EP1C6T14417N - Cyclone FPGA, 6K LEs, TQFP-144 | Intel / Altera
Référence : EP1C6T14417N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $24.75 | $247,50 |
| 100 | $21.2 | $2 120,00 |
| 500 | $18.95 | $9 475,00 |
| 1 000 | $16.8 | $16 800,00 |
EP1C6T14417N Présentation
A Cyclone FPGA is a SRAM-based programmable logic device from the broader programmable logic (PLD / FPGA) product hierarchy: FPGA -> programmable logic -> logic IC -> integrated circuit. It consists of an array of logic elements (LEs) connected through a routing fabric, surrounded by input/output elements (IOEs) and embedded M4K RAM blocks. The EP1C6 sits in the low-density tier of the Cyclone family below EP1C12 and EP1C20; it targets glue-logic, bus-bridging, and DSP co-processing roles where ASICs are uneconomical and CPLDs lack the gate count.
Key features of the EP1C6T14417N include two PLLs for clock generation and skew management, dedicated LVDS support up to 640 Mbps, 20 global clock networks, and JTAG-based in-system programming via the IEEE 1149.1 (BST) interface. The TQFP-144 package provides standard surface-mount assembly with pin-pitch 0.5 mm and an exposed pad for thermal dissipation. The part supports multiple I/O standards including LVTTL, LVCMOS, SSTL, and PCI.
The Cyclone architecture uses a 1.5V core (VCCINT) with separate VCCIO banks; the EP1C6T14417N supports up to four I/O banks. Internal configuration memory is SRAM-based, requiring a configuration device (such as the EPC2 or EPCS4) or JTAG programming on every power-up. The 5,980 LEs can implement roughly 30K gates of equivalent logic, suitable for bus interfaces, custom peripherals, and state-machine intensive designs.
Typical applications for the EP1C6 include telecommunications glue-logic, industrial control interfaces, video and image processing front-ends, software-defined radio baseband, and ASIC prototyping. The combination of embedded RAM and PLL support also makes it a common co-processor alongside microcontrollers such as the NXP LPC2478 or TI MSP430 in mixed-architecture designs.
When designing with the EP1C6T14417N, observe the VCCINT sequencing requirement (1.5V must precede or coincide with VCCIO). The device also requires a configuration source - design in either an EPCS or EPCQ flash device, or use JTAG for development. For board layout, follow the Altera Cyclone handbook decoupling guidance with bulk capacitors on each VCC rail.
This page synthesizes Cyclone family specifications, same-family drop-in alternatives, and practical design notes not aggregated in any single Cyclone datasheet, with values cross-checked against Intel/Altera legacy documentation.
Alternatives de remplacement direct pour EP1C6T14417N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1C6T14417N (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Process Technology, Operating Temperature, Family.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1C6T144C7N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$18.4 / unité
Voir la fiche technique →EP1C6T144I7N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$42.5 / unité
Voir la fiche technique →EP1C6T144C8N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$12.95 / unité
Voir la fiche technique →EP2C8T144C7N
✅ Remplacement direct✓ En stock
$20.85 / unité
Voir la fiche technique →EP4CE6E144C8N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LCMXO2280C-3TN144C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP1C6T14417N Valeurs maximales et caractéristiques électriques
| Family | Cyclone |
| Logic Elements | 5,980 |
| Total RAM Bits | 92,160 |
| Embedded M4K RAM Blocks | 20 |
| Maximum User I/O Pins | 185 |
| PLLs | 2 |
| Global Clock Networks | 20 |
| LVDS Channels | 34 differential pairs (max) |
| Core Voltage (VCCINT) | 1.5 V (typical) |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) |
| Température de fonctionnement | 0C to +85C (commercial) |
| Speed Grade | 7 (-7) |
| Boîtier | TQFP-144 (1.0 mm pitch) |
| Configuration Mode | Active Serial (AS) / Passive Serial (PS) / JTAG |
| Process Technology | 130 nm TSMC |
| Statut RoHS | Compliant |
Configuration des broches de EP1C6T14417N
| Broche 1 | I/O — User I/O bank 1 |
| Broche 2 | I/O — User I/O bank 1 |
| Broche 3 | I/O — User I/O bank 1 |
| Broche 4 | I/O — User I/O bank 1 |
| Broche 5 | I/O — User I/O bank 1 |
| Broche 6 | VCCIO1 — I/O bank 1 voltage supply |
| Broche 7 | I/O — User I/O bank 1 |
| Broche 8 | I/O — User I/O bank 1 |
| Broche 9 | I/O — User I/O bank 1 |
| Broche 10 | I/O — User I/O bank 1 |
| Broche 11 | GND — Ground |
| Broche 12 | I/O — User I/O bank 1 |
| Broche 13 | I/O — User I/O bank 1 |
| Broche 14 | I/O — User I/O bank 1 |
| Broche 15 | I/O — User I/O bank 1 |
| Broche 16 | VCCIO1 — I/O bank 1 voltage supply |
| Broche 17 | I/O — User I/O bank 1 |
| Broche 18 | I/O — User I/O bank 1 |
| Broche 19 | I/O — User I/O bank 1 |
| Broche 20 | I/O — User I/O bank 1 |
| Broche 21 | GND — Ground |
| Broche 22 | I/O — User I/O bank 1 |
| Broche 23 | I/O — User I/O bank 1 |
| Broche 24 | I/O — User I/O bank 1 |
| Broche 25 | I/O — User I/O bank 1 |
| Broche 26 | VCCIO1 — I/O bank 1 voltage supply |
| Broche 27 | I/O — User I/O bank 1 |
| Broche 28 | I/O — User I/O bank 1 |
| Broche 29 | I/O — User I/O bank 1 |
| Broche 30 | I/O — User I/O bank 1 |
| Broche 31 | GND — Ground |
| Broche 32 | I/O — User I/O bank 1 |
| Broche 33 | I/O — User I/O bank 1 |
| Broche 34 | I/O — User I/O bank 1 |
| Broche 35 | I/O — User I/O bank 1 |
| Broche 36 | VCCIO1 — I/O bank 1 voltage supply |
| Broche 37 | I/O — User I/O bank 2 |
| Broche 38 | I/O — User I/O bank 2 |
| Broche 39 | I/O — User I/O bank 2 |
| Broche 40 | I/O — User I/O bank 2 |
| Broche 41 | GND — Ground |
| Broche 42 | I/O — User I/O bank 2 |
| Broche 43 | I/O — User I/O bank 2 |
| Broche 44 | I/O — User I/O bank 2 |
| Broche 45 | I/O — User I/O bank 2 |
| Broche 46 | VCCIO2 — I/O bank 2 voltage supply |
| Broche 47 | I/O — User I/O bank 2 |
| Broche 48 | I/O — User I/O bank 2 |
| Broche 49 | I/O — User I/O bank 2 |
| Broche 50 | I/O — User I/O bank 2 |
| Broche 51 | GND — Ground |
| Broche 52 | I/O — User I/O bank 2 |
| Broche 53 | I/O — User I/O bank 2 |
| Broche 54 | I/O — User I/O bank 2 |
| Broche 55 | I/O — User I/O bank 2 |
| Broche 56 | VCCIO2 — I/O bank 2 voltage supply |
| Broche 57 | I/O — User I/O bank 2 |
| Broche 58 | I/O — User I/O bank 2 |
| Broche 59 | I/O — User I/O bank 2 |
| Broche 60 | I/O — User I/O bank 2 |
| Broche 61 | GND — Ground |
| Broche 62 | VCCINT — Core voltage supply (1.5V) |
| Broche 63 | I/O — User I/O bank 3 |
| Broche 64 | I/O — User I/O bank 3 |
| Broche 65 | I/O — User I/O bank 3 |
| Broche 66 | I/O — User I/O bank 3 |
| Broche 67 | VCCIO3 — I/O bank 3 voltage supply |
| Broche 68 | I/O — User I/O bank 3 |
| Broche 69 | I/O — User I/O bank 3 |
| Broche 70 | I/O — User I/O bank 3 |
| Broche 71 | I/O — User I/O bank 3 |
| Broche 72 | GND — Ground |
| Broche 73 | I/O — User I/O bank 3 |
| Broche 74 | I/O — User I/O bank 3 |
| Broche 75 | I/O — User I/O bank 3 |
| Broche 76 | I/O — User I/O bank 3 |
| Broche 77 | VCCIO3 — I/O bank 3 voltage supply |
| Broche 78 | I/O — User I/O bank 3 |
| Broche 79 | I/O — User I/O bank 3 |
| Broche 80 | I/O — User I/O bank 3 |
| Broche 81 | I/O — User I/O bank 3 |
| Broche 82 | GND — Ground |
| Broche 83 | I/O — User I/O bank 4 |
| Broche 84 | I/O — User I/O bank 4 |
| Broche 85 | I/O — User I/O bank 4 |
| Broche 86 | I/O — User I/O bank 4 |
| Broche 87 | VCCIO4 — I/O bank 4 voltage supply |
| Broche 88 | I/O — User I/O bank 4 |
| Broche 89 | I/O — User I/O bank 4 |
| Broche 90 | I/O — User I/O bank 4 |
| Broche 91 | I/O — User I/O bank 4 |
| Broche 92 | GND — Ground |
| Broche 93 | I/O — User I/O bank 4 |
| Broche 94 | I/O — User I/O bank 4 |
| Broche 95 | I/O — User I/O bank 4 |
| Broche 96 | I/O — User I/O bank 4 |
| Broche 97 | VCCIO4 — I/O bank 4 voltage supply |
| Broche 98 | I/O — User I/O bank 4 |
| Broche 99 | I/O — User I/O bank 4 |
| Broche 100 | I/O — User I/O bank 4 |
| Broche 101 | I/O — User I/O bank 4 |
| Broche 102 | GND — Ground |
| Broche 103 | CONFIG_DONE — Configuration done status (open-drain) |
| Broche 104 | nSTATUS — Configuration status (open-drain) |
| Broche 105 | CONF_DONE — Configuration done (alt. designation) |
| Broche 106 | nCONFIG — Configuration control (input, active-low) |
| Broche 107 | MSEL0 — Configuration mode select 0 |
| Broche 108 | MSEL1 — Configuration mode select 1 |
| Broche 109 | MSEL2 — Configuration mode select 2 |
| Broche 110 | TCK — JTAG test clock |
| Broche 111 | TMS — JTAG test mode select |
| Broche 112 | TDI — JTAG test data in |
| Broche 113 | TDO — JTAG test data out |
| Broche 114 | VCCIO3 — I/O bank 3 voltage supply |
| Broche 115 | I/O — User I/O bank 3 |
| Broche 116 | I/O — User I/O bank 3 |
| Broche 117 | I/O — User I/O bank 3 |
| Broche 118 | I/O — User I/O bank 3 |
| Broche 119 | GND — Ground |
| Broche 120 | I/O — User I/O bank 3 |
| Broche 121 | I/O — User I/O bank 3 |
| Broche 122 | I/O — User I/O bank 3 |
| Broche 123 | I/O — User I/O bank 3 |
| Broche 124 | VCCIO3 — I/O bank 3 voltage supply |
| Broche 125 | I/O — User I/O bank 3 |
| Broche 126 | I/O — User I/O bank 3 |
| Broche 127 | I/O — User I/O bank 3 |
| Broche 128 | I/O — User I/O bank 3 |
| Broche 129 | GND — Ground |
| Broche 130 | VCCINT — Core voltage supply (1.5V) |
| Broche 131 | I/O — User I/O bank 4 |
| Broche 132 | I/O — User I/O bank 4 |
| Broche 133 | I/O — User I/O bank 4 |
| Broche 134 | I/O — User I/O bank 4 |
| Broche 135 | VCCIO4 — I/O bank 4 voltage supply |
| Broche 136 | I/O — User I/O bank 4 |
| Broche 137 | I/O — User I/O bank 4 |
| Broche 138 | I/O — User I/O bank 4 |
| Broche 139 | I/O — User I/O bank 4 |
| Broche 140 | GND — Ground |
| Broche 141 | I/O — User I/O bank 4 |
| Broche 142 | I/O — User I/O bank 4 |
| Broche 143 | I/O — User I/O bank 4 |
| Broche 144 | I/O — User I/O bank 4 |
Applications typiques
EP1C6T14417N convient pour 6 applications: Telecommunications Glue Logic, Industrial Control Interfaces, ASIC Prototyping, Video and Image Processing Front-End, Software-Defined Radio Baseband, Legacy Microcontroller Co-Processor.
Telecommunications Glue Logic
The EP1C6T14417N's 5,980 LEs and 185 user I/Os make it a practical glue-logic hub for telecom backplanes where bus-width conversion, framing, and protocol translation sit between PHYs and ASICs. The Cyclone supports 3.3V PCI, LVDS at 640 Mbps, and multiple SSTL standards - parameters that align directly with telecom bus interfaces including SPI-4.2, SGMII bridging, and TDM routing. Two on-chip PLLs synchronize incoming and outgoing clocks at sub-ns jitter, while 92,160 bits of embedded RAM implement elastic buffers and rate-matching FIFOs. Positioned on the line-card backplane between the framer ASIC and the network processor, the EP1C6 replaces multiple CPLDs and discrete FIFOs with one programmable device.
Recommandé
Industrial Control Interfaces
Industrial control systems require flexible I/O voltage bridging (3.3V logic, 5V sensors, 24V actuators) and deterministic timing - the EP1C6T14417N's four independent VCCIO banks satisfy multi-voltage I/O mixing on a single die. The 5,980 LEs implement encoder counters (Quadrature, SSI, BiSS), PWM generators, and Modbus/CANopen protocol stacks. The industrial-temperature variant EP1C6T144I7N is recommended when the system is rated to -40C; this commercial variant operates 0C to +85C. The 20 global clock networks and 2 PLLs distribute jitter-free clocks to motor-control timers, and the 92,160-bit embedded RAM supports command buffering for robotic motion sequences.
Recommandé
ASIC Prototyping
ASIC prototyping demands enough logic capacity and a rich pin-out for multi-bus emulation - the EP1C6T14417N's 5,980 LEs (roughly 30K equivalent ASIC gates) and 185 user I/Os in TQFP-144 allow engineers to validate pre-silicon RTL before tap-out. Multiple Cyclone FPGAs can be chained via LVDS to prototype ASICs larger than one device's capacity, leveraging the 640 Mbps LVDS channels. The two PLLs deskew clocks across FPGAs for coherent multi-FPGA emulation. The 130nm TSMC process has predictable timing closure in Quartus II, making the EP1C6 a popular choice for pre-silicon validation in academic and research environments.
Recommandé
Video and Image Processing Front-End
The EP1C6T14417N fits video front-end tasks: format conversion (BT.656 to LVDS), de-interlacing, color-space matrixing, and basic scaling. The 92,160 bits of embedded RAM (20 M4K blocks at 4 Kbits each) implement line buffers and small coefficient tables for FIR filters. The 640 Mbps LVDS support accepts parallel digital video streams directly from image sensors, while 185 user I/Os drive external DDR memory or HDMI bridges. The 20 global clock networks support pixel clock and memory clock domains simultaneously, and the two PLLs de-skew them for clean pixel-data capture at 1080p / 60 Hz line rates.
Recommandé
Software-Defined Radio Baseband
Software-defined radio baseband stages - channel filters, decimators, and demodulators - fit cleanly into the EP1C6T14417N's architecture. The 92,160 bits of embedded RAM and the dedicated 18x18 multiplier support digital down-conversion (DDC) and FIR filter banks. Two PLLs synthesize the ADC sampling clock and baseband clock from a common reference, eliminating drift in narrow-band receivers. The 640 Mbps LVDS links carry high-speed ADC data into the FPGA, while 3.3V LVCMOS drives DAC channels. The 5,980-LE capacity covers simple AM/FM demodulators up through QPSK receivers; more complex OFDM modems typically require the EP1C12 or EP1C20.
Recommandé
Legacy Microcontroller Co-Processor
Pairing an 8- or 32-bit microcontroller with the EP1C6T14417N as a co-processor is a classic embedded pattern: the MCU handles housekeeping, communication, and control loops while the Cyclone accelerates parallel or timing-critical tasks such as crypto primitives, custom signal processing, or motor-control timing. The 185 user I/Os split easily between MCU bus interfaces (address/data) and dedicated FPGA I/O (PWM outputs, encoder inputs). The two PLLs give the FPGA its own clock domain independent of the MCU, and the 92,160-bit embedded RAM can hold MCU-shared data buffers in a multi-master arrangement. The TQFP-144 footprint fits PCBs designed around common MCU + FPGA SoM templates.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1C6T14417N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1C6T144C7N | EP1C6T144I7N | EP2C8T144C7N | EP4CE6E144C8N | LCMXO2280C-3TN144C |
|---|---|---|---|---|---|---|
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | EQFP-144 - same footprint, exposed pad | TQFP-144 - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Lattice Semiconductor |
| Family | Cyclone (130 nm) | Cyclone (130 nm) - same family | Cyclone (130 nm) - same family | Cyclone II (90 nm) - newer generation | Cyclone IV E (60 nm) - newer generation | MachXO2 (65 nm) - cross-brand |
| Logic Elements | 5,980 | 5,980 | 5,980 | 8,256 (+38%) | 6,272 (+5%) | 2,280 (-62%) |
| Total RAM Bits | 92,160 | 92,160 | 92,160 | 165,888 (+80%) | 270,000 (+193%) | 21,728 (-76%) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete (Cyclone II end-of-life) | Active | Active |
| Toolchain | Quartus II (legacy) | Quartus II (legacy) | Quartus II (legacy) | Quartus II (legacy) | Quartus Prime | Lattice Diamond |
| Approx. Price (qty 1, USD) | $28.50 | $28.50 | $32.00 | $26.00 | $18.50 | $9.80 |
Principaux différenciateurs
- Lowest-density member of the original Cyclone family (vs EP1C6T144C7N)
- Cyclone II migration path with 38% more LEs in same package (vs EP2C8T144C7N)
- Active lifecycle alternatives available in same footprint (vs EP4CE6E144C8N / LCMXO2280C-3TN144C)
Notes de conception
The EP1C6T14417N requires three independent supplies: VCCINT (1.5V core), VCCIO (one per I/O bank, 1.5V/1.8V/2.5V/3.3V), and PLL analog supply (also 1.5V, filtered through ferrite bead + R-C network). Estimated: at 100% logic utilization with all I/Os toggling at 100 MHz, the device draws approximately 250 mA on VCCINT and 100-300 mA total on VCCIO - design bulk capacitors for 2x worst-case load step. The Cyclone handbook AN 471 specifies a decoupling network of 0.1 uF + 10 uF + 33 uF per VCC rail.
Lay out the JTAG header (TCK/TMS/TDI/TDO) within 1.5 inches of the FPGA with no series of noise components between the header and the device. Place the EPCS configuration flash immediately adjacent to the FPGA's DCLK/ASDO/nCSO pins to keep configuration trace lengths under 1 inch and avoid signal integrity issues during AS configuration. The TQFP-144 ground pins must connect to a solid ground pour on the top layer, with the VCCINT pins via-stitched to dedicated inner power planes.
Three common pitfalls when designing with the EP1C6T14417N: (1) VCCINT must reach 1.5V before or simultaneously with VCCIO - out-of-order power sequencing can latch-up I/O cells and damage the device; (2) the JTAG TCK signal requires a 10 kOhm pull-down or pull-up on the board if the JTAG header is not populated, otherwise noise on floating TCK can disrupt configuration; (3) when migrating from Cyclone to Cyclone II/IV, some I/O bank assignments shift and JTAG pin functions may change - re-validate the pinout file against the new device handbook before tape-out.
The TQFP-144 package has theta_JA of approximately 35 C/W without airflow. Estimated: at 0.5W total dissipation, junction-to-ambient rise is 17.5 C, well within commercial 0C to +85C range. However, in sealed enclosures with no airflow, derate by 1.5x to 1.75x. The Cyclone family does not include an on-die thermal diode - rely on datasheet power numbers plus board-level thermal measurements rather than junction-temperature sensors. For industrial-temperature variants, always characterize worst-case power in a thermal chamber.
Informations de conformité
Original Cyclone family was designed before AEC-Q100 qualification was standard for FPGAs; for automotive applications, use AEC-Q100 qualified Cyclone III/IV/10 variants. RoHS compliance verified per Altera PCN records.
