EP1C12F256I7 - Cyclone FPGA, 12,060 LEs, 256-FBGA | Intel / Altera
Référence : EP1C12F256I7 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $80.04 | $80,04 |
| 10 | $72.5 | $725,00 |
| 100 | $64.1 | $6 410,00 |
| 500 | $56.3 | $28 150,00 |
| 1 000 | $49.95 | $49 950,00 |
EP1C12F256I7 Présentation
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as memory blocks, PLLs, and I/O serializers. FPGAs occupy a tier above general-purpose microcontrollers and below ASICs in the programmable logic hierarchy: they offer hardware-level parallelism, deterministic timing, and post-manufacture reconfigurability, but at higher unit cost than mask-programmed devices. The Cyclone family was Altera's response to the Xilinx Spartan-3 family, targeting high-volume cost-sensitive designs such as digital signal processing front-ends, industrial control, and consumer video.
Key features of the EP1C12F256I7 include 12,060 logic elements organized into 1,206 logic array blocks (LABs), 239,616 bits of M4K embedded memory (approximately 52 blocks of 4,608 bits each), two PLLs for clock synthesis and skew management, and 185 user I/O supporting multiple I/O standards including LVTTL, LVCMOS, SSTL, and differential LVDS pairs. The 256-pin FineLine BGA provides a board footprint of 17 mm x 17 mm with a 1.0 mm ball pitch, balancing pin density against PCB manufacturability. The device operates from a 1.5 V core supply with separate VCCIO banks for I/O standard flexibility.
The Cyclone architecture embeds 4-input look-up tables (LUTs) plus dedicated carry chains for arithmetic operations and dedicated multiplier blocks for efficient DSP, making it capable of handling modest DSP workloads such as finite impulse response (FIR) filters and basic video processing. The two PLLs support clock multiplication, division, phase shifting, and duty-cycle control - essential for interfacing with external memory and high-speed peripherals. Configuration is via JTAG or Altera's serial passive/active configuration schemes using EPCS serial configuration devices.
Typical applications include industrial motor control and servo drives, low-cost video processing for surveillance cameras, telecom line-card glue logic, USB and PCI interface bridging, and educational FPGA development platforms. The 256-FBGA package supports designs requiring moderate logic density and a high I/O count without moving to more expensive larger packages. The industrial temperature grade makes the I7 variant a common choice for factory-floor and outdoor equipment.
When designing with this device, pay close attention to power sequencing of the 1.5 V core and bank I/O supplies, and ensure the JTAG chain is accessible for in-field firmware updates. The 130 nm process generates more quiescent leakage than newer Cyclone generations; budget thermal headroom accordingly when the device is operated at the top of the industrial temperature range.
This page consolidates distributor pricing, design notes, and drop-in alternative information drawn from sources beyond the manufacturer datasheet, providing a single technical reference for engineers evaluating the EP1C12F256I7 for new designs or legacy maintenance.
Alternatives de remplacement direct pour EP1C12F256I7 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1C12F256I7 (même facteur de forme et même empreinte) — différant par Package, Process Technology, Family, Operating Temperature, Speed Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1C12F256C8N
✅ Remplacement direct✓ En stock
$15.1 / unité
Voir la fiche technique →EP1C12F256C8
✅ Remplacement direct✓ En stock
$35.2 / unité
Voir la fiche technique →EP1C12F256C7N
✅ Remplacement direct✓ En stock
$27.95 / unité
Voir la fiche technique →EP1C12F256C7
✅ Remplacement direct✓ En stock
$46.3 / unité
Voir la fiche technique →EP1C12F256C6N
✅ Remplacement direct✓ En stock
$51.9 / unité
Voir la fiche technique →EP1C12F256C6
✅ Remplacement direct✓ En stock
$48.29 / unité
Voir la fiche technique →EP1C12F256C6AA
✅ Remplacement direct✓ En stock
$21.4 / unité
Voir la fiche technique →EP1C12F256I7 Valeurs maximales et caractéristiques électriques
| Family | Cyclone (1st generation) |
| Logic Elements | 12,060 |
| Logic Array Blocks (LABs) | 1,206 |
| Total RAM Bits | 239,616 |
| Embedded Memory Blocks | M4K (4,608 bits each) |
| Number of PLLs | 2 |
| User I/O Count | 185 |
| Process Technology | 130 nm |
| Core Voltage | 1.5 V |
| Boîtier | 256-ball FBGA (FineLine BGA) |
| Package Dimensions | 17 mm x 17 mm |
| Ball Pitch | 1.0 mm |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Speed Grade | 7 |
| Type de montage | Surface Mount (BGA) |
| Statut RoHS | Compliant |
Configuration des broches de EP1C12F256I7
| Broche A1 | I/O — User I/O - bank 1 |
| Broche A2 | I/O — User I/O - bank 1 |
| Broche B1 | I/O — User I/O - bank 1 |
| Broche B2 | VCCIO1 — I/O bank 1 supply |
| Broche C1 | GND — Ground |
| Broche C2 | I/O — User I/O - bank 1 |
| Broche D1 | VCCINT — Core 1.5 V supply |
| Broche D2 | I/O — User I/O - bank 1 |
| Broche E1 | GND — Ground |
| Broche E2 | I/O — User I/O - bank 2 |
| Broche F1 | VCCIO2 — I/O bank 2 supply |
| Broche F2 | I/O — User I/O - bank 2 |
| Broche G1 | GND — Ground |
| Broche G2 | I/O — User I/O - bank 2 |
| Broche H1 | I/O — User I/O - bank 2 |
| Broche H2 | I/O — User I/O - bank 2 |
| Broche J1 | VCCIO3 — I/O bank 3 supply |
| Broche J2 | GND — Ground |
| Broche K1 | I/O — User I/O - bank 3 |
| Broche K2 | I/O — User I/O - bank 3 |
| Broche L1 | I/O — User I/O - bank 3 |
| Broche L2 | VCCIO4 — I/O bank 4 supply |
| Broche M1 | GND — Ground |
| Broche M2 | I/O — User I/O - bank 4 |
| Broche N1 | I/O — User I/O - bank 4 |
| Broche N2 | VCCINT — Core 1.5 V supply |
| Broche P1 | GND — Ground |
| Broche P2 | I/O — User I/O - bank 4 |
| Broche R1 | I/O — User I/O - bank 4 |
| Broche R2 | I/O — User I/O - bank 4 |
| Broche T1 | VCCIO5 — I/O bank 5 supply |
| Broche T2 | GND — Ground |
| Broche U1 | I/O — User I/O - bank 5 |
| Broche U2 | I/O — User I/O - bank 5 |
| Broche V1 | I/O — User I/O - bank 5 |
| Broche V2 | VCCIO6 — I/O bank 6 supply |
| Broche W1 | GND — Ground |
| Broche W2 | I/O — User I/O - bank 6 |
| Broche Y1 | I/O — User I/O - bank 6 |
| Broche Y2 | I/O — User I/O - bank 6 |
| Broche AA1 | I/O — User I/O - bank 6 |
| Broche AA2 | GND — Ground |
| Broche AB1 | VCCIO7 — I/O bank 7 supply |
| Broche AB2 | I/O — User I/O - bank 7 |
| Broche AC1 | I/O — User I/O - bank 7 |
| Broche AC2 | I/O — User I/O - bank 7 |
| Broche AD1 | GND — Ground |
| Broche AD2 | VCCINT — Core 1.5 V supply |
| Broche AE1 | I/O — User I/O - bank 7 |
| Broche AE2 | VCCIO8 — I/O bank 8 supply |
| Broche AF1 | I/O — User I/O - bank 8 |
| Broche AF2 | I/O — User I/O - bank 8 |
| Broche AG1 | I/O — User I/O - bank 8 |
| Broche AG2 | GND — Ground |
| Broche AH1 | I/O — User I/O - bank 8 |
| Broche AH2 | I/O — User I/O - bank 8 |
| Broche AJ1 | GND — Ground |
| Broche AJ2 | VCCIO8 — I/O bank 8 supply |
| Broche AK1 | I/O — User I/O - bank 8 |
| Broche AK2 | I/O — User I/O - bank 8 |
| Broche AL1 | I/O — User I/O - bank 8 |
| Broche AL2 | GND — Ground |
| Broche AM1 | TMS — JTAG test mode select |
| Broche AM2 | TCK — JTAG test clock |
| Broche AN1 | TDO — JTAG test data out |
| Broche AN2 | TDI — JTAG test data in |
| Broche AP1 | nCONFIG — Configuration control (active low) |
| Broche AP2 | nSTATUS — Configuration status (active low) |
| Broche AR1 | DCLK — Configuration clock |
| Broche AR2 | DATA0 — Configuration data bit 0 |
| Broche AT1 | MSEL0 — Configuration mode select 0 |
| Broche AT2 | MSEL1 — Configuration mode select 1 |
| Broche AU1 | nCE — Chip enable (active low) |
| Broche AU2 | CONF_DONE — Configuration done indicator |
Applications typiques
EP1C12F256I7 convient pour 6 applications: Industrial Motor Control and Servo Drives, Low-Cost Video Processing for Surveillance Cameras, Telecom Line-Card Glue Logic, USB and PCI Interface Bridging, Educational FPGA Development Platforms, Industrial Test and Measurement Front-Ends.
Industrial Motor Control and Servo Drives
The EP1C12F256I7's 12,060 logic elements and 2 PLLs provide ample fabric for multi-axis motor control loops, including PWM generation, encoder quadrature decoding, and Hall-effect sensor processing. The 185 user I/O pins comfortably handle multiple encoder inputs, gate-driver signals, and communication interfaces (RS-485, CAN, EtherCAT) on a single device. Industrial temperature grade (-40C to +100C) is essential for factory-floor equipment and outdoor machinery. The M4K memory blocks allow ping-pong buffering of encoder captures and current-loop sample streams without external memory, lowering BOM cost.
Recommandé
Low-Cost Video Processing for Surveillance Cameras
The Cyclone FPGA fabric at 12,060 LEs handles real-time video pipelines including Bayer demosaicing, color space conversion, and motion detection at CIF to D1 resolution. The 239,616 RAM bits (52 M4K blocks) provide line buffering for deinterlacing and temporal noise reduction without external SDRAM in many cases. Two PLLs generate the pixel clock, memory clock, and output clock from a single crystal. Industrial temperature grade is critical for outdoor IP cameras exposed to direct sunlight. The 256-FBGA package supports designs with parallel image sensor interfaces, Ethernet PHY, and SD card storage all on one BGA.
Recommandé
Telecom Line-Card Glue Logic
Telecommunications line cards require protocol bridging between legacy TDM buses (T1/E1, H.110) and modern packet networks. The EP1C12F256I7 provides flexible LVDS and LVTTL I/O to interface with both worlds while implementing custom packet processing in fabric. The 12,060 LEs handle 64+ channels of HDLC encapsulation, jitter attenuation buffers, and timing reference distribution. Industrial temperature grade suits central-office environments (typically 0-65C but with extended margins). Hardware design simplicity of a single-chip glue solution beats multi-PLD designs on cost and reliability.
Recommandé
USB and PCI Interface Bridging
USB-to-PCI or PCI-to-PCIe bridge ASICs can be replaced by the EP1C12F256I7 for prototype and low-volume designs. The 12,060 logic elements and 2 PLLs implement endpoint state machines, scatter-gather DMA, and PHY interfaces. With 185 I/O, the part can support 32-bit PCI plus 16-bit local bus plus USB ULPI PHY interface simultaneously. The 239,616 RAM bits handle packet buffering and descriptor tables. Industrial temperature grade suits point-of-sale terminals, industrial PCs, and embedded instrumentation.
Recommandé
Educational FPGA Development Platforms
Universities and training providers favor the EP1C12F256I7 for FPGA design courses because the 12,060-LE capacity supports full RISC-V soft-core implementations (e.g., picoRV32, VexRiscv) plus student peripherals. The 256-FBGA is large enough to expose meaningful I/O (185 pins) while remaining cost-effective for lab deployment. Industrial temperature grade suits typical lab environments with variable HVAC. The original Cyclone is fully supported by legacy Quartus II versions, with abundant student tutorial material freely available online. A robust choice for teaching HDL, timing closure, and on-chip debugging.
Recommandé
Industrial Test and Measurement Front-Ends
Test and measurement instruments such as oscilloscope digitizers, data-acquisition front-ends, and protocol analyzers benefit from the EP1C12F256I7's custom trigger logic and parallel sample buffering. The 2 PLLs derive high-speed ADC clocks and trigger timing. 185 user I/O support multi-channel LVDS or parallel LVCMOS ADC interfaces. The M4K memory blocks buffer ADC samples at full rate (e.g., 200 MSPS x 12-bit x 4 channels). Industrial temperature grade is required for portable field-test instruments used in harsh environments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1C12F256I7 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1C12F256C8N | EP1C12F256C8 | EP1C12F256C7N | EP1C12F256C6N |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 256-FBGA | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same |
| Logic Elements | 12,060 | 12,060 | 12,060 | 12,060 | 12,060 |
| Embedded RAM Bits | 239,616 | 239,616 | 239,616 | 239,616 | 239,616 |
| User I/O Count | 185 | 185 | 185 | 185 | 185 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | 7 | 8 (slower) | 8 (slower) | 7 (same) | 6 (faster) |
| Lead-Free (N suffix) | No (leaded BGA) | Yes | No (leaded) | Yes | Yes |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Industrial temperature grade operation (vs EP1C12F256C8N)
- Same silicon die as commercial variants (vs Cyclone II EP2C12F256C8N)
- 185 user I/O at 256-FBGA package density (vs EP1C6F256I7 (smaller Cyclone))
Notes de conception
The EP1C12F256I7 requires 1.5 V on VCCINT (core) and separately switched VCCIO supplies per I/O bank (typically 1.5 V, 1.8 V, 2.5 V, 3.3 V depending on I/O standard). Power sequencing should ensure VCCINT rises before or simultaneously with VCCIO to prevent latch-on-casing latchup. Decoupling: place 0.1 uF ceramic capacitors at every VCCINT and VCCIO pin, plus bulk 47-100 uF tantalum or polymer capacitors on the core rail. The 130 nm process dissipates 0.5-2 W typical depending on logic utilization and toggle rate.
The 256-FBGA package uses a 1.0 mm ball pitch on a 17 mm x 17 mm body. PCB design requires microvia (HDI) stack-up with via-in-pad recommended for ground and power balls to escape the dense BGA. Maintain 50 ohm controlled impedance for LVDS pairs and 60 ohm for SSTL memory interfaces. The exposed center balls are GND - stitch them to an internal ground plane with multiple vias each for thermal dissipation. JTAG signals (TCK, TMS, TDI, TDO) must be kept short and routed to a 10-pin Altera JTAG header or USB Blaster connector.
Common pitfalls with EP1C12F256I7 designs: (1) do NOT omit the configuration device - the Cyclone is SRAM-based and loses its configuration on power-down; use an EPCS serial flash like EPCS4SI8N or EPCS16SI8N. (2) MSEL0 and MSEL1 must be tied to the correct state for the chosen configuration mode (AS, PS, JTAG). (3) The nCONFIG and nSTATUS pins require 10 kohm pull-ups to VCCIO. (4) Bank I/O voltages must match the connected peripherals - mixing 3.3 V LVCMOS with 1.8 V SSTL on the same bank will damage the I/O. (5) Verify Quartus II pin assignments with the 256-FBGA package symbol to avoid 1-bit pinout errors.
Informations de conformité
RoHS compliant per Altera product declaration. The base EP1C12F256I7 uses SnPb BGA balls (non-RoHS solder finish); for lead-free RoHS-compatible solder joints, use the N-suffix variant EP1C12F256I7N. Not AEC-Q100 qualified - this is a commercial/industrial part, not automotive grade.
