DSPIC33EP512GM604-E/ML - 16-bit 70 MIPS DSC 512KB Flash | Microchip
Référence : DSPIC33EP512GM604-E/ML ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $8.42 | $8,42 |
| 10 | $7.68 | $76,80 |
| 100 | $6.85 | $685,00 |
| 500 | $6.12 | $3 060,00 |
| 1 000 | $5.55 | $5 550,00 |
DSPIC33EP512GM604-E/ML Présentation
A digital signal controller combines a microcontroller's peripherals and ease of use with the math throughput of a DSP on a single silicon die. Within the power-management hierarchy, the DSC sits above basic MCUs and below multi-core DSP SoCs, making it the standard choice for real-time closed-loop control such as field-oriented motor control, digital power conversion, and sensor signal processing.
Key features include the enhanced dsPIC33E core executing DSP and MCU instructions from a single instruction set, dual independently programmable operational amplifiers for current-sense front-ends, 12-channel motor-control PWM with complementary outputs and dead-time, two CAN 2.0B modules for industrial networking, and Peripheral Pin Select (PPS) for flexible pin remapping of digital peripherals.
The device is built on CMOS process technology and operates at 3.3V, with the -E/ML temperature suffix guaranteeing extended operation to +125C for harsh environments. The 8x8 mm QFN-EP package provides low-inductance ground return for the analog peripherals and good thermal dissipation for continuous operation at high clock rates.
Typical applications include brushless DC and PMSM motor drives, digital power supplies and solar inverters, automotive auxiliary systems (the series is documented as AEC-Q100 automotive), and industrial sensor front-ends that benefit from the on-chip op-amps reducing external BOM count.
Design consideration: at 70 MIPS the core requires a clean 3.3V rail with decoupling at every VDD pin and careful grounding of the exposed thermal pad; the PLL multiplies the primary oscillator, so layout the crystal away from the PWM switching nodes.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not consolidated in the manufacturer datasheet.
Alternatives de remplacement direct pour DSPIC33EP512GM604-E/ML — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33EP512GM604-E/ML (même facteur de forme et même empreinte) — différant par Core, Operating Temperature, Program Memory Size, Package, Automotive Qualification.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33EP512GM604-I/ML
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33EP256GM604-E/ML
✅ Remplacement direct✓ En stock
$6.55 / unité
Voir la fiche technique →DSPIC33EP512GM304-I/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →DSPIC33EP512GP504-H/ML
✅ Remplacement direct✓ En stock
$4.48 / unité
Voir la fiche technique →DSPIC33EP512MC604-E/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33EP512GM604-E/ML Valeurs maximales et caractéristiques électriques
| Core | dsPIC33E (16-bit DSC core) |
| Max CPU Speed | 70 MIPS |
| Max Clock Frequency | 60 MHz |
| Program Memory Size | 512 KB (170K x 24) Flash |
| Tension d'alimentation | 3.3 V |
| Température de fonctionnement | -40C to +125C |
| Boîtier | 44-QFN (8x8 mm) with Exposed Pad |
| Type de montage | Surface Mount |
| Motor Control PWM | 12 channels (8/8 IC/OC per Mouser listing) |
| Input Capture / Output Compare | 8 IC / 8 OC |
| Quadrature Encoder Interface | 4 QEI |
| On-chip Operational Amplifiers | 2 OpAmp |
| CAN Modules | 2 (CAN 2.0B) |
| Peripherals (per Mouser) | 12 MC, 8/8 IC/OC, 2 QEI, OpAmp |
| Packaging | Tube |
| Statut RoHS | ROHS3 Compliant |
| Automotive Qualification | AEC-Q100 qualified series |
| Manufacturer Lead Time | 26 weeks (per Microchip USA) |
| Product Status | Active |
Guide de configuration des broches du DSPIC33EP512GM604-E/ML 44-qfn (8x8 mm) with exposed pad
Configuration des broches du DSPIC33EP512GM604-E/ML (boîtier 44-qfn (8x8 mm) with exposed pad). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour DSPIC33EP512GM604-E/ML.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
DSPIC33EP512GM604-E/ML convient pour 6 applications: BLDC / PMSM Motor Drives, Digital Power Conversion, Automotive Auxiliary Systems, Industrial Sensor Front-Ends, Audio Signal Processing, Embedded Control and IoT Nodes.
BLDC / PMSM Motor Drives
The GM604 is purpose-built for field-oriented control of brushless DC and permanent-magnet synchronous motors. Its 12-channel motor-control PWM with complementary outputs and dead-time drives three-phase inverters directly, while the four quadrature encoder interfaces accept encoder or resolver feedback without external counters. The dual on-chip operational amplifiers amplify shunt-resistor current signals in-line, cutting external op-amp BOM cost and analog latency. Running the FOC current loop at 70 MIPS allows PWM frequencies well above the audible band, reducing acoustic noise; the -E grade (-40C to +125C) suits underhood and industrial drive environments.
Recommandé
Digital Power Conversion
In digital power supplies, solar micro-inverters, and PFC stages, the dsPIC33EP512GM604 executes control loops with deterministic interrupt latency from the 70 MIPS dsPIC33E core. The Peripheral Pin Select lets engineers map PWM outputs and ADC triggers onto optimal PCB pin locations, minimizing loop-area in switching layouts. Its 512 KB Flash holds multiple firmware images plus a bootloader for field firmware updates over CAN or UART - valuable for grid-tied equipment requiring remote updates. Running the loop in hardware DSP multiply-accumulate instructions achieves control bandwidths comparable to dedicated digital-power controllers at lower system cost.
Recommandé
Automotive Auxiliary Systems
The dsPIC33EP512GM604 series is documented as an AEC-Q100 automotive family by Microchip USA, and the -E/ML grade covers -40C to +125C ambient, matching underhood and body-domain requirements. CAN 2.0B modules interface directly with vehicle networks through an external transceiver, while the op-amps condition analog sensor inputs such as position and current sensing in electric power steering pumps, cooling-fan modules, and BLDC auxiliary actuators. Designers should obtain the automotive qualification letter and PPAP documentation from Microchip, since commercial datasheet numbers and automotive release status are managed separately by the manufacturer.
Recommandé
Industrial Sensor Front-Ends
The dual integrated operational amplifiers and 16-bit-capable ADC path let the GM604 amplify and digitize small sensor signals - load cells, thermocouples via conditioning, and pressure bridges - without external precision op-amps. The 70 MIPS DSP core applies digital filtering and calibration in firmware, achieving end-to-end accuracy that competes with discrete analog chains. Extended -40C to +125C operation permits mounting near actuators in factory automation, and CAN connectivity links the node into industrial control networks. The 512 KB Flash accommodates compensation tables and multi-protocol firmware stacks in a single-chip design, reducing board area and calibration overhead.
Recommandé
Audio Signal Processing
With a single-cycle DSP multiply-accumulate unit, hardware barrel shifter, and modulo addressing, the dsPIC33EP512GM604 implements audio effects, active crossover filtering, and echo cancellation at modest sample rates. The 512 KB Flash stores multiple coefficient sets for user-selectable filter profiles, and the 3.3V I/O interfaces directly with audio codecs and digital potentiometers. While the GM604 is not a dedicated audio DSP, its motor-control-grade PWM can also drive Class-D output stages in compact powered speakers, letting one controller handle both the audio processing and the power stage - a common cost-reduction pattern in mid-range consumer and kiosk audio hardware.
Recommandé
Embedded Control and IoT Nodes
For general embedded control, the GM604 offers an 8/8 input-capture/output-compare set, multiple UART, SPI, and I2C modules (all remappable via Peripheral Pin Select), and deep-sleep modes for battery-sensitive nodes. The 512 KB Flash hosts protocol stacks - Modbus, CANopen, or custom RF link firmware - with room for OTA updaters. DSP instructions accelerate FFT-based sensor analytics at the edge, such as vibration monitoring of pumps and fans. The 44-QFN 8x8 mm footprint fits compact node PCBs, and the extended temperature range suits unconditioned outdoor enclosures in agricultural and utility monitoring deployments where field servicing is costly.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33EP512GM604-E/ML — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33EP512GM604-I/ML | DSPIC33EP256GM604-E/ML | DSPIC33EP512GM304-I/ML | DSPIC33EP512GP504-H/ML | DSPIC33EP512MC604-E/ML |
|---|---|---|---|---|---|---|
| Package | 44-QFN (8x8 mm) EP (ML) | 44-QFN (8x8 mm) EP - same | 44-QFN (8x8 mm) EP - same | 44-QFN (8x8 mm) EP - same | 44-QFN (8x8 mm) EP - same | 44-QFN (8x8 mm) EP - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Program Memory | 512 KB (170K x 24) | 512 KB | 256 KB | 256 KB | 512 KB | 512 KB |
| Core Speed | 70 MIPS (dsPIC33E) | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| On-chip OpAmps | Yes (dual) | Yes (dual) | Yes (dual) | Yes (dual) | No (GP variant) | No (MC peripheral mix) |
| Operating Temperature | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +125C (H grade) | -40C to +125C (E grade) |
| CAN | Yes (CAN 2.0B) | Yes | Yes | Yes | Yes | Yes |
| RoHS | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant |
Principaux différenciateurs
- Dual on-chip operational amplifiers for current sensing (vs DSPIC33EP512GP504-H/ML)
- Extended -40C to +125C operation (vs DSPIC33EP512GM604-I/ML)
- Maximum Flash capacity in the 44-pin GM family (vs DSPIC33EP256GM604-E/ML)
Notes de conception
Connect the QFN exposed pad to a solid ground plane with a 3x3 via array directly under the package. The exposed pad is the primary ground return for the on-chip op-amps, ADC, and digital core; a floating or poorly soldered pad is a classic cause of ADC noise and intermittent op-amp offset on dsPIC33EP QFN devices. Follow the landing pattern in the family datasheet (document 70000689) or the ComponentSearchEngine ECAD footprint, and inspect solder voiding with X-ray for high-volume production.
Provide 0.1uF ceramic decoupling at every AVDD and VDD pin, placed within 2 mm of the pin, plus one 4.7uF to 10uF bulk capacitor near the package. Isolate AVDD with an RC or ferrite filter from the digital 3.3V rail to protect ADC and op-amp accuracy from core switching noise at 70 MIPS. Keep the crystal/PLL circuitry away from the motor-control PWM traces, whose high di/dt edges couple into the oscillator and cause clock jitter. Decouple VDDCORE per the datasheet recommendations - do not share its capacitor network with other rails.
Two frequent issues: (1) Peripheral Pin Select (PPS) must be unlocked before remapping and re-locked afterward; forgetting the lock sequence leaves peripherals unassigned and is the top dsPIC33E forum support topic. (2) The -E grade extends to +125C but the -I variant only to +85C - do not substitute an -I part in an underhood design, even though the packages are identical. Also note Microchip USA documents a 26-week manufacturer lead time; place orders early or qualify DSPIC33EP256GM604-E/ML as a second source on the same footprint.
Informations de conformité
Microchip USA lists 'ROHS3 Compliant' and 'Series: Automotive, AEC-Q100, dsPIC 33EP' for this part. Jotrin also lists the part as automotive 44-pin QFN EP. REACH, halogen-free, and conflict-minerals declarations were not found in provided data - obtain official declarations from Microchip's compliance portal.
