DSPIC33EP64GS502-E/MM - 16-Bit 64KB Flash DSC | Microchip
MPN: DSPIC33EP64GS502-E/MM ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6.45 | $6.45 |
| 10 | $5.82 | $58.20 |
| 100 | $4.98 | $498.00 |
| 500 | $4.35 | $2,175.00 |
| 1,000 | $3.78 | $3,780.00 |
DSPIC33EP64GS502-E/MM Overview
A Digital Signal Controller combines the deterministic interrupt behavior and peripheral set of a microcontroller with the multiply-accumulate (MAC) DSP engine of a digital signal processor. In the power-conversion hierarchy, the DSC sits above a general-purpose MCU (adding a DSP engine and high-resolution PWM) and below a dedicated digital power ASIC (adding full firmware flexibility), making the dsPIC33EP family the standard choice for closed-loop switched-mode power supplies.
The GS502 variant targets digital power specifically. Its distinguishing peripherals include an interconnected high-speed PWM module, a high-speed analog-to-digital converter with an integrated programmable gain amplifier (PGA), and analog comparators - a tightly coupled analog/PWM ecosystem that minimizes loop latency between current sensing and duty-cycle update. The -E suffix guarantees operation across the full automotive/industrial temperature range of -40C to +125C, and the device is AEC-Q100 qualified per distributor listings.
The 16-bit CPU executes DSP instructions such as MAC and dual data fetch in a single cycle, delivering the loop bandwidth required for peak-current-mode and voltage-mode control at hundreds of kilohertz switching frequencies. Typical applications include AC-DC power supplies, interleaved power factor correction (Microchip's 350W interleaved PFC reference design is based on this device family), digital lighting ballasts, battery chargers, and LLC/half-bridge converters.
Design consideration: the high-speed PWM requires careful routing - keep gate-drive traces short and pair the ADC sampling instant with a PWM trigger to avoid switching-noise corruption of current feedback.
This page synthesizes distributor pricing, pin-compatible family alternatives, application pairings, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for DSPIC33EP64GS502-E/MM — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP64GS502-E/MM (same form factor and footprint) — differing in Package, Operating Temperature, Supply Voltage, Core, ADC.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP64GS502-E/2N
✅ Drop-In✓ In Stock
$3.1 / Unit
View Datasheet →DSPIC33EP64GS502-I/MM
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$5.1 / Unit
View Datasheet →DSPIC33EP32GS202-E/MM
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP64GP502-I/MM
✅ Drop-In✓ In Stock
$2.2 / Unit
View Datasheet →DSPIC33EP32GP502-E/MM
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP64GS502-E/MM Maximum Ratings & Electrical Characteristics
| Core Architecture | 16-bit dsPIC33EP RISC with DSP engine |
| Core Performance | 70 MIPS |
| Flash Program Memory | 64 KB (64K x 8) |
| Supply Voltage | 3.3 V |
| Package | 28-QFN-S (6x6 mm) with Exposed Pad |
| Operating Temperature | -40C to +125C (E grade) |
| Qualification | AEC-Q100 Automotive |
| High-Speed PWM | Interconnected High-Speed PWM for digital power |
| ADC | High-Speed ADC with Programmable Gain Amplifier (PGA) |
| Analog Comparators | Yes (on-chip comparators for cycle-by-cycle current limit) |
| Target Applications | Digital Power, SMPS |
| Functional Safety Support | Yes (FuSa) |
| Mounting Type | Surface Mount |
| DAC | Yes (on-chip DAC per Microchip product page) |
| RoHS Status | Compliant |
DSPIC33EP64GS502-E/MM 28-qfn-s (6x6 mm) with exposed pad Pin Configuration Guide
Pin configuration for DSPIC33EP64GS502-E/MM (28-qfn-s (6x6 mm) with exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP64GS502-E/MM.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP64GS502-E/MM is suitable for 6 applications: AC-DC Digital Power Supplies, Interleaved Power Factor Correction, LLC and Half-Bridge DC-DC Converters, Digital Lighting Ballasts and LED Drivers, Battery Chargers and BMS Front Ends, Industrial Motor-Driven Power Systems.
AC-DC Digital Power Supplies
The DSPIC33EP64GS502-E/MM is purpose-built for digitally controlled AC-DC power supplies, where its interconnected high-speed PWM and high-speed ADC with PGA close current-mode loops with microsecond-scale latency. The DSP engine executes PI and 3p3z compensator calculations at 70 MIPS, sustaining loop bandwidths required by flyback, forward, and LLC converters switching at hundreds of kilohertz. The on-chip comparators provide hardware cycle-by-cycle overcurrent protection independent of firmware, meeting safety expectations for mains-powered supplies. Firmware-based control also enables adaptive burst mode, output scheduling, and telemetry via UART/I2C - capabilities fixed-frequency analog controllers cannot offer.
Recommended
Interleaved Power Factor Correction
Microchip's own 350W interleaved PFC reference design is based on the GS502 device family, demonstrating universal AC input rectification into a regulated high-voltage DC bus. The GS502's high-speed ADC samples inductor current synchronously with PWM triggers, while the PGA amplifies shunt signals without external op-amps, reducing BOM count and offset error. Interleaving two boost phases halves input ripple current; each phase uses a dedicated high-resolution PWM output with phase-shift control from a single DSC. Firmware implements average-current-mode PFC control plus front-end brownout, inrush, and OVP supervisory logic in one device, eliminating a separate supervisor IC.
Recommended
LLC and Half-Bridge DC-DC Converters
For resonant LLC and phase-shifted half-bridge converters, the GS502's interconnected high-speed PWM supports frequency modulation with fine resolution and complementary outputs with programmable dead time - the two control variables LLC topologies require. The high-speed ADC tracks the resonant tank current via the PGA, enabling burst-mode entry/exit and capacitive-protection algorithms in firmware. At 70 MIPS, the DSP core sustains the arithmetic load of adaptive dead-time optimization and light-load efficiency mapping. The -E grade (-40C to +125C) covers the elevated ambient conditions inside sealed telecom rectifiers and server power shelves where these topologies dominate.
Recommended
Digital Lighting Ballasts and LED Drivers
High-intensity discharge ballasts and high-power LED drivers benefit from the GS502's combination of resonant PWM control and precise analog sensing. The high-speed PWM generates ignition sequences and frequency-sweep startup for HID lamps, while the ADC with PGA monitors lamp current and voltage for constant-power regulation and end-of-life detection. For LED drivers, the DSC implements dimming curves, thermal foldback, and multi-channel current balancing in firmware. The 28-QFN 6x6 mm footprint fits the constrained PCB area of lamp heads and driver boards, and AEC-Q100 qualification supports automotive exterior lighting modules subject to wide temperature swings.
Recommended
Battery Chargers and BMS Front Ends
Multi-chemistry battery chargers use the GS502's DSP core to run charge-profile state machines (CC/CV, taper, top-off) while its high-speed PWM regulates the charger power stage with cycle-by-cycle current limiting from the analog comparators. The PGA-conditioned ADC measures pack current with shunt sensitivities down to tens of millivolts, supporting coulomb-counting accuracy targets. Firmware-driven supervision adds cell-balancing coordination over I2C/SMBus and fault logging for warranty analysis. The extended -40C to +125C temperature range of the -E/MM variant suits onboard chargers and power-tool packs exposed to engine-compartment or outdoor environments.
Recommended
Industrial Motor-Driven Power Systems
In industrial equipment where motor drives and power supplies coexist - HVAC compressors, servo packs, welding supplies - the GS502 provides DSP-class motor control (FOC with single-cycle MAC, 70 MIPS) alongside its digital-power peripherals for the drive's own auxiliary converters. The high-speed ADC with PGA samples phase currents through low-value shunts, and the comparators implement hardware overcurrent trip zones. QEI inputs support encoder feedback, while UART/SPI/I2C interfaces connect to factory PLC networks. The AEC-Q100 qualification and Functional Safety support make it viable for safety-adjacent industrial motion and power-conversion assemblies.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP64GS502-E/MM — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP64GS502-E/2N | DSPIC33EP64GS502-I/MM | DSPIC33EP32GS202-E/MM | DSPIC33EP64GP502-I/MM | DSPIC33EP32GP502-E/MM |
|---|---|---|---|---|---|---|
| Package | 28-QFN-S (6x6 mm, EP) | 28-UQFN (6x6 mm, EP) - same footprint | 28-QFN-S (6x6 mm, EP) - same | 28-QFN-S (6x6 mm, EP) - same | 28-QFN-S (6x6 mm, EP) - same | 28-QFN-S (6x6 mm, EP) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 64 KB | 64 KB | 64 KB | 32 KB | 64 KB | 32 KB |
| Core Performance | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Digital Power Peripherals (HS PWM + PGA ADC) | Yes | Yes | Yes | Yes | No (GP peripherals) | No (GP peripherals) |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +85C | -40C to +125C | -40C to +85C | -40C to +125C |
| Primary Use Case | Digital power / SMPS | Digital power / SMPS (identical) | Digital power, industrial temp | Cost-reduced digital power | General-purpose control | General-purpose, extended temp |
Key Differentiators
- Dedicated digital-power analog ecosystem (vs DSPIC33EP64GP502-I/MM)
- Extended temperature range at identical pinout (vs DSPIC33EP64GS502-I/MM)
- Trade-off: half the Flash at lower cost (vs DSPIC33EP32GS202-E/MM)
Design Notes
The 28-QFN exposed pad is the primary thermal and ground path. Estimated: at 70 MIPS with all digital-power peripherals active, core current is typically in the tens of mA range at 3.3V (sub-200 mW internal dissipation), so a solid ground pour of at least 1 square inch under the EP keeps junction rise modest. However, always verify worst-case dissipation with your peripheral loading against the datasheet power figures, since the EP solder coverage directly determines theta_JA in your stackup.
Route the high-speed PWM gate-drive outputs first, keeping them short and away from the PGA/ADC input traces; the same-package GS family shares sensitive analog pins adjacent to PWM pins on the 28-QFN. Place the shunt-sense RC filter for the PGA inputs close to the pin and Kelvin-connect it to the shunt. Decouple each VDD pin with a 0.1uF ceramic plus bulk capacitance, and synchronize ADC sampling to a PWM trigger event so switching noise never coincides with the sample window.
Do not confuse ordering suffixes: -E/MM is the extended-temperature (-40C to +125C) QFN part, while -I/MM is industrial grade (-40C to +85C) - substituting -I in an automotive ambient will violate derating margins. The GS-series digital-power peripherals differ from the GP-series even on identical footprints; firmware written for GP ADC/PWM registers will not drive the interconnected HS PWM without the GS register map. Finally, configure the comparators for cycle-by-cycle current limit in hardware - relying on firmware-only protection adds loop latency that can destroy the power stage.
Compliance Information
AEC-Q100 automotive qualification and RoHS compliance per distributor listings (Hotenda: 'Automotive, AEC-Q100'; FindIC: 'Automotive'). REACH, halogen-free, and conflict-minerals status not stated in provided data.
