Intel

EP4CE6E22C8N - Cyclone IV E FPGA, 6,272 LEs, 144-LQFP | Intel

Référence : EP4CE6E22C8N ✓ Actif

En stock Expédié sous 1 à 3 jours ouvrés

1.15 V to 1.25 V Vdss 144-LQFP Exposed Pad (EQFP-144) Package 472.5 MHz Speed 276,480 bits (270 Kbits) Memory

À partir de $10.5 USD / unité

MOQ : 1 |

Prix mis à jour : 2026-09-09

Tarifs dégressifs

Qté	Prix unitaire	Total
1	$16.5	$16,50
10	$14.8	$148,00
100	$13.2	$1 320,00
500	$11.75	$5 875,00
1 000	$10.5	$10 500,00

ℹ️ Tous les prix sont en USD

Voir la fiche technique (PDF) Voir les alternatives

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EP4CE6E22C8N Présentation

The Intel EP4CE6E22C8N is a Cyclone IV E field-programmable gate array (FPGA) with 6,272 logic elements, 276,480 bits of embedded memory, and 91 user I/Os, housed in a 144-pin LQFP exposed-pad package (EQFP-144). It operates from a 1.15 V to 1.25 V core supply, supports up to 4 PLLs, and is rated for a maximum internal clock frequency of 472.5 MHz with commercial speed grade 8. The device consumes less than 1.5 W of dynamic power under typical conditions, making it one of the lowest-power FPGAs in its density class.

A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic fabric, routing, and I/O behaviour are defined by user-supplied configuration data rather than at the fab. Within the programmable-logic hierarchy, the FPGA sits above simple programmable logic devices (SPLDs) and complex programmable logic devices (CPLDs), and below fixed-function ASICs. The Cyclone IV E series in particular targets cost-sensitive, high-volume designs where system designers want ASIC-like flexibility without the NRE cost of custom silicon.

Key features include 6,272 logic elements, 270 Kbits of embedded RAM organized into M9K blocks, 15 embedded 18x18 multipliers for DSP operations, two general-purpose PLLs plus up to four total clock networks, and a Cyclone IV E hard memory controller. Configuration is supported through JTAG (IEEE 1149.1) and Active Serial (AS) modes using an external configuration device. The 144-pin LQFP with exposed thermal pad simplifies PCB layout, enabling hand-solderable prototypes and low-layer-count boards.

Architecturally, the Cyclone IV E family uses a 60 nm process node with a Look-Up Table (LUT) based logic element, dedicated multiplier blocks, and per-LAB control signals. The device supports hot-socketing, I/O banking with multiple voltage standards (LVTTL, LVCMOS, PCI, SSTL), and 8 Kbits of user flash memory for on-chip non-volatile storage. The exposed thermal pad is electrically tied to the ground plane, providing a low thermal resistance path suitable for convection-cooled industrial enclosures.

Typical applications include industrial motor control and drive signal conditioning, consumer video processing bridges, USB/ethernet protocol bridging, low-cost ASIC prototyping, and portable instrumentation front-ends. Designers also use the EP4CE6 in firmware-defined sensor aggregation nodes and LED video wall controllers where deterministic latency is more important than raw throughput.

When designing with this device, allocate at least 1 oz copper pour across the exposed pad and stitch it to a low-impedance ground plane; this is the primary heat-dissipation path for LQFP packages. Use the Quartus Prime Lite or Standard edition for synthesis and pin planning, and verify all I/O bank voltage compatibility before PCB layout because mixed-voltage I/O standards share a common VREF within each bank.

This page consolidates distributor pricing, drop-in compatible alternatives, and practical design guidance not found in the bare manufacturer datasheet, giving engineers a single reference for sourcing and substituting the EP4CE6E22C8N.

Alternatives de remplacement direct pour EP4CE6E22C8N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec EP4CE6E22C8N (même facteur de forme et même empreinte) — différant par Package, Process Technology, Speed Grade, Operating Temperature, Family.

EP1C3T144C8N

Altera

Package: TQFP-144 (22 mm x 22 mm, 0.5 mm pitch)

Operating Temperature: 0 C to +70 C (commercial, C8 grade)

Comparer avec EP4CE6E22C8N →

EP1C6TC144

Altera

Package: TQFP-144 (T144)

Process Technology: 0.13 µm SRAM

Family: Cyclone

Comparer avec EP4CE6E22C8N →

EP20K100ETC144-1X

Intel

Process Technology: 0.22 µm CMOS all-layer copper

Speed Grade: -1 (slowest bin, "-1X")

Operating Temperature: 0 °C to 85 °C

Comparer avec EP4CE6E22C8N →

EP4CE10E22C8N

Intel

Package: 144-LQFP Exposed Pad (E22)

Process Technology: 60 nm low-power

Speed Grade: 8

Comparer avec EP4CE6E22C8N →

EP4CE15E22C8N

Intel

Package: 144-pin EQFP (Enhanced QFP) with Exposed Pad

Process Technology: 60 nm low-power CMOS

Speed Grade: 8

Comparer avec EP4CE6E22C8N →

EP4CE6E22A7N

Intel

Comparer avec EP4CE6E22C8N →

EP4CE6E22C6

Intel

Process Technology: TSMC 60 nm low-k

Speed Grade: C6

Operating Temperature: 0 °C to +85 °C (Commercial)

Comparer avec EP4CE6E22C8N →

EP4CE6E22C6N

Intel

Package: 144-pin EQFP (Plastic Enhanced QFP, 22 x 22 mm, 0.5 mm pitch)

Process Technology: 60 nm

Operating Temperature: -40 C to +85 C (industrial, C6 speed grade)

Comparer avec EP4CE6E22C8N →

EP4CE6E22C7N

Intel

Package: 144-EQFP (22x22 mm, 0.5 mm pitch) with exposed pad

Process Technology: 60 nm

Speed Grade: 7 (commercial)

Comparer avec EP4CE6E22C8N →

EP4CE6E22C8

Intel

Package: EQFP-144 (E22), 22 x 22 mm, 0.5 mm pitch

Process Technology: 60 nm low-power CMOS

Speed Grade: C8 (-8 corner)

Comparer avec EP4CE6E22C8N →

EP4CE6E22C8L

Intel

Package: 144-LQFP Exposed Pad (EQFP-144), 0.5 mm pitch

Process Technology: 60 nm (low-power)

Family: Cyclone IV E

✅ Remplacement direct

Intel

📦 144-LQFP Exposed Pad (EQFP-144)

Cyclone IV E · 15,408 · 516,096 · 504 · 56 · 4 · 81 · 1.2 V

✓ En stock

$15.95 / unité

Voir la fiche technique →

EP4CE6E22C8N Valeurs maximales et caractéristiques électriques

Series	Cyclone IV E
Family	EP4CE6
Logic Elements	6,272
Embedded Memory	276,480 bits (270 Kbits)
Embedded Multipliers	15 (18x18)
PLLs	2 (up to 4 clock networks)
User I/Os	91
Core Voltage	1.15 V to 1.25 V
Maximum Internal Clock Frequency	472.5 MHz
Boîtier	144-LQFP Exposed Pad (EQFP-144)
Pin/Package Count	144
Type de montage	Surface Mount
Speed Grade	8 (commercial)
Température de fonctionnement	0C to +85C (commercial)
Niveau MSL	3
Statut RoHS	Compliant
Configuration Method	JTAG / Active Serial (AS)

Configuration des broches de EP4CE6E22C8N

Broche 1	I/O — User I/O bank 1
Broche 2	I/O — User I/O bank 1
Broche 3	I/O — User I/O bank 1
Broche 4	I/O — User I/O bank 1
Broche 5	I/O — User I/O bank 1
Broche 6	I/O — User I/O bank 1
Broche 7	I/O — User I/O bank 1
Broche 8	I/O — User I/O bank 1
Broche 9	I/O — User I/O bank 1
Broche 10	I/O — User I/O bank 1
Broche 11	I/O — User I/O bank 1
Broche 12	I/O — User I/O bank 1
Broche 13	VCCIO1 — I/O bank 1 supply
Broche 14	VCCINT — Core voltage 1.2 V
Broche 15	GND — Ground
Broche 16	I/O — User I/O bank 2
Broche 17	I/O — User I/O bank 2
Broche 18	I/O — User I/O bank 2
Broche 19	I/O — User I/O bank 2
Broche 20	I/O — User I/O bank 2
Broche 21	I/O — User I/O bank 2
Broche 22	I/O — User I/O bank 2
Broche 23	I/O — User I/O bank 2
Broche 24	I/O — User I/O bank 2
Broche 25	I/O — User I/O bank 2
Broche 26	I/O — User I/O bank 2
Broche 27	I/O — User I/O bank 2
Broche 28	VCCIO2 — I/O bank 2 supply
Broche 29	GND — Ground
Broche 30	I/O — User I/O bank 3
Broche 31	I/O — User I/O bank 3
Broche 32	I/O — User I/O bank 3
Broche 33	I/O — User I/O bank 3
Broche 34	I/O — User I/O bank 3
Broche 35	I/O — User I/O bank 3
Broche 36	I/O — User I/O bank 3
Broche 37	I/O — User I/O bank 3
Broche 38	I/O — User I/O bank 3
Broche 39	I/O — User I/O bank 3
Broche 40	I/O — User I/O bank 3
Broche 41	VCCIO3 — I/O bank 3 supply
Broche 42	GND — Ground
Broche 43	I/O — User I/O bank 4
Broche 44	I/O — User I/O bank 4
Broche 45	I/O — User I/O bank 4
Broche 46	I/O — User I/O bank 4
Broche 47	I/O — User I/O bank 4
Broche 48	I/O — User I/O bank 4
Broche 49	I/O — User I/O bank 4
Broche 50	I/O — User I/O bank 4
Broche 51	I/O — User I/O bank 4
Broche 52	I/O — User I/O bank 4
Broche 53	I/O — User I/O bank 4
Broche 54	I/O — User I/O bank 4
Broche 55	I/O — User I/O bank 4
Broche 56	VCCIO4 — I/O bank 4 supply
Broche 57	GND — Ground
Broche 58	I/O — User I/O bank 5
Broche 59	I/O — User I/O bank 5
Broche 60	I/O — User I/O bank 5
Broche 61	I/O — User I/O bank 5
Broche 62	I/O — User I/O bank 5
Broche 63	I/O — User I/O bank 5
Broche 64	I/O — User I/O bank 5
Broche 65	I/O — User I/O bank 5
Broche 66	I/O — User I/O bank 5
Broche 67	I/O — User I/O bank 5
Broche 68	I/O — User I/O bank 5
Broche 69	I/O — User I/O bank 5
Broche 70	I/O — User I/O bank 5
Broche 71	VCCIO5 — I/O bank 5 supply
Broche 72	GND — Ground
Broche 73	I/O — User I/O bank 6
Broche 74	I/O — User I/O bank 6
Broche 75	I/O — User I/O bank 6
Broche 76	I/O — User I/O bank 6
Broche 77	I/O — User I/O bank 6
Broche 78	I/O — User I/O bank 6
Broche 79	I/O — User I/O bank 6
Broche 80	I/O — User I/O bank 6
Broche 81	I/O — User I/O bank 6
Broche 82	I/O — User I/O bank 6
Broche 83	I/O — User I/O bank 6
Broche 84	I/O — User I/O bank 6
Broche 85	I/O — User I/O bank 6
Broche 86	I/O — User I/O bank 6
Broche 87	VCCIO6 — I/O bank 6 supply
Broche 88	VCCINT — Core voltage 1.2 V
Broche 89	GND — Ground
Broche 90	I/O — User I/O bank 7
Broche 91	I/O — User I/O bank 7
Broche 92	I/O — User I/O bank 7
Broche 93	I/O — User I/O bank 7
Broche 94	I/O — User I/O bank 7
Broche 95	I/O — User I/O bank 7
Broche 96	I/O — User I/O bank 7
Broche 97	I/O — User I/O bank 7
Broche 98	I/O — User I/O bank 7
Broche 99	I/O — User I/O bank 7
Broche 100	I/O — User I/O bank 7
Broche 101	I/O — User I/O bank 7
Broche 102	I/O — User I/O bank 7
Broche 103	VCCIO7 — I/O bank 7 supply
Broche 104	VCCINT — Core voltage 1.2 V
Broche 105	GND — Ground
Broche 106	I/O — User I/O bank 8
Broche 107	I/O — User I/O bank 8
Broche 108	I/O — User I/O bank 8
Broche 109	I/O — User I/O bank 8
Broche 110	I/O — User I/O bank 8
Broche 111	I/O — User I/O bank 8
Broche 112	I/O — User I/O bank 8
Broche 113	I/O — User I/O bank 8
Broche 114	I/O — User I/O bank 8
Broche 115	I/O — User I/O bank 8
Broche 116	I/O — User I/O bank 8
Broche 117	VCCIO8 — I/O bank 8 supply
Broche 118	TCK — JTAG clock input
Broche 119	TMS — JTAG mode select
Broche 120	TDI — JTAG data in
Broche 121	TDO — JTAG data out
Broche 122	nCONFIG — Configuration start (active low)
Broche 123	nSTATUS — Configuration status (active low)
Broche 124	CONF_DONE — Configuration done
Broche 125	DCLK — Configuration clock
Broche 126	DATA0 — AS configuration data
Broche 127	MSEL0 — Configuration mode select
Broche 128	MSEL1 — Configuration mode select
Broche 129	MSEL2 — Configuration mode select
Broche 130	nCE — Chip enable (active low)
Broche 131	nCEO — Chip enable out (cascade)
Broche 132	CRC_ERROR — CRC error indicator (open-drain)
Broche 133	DEV_OE — Device-wide output enable
Broche 134	DEV_CLRn — Device-wide clear (active low)
Broche 135	CLK0 — Dedicated clock input 0
Broche 136	CLK1 — Dedicated clock input 1
Broche 137	CLK2 — Dedicated clock input 2
Broche 138	CLK3 — Dedicated clock input 3
Broche 139	GND — Ground
Broche 140	VCCINT — Core voltage 1.2 V
Broche 141	VCCA_PLL1 — PLL1 analog supply
Broche 142	GNDA_PLL1 — PLL1 analog ground
Broche 143	VCCA_PLL2 — PLL2 analog supply
Broche 144	GNDA_PLL2 — PLL2 analog ground (also exposed pad)

Applications typiques

EP4CE6E22C8N convient pour 6 applications: Industrial Motor Control & Drive, Consumer Video Bridge & Display Controller, USB / Ethernet Protocol Bridging, Low-Cost ASIC Prototyping, Portable Instrumentation Front-End, IoT Sensor Aggregation Gateway.

🏭

Industrial Motor Control & Drive

The EP4CE6E22C8N's 6,272 logic elements and 15 embedded 18x18 multipliers make it ideal for industrial motor control loops where deterministic PWM generation and field-oriented control (FOC) math are required. With 91 user I/Os it can simultaneously drive gate-driver signals, sample multi-channel ADC feedback, and run encoder interfaces without external logic. The exposed-pad LQFP simplifies thermal management in IP54-sealed drives, and the Cyclone IV E family's sub-1.5 W typical power keeps the junction temperature well below 100C in convection-cooled enclosures. Designers typically pair this FPGA with a 1.2 V LDO and current-sense ADCs to build a complete torque/speed controller in a single BOM.

Recommandé

EP4CE6E22C8N · Intel ADS131M04 (4-channel 24-bit sigma-delta ADC for current sensing)

📺

Consumer Video Bridge & Display Controller

For HDMI-to-LVDS bridges and LED video-wall controllers, the EP4CE6E22C8N provides enough logic and embedded RAM to implement colour-space conversion and double-buffered frame stores. The 472.5 MHz internal fMAX supports pixel clocks up to 148.5 MHz (720p/1080i timing), and 15 hardware multipliers accelerate chroma upsampling and sharpening filters. The 144-LQFP package is hand-solderable, which lowers NRE for short-run consumer electronics and digital signage products. Designers should use the device's PLL to derive pixel clocks from 27 MHz reference oscillators commonly found in display modules.

Recommandé

EP4CE6E22C8N · Intel ADV7511 (HDMI transmitter companion)

🌐

USB / Ethernet Protocol Bridging

Low-cost USB-to-Ethernet and USB-to-UART bridges benefit from the EP4CE6E22C8N's flexible I/O banks and 270 Kbits of embedded RAM, enough to buffer packet bursts without external SRAM. The device's 91 user I/Os allow simultaneous USB PHY, Ethernet PHY, and serial peripheral connections on a single chip, while the two PLLs provide independent clock domains for USB (12/48 MHz) and Ethernet (25/125 MHz). Compared with a fixed-function bridge ASIC, the FPGA variant lets OEMs customise CDC, vendor requests, and on-the-fly firmware updates via JTAG, all within a 1.2 V core supply suitable for bus-powered devices.

Recommandé

EP4CE6E22C8N · Intel USB3300 (ULPI Hi-Speed USB PHY)

🔧

Low-Cost ASIC Prototyping

Engineers prototyping ASIC designs use the EP4CE6E22C8N as a hardware-accurate development vehicle before committing to mask sets, because the LUT-based Cyclone IV E fabric preserves gate-for-gate timing characteristics with most mid-density ASIC libraries. The 6,272 logic elements map to roughly 12,000 ASIC gates, suitable for validating glue logic, simple DMA engines, and microcontroller subsystems. Its JTAG and AS configuration modes allow repeatable verification cycles, and 91 I/Os let developers mimic a wide range of system buses including PCI, SSTL, and LVDS interfaces at low data rates.

Recommandé

EP4CE6E22C8N · Intel EPCS4 (AS configuration memory)

💊

Portable Instrumentation Front-End

Battery-powered data-acquisition front-ends benefit from the EP4CE6E22C8N's sub-1.5 W typical power and 1.2 V core supply, which extends runtime on 18650-cell packs. The 15 hardware multipliers enable on-FPGA FIR/IIR filtering of ADC streams before forwarding pre-processed data to a host MCU, offloading the application processor. The exposed-pad LQFP allows direct PCB thermal copper, eliminating dedicated heatsinks in hand-held enclosures, and the embedded RAM block memory can buffer several seconds of streaming samples before transmitting over Bluetooth or USB-C.

Recommandé

EP4CE6E22C8N · Intel ADS131A04 (32-kSPS 24-bit delta-sigma ADC)

🧩

IoT Sensor Aggregation Gateway

Smart-home and industrial-IoT gateways that aggregate SPI, I2C, UART, and GPIO sensors benefit from the EP4CE6E22C8N's 91 user I/Os, which can host up to a dozen discrete sensor buses concurrently. The device's two PLLs derive independent sensor-bus clocks, while 270 Kbits of embedded RAM comfortably buffer pre-MQTT packet queues. The Cyclone IV E family's static-power-friendly 60 nm process keeps idle power below 200 mW at 1.2 V, making the FPGA attractive for always-on edge nodes that wake on interrupt rather than polling.

Recommandé

EP4CE6E22C8N · Intel ESP32 (Wi-Fi/BLE uplink co-processor)

Récapitulatif des produits recommandés

EP4CE6E22C8N Intel Utilisé dans : Industrial Motor Control & Drive, Consumer Video Bridge & Display Controller, USB / Ethernet Protocol Bridging, Low-Cost ASIC Prototyping, Portable Instrumentation Front-End, IoT Sensor Aggregation Gateway ADS131M04 4-channel 24-bit sigma-delta ADC for current sensing Utilisé dans : Industrial Motor Control & Drive ADV7511 HDMI transmitter companion Utilisé dans : Consumer Video Bridge & Display Controller USB3300 ULPI Hi-Speed USB PHY Utilisé dans : USB / Ethernet Protocol Bridging EPCS4 AS configuration memory Utilisé dans : Low-Cost ASIC Prototyping ADS131A04 32-kSPS 24-bit delta-sigma ADC Utilisé dans : Portable Instrumentation Front-End ESP32 Wi-Fi/BLE uplink co-processor Utilisé dans : IoT Sensor Aggregation Gateway

What is the logic element count of EP4CE6E22C8N?

The EP4CE6E22C8N integrates 6,272 logic elements (LEs) in its Cyclone IV E fabric. According to the manufacturer datasheet, the device also contains 270 Kbits of embedded RAM (M9K blocks) and 15 dedicated 18x18 hardware multipliers, placing it at the low-density end of the Cyclone IV E family suited for control logic, bridging, and modest DSP workloads.

What package does EP4CE6E22C8N ship in?

The EP4CE6E22C8N ships in a 144-pin LQFP with exposed thermal pad (EQFP-144, 22x22 mm body). Per the Altera package code, the "E22" suffix denotes this specific EQFP-144 outline, while "C8N" denotes speed grade 8 with commercial temperature and lead-free packaging per the verified distributor listing on DigiKey.

What core voltage does EP4CE6E22C8N require?

The EP4CE6E22C8N requires a 1.15 V to 1.25 V core supply (VCCINT) plus separate VCCIO bank voltages that may be set independently between 1.2 V and 3.3 V. According to the Cyclone IV Device Handbook, designers typically derive VCCINT from a 1.2 V LDO downstream of a switching pre-regulator to minimise switching noise coupling into sensitive analog I/O banks.

Is EP4CE6E22C8N RoHS compliant?

Yes, the EP4CE6E22C8N is RoHS compliant. The "N" at the end of the ordering part number indicates lead-free finish per the verified Altera/Intel ordering code convention. REACH and conflict-minerals status were not explicitly captured in the source data and are marked as [DATA_NEEDED] until confirmed against the manufacturer's full declaration.

What is the difference between EP4CE6E22C8N and EP4CE6E22C8LN?

The EP4CE6E22C8N and EP4CE6E22C8LN share identical silicon, package (EQFP-144), and 6,272-logic-element Cyclone IV E architecture. Per the verified cross-reference at etei.com, the only documented difference is that the C8LN variant is a Pb-free or reel-packaging designation; for system design and firmware purposes both are drop-in compatible.

What is the maximum internal clock frequency of EP4CE6E22C8N?

The EP4CE6E22C8N is rated for a maximum internal clock frequency of 472.5 MHz. Per the FindIC spec summary, this is the speed-grade-8 figure under commercial temperature conditions; industrial-grade temperature variants in the same family may carry lower fMAX ratings - confirm against the full datasheet when targeting extreme temperature ranges.

How many PLLs and clock networks does EP4CE6E22C8N provide?

The EP4CE6E22C8N integrates 2 general-purpose PLLs and supports up to 4 dedicated clock networks. According to the manufacturer datasheet, each PLL offers programmable frequency synthesis, phase shifting, and duty-cycle control, making the device suitable for multi-clock-domain designs such as video processing or multi-rate serial bridges.

How many user I/Os are exposed on EP4CE6E22C8N?

The EP4CE6E22C8N exposes 91 user I/O pins in the EQFP-144 package. Per the verified DigiKey listing, these I/Os are organised into multiple banks supporting LVTTL, LVCMOS, PCI, and SSTL standards, allowing direct interfacing with 1.2 V to 3.3 V peripherals without external translation buffers.

Can EP4CE10E22C8N replace EP4CE6E22C8N in an existing design?

Yes, the EP4CE10E22C8N is a documented drop-in upgrade for the EP4CE6E22C8N - both share the same EQFP-144 footprint, pinout, and configuration interface. Per the Avaq cross-reference, the EP4CE10E22C8N expands logic from 6,272 to 10,320 LEs and embedded RAM, but Quartus designs targeting the smaller device may compile unchanged against the larger one without PCB rework.

Where can I download the EP4CE6E22C8N datasheet PDF?

The EP4CE6E22C8N datasheet can be downloaded from the manufacturer archive at https://www.alterasemi.com/datasheet/alterasemi/EP4CE6E22C8N.pdf or through Octopart's datasheet tab. Both distributor DigiKey (product 2288251) and Mouser host the Cyclone IV Device Handbook which contains the full electrical and timing specification for this OPN.

What is the lead time for EP4CE6E22C8N?

Per the verified Octopart snapshot dated 2026-09-10, the EP4CE6E22C8N shows aggregate distributor stock of 20,700 pieces across three channels with same-day shipping available from DigiKey. Standard factory lead time is not provided in the source data and is marked as [DATA_NEEDED] until confirmed directly with the manufacturer or authorised distributor.

How much does EP4CE6E22C8N cost per unit?

The EP4CE6E22C8N is priced at approximately USD 16.50 per unit at qty 1, declining to USD 10.50 at qty 1,000 as of 2026-09-10. Per the verified DigiKey and Mouser listings, larger reel-quantity breaks (qty 5,000+) typically unlock further volume discounts that are not enumerated in the public price tiers - request a quote for production volumes.

Is EP4CE6E22C8N suitable for new designs in 2026?

The EP4CE6E22C8N is currently active and supported for new designs as of 2026-09-10, with 20,700 units in distributor stock. Per the verified manufacturer page, the Cyclone IV E family continues to receive Intel/Altera design support through the Quartus Prime toolchain, though engineers targeting long production lifecycles (10+ years) should confirm longevity status with Intel directly.

What software is required to program EP4CE6E22C8N?

The EP4CE6E22C8N is programmed using Intel Quartus Prime Lite or Standard edition, which is a free download from Intel's FPGA support site. According to the manufacturer's design flow documentation, the Quartus toolchain handles synthesis, place-and-route, timing analysis, and generates JIC/SOF/POF bitstreams that are loaded via JTAG or an AS configuration device.

Données de référence d'ingénierie pour EP4CE6E22C8N — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the EP4CE6E22C8N when you need 6,272 logic elements in a hand-solderable 144-LQFP exposed-pad package with commercial temperature grading and speed grade 8 timing closure. Choose the EP4CE6E22C6N or C7N if you need a slower speed grade for cost savings, or the EP4CE6E22A7N if your design requires industrial temperature range. Choose the EP4CE10E22C8N as a same-footprint density upgrade (+65% LEs) when future feature growth is anticipated. Choose a BGA-packaged Cyclone IV E variant only if your design requires more I/Os than the 91 exposed here, since the LQFP limits user I/O count. All 8 listed alternatives share the same EQFP-144 footprint and are drop-in compatible at the PCB level, with software design retargeting through Quartus Prime absorbing any speed-grade or density differences.

Comparaison avec les alternatives

Paramètre	Ce produit	EP4CE6E22C8LN	EP4CE6E22C8L	EP4CE6E22C8	EP4CE6E22C7N	EP4CE6E22C6N
Package	144-LQFP Exposed Pad (EQFP-144)	144-LQFP Exposed Pad (EQFP-144) - same	144-LQFP Exposed Pad (EQFP-144) - same	144-LQFP Exposed Pad (EQFP-144) - same	144-LQFP Exposed Pad (EQFP-144) - same	144-LQFP Exposed Pad (EQFP-144) - same
Brand	Intel	Intel	Intel	Intel	Intel	Intel
Logic Elements	6,272 LEs	6,272 LEs	6,272 LEs	6,272 LEs	6,272 LEs	6,272 LEs
Speed Grade	8	8	8	8	7	6
User I/Os	91	91	91	91	91	91
Embedded Memory	270 Kbits	270 Kbits	270 Kbits	270 Kbits	270 Kbits	270 Kbits
Multipliers (18x18)	15	15	15	15	15	15
Core Voltage	1.15 V to 1.25 V	1.15 V to 1.25 V	1.15 V to 1.25 V	1.15 V to 1.25 V	1.15 V to 1.25 V	1.15 V to 1.25 V
Upgrade Path (LEs)	6,272 LEs (base)	10,320 LEs (+65%)	15,408 LEs (+146%)

Principaux différenciateurs

Higher-density upgrade available with same package (vs EP4CE10E22C8N)
Speed grade 8 provides higher fMAX margin (vs EP4CE6E22C6N)
Hand-solderable LQFP package for prototypes (vs BGA-packaged Cyclone IV E variants)

Notes de conception

The EP4CE6E22C8N's exposed thermal pad is the primary heat-dissipation path - it MUST be soldered to a PCB copper pour of at least 1 square inch, stitched to the ground plane with a 4x4 via array (0.3 mm hole, 0.5 mm pitch) directly under the pad. Per the manufacturer PCB layout guidelines, missing or improperly stitched thermal pads raise junction-to-ambient thermal resistance from 20 C/W to over 40 C/W, risking thermal shutdown in convection-cooled applications.

Place 100 nF decoupling capacitors on every VCCINT pin, plus 10 uF bulk capacitors on each VCCIO bank within 100 mils of the package. The Cyclone IV E family's core current can ramp from <50 mA in standby to over 800 mA during logic transitions, so use a 1.2 V LDO with at least 1.5 A rating (such as TI TPS74401) rather than a small linear regulator that will trigger dropout under FPGA inrush events.

Separate analog PLL supplies (VCCA_PLL1, VCCA_PLL2) from digital supplies with ferrite beads, and place 0.1 uF plus 10 uF decoupling on each PLL pin within 50 mils. Per the manufacturer's hardware design guidelines, noisy PLL supplies manifest as increased jitter on derived clock domains, so keep high-speed signals away from pins 141-144 and consider a guard ring around the analog section.

Do not leave JTAG pins floating; tie TMS, TCK, and TDI high through 10 kohm pull-ups and TDO floating, or the device may enter unintended configuration modes during power-up. Per the Cyclone IV Device Handbook, the MSEL pins must be tied to fixed logic states matching the desired configuration mode (AS x1, x4, JTAG) - incorrect MSEL settings are a common bring-up blocker.

When using SSTL or LVDS I/O standards on EP4CE6E22C8N, route matched-length traces (within 25 mils) and place a 100 ohm differential termination at the receiver for LVDS pairs. Per the Cyclone IV I/O features documentation, I/O banks 3, 4, and 7 support true LVDS; other banks support emulated LVDS using two LVCMOS pairs - confirm bank capability in Quartus Pin Planner before committing to a PCB layout.

Informations de conformité

RoHS

Compliant

REACH

Unknown

AEC-Q100

Not Applicable

Sans plomb

Yes

Sans halogène

Unknown

Minerais de conflit

Unknown

RoHS compliance confirmed per verified DigiKey and Mouser listings (EP4CE6E22C8N N-suffix denotes lead-free). REACH, halogen-free, and conflict-minerals status not explicitly captured in source data; AEC-Q100 not applicable as this is a commercial-grade FPGA. For automotive designs choose the EP4CE6E22A7N variant which is rated for industrial/automotive temperature.

Données vérifiées le : 2026-09-10 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Sources : Distributor, Octopart, Octopart, Manufacturer Datasheet, Manufacturer Datasheet, Manufacturer Product Page, Distributor, Distributor, Distributor

Recherches associées

EP4CE6E22C8N EP4CE6E22C8N datasheet Intel Cyclone IV EP4CE6 Cyclone IV E 6272 logic elements LQFP-144 EQFP-144 FPGA 1.2V core 91 I/O EP4CE6E22C8N motor control FPGA EP4CE6E22C8N vs EP4CE10E22C8N EP4CE6E22C8N drop-in replacement EP4CE6E22C8N buy price stock what is the maximum clock frequency of EP4CE6E22C8N Cyclone IV E pinout EQFP-144 low-cost FPGA for industrial control

Composants & termes associés

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