DSPIC33FJ64GP802-E/MM - 16-bit 40MIPS DSC 64KB Flash | Microchip
Référence : DSPIC33FJ64GP802-E/MM ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $6.1 | $6,10 |
| 10 | $5.55 | $55,50 |
| 100 | $4.85 | $485,00 |
| 500 | $4.4 | $2 200,00 |
| 1 000 | $3.95 | $3 950,00 |
DSPIC33FJ64GP802-E/MM Présentation
A digital signal controller combines the deterministic control flow of a 16-bit microcontroller with the DSP engine of a digital signal processor in a single silicon device. In the embedded systems hierarchy, the DSC sits between general-purpose MCUs and dedicated DSPs, making it the natural choice for closed-loop control applications that need both C-friendly code density and single-cycle multiply-accumulate throughput.
Key features include 16384 words of Flash program memory, 8 DMA channels that move data without CPU intervention, 7 timers, 3 serial I/O interfaces (UART, SPI, I2C), and software-remappable pin functions that simplify PCB routing. The extended-temperature E suffix and AEC-Q100 qualification make this specific ordering code suitable for automotive and harsh industrial environments.
Architecturally, the dsPIC33FJ core uses CMOS process technology with a 16-bit modified Harvard bus, a hardware 17-bit x 17-bit multiplier, a barrel shifter, and DSP accumulate instructions executing in a single cycle at 40 MIPS from a 3.0V to 3.6V supply. An integrated 10-bit ADC with hardware conversion triggering feeds the DMA controller for low-jitter sensor sampling, while 5V-tolerant digital pins with per-pin overvoltage clamp current of 5 mA ease interfacing with legacy 5V systems.
Typical applications include BLDC/PMSM motor control where fast ADC-to-PWM latency matters, digital power supplies and PFC stages, automotive sensor nodes, and audio signal processing. The 28-pin footprint with 21 I/O ports gives enough peripheral density for compact control boards.
A key design consideration is supply integrity: the 3.3V rail must stay within 3.0V to 3.6V, and the internal regulator requires proper decoupling per the Microchip datasheet (DS70292G); the exposed pad should be soldered to a ground pour for thermal and EMI performance.
This page synthesizes distributor inventory data, drop-in family alternatives, and practical design notes not consolidated in the manufacturer datasheet.
Alternatives de remplacement direct pour DSPIC33FJ64GP802-E/MM — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33FJ64GP802-E/MM (même facteur de forme et même empreinte) — différant par Core Architecture, Package, Timers, ADC, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33FJ128GP802-E/MM
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33FJ32GP302-E/MM
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33FJ32GP202-E/MM
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33FJ32MC202-E/MM
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4.6 / unité
Voir la fiche technique →DSPIC33FJ64GP202-E/MM
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.85 / unité
Voir la fiche technique →DSPIC33FJ16GS502-E/MM
✅ Remplacement direct✓ En stock
$3.32 / unité
Voir la fiche technique →DSPIC33FJ64GP802-E/MM Valeurs maximales et caractéristiques électriques
| Core Architecture | 16-bit MCU/DSP (dsPIC33FJ) |
| Max CPU Speed | 40 MIPS (40 MHz clock) |
| Flash Program Memory | 64 KB (16384 words) |
| SRAM | 16 KB (16K x 8) |
| Supply Voltage Range | 3.0 V to 3.6 V (nominal 3.3 V) |
| DMA Channels | 8 |
| Timers | 7 |
| Serial Interfaces | 3 (UART, SPI, I2C) |
| I/O Pins | 21 |
| ADC | 10-bit, high-speed |
| Boîtier | 28-QFN-S, 6x6 mm, exposed pad |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40C to +125C (extended, E suffix) |
| Qualification | AEC-Q100 automotive qualified |
| Process Technology | CMOS |
| Pin Features | 5V-tolerant pins, remappable pin functions, open-drain, internal pull-ups, 5 mA/pin overvoltage clamp |
| Statut RoHS | Lead-free, RoHS compliant (QFN lead-free plastic per distributor data) |
Guide de configuration des broches du DSPIC33FJ64GP802-E/MM 28-qfn-s, 6x6 mm, exposed pad
Configuration des broches du DSPIC33FJ64GP802-E/MM (boîtier 28-qfn-s, 6x6 mm, exposed pad). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour DSPIC33FJ64GP802-E/MM.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
DSPIC33FJ64GP802-E/MM convient pour 6 applications: BLDC/PMSM Motor Control, Digital Power Conversion (SMPS/PFC), Automotive Sensor Nodes and Body Electronics, Audio Signal Processing, Industrial Automation and Sensing, Portable and Battery-Powered Instruments.
BLDC/PMSM Motor Control
The DSPIC33FJ64GP802-E/MM fits motor control because its 40 MIPS DSP core executes field-oriented control inner loops with single-cycle 17x17 multiply-accumulate instructions, while the high-speed 10-bit ADC with DMA support samples phase currents with low jitter. In a typical topology, the ADC is triggered by a PWM reload event, current readings are DMA-transferred to RAM without CPU intervention via one of the 8 DMA channels, and the control loop updates the PWM duty cycle within one PWM period. The 7 timers provide independent timebases for PWM, speed measurement, and commutation scheduling. The AEC-Q100 extended -40C to +125C grade of the E/MM ordering code specifically suits automotive pumps, fans, and actuators. Designers should budget Flash carefully, as 64 KB accommodates sensorless observer algorithms with headroom for diagnostics and communication stacks.
Recommandé
Digital Power Conversion (SMPS/PFC)
The DSPIC33FJ64GP802-E/MM is well suited to digital switch-mode power supplies and PFC stages because its 40 MIPS core closes voltage and current loops at switching frequencies typical of 100 to 500 kHz converters. The DMA-driven 10-bit ADC captures input/output voltage and inductor current samples synchronized to PWM edges, avoiding software-trigger jitter that would distort duty-cycle control. In a boost-PFC application, the part computes average current-mode control while managing fault handling and housekeeping on the same die, eliminating an external supervisory MCU. The 21 remappable I/O pins let designers route PWM, fault inputs, and UART telemetry optimally on a dense 6x6 mm QFN-28 board. The 3.0V to 3.6V supply and 5V-tolerant pins ease interfacing with auxiliary 5V housekeeping rails common in power supplies.
Recommandé
Automotive Sensor Nodes and Body Electronics
The AEC-Q100 qualification and extended -40C to +125C operating range make the DSPIC33FJ64GP802-E/MM appropriate for automotive body modules, sensor conditioning nodes, and actuator controllers. Its 10-bit ADC with 5 mA per-pin overvoltage clamp tolerance handles noisy automotive signal environments, while 5V-tolerant digital pins interface directly with legacy 5V in-vehicle logic without level translation. The 3 serial interfaces support LIN-adjacent UART links, SPI sensor buses, and I2C EEPROM diagnostics concurrently, and 8 DMA channels keep communication servicing off the real-time control path. Flash self-programming over the 64 KB array enables field firmware updates. When designing, place the exposed QFN pad on a solid ground pour and keep the crystal within 12 mm of the oscillator pins, per Microchip layout guidance in document 70292G.
Recommandé
Audio Signal Processing
For embedded audio, the DSPIC33FJ64GP802-E/MM provides the DSP math engine - single-cycle MAC, barrel shifter, and dual operand fetch - needed for FIR/IIR filtering, sample-rate conversion, and effects processing at 40 MIPS. The 10-bit ADC handles microphone capture for consumer-grade applications, while SPI connects external higher-resolution audio codecs for professional designs; 3 serial interfaces allow simultaneous codec control and audio data streaming. DMA channels move sample buffers between the ADC/codec and RAM so the CPU spends its cycles on filtering rather than data shuffling. The 64 KB Flash array holds filter coefficient sets plus Bluetooth-adjacent or USB-bridge communication stacks typical of guitar effects, intercoms, and kiosk audio. Developers should verify SRAM buffering budgets, since 16 KB limits block sizes for high-channel-count processing.
Recommandé
Industrial Automation and Sensing
In factory and process environments, the DSPIC33FJ64GP802-E/MM serves as a compact control node combining sensor conditioning, control-law execution, and field communication. The 40 MIPS core closes PID loops in software, the 10-bit ADC reads 4-20 mA-derived or ratiometric sensor signals, and the 3 serial interfaces bridge to industrial transceivers for Modbus-style links. Software-remappable pins let one PCB design serve multiple product variants by rerouting UART and SPI functions in firmware, cutting SKU proliferation. 5V-tolerant, open-drain-capable I/O simplifies interfacing with PLC-grade 5V and 24V-buffered logic through appropriate protection. The extended temperature range covers panel-mounted enclosures without active cooling. With 64 KB Flash, engineers can include calibration tables, self-test routines, and diagnostic logging alongside the main control firmware without external memory.
Recommandé
Portable and Battery-Powered Instruments
The DSPIC33FJ64GP802-E/MM suits handheld and battery-powered instruments through its 3.0V to 3.6V single-rail operation, integrated regulator, and low-power management modes that reduce average consumption in duty-cycled measurement products. The high-speed 10-bit ADC with DMA supports burst sampling of sensors - pressure, inertial, or optical - while the DSP engine performs real-time calibration and digital filtering, replacing external analog conditioning stages. 21 remappable I/O pins drive displays, keypads, and UART telemetry in a 6x6 mm QFN-28 footprint that fits compact probe and meter enclosures. 64 KB Flash retains multiple measurement profiles and configuration sets in-field. Designers should manage the extended-grade E suffix appropriately: it exceeds portable requirements, so the commercial I-suffix die variant may lower cost if -40C cold-chain exposure is not expected.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33FJ64GP802-E/MM — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33FJ128GP802-E/MM | DSPIC33FJ32GP302-E/MM | DSPIC33FJ32GP202-E/MM | DSPIC33FJ16GS502-E/MM |
|---|---|---|---|---|---|
| Package | QFN-28 (6x6 mm, exposed pad) | QFN-28 (6x6 mm, exposed pad) - same | QFN-28 (6x6 mm, exposed pad) - same | QFN-28 (6x6 mm, exposed pad) - same | QFN-28 - same footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Program Memory | 64 KB (16384 words) | 128 KB | 32 KB | 32 KB | 16 KB |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
| Operating Temperature / Qualification | -40C to +125C, AEC-Q100 (E suffix) | -40C to +125C, AEC-Q100 (E suffix) | -40C to +125C (E suffix) | -40C to +125C (E suffix) | -40C to +125C (E suffix) |
| Peripheral Family Focus | GP (general purpose, advanced analog) | GP (advanced analog) | GP (advanced analog) | GP (reduced analog) | GS (digital power) |
Principaux différenciateurs
- 2x program memory headroom versus 32 KB family siblings (vs DSPIC33FJ32GP302-E/MM)
- Extended automotive grade in a compact package (vs DSPIC33FJ32GP202-E/MM)
- DMA offload for ADC sampling (vs DSPIC33FJ16GS502-E/MM)
- Trade-off: GP analog set versus motor-control peripheral family (vs DSPIC33FJ32MC202-E/MM)
Notes de conception
Solder the exposed pad of the QFN-28 package to a solid ground pour with an array of thermal vias; the pad is both the primary thermal path and the main ground return for the die. Microchip layout guidance in document 70292G states the oscillator circuit should be on the same side of the board as the device, within 12 mm (one-half inch) of the oscillator pins, with load capacitors placed next to the crystal. Keep high dv/dt PWM traces away from the ADC input traces to protect the 10-bit converter's effective number of bits.
The device requires a regulated 3.0V to 3.6V rail with nominal 3.3V. Provide local 0.1 uF ceramic decoupling at each VDD pin plus a bulk capacitor of a few microfarads, and follow the internal regulator decoupling requirement in the datasheet for the regulator output capacitor - omitting it is a common cause of brown-out resets. Although many digital pins are 5V-tolerant, analog inputs must stay within the supply-referenced range; add series resistance and clamp diodes to external sensor lines that can exceed VDD during hot-plug or fault events.
The remappable PGC/PGD programming pins must be kept lightly loaded on the target board, or ICSP programming with MPLAB X IPE and PICkit 3-class tools becomes unreliable - a frequent issue reported in community builds. Also remember that peripheral pin remapping is one-time lockable via configuration bits: an accidental lock write with the wrong map permanently fixes UART/SPI routing in production units. Reserve the MCLR pin properly with a 10 k ohm pull-up and programming-header footprint to keep in-field firmware updates possible across the 64 KB Flash array.
Estimated: at 40 MHz full-speed operation the dsPIC33FJ core typically dissipates well under 0.5 W, so with the QFN-28 exposed-pad theta_JA on a standard 4-layer board the junction temperature rise is modest and no heatsink is required. However, in extended -40C to +125C automotive use, verify that worst-case ambient plus self-heating keeps the junction below the absolute maximum rating stated in the Microchip datasheet; use the internal thermal shutdown behavior as a last line of defense, not a design assumption.
Informations de conformité
Distributor listings (Arrow, Hotenda) state AEC-Q100 automotive qualification and lead-free/RoHS packaging for the QFN package. REACH, halogen-free, and conflict-minerals status not stated in provided data.
