DSPIC33EP512GM604-E/ML - 16-bit 70 MIPS DSC 512KB Flash | Microchip
部品番号: DSPIC33EP512GM604-E/ML ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $8.42 | $8.42 |
| 10 | $7.68 | $76.80 |
| 100 | $6.85 | $685.00 |
| 500 | $6.12 | $3,060.00 |
| 1,000 | $5.55 | $5,550.00 |
DSPIC33EP512GM604-E/ML 概要
A digital signal controller combines a microcontroller's peripherals and ease of use with the math throughput of a DSP on a single silicon die. Within the power-management hierarchy, the DSC sits above basic MCUs and below multi-core DSP SoCs, making it the standard choice for real-time closed-loop control such as field-oriented motor control, digital power conversion, and sensor signal processing.
Key features include the enhanced dsPIC33E core executing DSP and MCU instructions from a single instruction set, dual independently programmable operational amplifiers for current-sense front-ends, 12-channel motor-control PWM with complementary outputs and dead-time, two CAN 2.0B modules for industrial networking, and Peripheral Pin Select (PPS) for flexible pin remapping of digital peripherals.
The device is built on CMOS process technology and operates at 3.3V, with the -E/ML temperature suffix guaranteeing extended operation to +125C for harsh environments. The 8x8 mm QFN-EP package provides low-inductance ground return for the analog peripherals and good thermal dissipation for continuous operation at high clock rates.
Typical applications include brushless DC and PMSM motor drives, digital power supplies and solar inverters, automotive auxiliary systems (the series is documented as AEC-Q100 automotive), and industrial sensor front-ends that benefit from the on-chip op-amps reducing external BOM count.
Design consideration: at 70 MIPS the core requires a clean 3.3V rail with decoupling at every VDD pin and careful grounding of the exposed thermal pad; the PLL multiplies the primary oscillator, so layout the crystal away from the PWM switching nodes.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not consolidated in the manufacturer datasheet.
ドロップイン代替品: DSPIC33EP512GM604-E/ML — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: DSPIC33EP512GM604-E/ML （同一形状・フットプリント） — 相違点: Core, Operating Temperature, Program Memory Size, Package, Automotive Qualification.
クイック比較ツール — 並列比較する代替部品を選択:
DSPIC33EP512GM604-I/ML
✅ ドロップイン📋 参考代替品（カタログ未掲載）
DSPIC33EP256GM604-E/ML
✅ ドロップイン✓ 在庫あり
$6.55 / 個
データシートを見る →DSPIC33EP512GM304-I/ML
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
価格はお問い合わせください
データシートを見る →DSPIC33EP512GP504-H/ML
✅ ドロップイン✓ 在庫あり
$4.48 / 個
データシートを見る →DSPIC33EP512MC604-E/ML
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
DSPIC33EP512GM604-E/ML 最大定格＆電気的特性
| Core | dsPIC33E (16-bit DSC core) |
| Max CPU Speed | 70 MIPS |
| Max Clock Frequency | 60 MHz |
| Program Memory Size | 512 KB (170K x 24) Flash |
| 電源電圧 | 3.3 V |
| 動作温度 | -40C to +125C |
| パッケージ | 44-QFN (8x8 mm) with Exposed Pad |
| 実装タイプ | Surface Mount |
| Motor Control PWM | 12 channels (8/8 IC/OC per Mouser listing) |
| Input Capture / Output Compare | 8 IC / 8 OC |
| Quadrature Encoder Interface | 4 QEI |
| On-chip Operational Amplifiers | 2 OpAmp |
| CAN Modules | 2 (CAN 2.0B) |
| Peripherals (per Mouser) | 12 MC, 8/8 IC/OC, 2 QEI, OpAmp |
| Packaging | Tube |
| RoHS ステータス | ROHS3 Compliant |
| Automotive Qualification | AEC-Q100 qualified series |
| Manufacturer Lead Time | 26 weeks (per Microchip USA) |
| Product Status | Active |
DSPIC33EP512GM604-E/ML 44-qfn (8x8 mm) with exposed pad ピン配置ガイド
DSPIC33EP512GM604-E/ML (44-qfn (8x8 mm) with exposed pad パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: DSPIC33EP512GM604-E/ML.
詳細は データシート をご参照ください。
主な用途
DSPIC33EP512GM604-E/ML の用途: 6 件s: BLDC / PMSM Motor Drives, Digital Power Conversion, Automotive Auxiliary Systems, Industrial Sensor Front-Ends, Audio Signal Processing, Embedded Control and IoT Nodes.
BLDC / PMSM Motor Drives
The GM604 is purpose-built for field-oriented control of brushless DC and permanent-magnet synchronous motors. Its 12-channel motor-control PWM with complementary outputs and dead-time drives three-phase inverters directly, while the four quadrature encoder interfaces accept encoder or resolver feedback without external counters. The dual on-chip operational amplifiers amplify shunt-resistor current signals in-line, cutting external op-amp BOM cost and analog latency. Running the FOC current loop at 70 MIPS allows PWM frequencies well above the audible band, reducing acoustic noise; the -E grade (-40C to +125C) suits underhood and industrial drive environments.
おすすめ
Digital Power Conversion
In digital power supplies, solar micro-inverters, and PFC stages, the dsPIC33EP512GM604 executes control loops with deterministic interrupt latency from the 70 MIPS dsPIC33E core. The Peripheral Pin Select lets engineers map PWM outputs and ADC triggers onto optimal PCB pin locations, minimizing loop-area in switching layouts. Its 512 KB Flash holds multiple firmware images plus a bootloader for field firmware updates over CAN or UART - valuable for grid-tied equipment requiring remote updates. Running the loop in hardware DSP multiply-accumulate instructions achieves control bandwidths comparable to dedicated digital-power controllers at lower system cost.
おすすめ
Automotive Auxiliary Systems
The dsPIC33EP512GM604 series is documented as an AEC-Q100 automotive family by Microchip USA, and the -E/ML grade covers -40C to +125C ambient, matching underhood and body-domain requirements. CAN 2.0B modules interface directly with vehicle networks through an external transceiver, while the op-amps condition analog sensor inputs such as position and current sensing in electric power steering pumps, cooling-fan modules, and BLDC auxiliary actuators. Designers should obtain the automotive qualification letter and PPAP documentation from Microchip, since commercial datasheet numbers and automotive release status are managed separately by the manufacturer.
おすすめ
Industrial Sensor Front-Ends
The dual integrated operational amplifiers and 16-bit-capable ADC path let the GM604 amplify and digitize small sensor signals - load cells, thermocouples via conditioning, and pressure bridges - without external precision op-amps. The 70 MIPS DSP core applies digital filtering and calibration in firmware, achieving end-to-end accuracy that competes with discrete analog chains. Extended -40C to +125C operation permits mounting near actuators in factory automation, and CAN connectivity links the node into industrial control networks. The 512 KB Flash accommodates compensation tables and multi-protocol firmware stacks in a single-chip design, reducing board area and calibration overhead.
おすすめ
Audio Signal Processing
With a single-cycle DSP multiply-accumulate unit, hardware barrel shifter, and modulo addressing, the dsPIC33EP512GM604 implements audio effects, active crossover filtering, and echo cancellation at modest sample rates. The 512 KB Flash stores multiple coefficient sets for user-selectable filter profiles, and the 3.3V I/O interfaces directly with audio codecs and digital potentiometers. While the GM604 is not a dedicated audio DSP, its motor-control-grade PWM can also drive Class-D output stages in compact powered speakers, letting one controller handle both the audio processing and the power stage - a common cost-reduction pattern in mid-range consumer and kiosk audio hardware.
おすすめ
Embedded Control and IoT Nodes
For general embedded control, the GM604 offers an 8/8 input-capture/output-compare set, multiple UART, SPI, and I2C modules (all remappable via Peripheral Pin Select), and deep-sleep modes for battery-sensitive nodes. The 512 KB Flash hosts protocol stacks - Modbus, CANopen, or custom RF link firmware - with room for OTA updaters. DSP instructions accelerate FFT-based sensor analytics at the edge, such as vibration monitoring of pumps and fans. The 44-QFN 8x8 mm footprint fits compact node PCBs, and the extended temperature range suits unconditioned outdoor enclosures in agricultural and utility monitoring deployments where field servicing is costly.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: DSPIC33EP512GM604-E/ML — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | DSPIC33EP512GM604-I/ML | DSPIC33EP256GM604-E/ML | DSPIC33EP512GM304-I/ML | DSPIC33EP512GP504-H/ML | DSPIC33EP512MC604-E/ML |
|---|---|---|---|---|---|---|
| Package | 44-QFN (8x8 mm) EP (ML) | 44-QFN (8x8 mm) EP - same | 44-QFN (8x8 mm) EP - same | 44-QFN (8x8 mm) EP - same | 44-QFN (8x8 mm) EP - same | 44-QFN (8x8 mm) EP - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Program Memory | 512 KB (170K x 24) | 512 KB | 256 KB | 256 KB | 512 KB | 512 KB |
| Core Speed | 70 MIPS (dsPIC33E) | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| On-chip OpAmps | Yes (dual) | Yes (dual) | Yes (dual) | Yes (dual) | No (GP variant) | No (MC peripheral mix) |
| Operating Temperature | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +125C (H grade) | -40C to +125C (E grade) |
| CAN | Yes (CAN 2.0B) | Yes | Yes | Yes | Yes | Yes |
| RoHS | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant |
主な差別化要因
- Dual on-chip operational amplifiers for current sensing （vs DSPIC33EP512GP504-H/ML)
- Extended -40C to +125C operation （vs DSPIC33EP512GM604-I/ML)
- Maximum Flash capacity in the 44-pin GM family （vs DSPIC33EP256GM604-E/ML)
設計ノート
Connect the QFN exposed pad to a solid ground plane with a 3x3 via array directly under the package. The exposed pad is the primary ground return for the on-chip op-amps, ADC, and digital core; a floating or poorly soldered pad is a classic cause of ADC noise and intermittent op-amp offset on dsPIC33EP QFN devices. Follow the landing pattern in the family datasheet (document 70000689) or the ComponentSearchEngine ECAD footprint, and inspect solder voiding with X-ray for high-volume production.
Provide 0.1uF ceramic decoupling at every AVDD and VDD pin, placed within 2 mm of the pin, plus one 4.7uF to 10uF bulk capacitor near the package. Isolate AVDD with an RC or ferrite filter from the digital 3.3V rail to protect ADC and op-amp accuracy from core switching noise at 70 MIPS. Keep the crystal/PLL circuitry away from the motor-control PWM traces, whose high di/dt edges couple into the oscillator and cause clock jitter. Decouple VDDCORE per the datasheet recommendations - do not share its capacitor network with other rails.
Two frequent issues: (1) Peripheral Pin Select (PPS) must be unlocked before remapping and re-locked afterward; forgetting the lock sequence leaves peripherals unassigned and is the top dsPIC33E forum support topic. (2) The -E grade extends to +125C but the -I variant only to +85C - do not substitute an -I part in an underhood design, even though the packages are identical. Also note Microchip USA documents a 26-week manufacturer lead time; place orders early or qualify DSPIC33EP256GM604-E/ML as a second source on the same footprint.
コンプライアンス情報
Microchip USA lists 'ROHS3 Compliant' and 'Series: Automotive, AEC-Q100, dsPIC 33EP' for this part. Jotrin also lists the part as automotive 44-pin QFN EP. REACH, halogen-free, and conflict-minerals declarations were not found in provided data - obtain official declarations from Microchip's compliance portal.
