EP1C12F256I7N - Cyclone FPGA, 12K LEs, 256-BGA | Intel
Référence : EP1C12F256I7N ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $71.33 | $71,33 |
| 10 | $65.2 | $652,00 |
| 100 | $58.4 | $5 840,00 |
| 500 | $52.1 | $26 050,00 |
| 1 000 | $47.85 | $47 850,00 |
EP1C12F256I7N Présentation
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit that contains an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that can be re-programmed to implement arbitrary digital logic functions after manufacturing. FPGAs sit between fixed-function ASICs and software-driven processors in the design hierarchy: more flexible than ASICs, faster and more deterministic than general-purpose CPUs for parallel DSP and glue-logic tasks. Cyclone family FPGAs specifically target the low-cost, low-power end of the FPGA market for applications such as consumer electronics, industrial control, communications glue logic, and display interfaces.
Key features include 12,060 logic elements, 239,616 RAM bits organized into M4K memory blocks, two PLLs for clock management, and 185 user I/O pins supporting multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and PCI. The 256-pin FineLine BGA package offers high-density board integration while the industrial-grade -40°C to +100°C operating temperature range supports harsh-environment deployment.
Architecturally, the Cyclone device uses a 4-input look-up table (LUT) based logic element with embedded carry chain for arithmetic operations, distributed and block RAM for on-chip storage, and dedicated global clock networks with up to eight clock per quadrant. Configuration is typically loaded from a serial configuration device such as the EPCS4 or EPCS16 over an active serial interface.
Typical applications include industrial motor control and factory automation, video processing pipelines, protocol bridging between legacy and modern interfaces, software-defined radio front-end signal conditioning, and low-volume ASIC prototyping. The combination of high logic density and low unit cost also makes the part attractive for educational platforms and evaluation boards.
When designing with this part, plan for configuration memory requirements and select a serial configuration device sized to the bitstream. Use the Quartus II design software for synthesis, place-and-route, and timing closure - older versions of Quartus (10.0 to 13.0) are typically used because the Cyclone device family is mature and newer releases prioritize newer device families.
This page synthesizes distributor inventory, drop-in alternatives, and practical design considerations that engineers can use as a single reference, complementing the manufacturer datasheet with selection guidance and application context.
Alternatives de remplacement direct pour EP1C12F256I7N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1C12F256I7N (même facteur de forme et même empreinte) — différant par Package, Family, Process Technology, Operating Temperature, Speed Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1C12F256I7
✅ Remplacement direct✓ En stock
$49.95 / unité
Voir la fiche technique →EP1C12F256C7N
✅ Remplacement direct✓ En stock
$27.95 / unité
Voir la fiche technique →EP1C12F256C8N
✅ Remplacement direct✓ En stock
$15.1 / unité
Voir la fiche technique →EP1C12F256C6N
✅ Remplacement direct✓ En stock
$51.9 / unité
Voir la fiche technique →EP2C12F256I8N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP1C12F256I7N Valeurs maximales et caractéristiques électriques
| Family | Cyclone (EP1C12) |
| Logic Elements | 12,060 |
| Total RAM Bits | 239,616 |
| Embedded M4K RAM Blocks | 52 (128 x 36 bits each) |
| User I/O Pins | 185 |
| PLLs | 2 |
| Boîtier | 256-BGA FineLine |
| Température de fonctionnement | -40°C to +100°C (industrial) |
| Process Technology | 0.13 μm SRAM-based |
| Configuration Method | Active Serial (AS), Passive Serial (PS), JTAG |
| Supply Voltage (Core) | 1.5 V |
| I/O Standards Supported | LVTTL, LVCMOS, SSTL, LVDS, PCI |
| Type de montage | Surface Mount |
| Niveau MSL | 3 (168 hours) |
Guide de configuration des broches du EP1C12F256I7N 256-bga fineline
Configuration des broches du EP1C12F256I7N (boîtier 256-bga fineline). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP1C12F256I7N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP1C12F256I7N convient pour 6 applications: Industrial Motor Control, Video Processing Pipelines, Software-Defined Radio Front-End, Legacy Protocol Bridging, ASIC Prototyping and Emulation, Display and Panel Interface Controllers.
Industrial Motor Control
The EP1C12F256I7N's 12,060 logic elements and 185 user I/O pins support multi-axis industrial motor control loops where parallel logic implementation beats microcontrollers on determinism. The industrial -40°C to +100°C temperature grade lets the device sit directly on factory-floor control boards without thermal screening. Two on-chip PLLs generate the high-resolution PWM carrier clocks needed for field-oriented control of three-phase induction and permanent-magnet motors, while the 52 M4K blocks provide sufficient buffer space for encoder capture and current-sense sample tables. Engineers typically pair the FPGA with a dedicated microcontroller for command interface and use Quartus II to lock down deterministic interrupt latency for safety-critical control loops.
Recommandé
Video Processing Pipelines
The 239,616 bits of embedded RAM and 185 I/O pins make the EP1C12F256I7N suitable for mid-resolution video processing pipelines including de-interlacing, color space conversion, and on-screen display overlay. The device's LVDS I/O support allows direct connection to flat-panel display timing controllers without external serializer/deserializer chips. The two PLLs synthesize pixel clocks from any base oscillator, which simplifies BOM when supporting multiple display standards. Compared with software-only implementations on embedded processors, the FPGA delivers deterministic per-pixel latency, eliminating frame jitter in real-time video walls and broadcast auxiliary outputs.
Recommandé
Software-Defined Radio Front-End
The Cyclone architecture in EP1C12F256I7N provides the right logic density for software-defined radio digital down-conversion, FIR filtering, and demodulation stages operating on moderate-bandwidth IF signals. The 52 M4K RAM blocks implement FIFO buffers between the ADC interface and embedded soft-core processors such as the Nios II, while the 185 I/O pins accept parallel LVDS data from high-speed ADCs. PSRR performance and deterministic latency of FPGA fabric outperform general-purpose DSPs at fixed-point digital pre-distortion tasks. Designers typically combine the FPGA with a dedicated transceiver ADC and downstream DSP for baseband processing.
Recommandé
Legacy Protocol Bridging
The EP1C12F256I7N is widely deployed as a bus-bridging device between legacy parallel interfaces (PCI, ISA, VME) and modern serial protocols (UART, SPI, I2C, Ethernet). With 185 I/O pins the device can present multiple legacy bus widths simultaneously while the on-chip PLLs and 52 RAM blocks handle protocol conversion buffers. The 1.5 V core supply is compatible with 3.3 V and 5 V tolerant I/O when using LVCMOS standards with appropriate bus-keeper termination. This makes the Cyclone an efficient glue-logic replacement for several legacy interface ASICs that are no longer in production, extending the life of installed industrial and military equipment.
Recommandé
ASIC Prototyping and Emulation
The 12,060 logic elements, 52 M4K memory blocks, and 185 user I/O pins allow the EP1C12F256I7N to serve as a small-scale ASIC prototype platform for validation of mid-complexity digital designs. Designers map ASIC RTL into the FPGA using Quartus II synthesis, allowing functional verification at near-ASIC speed before committing to mask costs. The device is also widely used in university digital design labs and FPGA training curricula because of its mature toolchain support and low unit cost. For multi-FPGA partitioning of larger ASICs, multiple Cyclone devices can be cascaded using their LVDS I/O for chip-to-chip hand-off.
Recommandé
Display and Panel Interface Controllers
The 185 user I/O pins and embedded PLL blocks make the EP1C12F256I7N a cost-effective custom display timing controller for industrial LCD, OLED, and e-ink panels that lack standardized driver chips. Designers implement LVDS or TTL row/column drivers directly in the FPGA, generating accurate timing waveforms while using M4K RAM blocks to buffer partial-frame updates. The industrial temperature grade supports outdoor signage, kiosk, and in-vehicle display applications. Two on-chip PLLs synthesize the wide range of pixel clocks needed to support panels from small character displays through WUXGA resolutions without external clock generators.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1C12F256I7N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1C12F256I7 | EP1C12F256C7N | EP1C12F256C8N | EP1C12F256C6N | EP2C12F256I8N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-BGA FineLine | 256-BGA FineLine | 256-BGA FineLine | 256-BGA FineLine | 256-BGA FineLine | 256-BGA FineLine |
| Logic Elements | 12,060 | 12,060 | 12,060 | 12,060 | 12,060 | 12,060 |
| Total RAM Bits | 239,616 | 239,616 | 239,616 | 239,616 | 239,616 | 239,616 |
| User I/O | 185 | 185 | 185 | 185 | 185 | 185 |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) |
| Speed Grade | 7 (industrial) | 7 | 7 | 8 (slower) | 6 (faster) | 8 |
| Family / Generation | Cyclone (0.13 um) | Cyclone (0.13 um) | Cyclone (0.13 um) | Cyclone (0.13 um) | Cyclone (0.13 um) | Cyclone II (90 nm) |
| Lead-Free Finish | Yes (N suffix) | No (leaded) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) |
Principaux différenciateurs
- Highest user I/O count in the Cyclone family at this package (vs EP1C12Q240I7N)
- Industrial operating temperature range with lead-free finish (vs EP1C12F256C7N)
- Forward-migration drop-in to Cyclone II (vs EP2C12F256I8N)
Notes de conception
The EP1C12F256I7N requires a stable 1.5 V core supply with at least 1 A of current capacity for typical 12K-LE designs, plus 3.3 V for I/O banks and an auxiliary analog PLL supply (VCCA_PLL at 1.5 V). Use low-dropout regulators with input-to-output headroom of at least 0.5 V and place bulk decoupling capacitors (47 uF tantalum or polymer) within 25 mm of each power pin. Add 0.1 uF and 0.01 uF ceramic decoupling close to every VCCINT pin to suppress transient switching noise. Estimated: at 100% logic utilization and 100 MHz toggle rate, core current can reach 0.8-1.2 A; verify against Quartus II PowerPlay early in the design cycle.
The 256-BGA FineLine package uses 1.0 mm ball pitch and requires a multi-layer PCB (8+ layers recommended) with matched-length impedance control for high-speed LVDS pairs. Use microvia (laser-drilled) stack-up for inner-layer fan-out to keep escape routability manageable; through-hole vias under BGA balls are not recommended because the 1.0 mm pitch leaves insufficient antipad clearance. Provide at least one continuous GND plane directly under the BGA to control return-current paths for the high-pin-count I/O. Estimated: microvia BGA escape typically requires HDI (Any-Layer) stack-up costing $0.05-0.15 per cm^2 above standard 4-layer pricing.
Do not omit the configuration device: the EP1C12F256I7N has no internal flash and will not retain its bitstream through power cycles. Pair with an EPCS4 (4 Mbit) or EPCS16 (16 Mbit) serial configuration memory and wire MSEL pins correctly for Active Serial mode. The CONF_DONE, nCONFIG, and nSTATUS pins require 10 kohm pull-ups to 3.3 V; missing pull-ups are the most common reason boards fail to configure. Additionally, all unused I/O pins should be left floating or driven to a defined logic level - never tie them to VCC or GND directly through low-impedance paths. Power-on ramp sequencing must satisfy the Cyclone tRAMP specification of 100 us to 100 ms.
Although the industrial -40C to +100C specification refers to ambient operating range, the silicon junction temperature must remain below 125C. Estimated: at maximum toggle activity the EP1C12F256I7N dissipates approximately 0.8-1.2 W, and the BGA package theta_JA is approximately 18 C/W on a JEDEC 4-layer test board, giving a junction rise of ~15-22C above ambient. Place a thermal via array under the center BGA balls (which are internally bonded to GND) to provide a low-resistance thermal path to the inner ground plane. Forced airflow is not required at typical toggle rates but is recommended if the design approaches 100% LUT utilization.
Route each PLL's analog VCCA_PLL pin through a ferrite bead or LC filter from the digital 1.5 V supply, with 0.1 uF and 0.01 uF decoupling placed within 5 mm of the pin. Keep clock input traces short (<25 mm) and surrounded by ground guard traces to minimize jitter injection. Differential clock pairs (LVDS) must be length-matched within 0.13 mm (5 mil) to preserve duty cycle. Use Quartus II Pin Planner to assign clock inputs to dedicated CLK pins (not regular I/O) - non-clock pins cannot feed the global clock network and will introduce unacceptable skew into multi-MHz designs.
Informations de conformité
Lead-free (N suffix) per Altera/Intel part numbering convention. RoHS compliance inferred from N suffix designation; exact certificate of compliance should be requested from Intel. Halogen-free status not explicitly stated in available documentation.
