EP1AGX50DF1152I4N - Arria GX FPGA, 50K LE, 1152-BGA | Altera
MPN: EP1AGX50DF1152I4N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 500 | $205.2 | $102,600.00 |
| 1,000 | $185.25 | $185,250.00 |
Drop-in alternatives for EP1AGX50DF1152I4N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1AGX50DF1152I6N
✅ Drop-In✓ In Stock
$105 / Unit
View Datasheet →EP1AGX50DF1152C5N
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP1AGX50DF1152C4N
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$156.8 / Unit
View Datasheet →EP1AGX50DF1152C6N
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$270 / Unit
View Datasheet →EP1AGX50DF1152
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →EP1AGX50DF1152I4N Maximum Ratings & Electrical Characteristics
| Family | Arria GX |
| Logic Elements (LE) | 50160 |
| User I/O Pins | 514 |
| Embedded Memory | 2475072 bits |
| Transceivers | Up to 3.125 Gbps multi-gigabit transceivers |
| Package | 1152-ball FineLine BGA |
| Speed Grade | I4 |
| Operating Temperature | -40C to +100C (Industrial) |
| Mounting Type | Surface Mount |
| Lead-Free / RoHS | Yes (RoHS Compliant) |
| Configuration Method | Passive serial / Fast passive parallel / JTAG |
EP1AGX50DF1152I4N 1152-ball fineline bga Pin Configuration Guide
Complete pinout information for EP1AGX50DF1152I4N (1152-ball fineline bga package) with 514 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1AGX50DF1152I4N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 514 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1AGX50DF1152I4N is suitable for 6 applications: High-Speed Serial Protocol Bridge, Telecom Line Card Processing, Broadcast Video Processing, Industrial Imaging Pipeline, ASIC Prototyping Platform, Test and Measurement Instrumentation.
High-Speed Serial Protocol Bridge
The EP1AGX50DF1152I4N is well-suited as a multi-protocol serial bridge between PCI Express, Gigabit Ethernet, and Serial RapidIO. Its eight 3.125 Gbps multi-gigabit transceivers provide one x4 PCIe Gen1 link plus four additional serial channels, while the 50K logic elements and embedded DSP blocks handle protocol conversion and packet processing. According to the Altera Arria GX datasheet, integrating both transceivers and parallel logic on a single device eliminates the need for a companion bridge ASIC, reducing board area and BOM cost. The 1152-ball FineLine BGA package provides sufficient routing density to maintain 90-ohm differential impedance across all serial channels.
Recommended
Telecom Line Card Processing
In telecom line card applications the EP1AGX50DF1152I4N provides the parallel processing bandwidth required for packet classification, traffic shaping, and backplane interfacing. The 50160 logic elements are sufficient for 10 Gbps line-rate header processing, and the 2.4 Mbit embedded memory supports deep packet buffers and lookup tables. The 514 user I/O pins interface directly to network processors, search engines, and SGMII/SerDes PHYs without external glue logic. The industrial temperature range (I4 grade) and 1152-ball BGA footprint suit both ATCA and proprietary backplane form factors.
Recommended
Broadcast Video Processing
The EP1AGX50DF1152I4N's 50160 logic elements and embedded DSP blocks make it a strong fit for broadcast video format conversion, scaling, and overlay processing. The 2.4 Mbit embedded memory buffers video frames for pipelined processing, while the 514 user I/O pins drive multiple parallel video buses at HD-SDI and 3G-SDI rates. According to the Arria GX datasheet, dedicated DDR2 controllers interface directly to external frame buffers, eliminating the need for a separate memory controller ASIC. The 3.125 Gbps transceivers also support SDI over fibre for studio camera links.
Recommended
Industrial Imaging Pipeline
Industrial machine vision systems use the EP1AGX50DF1152I4N for high-throughput image preprocessing, color space conversion, and feature extraction. The 50K logic elements implement real-time Bayer demosaicing and edge detection, while the embedded DSP blocks accelerate convolution and FFT operations. The 514 user I/O pins connect to multiple Camera Link or CoaXPress cameras, and the integrated transceivers drive gigabit Ethernet to factory networks. Industrial temperature grade (I4) and RoHS compliance suit factory floor deployment.
Recommended
ASIC Prototyping Platform
The EP1AGX50DF1152I4N serves as a high-density prototyping platform for ASIC designs targeting 100K-200K gate equivalent ASICs. The 50160 logic elements and abundant embedded memory map directly from ASIC RTL through standard synthesis flows, while the 514 user I/O pins expose ASIC I/O for functional testing. According to Altera application notes, the Quartus II design suite supports ASIC prototyping methodologies including design partitioning and time-domain multiplexing. Multiple EP1AGX50 devices can be combined on a prototyping board to validate multi-million-gate ASICs.
Recommended
Test and Measurement Instrumentation
The EP1AGX50DF1152I4N is used in high-end oscilloscopes, protocol analyzers, and arbitrary waveform generators where its combination of fast transceivers, DSP blocks, and large I/O count enables real-time signal processing. The 50K logic elements implement trigger logic and protocol decoders, the embedded DSP blocks run FFT-based spectrum analysis, and the 514 user I/O drive high-speed ADCs and DACs. The 1152-ball BGA provides the routing density required for analog signal integrity on mixed-signal PCBs.
Recommended
Recommended Products Summary
Engineering reference data for EP1AGX50DF1152I4N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1AGX50DF1152I6N | EP1AGX50DF1152C5N | EP1AGX50DF1152C4N | EP1AGX50DF1152C6N | EP1AGX50DF1152 |
|---|---|---|---|---|---|---|
| Package | 1152-ball FineLine BGA | 1152-ball FineLine BGA - same | 1152-ball FineLine BGA - same | 1152-ball FineLine BGA - same | 1152-ball FineLine BGA - same | 1152-ball FineLine BGA - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Speed Grade | I4 | I6 (faster) | C5 (commercial) | C4 (commercial, slowest) | C6 (commercial, fastest) | Generic - unspecified |
| Logic Elements | 50160 | 50160 | 50160 | 50160 | 50160 | 50160 |
| Embedded Memory | 2475072 bits | 2475072 bits | 2475072 bits | 2475072 bits | 2475072 bits | 2475072 bits |
| User I/O Pins | 514 | 514 | 514 | 514 | 514 | 514 |
| Transceiver Rate | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | Per speed grade specified at order |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
| 1-piece Price (USD) | 285.00 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Higher speed grade for tighter timing margins (vs EP1AGX50DF1152I6N)
- Lowest cost in the 1152-ball BGA family (vs EP1AGX50DF1152C4N)
- Industrial temperature range for harsh environments (vs EP1AGX50DF1152C5N)
Design Notes
The 1152-ball FineLine BGA requires a minimum of 10 PCB layers (12 recommended) for clean breakout and routing. Use a 1.0 mm or 1.27 mm ball pitch PCB footprint with microvia-in-pad technology for the inner rows. Maintain 90-ohm differential impedance for all 8 multi-gigabit transceiver channels; per Altera's AN 532 (Arria GX transceiver layout guidelines), trace length matching tolerance should be within 150 mil across a single channel pair. Decoupling capacitor placement: at least one 0.1uF MLCC per VCC pin, plus bulk decoupling (47uF to 220uF) on each power rail within 1 inch of the package.
Estimated: at typical operating conditions (room temperature, moderate toggle rate, 50% I/O usage) the EP1AGX50DF1152I4N consumes approximately 8-12 W from a 1.2 V core supply. Use a synchronous buck regulator with at least 15 A capacity and place it within 2 inches of the FPGA core supply pins. Multiple VCCINT and VCCIO power islands should be powered up in the sequence specified by Altera (typically 3.3 V -> 2.5 V -> 1.8 V -> 1.2 V with 1 ms to 100 ms delay between stages). Failure to follow the power sequencing can cause latch-up and permanent device damage.
Common pitfalls with Arria GX designs include: (1) omitting the external configuration memory or selecting the wrong mode (the EP1AGX50 requires a separate EPCS or enhanced configuration device for AS mode), (2) forgetting to instantiate the altgx megafunction in the Quartus II design before place-and-route will warn of unbound transceiver pins, (3) using LVDS channels without enabling the on-chip termination in the I/O assignment, and (4) not connecting the nCONFIG, nSTATUS, and CONF_DONE pins to the system reset circuit. According to Altera's Arria GX device handbook, all configuration status pins must be pulled up to 3.3 V with 10 kohm resistors to ensure reliable configuration.
Compliance Information
RoHS compliant and lead-free (N suffix). Industrial temperature grade (I4). NRND status. AEC-Q100 not applicable (this is an FPGA, not an automotive-grade IC).
