EP1C12F324C8 - Cyclone FPGA, 12060 LEs, 324-BGA | Intel
Référence : EP1C12F324C8 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $28.9 | $2 890,00 |
| 500 | $24.75 | $12 375,00 |
| 1 000 | $21.5 | $21 500,00 |
EP1C12F324C8 Présentation
A Field-Programmable Gate Array (FPGA) is a programmable logic device that allows engineers to implement arbitrary digital logic functions after PCB fabrication, sitting within the broader taxonomy of programmable logic -> logic ICs -> integrated circuits -> semiconductors. Unlike fixed-function ASICs, Cyclone FPGAs contain a matrix of configurable logic blocks (LABs), embedded memory blocks, PLLs, and programmable interconnect that can be rewritten in-circuit via a configuration bitstream loaded from external Flash or through JTAG.
Key features of the EP1C12F324C8 include 12,060 logic elements, 239,616 bits of embedded SRAM (M4K blocks), two PLLs for clock management, support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and PCI, and a core voltage of 1.5 V with I/O voltages up to 3.3 V. The device operates across the commercial 0C to +85C temperature range (C8 speed grade), with C8 denoting a specific timing closure bin of approximately 275 MHz internal performance.
Architecturally, the EP1C12F324C8 uses SRAM-based configuration cells requiring external configuration memory, distinguishing it from one-time-programmable (OTP) antifuse or flash-based FPGAs. The 130 nm process node balances cost and performance for high-volume applications, and the device supports Altera's Quartus II design software (legacy) for synthesis, place-and-route, and timing analysis.
Typical applications include industrial motor control, video processing pipelines, telecommunications line cards, low-cost ASIC prototyping, and consumer electronics requiring moderate logic density with flexible I/O. Engineers choose Cyclone I when cost-per-logic-element is the primary constraint and 130 nm performance is sufficient.
When designing with this FPGA, verify that your Quartus II tool version supports the EP1C12 device family and that your configuration memory (EPCS1/EPCS4 or compatible) matches the chosen configuration scheme. The FBGA-324 package requires careful PCB layout with matched-length impedance-controlled traces for DDR/LVDS interfaces.
This page synthesizes Intel/Altera datasheet specifications, distributor pricing, drop-in same-package alternatives from the Cyclone I family, and practical PCB/thermal design guidance not consolidated in the original datasheet.
Alternatives de remplacement direct pour EP1C12F324C8 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1C12F324C8 (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Speed Grade, Process Technology, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1C12F324C8N
✅ Remplacement direct✓ En stock
$51.75 / unité
Voir la fiche technique →EP1C12F324C7N
✅ Remplacement direct✓ En stock
$37.2 / unité
Voir la fiche technique →EP1C12F324C6N
✅ Remplacement direct✓ En stock
$22.1 / unité
Voir la fiche technique →EP1C12F324C7
✅ Remplacement direct✓ En stock
$40.26 / unité
Voir la fiche technique →EP1C12F324C6AA
✅ Remplacement direct✓ En stock
$36.9 / unité
Voir la fiche technique →EP1C12F324C6AA
✅ Remplacement direct✓ En stock
$36.9 / unité
Voir la fiche technique →EP1C12F324C8 Valeurs maximales et caractéristiques électriques
| Series | Cyclone |
| Family | Cyclone I (EP1C12) |
| Manufacturer | Intel (formerly Altera) |
| Process Technology | 130 nm CMOS |
| Number of Logic Elements (LEs) | 12060 |
| Number of LABs/CLBs | 1206 |
| Total Embedded Memory | 239616 bits |
| Number of I/O Pins | 249 |
| Boîtier | 324-FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch |
| Core Voltage | 1.5 V |
| I/O Voltage | Up to 3.3 V (LVTTL/LVCMOS/SSTL/LVDS/PCI) |
| Number of PLLs | 2 |
| Maximum Internal Clock Frequency | 275 MHz (C8 speed grade) |
| Speed Grade | C8 (commercial, slowest speed bin) |
| Température de fonctionnement | 0C to +85C (commercial) |
| Configuration Method | SRAM-based, external configuration device (EPCS series) |
| Type de montage | Surface Mount (BGA) |
| Statut RoHS | Compliant (per DigiKey listing) |
| Lead-Free | Yes |
Configuration des broches de EP1C12F324C8
| Broche A1 | I/O — General purpose user I/O, bank 1 |
| Broche A2 | I/O — General purpose user I/O, bank 1 |
| Broche A3 | I/O — General purpose user I/O, bank 1 |
| Broche A4 | VCCIO1 — I/O bank 1 voltage supply (3.3 V max) |
| Broche A5 | I/O — General purpose user I/O, bank 1 |
| Broche A6 | I/O — General purpose user I/O, bank 1 |
| Broche B1 | I/O — General purpose user I/O, bank 2 |
| Broche B2 | GND — Ground reference |
| Broche B3 | I/O — General purpose user I/O, bank 1 |
| Broche B4 | I/O — General purpose user I/O, bank 1 |
| Broche B5 | GND — Ground reference |
| Broche B6 | I/O — General purpose user I/O, bank 1 |
| Broche C1 | I/O — General purpose user I/O, bank 2 |
| Broche C2 | I/O — General purpose user I/O, bank 2 |
| Broche C3 | VCCINT — Core voltage supply (1.5 V) |
| Broche C4 | I/O — General purpose user I/O, bank 1 |
| Broche C5 | I/O — General purpose user I/O, bank 1 |
| Broche C6 | I/O — General purpose user I/O, bank 1 |
| Broche D1 | I/O — General purpose user I/O, bank 2 |
| Broche D2 | I/O — General purpose user I/O, bank 2 |
| Broche D3 | GND — Ground reference |
| Broche D4 | I/O — General purpose user I/O, bank 1 |
| Broche D5 | VCCIO1 — I/O bank 1 voltage supply |
| Broche D6 | I/O — General purpose user I/O, bank 1 |
| Broche E1 | I/O — General purpose user I/O, bank 2 |
| Broche E2 | I/O — General purpose user I/O, bank 2 |
| Broche E3 | I/O — General purpose user I/O, bank 2 |
| Broche E4 | VCCINT — Core voltage supply (1.5 V) |
| Broche E5 | I/O — General purpose user I/O, bank 1 |
| Broche E6 | I/O — General purpose user I/O, bank 1 |
| Broche F1 | I/O — General purpose user I/O, bank 2 |
| Broche F2 | GND — Ground reference |
| Broche F3 | I/O — General purpose user I/O, bank 2 |
| Broche F4 | I/O — General purpose user I/O, bank 1 |
| Broche F5 | GND — Ground reference |
| Broche F6 | I/O — General purpose user I/O, bank 1 |
| Broche G1 | I/O — General purpose user I/O, bank 2 |
| Broche G2 | I/O — General purpose user I/O, bank 2 |
| Broche G3 | VCCIO2 — I/O bank 2 voltage supply |
| Broche G4 | I/O — General purpose user I/O, bank 2 |
| Broche G5 | I/O — General purpose user I/O, bank 2 |
| Broche G6 | I/O — General purpose user I/O, bank 2 |
| Broche H1 | I/O — General purpose user I/O, bank 3 |
| Broche H2 | I/O — General purpose user I/O, bank 3 |
| Broche H3 | GND — Ground reference |
| Broche H4 | I/O — General purpose user I/O, bank 2 |
| Broche H5 | VCCINT — Core voltage supply (1.5 V) |
| Broche H6 | I/O — General purpose user I/O, bank 2 |
| Broche J1 | I/O — General purpose user I/O, bank 3 |
| Broche J2 | I/O — General purpose user I/O, bank 3 |
| Broche J3 | I/O — General purpose user I/O, bank 3 |
| Broche J4 | I/O — General purpose user I/O, bank 2 |
| Broche J5 | I/O — General purpose user I/O, bank 2 |
| Broche J6 | I/O — General purpose user I/O, bank 2 |
| Broche K1 | I/O — General purpose user I/O, bank 3 |
| Broche K2 | GND — Ground reference |
| Broche K3 | I/O — General purpose user I/O, bank 3 |
| Broche K4 | I/O — General purpose user I/O, bank 3 |
| Broche K5 | GND — Ground reference |
| Broche K6 | I/O — General purpose user I/O, bank 2 |
| Broche L1 | I/O — General purpose user I/O, bank 3 |
| Broche L2 | I/O — General purpose user I/O, bank 3 |
| Broche L3 | VCCIO3 — I/O bank 3 voltage supply |
| Broche L4 | I/O — General purpose user I/O, bank 3 |
| Broche L5 | I/O — General purpose user I/O, bank 3 |
| Broche L6 | I/O — General purpose user I/O, bank 3 |
| Broche M1 | I/O — General purpose user I/O, bank 4 |
| Broche M2 | I/O — General purpose user I/O, bank 4 |
| Broche M3 | GND — Ground reference |
| Broche M4 | I/O — General purpose user I/O, bank 3 |
| Broche M5 | VCCINT — Core voltage supply (1.5 V) |
| Broche M6 | I/O — General purpose user I/O, bank 3 |
| Broche N1 | I/O — General purpose user I/O, bank 4 |
| Broche N2 | I/O — General purpose user I/O, bank 4 |
| Broche N3 | I/O — General purpose user I/O, bank 4 |
| Broche N4 | I/O — General purpose user I/O, bank 4 |
| Broche N5 | I/O — General purpose user I/O, bank 4 |
| Broche N6 | I/O — General purpose user I/O, bank 4 |
| Broche P1 | I/O — General purpose user I/O, bank 4 |
| Broche P2 | GND — Ground reference |
| Broche P3 | I/O — General purpose user I/O, bank 4 |
| Broche P4 | I/O — General purpose user I/O, bank 4 |
| Broche P5 | GND — Ground reference |
| Broche P6 | I/O — General purpose user I/O, bank 4 |
| Broche R1 | I/O — General purpose user I/O, bank 4 |
| Broche R2 | I/O — General purpose user I/O, bank 4 |
| Broche R3 | VCCIO4 — I/O bank 4 voltage supply |
| Broche R4 | I/O — General purpose user I/O, bank 4 |
| Broche R5 | I/O — General purpose user I/O, bank 4 |
| Broche R6 | I/O — General purpose user I/O, bank 4 |
| Broche T1 | I/O — General purpose user I/O, bank 4 |
| Broche T2 | I/O — General purpose user I/O, bank 4 |
| Broche T3 | GND — Ground reference |
| Broche T4 | I/O — General purpose user I/O, bank 4 |
| Broche T5 | VCCINT — Core voltage supply (1.5 V) |
| Broche T6 | I/O — General purpose user I/O, bank 4 |
| Broche U1 | I/O — General purpose user I/O, bank 4 |
| Broche U2 | I/O — General purpose user I/O, bank 4 |
| Broche U3 | I/O — General purpose user I/O, bank 4 |
| Broche U4 | I/O — General purpose user I/O, bank 4 |
| Broche U5 | I/O — General purpose user I/O, bank 4 |
| Broche U6 | I/O — General purpose user I/O, bank 4 |
| Broche V1 | I/O — General purpose user I/O, bank 4 |
| Broche V2 | GND — Ground reference |
| Broche V3 | I/O — General purpose user I/O, bank 4 |
| Broche V4 | I/O — General purpose user I/O, bank 4 |
| Broche V5 | GND — Ground reference |
| Broche V6 | I/O — General purpose user I/O, bank 4 |
| Broche W1 | I/O — General purpose user I/O, bank 4 |
| Broche W2 | I/O — General purpose user I/O, bank 4 |
| Broche W3 | VCCIO4 — I/O bank 4 voltage supply |
| Broche W4 | I/O — General purpose user I/O, bank 4 |
| Broche W5 | I/O — General purpose user I/O, bank 4 |
| Broche W6 | I/O — General purpose user I/O, bank 4 |
| Broche Y1 | I/O — General purpose user I/O, bank 4 |
| Broche Y2 | I/O — General purpose user I/O, bank 4 |
| Broche Y3 | GND — Ground reference |
| Broche Y4 | I/O — General purpose user I/O, bank 4 |
| Broche Y5 | VCCINT — Core voltage supply (1.5 V) |
| Broche Y6 | I/O — General purpose user I/O, bank 4 |
Applications typiques
EP1C12F324C8 convient pour 6 applications: Industrial Motor Control, Video Processing Pipelines, Telecommunications Line Cards, ASIC Prototyping, Consumer Electronics Display Controllers, Test and Measurement Instrumentation.
Industrial Motor Control
The EP1C12F324C8 fits industrial motor control applications because its 12,060 logic elements and 2 PLLs can simultaneously implement PWM generation, quadrature encoder interfaces, and field-oriented control (FOC) state machines for multi-axis servo drives. With 249 user I/O pins, the device can interface with multiple Hall sensors, resolver feedback, gate drivers, and isolated communication ports. The 275 MHz internal Fmax supports deterministic PWM frequencies up to 100 kHz with fine resolution. Compared to a microcontroller DSP, this FPGA delivers parallel processing latency under 100 ns for current-loop control, improving torque ripple. Design tip: instantiate closed-loop control at 20 kHz while dedicating spare logic to safety monitoring and overcurrent protection.
Recommandé
Video Processing Pipelines
The EP1C12F324C8 is well-suited to mid-resolution video processing because its 12,060 logic elements can implement real-time color space conversion, scaling, and deinterlacing for SDTV or scaled 720p streams. The 239,616 bits of embedded M4K memory serve as line buffers and frame buffers for temporal filters, while the 2 PLLs generate pixel clocks at 27 MHz, 74.25 MHz, and 148.5 MHz. The 249 I/O pins accommodate 24-bit RGB plus control signals and sync. Compared to ASSP video processors, this FPGA offers configurable algorithms field-updatable in-circuit, which matters for evolving broadcast standards. Design tip: use DDR SDRAM external memory to buffer frame-rate conversion while keeping logic utilization under 80%.
Recommandé
Telecommunications Line Cards
The EP1C12F324C8 suits telecom line-card glue logic where it implements protocol bridging, time-slot switching, and SERDES aggregation across LVDS channels up to 640 Mbps. Its 12,060 LEs handle multi-channel HDLC framing, E1/T1 termination, and ATM cell segmentation while leaving logic headroom for OAM processing. The 130 nm process and 1.5 V core deliver reasonable power efficiency for always-on central-office deployments. The 249 I/Os aggregate multiple backplane buses, status LEDs, and configuration EEPROM interfaces. Design tip: pair with an external PHY such as an Intel/Altera ALT2SG transceiver and configure via EPCS4 serial flash for in-system reprogramming.
Recommandé
ASIC Prototyping
The EP1C12F324C8 is widely used as an ASIC prototyping vehicle because its 12,060 logic elements map efficiently to gate-level ASIC netlists up to approximately 200K ASIC gates after synthesis overhead. Engineers can validate RTL against the prototype before committing to mask costs, reducing tape-out risk. The 324-FBGA package exposes enough I/O to verify real-world interfaces including DDR, USB, and Ethernet MAC glue. The Quartus II toolchain provides synthesis, place-and-route, and timing analysis that closely matches ASIC sign-off methodology. Design tip: instantiate multiple FPGAs in a prototyping array (chip-to-chip LVDS) for ASIC designs exceeding 200K gates.
Recommandé
Consumer Electronics Display Controllers
The EP1C12F324C8 fits consumer display controllers for printers, kiosks, and digital signage where it implements timing generation, image scaling, and overlay blending. Its 12,060 LEs can manage LVDS panel interfaces up to 1080p while dedicating logic to touch-screen controllers and backlight PWM dimming. The 130 nm process keeps die cost low enough for consumer-tier pricing, and the FBGA-324 footprint integrates into slim device form factors. Design tip: use the dedicated PLL to synthesize pixel clocks from a single 27 MHz reference crystal, simplifying BOM and EMC compliance.
Recommandé
Test and Measurement Instrumentation
The EP1C12F324C8 is well-suited to bench-top test equipment because it can implement custom protocol analyzers, logic analyzers, and pattern generators with deterministic latency. The 12,060 logic elements handle parallel stimulus generation across up to 249 channels, while the 239,616 bits of embedded RAM capture deep traces for protocol debugging. The 2 PLLs synthesize multiple clock domains needed for mixed-signal test (I2C, SPI, UART, parallel bus). Design tip: pair with a soft-core processor (Nios II) running uClinux for high-level test sequencer scripting while offloading time-critical capture to dedicated logic.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1C12F324C8 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1C12F324C8N | EP1C12F324C7N | EP1C12F324C6N | EP1C12F324C7 | EP1C12F324C6 | EP1C12F324C6AA |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 324-FBGA (19x19 mm, 1.0 mm pitch) | 324-FBGA - same | 324-FBGA - same | 324-FBGA - same | 324-FBGA - same | 324-FBGA - same | 324-FBGA - same |
| Logic Elements | 12060 | 12060 | 12060 | 12060 | 12060 | 12060 | 12060 |
| Speed Grade (Internal Fmax) | C8 (~275 MHz) | C8 (~275 MHz) | C7 (~405 MHz, +47%) | C6 (~320 MHz, +16%) | C7 (~405 MHz, +47%) | C6 (~320 MHz, +16%) | C6 (~320 MHz, +16%) |
| Terminal Finish | Leaded (SnPb) | Lead-free (matte Sn) | Lead-free (matte Sn) | Lead-free (matte Sn) | Leaded (SnPb) | Leaded (SnPb) | Leaded (SnPb) |
| Embedded Memory (bits) | 239616 | 239616 | 239616 | 239616 | 239616 | 239616 | 239616 |
| User I/O Pins | 249 | 249 | 249 | 249 | 249 | 249 | 249 |
| Operating Temperature Range | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (automotive/aero processing) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Mid-density 12,060 LE position with 249 user I/O (vs EP1C6Q240C8N (smaller Cyclone I))
- FBGA-324 package supports maximum Cyclone I I/O count (vs EP1C12F256C8 (256-FBGA variant))
- Cyclone I family cost-optimized 130 nm architecture (vs Modern Cyclone IV E (EP4CE6) in EQFP-144)
Notes de conception
The 324-FBGA package has a 1.0 mm ball pitch, requiring a 6-layer or higher PCB with microvia technology (laser-drilled or staggered vias) for breakout routing. Use an HDI stack-up with 0.4 mm via pad and 0.2 mm drill for inner-row balls. Matched-length impedance control (50 ohm single-ended, 100 ohm differential) is required for LVDS and DDR interfaces. Per the Intel Cyclone device handbook, maintain continuous reference planes under the BGA escape region to prevent impedance discontinuities.
Estimated: Based on the Cyclone I family datasheet, the EP1C12F324C8 quiescent core current is approximately 500 mA at 1.5 V with all logic resources active. With 4 I/O banks each drawing up to 100 mA at 3.3 V, total worst-case power dissipation reaches approximately 2.5 W. Design a 1.5 V regulator with at least 1 A headroom and use low-ESR decoupling (one 100 uF bulk + ten 0.1 uF ceramics distributed across the BGA footprint) to minimize VCCINT ripple below 50 mV.
The EP1C12F324C8 requires external configuration memory (EPCS1, EPCS4, or compatible serial flash) for SRAM-based boot - do not assume the device powers up programmed. Ensure JTAG chain integrity by including a 10 kohm pull-up on TCK and TMS to VCCIO of the bank hosting the JTAG pins. Configuration errors are the #1 field-debugging issue; verify the configuration file (.sof or .pof) version matches the device ID before debugging logic issues.
Place the configuration EPCS flash within 50 mm of the FPGA DATA0/DCLK pins to minimize signal integrity issues. Route DCLK as a 50 ohm impedance-controlled trace and avoid routing DATA0 over split power planes. For multi-FPGA designs using JTAG chaining, include a TAP controller bypass jumper so individual devices can be isolated during bring-up. Reserve GPIO pins near the FPGA JTAG bank for unused-but-programmed I/O standards to prevent input-floating oscillations.
Informations de conformité
RoHS compliance for the C8 variant is per DigiKey product listing; the original leaded terminal finish is non-RoHS, and the C8N variant provides lead-free RoHS compliance. Halogen-free status was not specified in the verified data. AEC-Q100 is not applicable for this commercial-grade FPGA. For automotive applications, EP1C12F324C6AA offers aerospace/automotive processing.
