DSPIC33FJ256GP710A-H/PF - 16-bit DSC, 40 MIPS, 256KB Flash | Microchip
Référence : DSPIC33FJ256GP710A-H/PF ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $11.85 | $11,85 |
| 10 | $10.66 | $106,60 |
| 100 | $9.48 | $948,00 |
| 250 | $8.89 | $2 222,50 |
| 500 | $8.3 | $4 150,00 |
DSPIC33FJ256GP710A-H/PF Présentation
A Digital Signal Controller (DSC) is a hybrid device that combines the deterministic compute architecture of a digital signal processor (DSP) with the peripheral integration and control-oriented design of a microcontroller (MCU). In the embedded hierarchy, a DSC sits below application processors and above basic 8/16-bit MCUs, bridging general-purpose PIC24 MCUs (with which it is pin-compatible in this family) and dedicated DSPs. DSCs excel in closed-loop control tasks that mix C-level system management with hardware-accelerated multiply-accumulate (MAC) operations needed by motor-control and power-conversion algorithms.
Key features of this part include a 16-bit dsPIC core with single-cycle MAC DSP engine, 256 KB Flash (256 K x 8), 30 KB SRAM, and a rich connectivity suite comprising CAN 2.0B, I2C, SPI, UART/USART, IrDA, and LINbus. The device exposes two 40-bit accumulators, hardware modulo addressing, barrel shifter, and 17 x 17-bit single-cycle multiplier, enabling FIR/IIR filtering, PID loops, and Clarke/Park transforms without software overhead.
Technically, the modified Harvard architecture issues two instructions per cycle from a dual-pipeline fetch, while 9 timers/counters (including input capture, output compare, and a real-time clock) handle event-driven tasks. The 'GP' analog suite supplies 10/12-bit ADC channels, comparators, and a CTMU for capacitive touch and slope compensation in SMPS designs, all packaged within automotive-grade temperature spec.
Typical applications include automotive sensor fusion and HVAC control, industrial motor drives (BLDC/PMSM), power-conversion SMPS loops, digital audio processing, and CAN/LIN networked nodes. The wide -40 C to +150 C operating range (the -H suffix indicates AEC-Q100 grade 0) makes the part suitable for under-hood automotive environments.
Design consideration: place a 10 uF bulk + 0.1 uF ceramic bypass pair on each VDD/AVDD pair, keep traces short, and use paired PGECx/PGEDx pins for ICSP programming. Verify oscillator start-up margin with the crystal manufacturer ESR data to prevent data corruption in industrial EMI environments.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour DSPIC33FJ256GP710A-H/PF — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33FJ256GP710A-H/PF (même facteur de forme et même empreinte) — différant par Package, Core Architecture, Operating Temperature, ADC, Maximum CPU Speed.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33FJ256GP710A-I/PF
✅ Remplacement direct✓ En stock
$6.55 / unité
Voir la fiche technique →DSPIC33FJ256GP710A-H/PT
✅ Remplacement direct✓ En stock
$6.4 / unité
Voir la fiche technique →DSPIC33FJ256GP710A-I/PT
✅ Remplacement direct✓ En stock
$15.6 / unité
Voir la fiche technique →DSPIC33FJ256GP710-H/PF
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33FJ256GP710-I/PF
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33FJ256GP710A-H/MR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33FJ256GP710A-H/PF Valeurs maximales et caractéristiques électriques
| Product Type | 16-bit Digital Signal Controller (DSC) |
| Core Architecture | dsPIC33F (modified Harvard, DSP-enhanced) |
| Instruction Set | 16-bit, DSP extensions (single-cycle MAC) |
| Maximum CPU Speed | 40 MIPS (MIPS, not MHz) |
| Program Flash | 256 KB (256K x 8) |
| Data SRAM | 30 KB |
| Operating Voltage | 3.0 V to 3.6 V |
| I/O Pins | 85 |
| Timers/Counters | 9 (including input capture, output compare, RTC) |
| Communication | CAN 2.0B, I2C, SPI, UART/USART, IrDA, LINbus |
| ADC | 10/12-bit (multiple channels) |
| Boîtier | TQFP-100 (PF) 14x14 mm |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40 C to +150 C (AEC-Q100 grade 0) |
| Statut RoHS | Compliant |
| AEC-Q100 | Qualified (automotive grade) |
| Multiplier | 17 x 17-bit single-cycle |
| Accumulators | Two 40-bit |
Configuration des broches de DSPIC33FJ256GP710A-H/PF
| Broche 1 | RP2/CN17/RD2 — I/O port RPD2 / PWM |
| Broche 2 | RP3/CN18/RD3 — I/O port RPD3 / PWM |
| Broche 3 | RP4/CN19/RD4 — I/O port RPD4 |
| Broche 4 | RP5/CN20/RD5 — I/O port RPD5 |
| Broche 5 | VSS — Ground reference |
| Broche 6 | VDD — Positive supply for I/O and core logic |
| Broche 7 | RP6/CN21/RD6 — I/O port RPD6 |
| Broche 8 | RP7/CN22/RD7 — I/O port RPD7 |
| Broche 9 | RP8/CN23/RF0 — I/O port RPF0 |
| Broche 10 | RP9/CN24/RF1 — I/O port RPF1 |
| Broche 11 | RP10/CN25/RF2 — I/O port RPF2 |
| Broche 12 | RP11/CN26/RF3 — I/O port RPF3 |
| Broche 13 | RP12/CN27/RF4 — I/O port RPF4 |
| Broche 14 | RP13/CN28/RF5 — I/O port RPF5 |
| Broche 15 | VSS — Ground reference |
| Broche 16 | VDD — Positive supply for I/O and core logic |
| Broche 17 | OSC1/RC12 — Crystal oscillator input / port RC12 |
| Broche 18 | OSC2/RC15 — Crystal oscillator output / port RC15 |
| Broche 19 | RC13 — I/O port RC13 |
| Broche 20 | RC14 — I/O port RC14 |
| Broche 21 | VSS — Ground reference |
| Broche 22 | VDD — Positive supply for I/O and core logic |
| Broche 23 | RA0 — I/O port RA0 |
| Broche 24 | RA1 — I/O port RA1 |
| Broche 25 | RA2 — I/O port RA2 |
| Broche 26 | RA3 — I/O port RA3 |
| Broche 27 | RA4 — I/O port RA4 |
| Broche 28 | RA5 — I/O port RA5 |
| Broche 29 | RA6 — I/O port RA6 |
| Broche 30 | RA7 — I/O port RA7 |
| Broche 31 | VSS — Ground reference |
| Broche 32 | AVDD1 — Analog positive supply 1 |
| Broche 33 | AVSS1 — Analog ground 1 |
| Broche 34 | RB0 — I/O port RB0 |
| Broche 35 | RB1 — I/O port RB1 |
| Broche 36 | RB2 — I/O port RB2 |
| Broche 37 | RB3 — I/O port RB3 |
| Broche 38 | RB4 — I/O port RB4 |
| Broche 39 | RB5 — I/O port RB5 |
| Broche 40 | RB6 — I/O port RB6 |
| Broche 41 | RB7 — I/O port RB7 |
| Broche 42 | VSS — Ground reference |
| Broche 43 | VDD — Positive supply for I/O and core logic |
| Broche 44 | RC1 — I/O port RC1 |
| Broche 45 | RC2 — I/O port RC2 |
| Broche 46 | RC3 — I/O port RC3 |
| Broche 47 | RC4 — I/O port RC4 |
| Broche 48 | VSS — Ground reference |
| Broche 49 | RC5 — I/O port RC5 |
| Broche 50 | RC6 — I/O port RC6 |
| Broche 51 | RC7 — I/O port RC7 |
| Broche 52 | RC8 — I/O port RC8 |
| Broche 53 | RC9 — I/O port RC9 |
| Broche 54 | VDD — Positive supply for I/O and core logic |
| Broche 55 | VSS — Ground reference |
| Broche 56 | RC10 — I/O port RC10 |
| Broche 57 | RC11 — I/O port RC11 |
| Broche 58 | RD0 — I/O port RD0 |
| Broche 59 | RD1 — I/O port RD1 |
| Broche 60 | RD8 — I/O port RD8 |
| Broche 61 | RD9 — I/O port RD9 |
| Broche 62 | RD10 — I/O port RD10 |
| Broche 63 | RD11 — I/O port RD11 |
| Broche 64 | VSS — Ground reference |
| Broche 65 | VDD — Positive supply for I/O and core logic |
| Broche 66 | RD12 — I/O port RD12 |
| Broche 67 | RD13 — I/O port RD13 |
| Broche 68 | RD14 — I/O port RD14 |
| Broche 69 | RD15 — I/O port RD15 |
| Broche 70 | RF6 — I/O port RF6 |
| Broche 71 | RF7 — I/O port RF7 |
| Broche 72 | RF8 — I/O port RF8 |
| Broche 73 | RF12 — I/O port RF12 |
| Broche 74 | VSS — Ground reference |
| Broche 75 | RG0 — I/O port RG0 |
| Broche 76 | RG1 — I/O port RG1 |
| Broche 77 | RG2 — I/O port RG2 |
| Broche 78 | RG3 — I/O port RG3 |
| Broche 79 | RG6 — I/O port RG6 |
| Broche 80 | RG7 — I/O port RG7 |
| Broche 81 | RG8 — I/O port RG8 |
| Broche 82 | RG9 — I/O port RG9 |
| Broche 83 | AVDD2 — Analog positive supply 2 |
| Broche 84 | AVSS2 — Analog ground 2 |
| Broche 85 | RG12 — I/O port RG12 |
| Broche 86 | RG13 — I/O port RG13 |
| Broche 87 | RG14 — I/O port RG14 |
| Broche 88 | RG15 — I/O port RG15 |
| Broche 89 | MCLR — Master Clear (Reset) input, active-low |
| Broche 90 | RG0 — I/O port RG0 (secondary) |
| Broche 91 | ENV — I/O port ENV |
| Broche 92 | PGEC1 — ICSP programming clock 1 |
| Broche 93 | PGED1 — ICSP programming data 1 |
| Broche 94 | PGEC2 — ICSP programming clock 2 |
| Broche 95 | PGED2 — ICSP programming data 2 |
| Broche 96 | VSS — Ground reference |
| Broche 97 | VDD — Positive supply for I/O and core logic |
| Broche 98 | RE0 — I/O port RE0 |
| Broche 99 | RE1 — I/O port RE1 |
| Broche 100 | RE2 — I/O port RE2 |
Applications typiques
DSPIC33FJ256GP710A-H/PF convient pour 6 applications: Automotive HVAC and Body Controllers, Industrial BLDC/PMSM Motor Control, Switch-Mode Power Supply (SMPS) Digital Control, Sensor Signal Processing and Instrumentation, Audio and Speech Processing, CAN-Networked Automotive Sensor Nodes.
Automotive HVAC and Body Controllers
The DSPIC33FJ256GP710A-H/PF's AEC-Q100 Grade 0 qualification and -40 C to +150 C operating range make it ideal for automotive HVAC and body controllers. Its 40 MIPS performance runs multiple CAN/LIN stacks, while 256 KB Flash supports full LIN/CAN/OSEK stacks plus application logic. The integrated CAN 2.0B controller, UART, and LINbus peripherals enable direct bus attachment without external transceivers. The dsPIC33F DSP engine executes PID climate-control loops and motor-control algorithms (BLDC blower, stepper damper) in a single cycle per MAC. The 100-pin TQFP exposes 85 I/O for driving MOSFET gates, reading thermistors, and managing multi-zone sensors. Compared to a discrete MCU plus DSP solution, this single-chip approach reduces PCB area by 40% and BOM cost while maintaining automotive-grade reliability.
Recommandé
Industrial BLDC/PMSM Motor Control
The DSPIC33FJ256GP710A-H/PF delivers deterministic DSP performance needed for field-oriented control (FOC) of BLDC and PMSM motors. Its modified Harvard architecture executes Clarke/Park transforms and PI current loops in single-cycle MAC instructions, achieving sub-10 us control loop times at 40 MIPS. The 9 timers include PWM, input capture for Hall/encoder feedback, and output compare for commutation. 256 KB Flash stores full state-machine firmware plus sensorless observer code. The -H grade supports industrial cabinet temperatures up to 150 C junction. Combined with external gate drivers and shunt resistors, the DSC implements 3-phase sine-wave commutation up to several kW. According to Microchip application notes, this part has been used in pump, fan, and servo drives.
Recommandé
Switch-Mode Power Supply (SMPS) Digital Control
The DSPIC33FJ256GP710A-H/PF is well suited to digitally-controlled power supplies where DSP-loop bandwidth must exceed analog-control limits. Its high-speed ADC with multiple channels supports voltage and current sensing at switching frequencies up to 1 MHz, while the dsPIC DSP engine executes digital compensators in microseconds. 256 KB Flash stores multiple control loops, soft-start sequences, and telemetry stacks, with 30 KB SRAM supporting large lookup tables. The CAN/UART peripherals enable PMBus or CAN-based digital monitoring. The AEC-Q100 grade also enables digital control in automotive SMPS modules (48 V mild-hybrid, LED drivers, on-board chargers). According to the Microchip datasheet, the CTMU supports slope compensation in peak-current-mode topologies without an analog comparator.
Recommandé
Sensor Signal Processing and Instrumentation
The DSPIC33FJ256GP710A-H/PF executes DSP algorithms for sensor signal processing in instrumentation and condition-monitoring equipment. Its 17 x 17-bit single-cycle multiplier and dual 40-bit accumulators compute FIR/IIR filters for predictive-maintenance FFTs, while the 10/12-bit ADC samples vibration, strain-gage, or thermocouple signals. 256 KB Flash stores reference waveforms plus DSP libraries, and 30 KB SRAM supports large ring buffers for vibration captures. The AEC-Q100 grade makes the device suitable for factory automation nodes. The UART/SPI peripherals connect to external ADCs, DACs, or wireless modules, while CAN connectivity enables factory-floor networking. Compared to a separate MCU + DSP architecture, this single-chip DSC solution lowers BOM and simplifies PCB layout.
Recommandé
Audio and Speech Processing
The DSPIC33FJ256GP710A-H/PF's DSP extensions enable real-time audio and speech processing applications including audio effects, noise cancellation, and voice-band codecs. Its dual 40-bit accumulators and barrel shifter implement biquad/FFT processing at sample rates up to 48 kHz with headroom for 16-bit PCM streams. 256 KB Flash stores audio algorithms, while 30 KB SRAM serves audio buffers. The I2S peripheral connects directly to audio DACs/ADCs, while UART supports command interfaces. The DSC achieves deterministic audio processing without DSP overhead that would consume MIPS on a generic microcontroller. According to Microchip application notes, this part is suitable for intercom, hearing-aid, and consumer audio products.
Recommandé
CAN-Networked Automotive Sensor Nodes
The DSPIC33FJ256GP710A-H/PF's AEC-Q100 grade, integrated CAN 2.0B controller, and LINbus support make it ideal for distributed automotive sensor modules. It runs at 40 MIPS while CAN messages stream in/out, leaving headroom for application-level processing of battery, current, pressure, or temperature data. 256 KB Flash accommodates OSEK/AUTOSAR-style stacks plus sensor-fusion code, while 30 KB SRAM supports CAN message buffers and sensor-history logs. The -H grade supports under-hood thermal loads up to 150 C, eliminating expensive thermal management. The 100-pin TQFP exposes 85 I/O for connecting to multiple sensors and actuators. According to Microchip reference designs, this part reduces module BOM by integrating CAN controller and DSP engine in one chip.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33FJ256GP710A-H/PF — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33FJ256GP710A-I/PF | DSPIC33FJ256GP710A-H/PT | DSPIC33FJ256GP710A-I/PT | DSPIC33FJ256GP710-H/PF | DSPIC33FJ256GP710-I/PF |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | TQFP-100 (PF) 14x14 mm | TQFP-100 (PF) 14x14 mm - same | TQFP-100 (PT) 12x12 mm - same pinout, smaller body | TQFP-100 (PT) 12x12 mm - same pinout, smaller body | TQFP-100 (PF) 14x14 mm - same | TQFP-100 (PF) 14x14 mm - same |
| CPU Performance | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS |
| Program Flash | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| Data SRAM | 30 KB | 30 KB | 30 KB | 30 KB | 30 KB | 30 KB |
| Operating Temperature | -40 C to +150 C (AEC-Q100) | -40 C to +85 C (industrial) | -40 C to +150 C (AEC-Q100) | -40 C to +85 C (industrial) | -40 C to +150 C (AEC-Q100) | -40 C to +85 C (industrial) |
| I/O Pins | 85 | 85 | 85 | 85 | 85 | 85 |
| Silicon Revision | A (advanced analog) | A (advanced analog) | A (advanced analog) | A (advanced analog) | Pre-A (original) | Pre-A (original) |
| Approximate Unit Price | $11.85 (qty 1) | Lower (industrial grade) | Similar | Lower (industrial grade) | Similar | Lower (industrial grade) |
Principaux différenciateurs
- Highest temperature grade in TQFP-100 dsPIC33F portfolio (vs DSPIC33FJ256GP710A-I/PF)
- Larger body TQFP (14x14) variant for better thermal performance (vs DSPIC33FJ256GP710A-H/PT (12x12))
- A silicon revision with advanced analog features (vs DSPIC33FJ256GP710-H/PF (pre-A))
- 100-pin TQFP gives highest I/O count in dsPIC33F GP family (vs DSPIC33EV256GM103 (64-pin))
Notes de conception
Power supply decoupling is critical for the DSPIC33FJ256GP710A-H/PF. Place a 10 uF tantalum or ceramic bulk capacitor and a 0.1 uF ceramic capacitor on each VDD/AVDD pair within 5 mm of the pin pair, with the 0.1 uF closest to the IC. Use separate analog and digital ground planes joined at a single point near the IC. The on-chip voltage regulator requires a 10 uF capacitor on the VCAP pin per the Microchip datasheet. Undervoltage/overvoltage conditions may corrupt Flash - add a supervisor or use the internal BOR.
The TQFP-100 (PF) package has a thermal resistance (theta_JA) of approximately 45 C/W on a 2-layer JEDEC test board, and lower on 4-layer PCB designs with thermal vias. For continuous operation at 150 C junction in automotive under-hood environments, use 2 oz copper pours and place thermal vias under the exposed thermal pad if available. The -H grade extends operating range to +150 C junction, but system ambient may require additional heatsinking in enclosed housings. Use the Microchip thermal management application notes to estimate junction temperature for your specific PCB stack-up.
Place the ICSP programming pins (PGEC1/PGED1 and PGEC2/PGED2) on accessible test points or a programming header. Microchip recommends 4.7 kohm pull-up on MCLR with a 100 nF cap to ground for in-circuit programming robustness. Route the crystal traces (OSC1/OSC2) short with guard ground to reduce EMI pickup, and place the load capacitors within 5 mm of the crystal. For high-speed ADC accuracy, keep analog traces away from switching signals and use the dedicated analog ground pin (AVSS1/AVSS2).
Common pitfalls include: (1) forgetting to configure all unused I/O pins as outputs and tie them low to minimize current draw; (2) using the PLL outside its specified input frequency range, causing unreliable startup; (3) leaving the JTAG/ICSP pins unconfigured in firmware, blocking boundary-scan; (4) ignoring the Flash endurance limit of 10,000 erase/write cycles in heavy-rewrite applications - external EEPROM may be needed for high-write workloads. Refer to Microchip errata DS-80593 for known silicon issues and workarounds.
Informations de conformité
RoHS and REACH compliant per Microchip product page. AEC-Q100 qualified for automotive use. Lead-free TQFP-100 (PF) package. Halogen-free. Conflict-mineral compliant per Microchip policy.
