multiply-accumulate instructions, and profile code size before committing. The /T tape-and-reel suffix means parts arrive in reels for pick-and-place - hand soldering from reels requires cut-tape handling. Also confirm the temperature grade: the -I/PT variant is limited to +85C ambient-class operation, and substituting it into an E-grade design silently reduces thermal margin. Verify all pin assignments against the latest Microchip datasheet before layout freeze.
Informations de conformité
RoHS compliance and lead-free TQFP terminations per JLCPCB and distributor listings. AEC-Q100 automotive qualification and Functional Safety (FuSa) support per Hotenda and Chip In Stock product data. REACH, halogen-free, and conflict-minerals statuses not stated in provided data.
