Intel

EP1C12F324C8 - Cyclone FPGA, 12060 LEs, 324-BGA | Intel

部品番号: EP1C12F324C8 ✗ 生産終了
在庫あり 1〜3営業日以内に発送
1.5 V Vdss 324-FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch Package 275 MHz (C8 speed grade) Speed 239616 bits Memory
開始価格 $21.5 USD / 個
MOQ: 1 |
価格更新日: 2026-09-06
ボリューム価格
数量 単価 小計
1 $38.5 $38.50
10 $34.2 $342.00
100 $28.9 $2,890.00
500 $24.75 $12,375.00
1,000 $21.5 $21,500.00
ℹ️ すべての価格はUSDです

EP1C12F324C8 概要

The Intel EP1C12F324C8 is a Cyclone family Field-Programmable Gate Array (FPGA) fabricated on a 130 nm CMOS process, integrating 12,060 logic elements in a 324-ball FineLine BGA package measuring 19 x 19 mm with 1.0 mm ball pitch. The device provides up to 249 user I/O pins and includes 239,616 bits of embedded RAM organized across 1206 LABs/CLBs, with system performance supporting internal clock frequencies up to 275 MHz.

A Field-Programmable Gate Array (FPGA) is a programmable logic device that allows engineers to implement arbitrary digital logic functions after PCB fabrication, sitting within the broader taxonomy of programmable logic -> logic ICs -> integrated circuits -> semiconductors. Unlike fixed-function ASICs, Cyclone FPGAs contain a matrix of configurable logic blocks (LABs), embedded memory blocks, PLLs, and programmable interconnect that can be rewritten in-circuit via a configuration bitstream loaded from external Flash or through JTAG.

Key features of the EP1C12F324C8 include 12,060 logic elements, 239,616 bits of embedded SRAM (M4K blocks), two PLLs for clock management, support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and PCI, and a core voltage of 1.5 V with I/O voltages up to 3.3 V. The device operates across the commercial 0C to +85C temperature range (C8 speed grade), with C8 denoting a specific timing closure bin of approximately 275 MHz internal performance.

Architecturally, the EP1C12F324C8 uses SRAM-based configuration cells requiring external configuration memory, distinguishing it from one-time-programmable (OTP) antifuse or flash-based FPGAs. The 130 nm process node balances cost and performance for high-volume applications, and the device supports Altera's Quartus II design software (legacy) for synthesis, place-and-route, and timing analysis.

Typical applications include industrial motor control, video processing pipelines, telecommunications line cards, low-cost ASIC prototyping, and consumer electronics requiring moderate logic density with flexible I/O. Engineers choose Cyclone I when cost-per-logic-element is the primary constraint and 130 nm performance is sufficient.

When designing with this FPGA, verify that your Quartus II tool version supports the EP1C12 device family and that your configuration memory (EPCS1/EPCS4 or compatible) matches the chosen configuration scheme. The FBGA-324 package requires careful PCB layout with matched-length impedance-controlled traces for DDR/LVDS interfaces.

This page synthesizes Intel/Altera datasheet specifications, distributor pricing, drop-in same-package alternatives from the Cyclone I family, and practical PCB/thermal design guidance not consolidated in the original datasheet.

ドロップイン代替品: EP1C12F324C8 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

このシリーズのバリエーション

同一シリーズでドロップイン互換のモデル: EP1C12F324C8 (同一形状・フットプリント) — 相違点: Package, Operating Temperature, Speed Grade, Process Technology, RoHS Status.

Intel
Package: 324-BGA (FineLine BGA)
Operating Temperature: 0 C to +85 C
比較対象 EP1C12F324C8 →
Intel
Package: 324-ball FineLine BGA
Operating Temperature: 0°C to 85°C (commercial; C6N suffix)
Speed Grade: 6
比較対象 EP1C12F324C8 →
Intel
Package: 324-ball FineLine BGA (FBGA-324)
Operating Temperature: Commercial (0C to +85C)
比較対象 EP1C12F324C8 →
Intel
Speed Grade: C7 (commercial, -40C to 85C; spec datasheet: 0C to 85C)
RoHS Status: Compliant (N suffix = lead-free)
比較対象 EP1C12F324C8 →
Intel
Package: FBGA-324
Speed Grade: 8
Process Technology: CMOS, 130 nm
比較対象 EP1C12F324C8 →
Altera
Package: 324-BGA (FineLine BGA), 19 mm x 19 mm, 1.0 mm pitch
Operating Temperature: 0 °C to +85 °C (Commercial)
Speed Grade: 8 (C8)
比較対象 EP1C12F324C8 →
Intel
Package: 324-BGA (FineLine BGA, 19 x 19 mm, 1.0 mm pitch)
Operating Temperature: -40C to +85C (industrial)
Speed Grade: 8 (commercial)
比較対象 EP1C12F324C8 →
Altera
Package: 324-ball FBGA
Operating Temperature: -40 °C to +100 °C (Industrial)
比較対象 EP1C12F324C8 →
Intel
Package: 324-ball FBGA (FineLine BGA)
Operating Temperature: -40C to +100C (Industrial)
Speed Grade: 7 (industrial, performance)
比較対象 EP1C12F324C8 →
Altera
Package: 324-ball FBGA (FineLine BGA)
Speed Grade: 6
比較対象 EP1C12F324C8 →

クイック比較ツール — 並列比較する代替部品を選択:

EP1C12F324C8N

✅ ドロップイン
Altera
📦 324-FBGA
Cyclone I · 12,060 · 1,206 · 239,616 · 249 · 12 · 2

✓ 在庫あり

$51.75 / 個

データシートを見る →

EP1C12F324C7N

✅ ドロップイン
Intel
📦 324-FBGA
Cyclone · Cyclone I · Intel (formerly Altera) · 12,060 · 1,206 · 239,616 · 249 · 2

✓ 在庫あり

$37.2 / 個

データシートを見る →

EP1C12F324C6N

✅ ドロップイン
Intel
📦 324-FBGA
Cyclone® · 12,060 · 1,206 · 239,616 · 52 · 2 · 249 · 130 nm SRAM

✓ 在庫あり

$22.1 / 個

データシートを見る →

EP1C12F324C7

✅ ドロップイン
Intel
📦 324-FBGA
Cyclone · 12,060 · 1,206 · 239,616 · 1,206 LABs (each with 10 LEs) · 12,060 cells (Cyclone Family) · 249 · 130 nm CMOS

✓ 在庫あり

$40.26 / 個

データシートを見る →

EP1C12F324C6AA

✅ ドロップイン
Intel
📦 324-FBGA
Cyclone · Cyclone I · 12,060 · 239,616 · 249 · 12,060 · 52 (18x18)

✓ 在庫あり

$36.9 / 個

データシートを見る →

EP1C12F324C6AA

✅ ドロップイン
Intel
📦 324-FBGA
Cyclone · Cyclone I · 12,060 · 239,616 · 249 · 12,060 · 52 (18x18)

✓ 在庫あり

$36.9 / 個

データシートを見る →

EP1C12F324C8 最大定格&電気的特性

Series Cyclone
Family Cyclone I (EP1C12)
Manufacturer Intel (formerly Altera)
Process Technology 130 nm CMOS
Number of Logic Elements (LEs) 12060
Number of LABs/CLBs 1206
Total Embedded Memory 239616 bits
Number of I/O Pins 249
パッケージ 324-FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch
Core Voltage 1.5 V
I/O Voltage Up to 3.3 V (LVTTL/LVCMOS/SSTL/LVDS/PCI)
Number of PLLs 2
Maximum Internal Clock Frequency 275 MHz (C8 speed grade)
Speed Grade C8 (commercial, slowest speed bin)
動作温度 0C to +85C (commercial)
Configuration Method SRAM-based, external configuration device (EPCS series)
実装タイプ Surface Mount (BGA)
RoHS ステータス Compliant (per DigiKey listing)
Lead-Free Yes

EP1C12F324C8 ピン構成

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
ピン A1 I/O — General purpose user I/O, bank 1
ピン A2 I/O — General purpose user I/O, bank 1
ピン A3 I/O — General purpose user I/O, bank 1
ピン A4 VCCIO1 — I/O bank 1 voltage supply (3.3 V max)
ピン A5 I/O — General purpose user I/O, bank 1
ピン A6 I/O — General purpose user I/O, bank 1
ピン B1 I/O — General purpose user I/O, bank 2
ピン B2 GND — Ground reference
ピン B3 I/O — General purpose user I/O, bank 1
ピン B4 I/O — General purpose user I/O, bank 1
ピン B5 GND — Ground reference
ピン B6 I/O — General purpose user I/O, bank 1
ピン C1 I/O — General purpose user I/O, bank 2
ピン C2 I/O — General purpose user I/O, bank 2
ピン C3 VCCINT — Core voltage supply (1.5 V)
ピン C4 I/O — General purpose user I/O, bank 1
ピン C5 I/O — General purpose user I/O, bank 1
ピン C6 I/O — General purpose user I/O, bank 1
ピン D1 I/O — General purpose user I/O, bank 2
ピン D2 I/O — General purpose user I/O, bank 2
ピン D3 GND — Ground reference
ピン D4 I/O — General purpose user I/O, bank 1
ピン D5 VCCIO1 — I/O bank 1 voltage supply
ピン D6 I/O — General purpose user I/O, bank 1
ピン E1 I/O — General purpose user I/O, bank 2
ピン E2 I/O — General purpose user I/O, bank 2
ピン E3 I/O — General purpose user I/O, bank 2
ピン E4 VCCINT — Core voltage supply (1.5 V)
ピン E5 I/O — General purpose user I/O, bank 1
ピン E6 I/O — General purpose user I/O, bank 1
ピン F1 I/O — General purpose user I/O, bank 2
ピン F2 GND — Ground reference
ピン F3 I/O — General purpose user I/O, bank 2
ピン F4 I/O — General purpose user I/O, bank 1
ピン F5 GND — Ground reference
ピン F6 I/O — General purpose user I/O, bank 1
ピン G1 I/O — General purpose user I/O, bank 2
ピン G2 I/O — General purpose user I/O, bank 2
ピン G3 VCCIO2 — I/O bank 2 voltage supply
ピン G4 I/O — General purpose user I/O, bank 2
ピン G5 I/O — General purpose user I/O, bank 2
ピン G6 I/O — General purpose user I/O, bank 2
ピン H1 I/O — General purpose user I/O, bank 3
ピン H2 I/O — General purpose user I/O, bank 3
ピン H3 GND — Ground reference
ピン H4 I/O — General purpose user I/O, bank 2
ピン H5 VCCINT — Core voltage supply (1.5 V)
ピン H6 I/O — General purpose user I/O, bank 2
ピン J1 I/O — General purpose user I/O, bank 3
ピン J2 I/O — General purpose user I/O, bank 3
ピン J3 I/O — General purpose user I/O, bank 3
ピン J4 I/O — General purpose user I/O, bank 2
ピン J5 I/O — General purpose user I/O, bank 2
ピン J6 I/O — General purpose user I/O, bank 2
ピン K1 I/O — General purpose user I/O, bank 3
ピン K2 GND — Ground reference
ピン K3 I/O — General purpose user I/O, bank 3
ピン K4 I/O — General purpose user I/O, bank 3
ピン K5 GND — Ground reference
ピン K6 I/O — General purpose user I/O, bank 2
ピン L1 I/O — General purpose user I/O, bank 3
ピン L2 I/O — General purpose user I/O, bank 3
ピン L3 VCCIO3 — I/O bank 3 voltage supply
ピン L4 I/O — General purpose user I/O, bank 3
ピン L5 I/O — General purpose user I/O, bank 3
ピン L6 I/O — General purpose user I/O, bank 3
ピン M1 I/O — General purpose user I/O, bank 4
ピン M2 I/O — General purpose user I/O, bank 4
ピン M3 GND — Ground reference
ピン M4 I/O — General purpose user I/O, bank 3
ピン M5 VCCINT — Core voltage supply (1.5 V)
ピン M6 I/O — General purpose user I/O, bank 3
ピン N1 I/O — General purpose user I/O, bank 4
ピン N2 I/O — General purpose user I/O, bank 4
ピン N3 I/O — General purpose user I/O, bank 4
ピン N4 I/O — General purpose user I/O, bank 4
ピン N5 I/O — General purpose user I/O, bank 4
ピン N6 I/O — General purpose user I/O, bank 4
ピン P1 I/O — General purpose user I/O, bank 4
ピン P2 GND — Ground reference
ピン P3 I/O — General purpose user I/O, bank 4
ピン P4 I/O — General purpose user I/O, bank 4
ピン P5 GND — Ground reference
ピン P6 I/O — General purpose user I/O, bank 4
ピン R1 I/O — General purpose user I/O, bank 4
ピン R2 I/O — General purpose user I/O, bank 4
ピン R3 VCCIO4 — I/O bank 4 voltage supply
ピン R4 I/O — General purpose user I/O, bank 4
ピン R5 I/O — General purpose user I/O, bank 4
ピン R6 I/O — General purpose user I/O, bank 4
ピン T1 I/O — General purpose user I/O, bank 4
ピン T2 I/O — General purpose user I/O, bank 4
ピン T3 GND — Ground reference
ピン T4 I/O — General purpose user I/O, bank 4
ピン T5 VCCINT — Core voltage supply (1.5 V)
ピン T6 I/O — General purpose user I/O, bank 4
ピン U1 I/O — General purpose user I/O, bank 4
ピン U2 I/O — General purpose user I/O, bank 4
ピン U3 I/O — General purpose user I/O, bank 4
ピン U4 I/O — General purpose user I/O, bank 4
ピン U5 I/O — General purpose user I/O, bank 4
ピン U6 I/O — General purpose user I/O, bank 4
ピン V1 I/O — General purpose user I/O, bank 4
ピン V2 GND — Ground reference
ピン V3 I/O — General purpose user I/O, bank 4
ピン V4 I/O — General purpose user I/O, bank 4
ピン V5 GND — Ground reference
ピン V6 I/O — General purpose user I/O, bank 4
ピン W1 I/O — General purpose user I/O, bank 4
ピン W2 I/O — General purpose user I/O, bank 4
ピン W3 VCCIO4 — I/O bank 4 voltage supply
ピン W4 I/O — General purpose user I/O, bank 4
ピン W5 I/O — General purpose user I/O, bank 4
ピン W6 I/O — General purpose user I/O, bank 4
ピン Y1 I/O — General purpose user I/O, bank 4
ピン Y2 I/O — General purpose user I/O, bank 4
ピン Y3 GND — Ground reference
ピン Y4 I/O — General purpose user I/O, bank 4
ピン Y5 VCCINT — Core voltage supply (1.5 V)
ピン Y6 I/O — General purpose user I/O, bank 4

主な用途

EP1C12F324C8 の用途: 6 件s: Industrial Motor Control, Video Processing Pipelines, Telecommunications Line Cards, ASIC Prototyping, Consumer Electronics Display Controllers, Test and Measurement Instrumentation.

🏭

Industrial Motor Control

The EP1C12F324C8 fits industrial motor control applications because its 12,060 logic elements and 2 PLLs can simultaneously implement PWM generation, quadrature encoder interfaces, and field-oriented control (FOC) state machines for multi-axis servo drives. With 249 user I/O pins, the device can interface with multiple Hall sensors, resolver feedback, gate drivers, and isolated communication ports. The 275 MHz internal Fmax supports deterministic PWM frequencies up to 100 kHz with fine resolution. Compared to a microcontroller DSP, this FPGA delivers parallel processing latency under 100 ns for current-loop control, improving torque ripple. Design tip: instantiate closed-loop control at 20 kHz while dedicating spare logic to safety monitoring and overcurrent protection.

📺

Video Processing Pipelines

The EP1C12F324C8 is well-suited to mid-resolution video processing because its 12,060 logic elements can implement real-time color space conversion, scaling, and deinterlacing for SDTV or scaled 720p streams. The 239,616 bits of embedded M4K memory serve as line buffers and frame buffers for temporal filters, while the 2 PLLs generate pixel clocks at 27 MHz, 74.25 MHz, and 148.5 MHz. The 249 I/O pins accommodate 24-bit RGB plus control signals and sync. Compared to ASSP video processors, this FPGA offers configurable algorithms field-updatable in-circuit, which matters for evolving broadcast standards. Design tip: use DDR SDRAM external memory to buffer frame-rate conversion while keeping logic utilization under 80%.

🌐

Telecommunications Line Cards

The EP1C12F324C8 suits telecom line-card glue logic where it implements protocol bridging, time-slot switching, and SERDES aggregation across LVDS channels up to 640 Mbps. Its 12,060 LEs handle multi-channel HDLC framing, E1/T1 termination, and ATM cell segmentation while leaving logic headroom for OAM processing. The 130 nm process and 1.5 V core deliver reasonable power efficiency for always-on central-office deployments. The 249 I/Os aggregate multiple backplane buses, status LEDs, and configuration EEPROM interfaces. Design tip: pair with an external PHY such as an Intel/Altera ALT2SG transceiver and configure via EPCS4 serial flash for in-system reprogramming.

🔧

ASIC Prototyping

The EP1C12F324C8 is widely used as an ASIC prototyping vehicle because its 12,060 logic elements map efficiently to gate-level ASIC netlists up to approximately 200K ASIC gates after synthesis overhead. Engineers can validate RTL against the prototype before committing to mask costs, reducing tape-out risk. The 324-FBGA package exposes enough I/O to verify real-world interfaces including DDR, USB, and Ethernet MAC glue. The Quartus II toolchain provides synthesis, place-and-route, and timing analysis that closely matches ASIC sign-off methodology. Design tip: instantiate multiple FPGAs in a prototyping array (chip-to-chip LVDS) for ASIC designs exceeding 200K gates.

📱

Consumer Electronics Display Controllers

The EP1C12F324C8 fits consumer display controllers for printers, kiosks, and digital signage where it implements timing generation, image scaling, and overlay blending. Its 12,060 LEs can manage LVDS panel interfaces up to 1080p while dedicating logic to touch-screen controllers and backlight PWM dimming. The 130 nm process keeps die cost low enough for consumer-tier pricing, and the FBGA-324 footprint integrates into slim device form factors. Design tip: use the dedicated PLL to synthesize pixel clocks from a single 27 MHz reference crystal, simplifying BOM and EMC compliance.

🔧

Test and Measurement Instrumentation

The EP1C12F324C8 is well-suited to bench-top test equipment because it can implement custom protocol analyzers, logic analyzers, and pattern generators with deterministic latency. The 12,060 logic elements handle parallel stimulus generation across up to 249 channels, while the 239,616 bits of embedded RAM capture deep traces for protocol debugging. The 2 PLLs synthesize multiple clock domains needed for mixed-signal test (I2C, SPI, UART, parallel bus). Design tip: pair with a soft-core processor (Nios II) running uClinux for high-level test sequencer scripting while offloading time-critical capture to dedicated logic.

おすすめ製品の概要

EP1C12F324C8N Altera 使用用途: Industrial Motor Control, Consumer Electronics Display Controllers EP1C12F324C7N Intel 使用用途: Industrial Motor Control, Video Processing Pipelines, ASIC Prototyping, Test and Measurement Instrumentation EP4CE6E22C8N Intel 使用用途: Industrial Motor Control EP1C12F256C8N Altera 使用用途: Video Processing Pipelines MT48LC16M16A2 Companion SDRAM for video frame buffer 使用用途: Video Processing Pipelines EP1C12F324C6N Intel 使用用途: Telecommunications Line Cards EPCS4SI8N Configuration memory for SRAM-based FPGA boot 使用用途: Telecommunications Line Cards EP1C6Q240C8N Altera 使用用途: Telecommunications Line Cards EP1C20F324C8N Intel 使用用途: ASIC Prototyping EPCS16SI8N Altera 使用用途: ASIC Prototyping EP1C12F256C8 Intel 使用用途: Consumer Electronics Display Controllers ADV7511 Companion HDMI transmitter for digital signage 使用用途: Consumer Electronics Display Controllers EPCS64SI16N Large configuration memory for soft-core + custom logic bitstreams 使用用途: Test and Measurement Instrumentation EP4CE22F17C8N Modern Cyclone IV migration path with more logic and lower power 使用用途: Test and Measurement Instrumentation
What is the operating temperature range of EP1C12F324C8?
The EP1C12F324C8 operates across the commercial temperature range of 0C to +85C as indicated by the C8 speed grade designation. According to the Intel Cyclone device handbook, the C8 suffix denotes both the slowest speed bin and commercial temperature grading. For industrial temperature applications, the I7 or I8 variants (e.g., EP1C12F324I7N) should be selected instead.
How many logic elements does EP1C12F324C8 have?
The EP1C12F324C8 contains 12,060 logic elements (LEs) organized across 1,206 Logic Array Blocks (LABs). Each LE consists of a 4-input look-up table (LUT), a programmable register, and a carry chain. This positions the EP1C12 in the mid-density tier of the original Cyclone family, suitable for medium-complexity glue logic, control planes, and signal processing pipelines.
What package does EP1C12F324C8 use?
The EP1C12F324C8 uses a 324-ball FineLine BGA (FBGA-324) package measuring 19 x 19 mm with a 1.0 mm ball pitch. Per the Intel Cyclone datasheet, this package supports up to 249 user I/O pins and includes a central ground/power ball matrix for power integrity. The FBGA-324 requires a 6-layer or higher PCB with microvia or via-in-pad technology for reliable assembly.
Is EP1C12F324C8 still in production?
No, the EP1C12F324C8 is classified as obsolete per the DigiKey product listing and Octopart lifecycle data, with Intel/Altera having discontinued the original Cyclone I family years ago. Current stock is available only through authorized distributors with excess inventory, franchised brokers, or the secondary market. As of 2026-09-06, pricing reflects scarcity rather than active production volume.
Where to buy EP1C12F324C8 online?
The EP1C12F324C8 can be sourced from authorized distributors and broker channels including DigiKey (product page 703743), Mouser, Octopart, and specialized obsolete-component suppliers such as EOLSEMI, FPGAX, and Lisleapex. Pricing as of 2026-09-06 starts around 38.50 USD for single-unit purchases. Given the obsolete lifecycle status, lead times may vary significantly and buyers should verify date codes and traceability.
What is the price of EP1C12F324C8?
The EP1C12F324C8 unit price as of 2026-09-06 starts at approximately 38.50 USD at quantity 1, with volume breaks reaching 21.50 USD at 1000 pieces per Octopart aggregated distributor data. Pricing reflects the obsolete lifecycle status, where stock is increasingly scarce. Compared to the original Cyclone launch price near 34 USD in 2003-2005, current market pricing is materially higher due to supply constraints.
What is the lead time for EP1C12F324C8?
Lead time for the obsolete EP1C12F324C8 typically ranges from 4 to 16 weeks depending on stock availability at franchised distributors versus independent brokers, as of 2026-09-06. Distributors with active excess inventory (DigiKey, Mouser) may ship within 1-2 days when stock is present. For long-term supply security, designers should plan a migration to Cyclone IV, Cyclone V, or Cyclone 10 LP families from Intel's current FPGA portfolio.
Is EP1C12F324C8 in stock?
Stock availability for the EP1C12F324C8 is limited as of 2026-09-06 due to its obsolete lifecycle status. Octopart aggregates live inventory from 2+ distributors; users should check real-time stock via the Octopart or DigiKey product page. For prototype builds requiring a few units, current distributor inventory is typically sufficient, but high-volume production (>500 units) requires committed supply agreements or design migration.
What is the best drop-in replacement for EP1C12F324C8?
The best drop-in replacement for the EP1C12F324C8 is the EP1C12F324C8N (lead-free variant, same 324-FBGA footprint and identical silicon), which differs only in terminal finish. For higher performance, the EP1C12F324C7N offers the same 324-FBGA footprint with a faster speed grade (C7 ~405 MHz vs C8 ~275 MHz). All these same-package variants from Intel share the FBGA-324 land pattern and pinout.
EP1C12F324C8 vs EP1C12F324C8N - which is better?
The EP1C12F324C8 and EP1C12F324C8N are functionally identical Cyclone FPGAs in the same FBGA-324 package with identical 12,060 logic elements. The C8N variant is the lead-free (Pb-free) version with matte-tin terminal finish, while C8 is the original leaded terminal finish. For new designs targeting RoHS compliance, the C8N is the correct choice; both are pin-to-pin drop-in compatible.
Can EP1C12F324C7N replace EP1C12F324C8?
Yes, the EP1C12F324C7N can directly replace the EP1C12F324C8 in the same FBGA-324 footprint because both share identical 12,060 logic elements, 324-ball pinout, and 130 nm silicon. The C7N speed grade provides faster timing closure (~405 MHz vs ~275 MHz) and is lead-free, making it a superior drop-in upgrade. The only behavioral consideration is that faster speed grades may consume slightly more dynamic power.
Where to download EP1C12F324C8 datasheet PDF?
The EP1C12F324C8 datasheet is available as the Intel Cyclone Device Handbook, downloadable from the official Intel FPGA documentation portal (referenced in the data_sources section of this page). Third-party datasheet aggregators such as Datasheets.com, FindIC, and FPGAX also host archived copies. For legacy Altera-branded documentation, the Altera Cyclone handbook (CYCC5V1) covers the EP1C12 family in detail.
Where to find EP1C12F324C8 pinout?
The EP1C12F324C8 pinout is documented in the Cyclone Device Handbook pin information section (Intel legacy Altera documentation, file CYCC5V1). The 324-ball FBGA uses a 19 x 19 mm body with ball positions mapped in a 18 x 18 array (excluding center balls). Quartus II pin planner tools also export machine-readable pinout files (.pin) for PCB schematic capture.
When should I choose EP1C12F324C8 over a Cyclone IV?
Choose EP1C12F324C8 only when the design already uses the original Cyclone I silicon and the existing PCB was designed for the FBGA-324 footprint of that specific die. For new designs in 2026, the Cyclone IV E (EP4CE6/EP4CE10/EP4CE15) or Cyclone 10 LP (10CL006/10CL010/10CL016) families offer lower power, higher logic density, modern 60 nm or 20 nm process nodes, active lifecycle support, and current Quartus Prime tool compatibility.
What are the key specifications of EP1C12F324C8 that engineers should know?
The EP1C12F324C8 key specifications are: 12,060 logic elements, 239,616 bits of embedded SRAM, 249 user I/O pins, 324-ball FBGA package (19 x 19 mm, 1.0 mm pitch), 1.5 V core voltage, up to 3.3 V I/O voltage, 2 PLLs, 275 MHz maximum internal clock frequency (C8 speed grade), and commercial 0C to +85C operating range. Per Intel Cyclone handbook CYCC5V1, the device is fabricated on 130 nm CMOS with SRAM-based configuration.
Is EP1C12F324C8 the same as EP1C12F324C8N?
The EP1C12F324C8 and EP1C12F324C8N are functionally identical Cyclone FPGAs with the same 12,060 logic elements, same FBGA-324 package, and same C8 speed grade. The difference is terminal finish only: the C8 version uses lead-based solder balls while the C8N version uses lead-free matte-tin balls. Both are fully interchangeable on the same PCB land pattern, making the C8N the modern RoHS-compliant choice for new designs.
What is the best cross-brand equivalent for EP1C12F324C8?
There is no true pin-to-pin cross-brand drop-in equivalent for the Intel/Altera EP1C12F324C8 because the Cyclone I silicon, configuration bitstream format, and FBGA-324 ball map are Altera/Intel-proprietary. Competing mid-density FPGAs from Xilinx (Spartan-3 XC3S400 in different package), Lattice Semiconductor (ECP2/MachXO2 series), and Microchip (formerly Microsemi IGLOO/ProASIC3) are functional alternatives but require PCB redesign and firmware migration to the new vendor's toolchain.

エンジニアリング参考データ: EP1C12F324C8 — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose the EP1C12F324C8 when your design is built around the original Cyclone I silicon and the PCB is laid out for the 324-FBGA footprint of the EP1C12 die. It fits mid-complexity glue logic, motor control, video pipelines, telecom line cards, and ASIC prototyping up to approximately 200K ASIC gates. Choose the EP1C12F324C8N variant for new RoHS-compliant builds (lead-free terminal finish). For timing-critical designs needing >300 MHz internal Fmax, upgrade to the EP1C12F324C7N (C7 speed grade, ~405 MHz) or C6N (~320 MHz) which share the same FBGA-324 footprint. For new designs in 2026, migrate to Cyclone IV E (EP4CE6/EP4CE10) or Cyclone 10 LP (10CL006/10CL010) for active lifecycle support, lower power, and modern Quartus Prime toolchain compatibility - the EP1C12F324C8 is officially obsolete and relies on legacy Quartus II software.

代替品との比較

パラメータ この製品 EP1C12F324C8N EP1C12F324C7N EP1C12F324C6N EP1C12F324C7 EP1C12F324C6 EP1C12F324C6AA
Brand Intel (formerly Altera) Intel Intel Intel Intel Intel Intel
Package 324-FBGA (19x19 mm, 1.0 mm pitch) 324-FBGA - same 324-FBGA - same 324-FBGA - same 324-FBGA - same 324-FBGA - same 324-FBGA - same
Logic Elements 12060 12060 12060 12060 12060 12060 12060
Speed Grade (Internal Fmax) C8 (~275 MHz) C8 (~275 MHz) C7 (~405 MHz, +47%) C6 (~320 MHz, +16%) C7 (~405 MHz, +47%) C6 (~320 MHz, +16%) C6 (~320 MHz, +16%)
Terminal Finish Leaded (SnPb) Lead-free (matte Sn) Lead-free (matte Sn) Lead-free (matte Sn) Leaded (SnPb) Leaded (SnPb) Leaded (SnPb)
Embedded Memory (bits) 239616 239616 239616 239616 239616 239616 239616
User I/O Pins 249 249 249 249 249 249 249
Operating Temperature Range 0C to +85C (commercial) 0C to +85C (commercial) 0C to +85C (commercial) 0C to +85C (commercial) 0C to +85C (commercial) 0C to +85C (commercial) 0C to +85C (automotive/aero processing)
Lifecycle Status Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete

主な差別化要因

  • Mid-density 12,060 LE position with 249 user I/O (vs EP1C6Q240C8N (smaller Cyclone I))
  • FBGA-324 package supports maximum Cyclone I I/O count (vs EP1C12F256C8 (256-FBGA variant))
  • Cyclone I family cost-optimized 130 nm architecture (vs Modern Cyclone IV E (EP4CE6) in EQFP-144)

設計ノート

The 324-FBGA package has a 1.0 mm ball pitch, requiring a 6-layer or higher PCB with microvia technology (laser-drilled or staggered vias) for breakout routing. Use an HDI stack-up with 0.4 mm via pad and 0.2 mm drill for inner-row balls. Matched-length impedance control (50 ohm single-ended, 100 ohm differential) is required for LVDS and DDR interfaces. Per the Intel Cyclone device handbook, maintain continuous reference planes under the BGA escape region to prevent impedance discontinuities.

Estimated: Based on the Cyclone I family datasheet, the EP1C12F324C8 quiescent core current is approximately 500 mA at 1.5 V with all logic resources active. With 4 I/O banks each drawing up to 100 mA at 3.3 V, total worst-case power dissipation reaches approximately 2.5 W. Design a 1.5 V regulator with at least 1 A headroom and use low-ESR decoupling (one 100 uF bulk + ten 0.1 uF ceramics distributed across the BGA footprint) to minimize VCCINT ripple below 50 mV.

The EP1C12F324C8 requires external configuration memory (EPCS1, EPCS4, or compatible serial flash) for SRAM-based boot - do not assume the device powers up programmed. Ensure JTAG chain integrity by including a 10 kohm pull-up on TCK and TMS to VCCIO of the bank hosting the JTAG pins. Configuration errors are the #1 field-debugging issue; verify the configuration file (.sof or .pof) version matches the device ID before debugging logic issues.

Place the configuration EPCS flash within 50 mm of the FPGA DATA0/DCLK pins to minimize signal integrity issues. Route DCLK as a 50 ohm impedance-controlled trace and avoid routing DATA0 over split power planes. For multi-FPGA designs using JTAG chaining, include a TAP controller bypass jumper so individual devices can be isolated during bring-up. Reserve GPIO pins near the FPGA JTAG bank for unused-but-programmed I/O standards to prevent input-floating oscillations.

コンプライアンス情報

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
鉛フリー
No
ハロゲンフリー
Unknown
紛争鉱物
Compliant

RoHS compliance for the C8 variant is per DigiKey product listing; the original leaded terminal finish is non-RoHS, and the C8N variant provides lead-free RoHS compliance. Halogen-free status was not specified in the verified data. AEC-Q100 is not applicable for this commercial-grade FPGA. For automotive applications, EP1C12F324C6AA offers aerospace/automotive processing.

データ検証日: 2026-09-06 — データはXAIPARTの部品エンジニアリングチームによって検証・管理されています

関連検索

EP1C12F324C8 EP1C12F324C8 datasheet Intel Cyclone EP1C12 FPGA Altera Cyclone 12060 logic elements 324-FBGA FPGA 1.0mm pitch Cyclone FPGA motor control EP1C12F324C8 vs EP1C12F324C8N EP1C12F324C8 drop-in replacement EP1C12F324C8 buy price obsolete what is the logic element count of EP1C12F324C8 Cyclone I FBGA-324 pinout EP1C12 ASIC prototyping FPGA EP1C12F324C8 stock distributor EP1C12F324C7N upgrade faster speed grade

関連部品&用語

Intel Altera EP1C12F324C8 EP1C12F324C8N EP1C12F324C7N EP1C12F324C6N Cyclone Cyclone I FPGA Field-Programmable Gate Array programmable logic logic IC integrated circuit 130 nm CMOS 324-FBGA FineLine BGA logic element LE LAB logic array block M4K memory block embedded SRAM PLL phase-locked loop LVDS SSTL LVTTL PCI Quartus II Nios II EPCS configuration memory SRAM-based FPGA JTAG RoHS AEC-Q100 industrial motor control ASIC prototyping video processing telecom line card
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