EP1C6F256I7L - Cyclone FPGA, 5,980 LEs, 256-BGA | Intel / Altera
Référence : EP1C6F256I7L ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $41.93 | $41,93 |
| 10 | $39.8 | $398,00 |
| 100 | $35.5 | $3 550,00 |
| 500 | $31.2 | $15 600,00 |
| 1 000 | $27.4 | $27 400,00 |
EP1C6F256I7L Présentation
A Field Programmable Gate Array (FPGA) is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware blocks (memory, multipliers, PLLs, I/O) that engineers can re-program after manufacture. FPGAs sit between fixed-function ASICs (lowest per-unit cost, no flexibility) and microcontrollers (sequential, lower throughput) in the digital design hierarchy: FPGA -> programmable logic -> digital IC -> semiconductor. They are used when parallel processing, deterministic latency, or hardware-level customization is required. Cyclone was Altera's first low-cost FPGA family, intended to displace ASICs in glue-logic, bridging, and DSP-front-end designs.
Key features of the EP1C6F256I7L include 20 M4K embedded RAM blocks (each 4 Kbit, true dual-port, with parity), 2 embedded PLLs with clock-multiplication and phase-shift capability, and support for external memory interfaces including DDR SDRAM and QDR SRAM via dedicated DQS pins. The device supports single-ended I/O standards (LVTTL, LVCMOS, PCI, SSTL, HSTL) on most pins and LVDS up to 303 Mbps on designated pairs. Configuration is via passive serial (PS), active serial (AS), or JTAG.
Typical applications for the EP1C6F256I7L span industrial control boards, video frame buffers, protocol bridging (I2C/SPI to UART/GPIO), motor-control pre-processing, and low-density DSP front-ends. Its 256-FBGA package and 1.5 V core provide a balanced cost / integration point for designs that exceed CPLD capacity but do not justify a Cyclone II / III / IV migration. Designers should budget at least one configuration flash (e.g., EPCS4) and a JTAG header for in-system programming. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour EP1C6F256I7L — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1C6F256I7L (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Operating Temperature, Process Technology, Family.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1C6F256I7
✅ Remplacement direct✓ En stock
$23.8 / unité
Voir la fiche technique →EP1C6F256C8N
✅ Remplacement direct✓ En stock
$21.4 / unité
Voir la fiche technique →EP1C6F256C7N
✅ Remplacement direct✓ En stock
$18.2 / unité
Voir la fiche technique →EP1C6F256C6N
✅ Remplacement direct✓ En stock
$21.8 / unité
Voir la fiche technique →EP1C12F256I7N
✅ Remplacement direct✓ En stock
$47.85 / unité
Voir la fiche technique →EP1C20F256I7N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP4CE6F256I7N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP1C6F256I7L Valeurs maximales et caractéristiques électriques
| Family | Cyclone |
| Logic Elements | 5,980 |
| Total RAM Bits | 92,160 |
| Embedded Memory Blocks | 20 M4K blocks (4 Kbit each) |
| User I/Os | 185 |
| PLLs | 2 |
| Boîtier | 256-BGA (FBGA, 17x17 mm, 1.0 mm pitch) |
| Process Technology | 0.13 µm SRAM |
| Core Voltage | 1.5 V |
| Speed Grade | I7 (-7, industrial) |
| Température de jonction en fonctionnement | -40C to +100C |
| Configuration Modes | Passive Serial, Active Serial, JTAG |
| External Memory Support | DDR SDRAM, QDR SRAM, FCRAM |
| I/O Standards | LVTTL, LVCMOS, PCI, SSTL, HSTL, LVDS |
| Lead-Free Finish | Yes (L suffix) |
| Statut RoHS | Compliant |
Guide de configuration des broches du EP1C6F256I7L 256-bga (fbga, 17x17 mm, 1.0 mm pitch)
Configuration des broches du EP1C6F256I7L (boîtier 256-bga (fbga, 17x17 mm, 1.0 mm pitch)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP1C6F256I7L.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP1C6F256I7L convient pour 6 applications: Industrial Control & Glue Logic, Video Frame Buffer / Display Bridging, Protocol Bridging (I2C/SPI to UART/GPIO/MIPI), Motor Control Pre-Processing, Test & Measurement Instrumentation Front-End, Low-Density DSP / Pre-Processing Front-End.
Industrial Control & Glue Logic
The EP1C6F256I7L's 5,980 LEs and 185 user I/Os make it well-suited to industrial PLC backplanes where it consolidates multiple discrete logic functions into a single reconfigurable device. Industrial temperature rating (junction -40C to +100C) and lead-free 256-BGA finish meet factory-floor reliability requirements. Placed alongside a microcontroller, the Cyclone handles custom peripheral interfaces, encoder decoding, and pulse-train generation in parallel, offloading deterministic real-time tasks from the MCU. Designers typically instantiate ALTPLL for motor-control clock generation and SOPC Builder for Nios II soft-core integration when logic capacity permits.
Recommandé
Video Frame Buffer / Display Bridging
With 92 Kbit of M4K RAM (20 dual-port blocks) and DDR-SDRAM support via dedicated DQS pins, the EP1C6F256I7L can buffer video frames between sensors and LCD controllers in mid-resolution applications. The 256-BGA package exposes sufficient LVDS pairs for parallel RGB or BT.656 inputs, while ALTMEMPHY megafunctions handle DDR line-rate transfers up to 133 MHz. Compared to a CPLD, the Cyclone offers far larger FIFOs and full RGB-to-LVDS conversion without external glue logic, reducing board area and BOM cost. Quartus II video IP (VIP) simplifies color-space conversion and chroma resampling.
Recommandé
Protocol Bridging (I2C/SPI to UART/GPIO/MIPI)
Engineers use the EP1C6F256I7L as a hardware-protocol bridge when off-the-shelf ICs cannot connect legacy and modern peripherals. Its 185 I/Os easily accommodate multi-master I2C, quad SPI, UART, and GPIO fan-out in a single device, while the two PLLs derive independent baud-rate clocks. The Cyclone's parallel fabric outperforms microcontroller bit-banging by 10x-100x for throughput-bound tasks such as SPI-to-parallel camera capture. Industrial temperature rating suits automotive aftermarket and factory sensor hubs.
Recommandé
Motor Control Pre-Processing
The EP1C6F256I7L handles encoder quadrature decoding, Hall-sensor commutation, and PWM generation ahead of a microcontroller or DSP in servo and stepper drive systems. Two PLLs multiply a low-frequency crystal to the PWM carrier frequency and provide phase-shifted clocks for three-phase inverter timing. 185 I/Os support multi-axis drives with parallel feedback. The 100C industrial junction temperature and lead-free BGA finish withstand drive-cabinet thermal environments where convection cooling is limited.
Recommandé
Test & Measurement Instrumentation Front-End
In bench instruments and data-acquisition modules, the EP1C6F256I7L acts as a programmable timing generator, trigger router, and signal-conditioning matrix. Its 92 Kbit M4K RAM captures pre-trigger samples, while 185 I/Os route multiple analog-front-end channels to an ADC. LVDS support up to 303 Mbps simplifies connection to high-speed ADCs. Compared to discrete 74-series logic, the Cyclone shrinks a typical trigger-and-timing board from 8-12 ICs to 1, improving cost and reliability. Quartus II SignalTap II provides on-chip logic-analyzer visibility.
Recommandé
Low-Density DSP / Pre-Processing Front-End
Before a dedicated DSP or ARM processor takes over, the EP1C6F256I7L can perform FIR filtering, FFT pre-processing, and sample-rate conversion in parallel hardware. Its 92 Kbit of dual-port RAM holds FFT twiddle factors and overlap-save buffers, while 185 I/Os connect to parallel ADC buses. Engineers typically use the ALTMULT_ADD and ALTMULT_ACCUM megafunctions for fixed-point MAC operations, achieving 16-bit MAC throughputs of several hundred MSPS at I7 speed grade. This front-end pattern is common in SDR, audio processing, and vibration-analysis modules.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1C6F256I7L — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1C6F256I7 | EP1C6F256C8N | EP1C12F256I7N | EP1C20F256I7N | EP4CE6F256I7N |
|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | 256-BGA (FBGA, 17x17 mm) | 256-BGA (FBGA) - same | 256-BGA (FBGA) - same | 256-BGA (FBGA) - same | 256-BGA (FBGA) - same | 256-BGA (FBGA) - same |
| Logic Elements | 5,980 | 5,980 (same die) | 5,980 (same die) | 12,060 | 20,060 | 6,272 (Cyclone IV E) |
| Total RAM Bits | 92,160 | 92,160 | 92,160 | 239,616 | 294,912 | 270,000 |
| User I/Os | 185 | 185 | 185 | 185 | 185 | 179 |
| PLLs | 2 | 2 | 2 | 2 | 2 | 4 |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | -40C to +100C (industrial) | -40C to +100C (industrial) | -40C to +100C (industrial) |
| Speed Grade | I7 (mid) | I7 | C8 (slower) | I7 | I7 | I7 |
| Ball Finish | Lead-free (Pb-free) | Tin-lead (SnPb) | Lead-free | Lead-free | Lead-free | Lead-free |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.2 V |
Principaux différenciateurs
- Pb-free lead-free finish in 256-BGA (vs EP1C6F256I7)
- Industrial temperature grade with I7 speed (vs EP1C6F256C8N)
- Mid-density Cyclone with 185 user I/Os (vs EP1C12F256I7N)
Notes de conception
Estimated: at typical utilization (60% LE, 50% RAM, 2 PLLs, 100 MHz) the EP1C6F256I7L core draws approximately 200-350 mA from VCCINT (1.5 V), plus I/O bank current scaled by switching frequency. The 256-BGA requires a low-impedance power plane for VCCINT (1.5 V), VCCIO (per-bank, 1.5/1.8/2.5/3.3 V), and PLL analog supply. Decouple each of the four VCCIO banks with 0.1 µF and 10 µF ceramic caps within 5 mm of the BGA balls; place 1.0 µF and 0.1 µF caps directly on VCCINT and VCCA_PLL balls.
The 256-BGA at 1.0 mm pitch requires 4-6 layer PCB with via-in-pad or microvia fan-out. Recommended stack-up: signal + GND + power + GND + signal, with continuous GND plane under the BGA. Matched-length trace tuning for DDR and LVDS is essential; use the Quartus II TimeQuest timing analyzer with board IBIS models. Expose TDI/TDO/TMS/TCK balls to a JTAG header for in-system programming; expose MSEL[2:0] balls to set the configuration mode (00=AS, 01=PS, 10=JTAG-only, 11=fast AS).
Do not attempt to migrate an EP1C6F256I7L board to a Cyclone IV E (EP4CE6F256) by simple part substitution without re-running Quartus timing closure: the core voltage changes from 1.5 V to 1.2 V, the PLL parameters differ, and a few configuration pins have moved. Also avoid substituting the EP1C6F256I7 (tin-lead) onto a board designed for the L (lead-free) without checking reflow profile compatibility. Always regenerate configuration data when changing speed grade (I7 vs C8) since timing paths re-balance.
Informations de conformité
L suffix confirms lead-free (Pb-free) finish for RoHS assembly. Halogen-free status not stated in available data - verified data marked [DATA_NEEDED: halogen-free]. AEC-Q100 not applicable (FPGA, not an automotive-qualified analog IC).
