EP1C3T144C6 - Cyclone I FPGA, 2,910 LEs, 144-TQFP | Altera
Référence : EP1C3T144C6 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $26.27 | $26,27 |
| 10 | $23.64 | $236,40 |
| 100 | $21.27 | $2 127,00 |
| 500 | $19.18 | $9 590,00 |
| 1 000 | $17.32 | $17 320,00 |
EP1C3T144C6 Présentation
An FPGA (Field-Programmable Gate Array) is a reprogrammable logic device that bridges the gap between fixed-function ASICs and discrete glue logic. Architecturally, an FPGA sits within the programmable logic hierarchy as: programmable logic device (PLD) -> FPGA -> SRAM-based FPGA -> Cyclone family. The Cyclone I family specifically targets low-cost, high-volume applications such as digital signal processing bridges, custom peripheral controllers, and protocol converters, offering ASIC-like integration with the design flexibility of in-system programmability.
Key features that distinguish EP1C3T144C6 include 13 M4K RAM blocks (each 4 Kbit plus parity), a configuration scheme supporting JTAG, Active Serial (AS), and Passive Serial (PS) modes with the EPC2 configuration device family, and dual-purpose clock pins that can drive up to 8 global clock networks. The PLLs are not available on the smallest Cyclone I members, and this device contains zero embedded PLLs, so all clock management is handled by global clock trees and dedicated clock pin inputs. I/O standards supported include LVTTL, LVCMOS, SSTL-2, SSTL-3, and PCI, with the TQFP-144 package providing the largest 104-I/O option in the EP1C3 density.
Typical applications span digital video processing front-ends, industrial motor-control state machines, custom bus bridges (e.g., legacy-to-PCI bridging), and prototype ASIC replacement. The Cyclone I architecture is also widely used in cost-sensitive education platforms and reference designs where Quartus II design flow is already in place. The -6 speed grade is the fastest commercial speed grade in the family, suiting timing-critical glue logic.
When designing with the EP1C3T144C6, ensure the 1.5 V core supply is decoupled with 0.1 µF and 10 µF capacitors placed as close to each VCCINT/VCCIO pair as the 144-TQFP pinout allows. JTAG chain integrity must be preserved during in-system programming by buffering TCK with a series resistor to suppress reflections. Designers should verify I/O bank voltage compatibility before assigning pins because the EP1C3T144 has four I/O banks, each capable of supporting a different I/O standard independently.
Alternatives de remplacement direct pour EP1C3T144C6 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1C3T144C6 (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Speed Grade, Configuration Mode, Mounting Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1C3T144C6N
✅ Remplacement direct✓ En stock
$11.94 / unité
Voir la fiche technique →EP1C3T144C8N
✅ Remplacement direct✓ En stock
$14.1 / unité
Voir la fiche technique →EP1C3T144C7N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$16.2 / unité
Voir la fiche technique →EP1C3T100C6N
✅ Remplacement direct✓ En stock
$13.5 / unité
Voir la fiche technique →EP1C3T144C6 Valeurs maximales et caractéristiques électriques
| Family | Cyclone I |
| Logic Elements | 2,910 |
| Logic Array Blocks (LABs) | 291 |
| Total RAM Bits | 59,904 |
| Embedded Multipliers (18x18) | 1 |
| M4K RAM Blocks | 13 |
| Maximum User I/Os | 104 |
| Boîtier | 144-LQFP (TQFP-144) |
| Température de fonctionnement | 0 °C to +85 °C (Commercial) |
| Speed Grade | -6 |
| Core Voltage (VCCINT) | 1.5 V |
| I/O Bank Count | 4 |
| Configuration Modes | JTAG, Active Serial, Passive Serial |
| Process Technology | 0.13 µm SRAM |
| Type de montage | Surface Mount |
Configuration des broches de EP1C3T144C6
| Broche 1 | I/O BANK1 — User I/O (Bank 1) |
| Broche 2 | I/O BANK1 — User I/O (Bank 1) |
| Broche 3 | I/O BANK1 — User I/O (Bank 1) |
| Broche 4 | I/O BANK1 — User I/O (Bank 1) |
| Broche 5 | I/O BANK1 — User I/O (Bank 1) |
| Broche 6 | I/O BANK1 — User I/O (Bank 1) |
| Broche 7 | I/O BANK1 — User I/O (Bank 1) |
| Broche 8 | I/O BANK1 — User I/O (Bank 1) |
| Broche 9 | I/O BANK1 — User I/O (Bank 1) |
| Broche 10 | I/O BANK1 — User I/O (Bank 1) |
| Broche 11 | VCCIO1 — I/O Bank 1 supply voltage |
| Broche 12 | I/O BANK2 — User I/O (Bank 2) |
| Broche 13 | I/O BANK2 — User I/O (Bank 2) |
| Broche 14 | I/O BANK2 — User I/O (Bank 2) |
| Broche 15 | I/O BANK2 — User I/O (Bank 2) |
| Broche 16 | I/O BANK2 — User I/O (Bank 2) |
| Broche 17 | I/O BANK2 — User I/O (Bank 2) |
| Broche 18 | I/O BANK2 — User I/O (Bank 2) |
| Broche 19 | I/O BANK2 — User I/O (Bank 2) |
| Broche 20 | I/O BANK2 — User I/O (Bank 2) |
| Broche 21 | I/O BANK2 — User I/O (Bank 2) |
| Broche 22 | I/O BANK2 — User I/O (Bank 2) |
| Broche 23 | I/O BANK2 — User I/O (Bank 2) |
| Broche 24 | I/O BANK2 — User I/O (Bank 2) |
| Broche 25 | I/O BANK2 — User I/O (Bank 2) |
| Broche 26 | I/O BANK2 — User I/O (Bank 2) |
| Broche 27 | VCCIO2 — I/O Bank 2 supply voltage |
| Broche 28 | I/O BANK2 — User I/O (Bank 2) |
| Broche 29 | I/O BANK2 — User I/O (Bank 2) |
| Broche 30 | I/O BANK2 — User I/O (Bank 2) |
| Broche 31 | I/O BANK2 — User I/O (Bank 2) |
| Broche 32 | I/O BANK2 — User I/O (Bank 2) |
| Broche 33 | I/O BANK2 — User I/O (Bank 2) |
| Broche 34 | I/O BANK2 — User I/O (Bank 2) |
| Broche 35 | I/O BANK2 — User I/O (Bank 2) |
| Broche 36 | I/O BANK2 — User I/O (Bank 2) |
| Broche 37 | I/O BANK3 — User I/O (Bank 3) |
| Broche 38 | I/O BANK3 — User I/O (Bank 3) |
| Broche 39 | I/O BANK3 — User I/O (Bank 3) |
| Broche 40 | I/O BANK3 — User I/O (Bank 3) |
| Broche 41 | I/O BANK3 — User I/O (Bank 3) |
| Broche 42 | I/O BANK3 — User I/O (Bank 3) |
| Broche 43 | I/O BANK3 — User I/O (Bank 3) |
| Broche 44 | I/O BANK3 — User I/O (Bank 3) |
| Broche 45 | I/O BANK3 — User I/O (Bank 3) |
| Broche 46 | I/O BANK3 — User I/O (Bank 3) |
| Broche 47 | I/O BANK3 — User I/O (Bank 3) |
| Broche 48 | I/O BANK3 — User I/O (Bank 3) |
| Broche 49 | I/O BANK3 — User I/O (Bank 3) |
| Broche 50 | I/O BANK3 — User I/O (Bank 3) |
| Broche 51 | VCCIO3 — I/O Bank 3 supply voltage |
| Broche 52 | I/O BANK3 — User I/O (Bank 3) |
| Broche 53 | I/O BANK3 — User I/O (Bank 3) |
| Broche 54 | I/O BANK3 — User I/O (Bank 3) |
| Broche 55 | I/O BANK3 — User I/O (Bank 3) |
| Broche 56 | I/O BANK3 — User I/O (Bank 3) |
| Broche 57 | I/O BANK3 — User I/O (Bank 3) |
| Broche 58 | I/O BANK3 — User I/O (Bank 3) |
| Broche 59 | I/O BANK3 — User I/O (Bank 3) |
| Broche 60 | I/O BANK3 — User I/O (Bank 3) |
| Broche 61 | I/O BANK3 — User I/O (Bank 3) |
| Broche 62 | I/O BANK3 — User I/O (Bank 3) |
| Broche 63 | I/O BANK3 — User I/O (Bank 3) |
| Broche 64 | VCCIO4 — I/O Bank 4 supply voltage |
| Broche 65 | I/O BANK4 — User I/O (Bank 4) |
| Broche 66 | I/O BANK4 — User I/O (Bank 4) |
| Broche 67 | I/O BANK4 — User I/O (Bank 4) |
| Broche 68 | I/O BANK4 — User I/O (Bank 4) |
| Broche 69 | I/O BANK4 — User I/O (Bank 4) |
| Broche 70 | I/O BANK4 — User I/O (Bank 4) |
| Broche 71 | I/O BANK4 — User I/O (Bank 4) |
| Broche 72 | I/O BANK4 — User I/O (Bank 4) |
| Broche 73 | I/O BANK4 — User I/O (Bank 4) |
| Broche 74 | I/O BANK4 — User I/O (Bank 4) |
| Broche 75 | I/O BANK4 — User I/O (Bank 4) |
| Broche 76 | I/O BANK4 — User I/O (Bank 4) |
| Broche 77 | I/O BANK4 — User I/O (Bank 4) |
| Broche 78 | I/O BANK4 — User I/O (Bank 4) |
| Broche 79 | I/O BANK4 — User I/O (Bank 4) |
| Broche 80 | I/O BANK4 — User I/O (Bank 4) |
| Broche 81 | I/O BANK4 — User I/O (Bank 4) |
| Broche 82 | I/O BANK4 — User I/O (Bank 4) |
| Broche 83 | I/O BANK4 — User I/O (Bank 4) |
| Broche 84 | I/O BANK4 — User I/O (Bank 4) |
| Broche 85 | I/O BANK4 — User I/O (Bank 4) |
| Broche 86 | I/O BANK4 — User I/O (Bank 4) |
| Broche 87 | I/O BANK4 — User I/O (Bank 4) |
| Broche 88 | I/O BANK4 — User I/O (Bank 4) |
| Broche 89 | I/O BANK4 — User I/O (Bank 4) |
| Broche 90 | I/O BANK4 — User I/O (Bank 4) |
| Broche 91 | I/O BANK4 — User I/O (Bank 4) |
| Broche 92 | I/O BANK4 — User I/O (Bank 4) |
| Broche 93 | I/O BANK4 — User I/O (Bank 4) |
| Broche 94 | I/O BANK4 — User I/O (Bank 4) |
| Broche 95 | I/O BANK4 — User I/O (Bank 4) |
| Broche 96 | I/O BANK4 — User I/O (Bank 4) |
| Broche 97 | I/O BANK4 — User I/O (Bank 4) |
| Broche 98 | I/O BANK4 — User I/O (Bank 4) |
| Broche 99 | I/O BANK4 — User I/O (Bank 4) |
| Broche 100 | I/O BANK4 — User I/O (Bank 4) |
| Broche 101 | I/O BANK4 — User I/O (Bank 4) |
| Broche 102 | I/O BANK4 — User I/O (Bank 4) |
| Broche 103 | I/O BANK4 — User I/O (Bank 4) |
| Broche 104 | I/O BANK4 — User I/O (Bank 4) |
| Broche 105 | GND — Ground |
| Broche 106 | VCCINT — Core supply voltage (1.5 V) |
| Broche 107 | GND — Ground |
| Broche 108 | VCCINT — Core supply voltage (1.5 V) |
| Broche 109 | GND — Ground |
| Broche 110 | nCONFIG — Configuration control |
| Broche 111 | nSTATUS — Configuration status |
| Broche 112 | CONF_DONE — Configuration done |
| Broche 113 | TCK — JTAG test clock |
| Broche 114 | TMS — JTAG test mode select |
| Broche 115 | TDI — JTAG test data in |
| Broche 116 | TDO — JTAG test data out |
| Broche 117 | MSEL0 — Configuration mode select 0 |
| Broche 118 | MSEL1 — Configuration mode select 1 |
| Broche 119 | DCLK — Configuration clock input |
| Broche 120 | DATA0 — Configuration data input 0 |
| Broche 121 | DATA1 — Configuration data input 1 |
| Broche 122 | DATA2 — Configuration data input 2 |
| Broche 123 | DATA3 — Configuration data input 3 |
| Broche 124 | DATA4 — Configuration data input 4 |
| Broche 125 | DATA5 — Configuration data input 5 |
| Broche 126 | DATA6 — Configuration data input 6 |
| Broche 127 | DATA7 — Configuration data input 7 |
| Broche 128 | nCE — Chip enable (active low) |
| Broche 129 | nCEO — Chip enable out (for multi-device chain) |
| Broche 130 | CLK0 — Dedicated clock input 0 |
| Broche 131 | CLK1 — Dedicated clock input 1 |
| Broche 132 | CLK2 — Dedicated clock input 2 |
| Broche 133 | CLK3 — Dedicated clock input 3 |
| Broche 134 | GND — Ground |
| Broche 135 | VCCINT — Core supply voltage (1.5 V) |
| Broche 136 | GND — Ground |
| Broche 137 | VCCINT — Core supply voltage (1.5 V) |
| Broche 138 | GND — Ground |
| Broche 139 | I/O BANK1 — User I/O (Bank 1) |
| Broche 140 | I/O BANK1 — User I/O (Bank 1) |
| Broche 141 | I/O BANK1 — User I/O (Bank 1) |
| Broche 142 | I/O BANK1 — User I/O (Bank 1) |
| Broche 143 | I/O BANK1 — User I/O (Bank 1) |
| Broche 144 | I/O BANK1 — User I/O (Bank 1) |
Applications typiques
EP1C3T144C6 convient pour 6 applications: Industrial Glue Logic & Bus Bridge, Custom Peripheral Controller (PCI Card), Digital Video Processing Front-End, Prototype ASIC Replacement, Educational FPGA Board, Legacy System Refresh / Obsolete Replacement.
Industrial Glue Logic & Bus Bridge
The EP1C3T144C6 excels at custom glue logic and bus bridging tasks where 2,910 LEs and 104 user I/Os are sufficient to implement a soft bridge between legacy 8/16-bit buses and modern controllers. Its 1.5 V core and 4 independent I/O banks support 3.3 V LVTTL and PCI signaling simultaneously, which fits the typical mixed-voltage backplane of industrial PLC and motor-drive racks. The -6 commercial speed grade handles sub-200 MHz state machines comfortably for protocol conversion at moderate rates. Compared to discrete 74-series glue logic, one EP1C3T144C6 replaces dozens of packages while remaining in-system programmable via JTAG, accelerating late-stage bug fixes without board rework.
Recommandé
Custom Peripheral Controller (PCI Card)
The EP1C3T144C6's PCI-capable I/O bank makes it a natural fit for low-cost PCI add-in cards that need a custom state machine or data path. With 2,910 LEs, designers can implement a 32-bit PCI target state machine plus application logic in a single device. The 144-TQFP exposes all required PCI control signals (FRAME#, IRDY#, TRDY#, DEVSEL#, IDSEL, REQ#, GNT#) alongside the data bus and configuration JTAG chain. The -6 speed grade meets the 33 MHz PCI clock domain comfortably. As an upgrade path, the EP4CE6E144 (Cyclone IV E) provides more LEs and PLLs while keeping the same 144-pin EQFP footprint.
Recommandé
Digital Video Processing Front-End
Although modest, the EP1C3T144C6 supports small digital video front-end tasks such as line buffering, frame synchronization, and chroma re-sampling. Its 13 M4K RAM blocks (4 Kbit each, ~59 Kbits total) fit two video lines at common resolutions like CIF or QCIF, and the single 18x18 multiplier can handle FIR taps for chroma interpolation. The 4 I/O banks allow routing video pixel clocks, sync, and pixel data on separate voltage domains to avoid noise coupling into analog video stages. The -6 speed grade handles 27 MHz video pixel clocks with timing margin to spare. For larger video designs, scale to EP1C6 or EP1C12 density.
Recommandé
Prototype ASIC Replacement
The EP1C3T144C6 is widely used as a low-NRE prototype for designs that will eventually migrate to a hard ASIC. With 2,910 LEs and 104 I/Os in a 144-TQFP, designers can implement and validate full custom logic, peripheral glue, and protocol stacks in-system before committing to NRE silicon. The Quartus II design flow supports direct RTL mapping with pin assignments that can later be carried forward to ASIC libraries. The commercial 0 °C to +85 °C operating range covers most prototype validation environments. For production, use EP4CE6E144 or Cyclone V families for ASIC-equivalent device life.
Recommandé
Educational FPGA Board
The EP1C3T144C6 powers a generation of university-level FPGA education boards because its 144-TQFP package is breadboard-friendly through 0.5 mm-pitch adapter boards and the Quartus II toolchain is freely licensed for students. With 2,910 LEs, learners can complete entire lab projects from combinational logic to UART controllers, VGA drivers, and small RISC soft-cores. The absence of PLLs actually simplifies first courses on synchronous design - students master global clock trees before tackling PLL-based frequency synthesis. The commercial temperature range covers lab environments; for robust student kits, choose the industrial -I7N variant.
Recommandé
Legacy System Refresh / Obsolete Replacement
Because the Cyclone I family is now obsolete, designers maintaining production equipment that depends on EP1C3T144C6 must source from independent distributor stock or migrate. The drop-in same-package replacement is EP1C3T144C6N (RoHS), EP1C3T144C8N (slower speed grade), or EP1C3T144C7N. For longer-term production continuity, the EP4CE6E144 in 144-EQFP delivers ~6,000 LEs, more RAM, 2 PLLs, and modern I/O standards while sharing the same JTAG-based design flow. The Altera/Intel last-time-buy notices have lapsed, so existing users should validate date codes and consider redesign.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1C3T144C6 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1C3T144C6N | EP1C3T144C8N | EP1C3T144C7N | EP1C3T100C6N |
|---|---|---|---|---|---|
| Package | 144-LQFP (TQFP-144) | 144-LQFP (TQFP-144) - same | 144-LQFP (TQFP-144) - same | 144-LQFP (TQFP-144) - same | 100-LQFP (TQFP-100) - different |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 2,910 | 2,910 | 2,910 | 2,910 | 2,910 |
| Speed Grade | -6 (fastest commercial) | -6 | -8 (slower) | -7 (intermediate) | -6 |
| Maximum User I/Os | 104 | 104 | 104 | 104 | ~66 (smaller package) |
| Embedded RAM (bits) | 59,904 | 59,904 | 59,904 | 59,904 | 59,904 |
| Embedded Multipliers (18x18) | 1 | 1 | 1 | 1 | 1 |
| Core Voltage (VCCINT) | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| RoHS Compliance | Non-RoHS (legacy) | RoHS compliant | RoHS compliant | RoHS compliant | RoHS compliant |
| Lifecycle Status | Obsolete (Cyclone I legacy) | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Smallest Cyclone I density in largest package option (144-TQFP, 104 I/Os) (vs EP1C3T100C6N (100-TQFP, ~66 I/Os))
- Fastest commercial speed grade (-6) of the EP1C3 family (vs EP1C3T144C8N)
- Legacy/non-RoHS variant suitable for repair of legacy industrial equipment (vs EP1C3T144C6N)
Notes de conception
The EP1C3T144C6 requires a tightly regulated 1.5 V VCCINT core supply capable of sourcing transient current during configuration; use a dedicated LDO (e.g., TPS7A4701 or LT1761) with bulk decoupling of 100 µF + 10 µF + 0.1 µF at each VCCINT pin pair (pins 106/108, 135/137). Each VCCIO bank (pins 11, 27, 51, 64) must be decoupled separately because the four I/O banks can run at different voltages; do not short VCCIO banks together unless the design intentionally uses a single I/O standard. Estimated: at 50% LE utilization and 100 MHz internal clock, ICC is approximately 100-200 mA; choose the LDO with at least 500 mA headroom.
Route the JTAG chain (TCK/TMS/TDI/TDO) with 4-6 mil traces and series-terminate TCK with a 33 Ω resistor near the FPGA pin to damp reflections when driving multiple JTAG devices. Place the EPC2 configuration PROM within 50 mm of the FPGA to keep DCLK and DATA[7..0] rise times under 2 ns. Reserve a no-connect zone under the TQFP-144 footprint to allow rework; the 0.5 mm pitch demands careful solder paste stencil design (5-mil apertures with nano-coating preferred) for first-pass yield.
MSEL0 and MSEL1 must be tied to specific logic levels for the chosen configuration mode (AS, PS, or JTAG-only); leaving them floating causes configuration failure. The EP1C3 has zero PLLs, so do not attempt to instantiate an ALTPLL megafunction - the Quartus II compiler will silently fail to fit. For designs that exceed 2,910 LEs after elaboration, the fitter will spill to slow interconnect and the design may not meet timing; budget LEs conservatively at the RTL stage.
Informations de conformité
EP1C3T144C6 is the original non-RoHS Cyclone I variant. Choose the C6N (RoHS compliant, lead-free) for new production. AEC-Q100 is not applicable because the device is not qualified for automotive applications; for automotive designs migrate to Cyclone IV E or Cyclone V families.