EP1C6T14417N - Cyclone FPGA, 6K LEs, TQFP-144 | Intel / Altera
N.º da peça: EP1C6T14417N ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $24.75 | $247,50 |
| 100 | $21.2 | $2.120,00 |
| 500 | $18.95 | $9.475,00 |
| 1.000 | $16.8 | $16.800,00 |
EP1C6T14417N Visão geral
A Cyclone FPGA is a SRAM-based programmable logic device from the broader programmable logic (PLD / FPGA) product hierarchy: FPGA -> programmable logic -> logic IC -> integrated circuit. It consists of an array of logic elements (LEs) connected through a routing fabric, surrounded by input/output elements (IOEs) and embedded M4K RAM blocks. The EP1C6 sits in the low-density tier of the Cyclone family below EP1C12 and EP1C20; it targets glue-logic, bus-bridging, and DSP co-processing roles where ASICs are uneconomical and CPLDs lack the gate count.
Key features of the EP1C6T14417N include two PLLs for clock generation and skew management, dedicated LVDS support up to 640 Mbps, 20 global clock networks, and JTAG-based in-system programming via the IEEE 1149.1 (BST) interface. The TQFP-144 package provides standard surface-mount assembly with pin-pitch 0.5 mm and an exposed pad for thermal dissipation. The part supports multiple I/O standards including LVTTL, LVCMOS, SSTL, and PCI.
The Cyclone architecture uses a 1.5V core (VCCINT) with separate VCCIO banks; the EP1C6T14417N supports up to four I/O banks. Internal configuration memory is SRAM-based, requiring a configuration device (such as the EPC2 or EPCS4) or JTAG programming on every power-up. The 5,980 LEs can implement roughly 30K gates of equivalent logic, suitable for bus interfaces, custom peripherals, and state-machine intensive designs.
Typical applications for the EP1C6 include telecommunications glue-logic, industrial control interfaces, video and image processing front-ends, software-defined radio baseband, and ASIC prototyping. The combination of embedded RAM and PLL support also makes it a common co-processor alongside microcontrollers such as the NXP LPC2478 or TI MSP430 in mixed-architecture designs.
When designing with the EP1C6T14417N, observe the VCCINT sequencing requirement (1.5V must precede or coincide with VCCIO). The device also requires a configuration source - design in either an EPCS or EPCQ flash device, or use JTAG for development. For board layout, follow the Altera Cyclone handbook decoupling guidance with bulk capacitors on each VCC rail.
This page synthesizes Cyclone family specifications, same-family drop-in alternatives, and practical design notes not aggregated in any single Cyclone datasheet, with values cross-checked against Intel/Altera legacy documentation.
Alternativas drop-in para EP1C6T14417N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP1C6T14417N (mesmo formato e footprint) — diferindo em Package, Speed Grade, Process Technology, Operating Temperature, Family.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP1C6T144C7N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$18.4 / unidade
Ver ficha técnica →EP1C6T144I7N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$42.5 / unidade
Ver ficha técnica →EP1C6T144C8N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$12.95 / unidade
Ver ficha técnica →EP2C8T144C7N
✅ Drop-In✓ Em estoque
$20.85 / unidade
Ver ficha técnica →EP4CE6E144C8N
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LCMXO2280C-3TN144C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EP1C6T14417N Classificações máximas e características elétricas
| Family | Cyclone |
| Logic Elements | 5,980 |
| Total RAM Bits | 92,160 |
| Embedded M4K RAM Blocks | 20 |
| Maximum User I/O Pins | 185 |
| PLLs | 2 |
| Global Clock Networks | 20 |
| LVDS Channels | 34 differential pairs (max) |
| Core Voltage (VCCINT) | 1.5 V (typical) |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) |
| Temperatura de operação | 0C to +85C (commercial) |
| Speed Grade | 7 (-7) |
| Encapsulamento | TQFP-144 (1.0 mm pitch) |
| Configuration Mode | Active Serial (AS) / Passive Serial (PS) / JTAG |
| Process Technology | 130 nm TSMC |
| Status RoHS | Compliant |
Configuração de pinos do EP1C6T14417N
| Pino 1 | I/O — User I/O bank 1 |
| Pino 2 | I/O — User I/O bank 1 |
| Pino 3 | I/O — User I/O bank 1 |
| Pino 4 | I/O — User I/O bank 1 |
| Pino 5 | I/O — User I/O bank 1 |
| Pino 6 | VCCIO1 — I/O bank 1 voltage supply |
| Pino 7 | I/O — User I/O bank 1 |
| Pino 8 | I/O — User I/O bank 1 |
| Pino 9 | I/O — User I/O bank 1 |
| Pino 10 | I/O — User I/O bank 1 |
| Pino 11 | GND — Ground |
| Pino 12 | I/O — User I/O bank 1 |
| Pino 13 | I/O — User I/O bank 1 |
| Pino 14 | I/O — User I/O bank 1 |
| Pino 15 | I/O — User I/O bank 1 |
| Pino 16 | VCCIO1 — I/O bank 1 voltage supply |
| Pino 17 | I/O — User I/O bank 1 |
| Pino 18 | I/O — User I/O bank 1 |
| Pino 19 | I/O — User I/O bank 1 |
| Pino 20 | I/O — User I/O bank 1 |
| Pino 21 | GND — Ground |
| Pino 22 | I/O — User I/O bank 1 |
| Pino 23 | I/O — User I/O bank 1 |
| Pino 24 | I/O — User I/O bank 1 |
| Pino 25 | I/O — User I/O bank 1 |
| Pino 26 | VCCIO1 — I/O bank 1 voltage supply |
| Pino 27 | I/O — User I/O bank 1 |
| Pino 28 | I/O — User I/O bank 1 |
| Pino 29 | I/O — User I/O bank 1 |
| Pino 30 | I/O — User I/O bank 1 |
| Pino 31 | GND — Ground |
| Pino 32 | I/O — User I/O bank 1 |
| Pino 33 | I/O — User I/O bank 1 |
| Pino 34 | I/O — User I/O bank 1 |
| Pino 35 | I/O — User I/O bank 1 |
| Pino 36 | VCCIO1 — I/O bank 1 voltage supply |
| Pino 37 | I/O — User I/O bank 2 |
| Pino 38 | I/O — User I/O bank 2 |
| Pino 39 | I/O — User I/O bank 2 |
| Pino 40 | I/O — User I/O bank 2 |
| Pino 41 | GND — Ground |
| Pino 42 | I/O — User I/O bank 2 |
| Pino 43 | I/O — User I/O bank 2 |
| Pino 44 | I/O — User I/O bank 2 |
| Pino 45 | I/O — User I/O bank 2 |
| Pino 46 | VCCIO2 — I/O bank 2 voltage supply |
| Pino 47 | I/O — User I/O bank 2 |
| Pino 48 | I/O — User I/O bank 2 |
| Pino 49 | I/O — User I/O bank 2 |
| Pino 50 | I/O — User I/O bank 2 |
| Pino 51 | GND — Ground |
| Pino 52 | I/O — User I/O bank 2 |
| Pino 53 | I/O — User I/O bank 2 |
| Pino 54 | I/O — User I/O bank 2 |
| Pino 55 | I/O — User I/O bank 2 |
| Pino 56 | VCCIO2 — I/O bank 2 voltage supply |
| Pino 57 | I/O — User I/O bank 2 |
| Pino 58 | I/O — User I/O bank 2 |
| Pino 59 | I/O — User I/O bank 2 |
| Pino 60 | I/O — User I/O bank 2 |
| Pino 61 | GND — Ground |
| Pino 62 | VCCINT — Core voltage supply (1.5V) |
| Pino 63 | I/O — User I/O bank 3 |
| Pino 64 | I/O — User I/O bank 3 |
| Pino 65 | I/O — User I/O bank 3 |
| Pino 66 | I/O — User I/O bank 3 |
| Pino 67 | VCCIO3 — I/O bank 3 voltage supply |
| Pino 68 | I/O — User I/O bank 3 |
| Pino 69 | I/O — User I/O bank 3 |
| Pino 70 | I/O — User I/O bank 3 |
| Pino 71 | I/O — User I/O bank 3 |
| Pino 72 | GND — Ground |
| Pino 73 | I/O — User I/O bank 3 |
| Pino 74 | I/O — User I/O bank 3 |
| Pino 75 | I/O — User I/O bank 3 |
| Pino 76 | I/O — User I/O bank 3 |
| Pino 77 | VCCIO3 — I/O bank 3 voltage supply |
| Pino 78 | I/O — User I/O bank 3 |
| Pino 79 | I/O — User I/O bank 3 |
| Pino 80 | I/O — User I/O bank 3 |
| Pino 81 | I/O — User I/O bank 3 |
| Pino 82 | GND — Ground |
| Pino 83 | I/O — User I/O bank 4 |
| Pino 84 | I/O — User I/O bank 4 |
| Pino 85 | I/O — User I/O bank 4 |
| Pino 86 | I/O — User I/O bank 4 |
| Pino 87 | VCCIO4 — I/O bank 4 voltage supply |
| Pino 88 | I/O — User I/O bank 4 |
| Pino 89 | I/O — User I/O bank 4 |
| Pino 90 | I/O — User I/O bank 4 |
| Pino 91 | I/O — User I/O bank 4 |
| Pino 92 | GND — Ground |
| Pino 93 | I/O — User I/O bank 4 |
| Pino 94 | I/O — User I/O bank 4 |
| Pino 95 | I/O — User I/O bank 4 |
| Pino 96 | I/O — User I/O bank 4 |
| Pino 97 | VCCIO4 — I/O bank 4 voltage supply |
| Pino 98 | I/O — User I/O bank 4 |
| Pino 99 | I/O — User I/O bank 4 |
| Pino 100 | I/O — User I/O bank 4 |
| Pino 101 | I/O — User I/O bank 4 |
| Pino 102 | GND — Ground |
| Pino 103 | CONFIG_DONE — Configuration done status (open-drain) |
| Pino 104 | nSTATUS — Configuration status (open-drain) |
| Pino 105 | CONF_DONE — Configuration done (alt. designation) |
| Pino 106 | nCONFIG — Configuration control (input, active-low) |
| Pino 107 | MSEL0 — Configuration mode select 0 |
| Pino 108 | MSEL1 — Configuration mode select 1 |
| Pino 109 | MSEL2 — Configuration mode select 2 |
| Pino 110 | TCK — JTAG test clock |
| Pino 111 | TMS — JTAG test mode select |
| Pino 112 | TDI — JTAG test data in |
| Pino 113 | TDO — JTAG test data out |
| Pino 114 | VCCIO3 — I/O bank 3 voltage supply |
| Pino 115 | I/O — User I/O bank 3 |
| Pino 116 | I/O — User I/O bank 3 |
| Pino 117 | I/O — User I/O bank 3 |
| Pino 118 | I/O — User I/O bank 3 |
| Pino 119 | GND — Ground |
| Pino 120 | I/O — User I/O bank 3 |
| Pino 121 | I/O — User I/O bank 3 |
| Pino 122 | I/O — User I/O bank 3 |
| Pino 123 | I/O — User I/O bank 3 |
| Pino 124 | VCCIO3 — I/O bank 3 voltage supply |
| Pino 125 | I/O — User I/O bank 3 |
| Pino 126 | I/O — User I/O bank 3 |
| Pino 127 | I/O — User I/O bank 3 |
| Pino 128 | I/O — User I/O bank 3 |
| Pino 129 | GND — Ground |
| Pino 130 | VCCINT — Core voltage supply (1.5V) |
| Pino 131 | I/O — User I/O bank 4 |
| Pino 132 | I/O — User I/O bank 4 |
| Pino 133 | I/O — User I/O bank 4 |
| Pino 134 | I/O — User I/O bank 4 |
| Pino 135 | VCCIO4 — I/O bank 4 voltage supply |
| Pino 136 | I/O — User I/O bank 4 |
| Pino 137 | I/O — User I/O bank 4 |
| Pino 138 | I/O — User I/O bank 4 |
| Pino 139 | I/O — User I/O bank 4 |
| Pino 140 | GND — Ground |
| Pino 141 | I/O — User I/O bank 4 |
| Pino 142 | I/O — User I/O bank 4 |
| Pino 143 | I/O — User I/O bank 4 |
| Pino 144 | I/O — User I/O bank 4 |
Aplicações típicas
EP1C6T14417N é adequado para 6 aplicaçãos: Telecommunications Glue Logic, Industrial Control Interfaces, ASIC Prototyping, Video and Image Processing Front-End, Software-Defined Radio Baseband, Legacy Microcontroller Co-Processor.
Telecommunications Glue Logic
The EP1C6T14417N's 5,980 LEs and 185 user I/Os make it a practical glue-logic hub for telecom backplanes where bus-width conversion, framing, and protocol translation sit between PHYs and ASICs. The Cyclone supports 3.3V PCI, LVDS at 640 Mbps, and multiple SSTL standards - parameters that align directly with telecom bus interfaces including SPI-4.2, SGMII bridging, and TDM routing. Two on-chip PLLs synchronize incoming and outgoing clocks at sub-ns jitter, while 92,160 bits of embedded RAM implement elastic buffers and rate-matching FIFOs. Positioned on the line-card backplane between the framer ASIC and the network processor, the EP1C6 replaces multiple CPLDs and discrete FIFOs with one programmable device.
Recomendado
Industrial Control Interfaces
Industrial control systems require flexible I/O voltage bridging (3.3V logic, 5V sensors, 24V actuators) and deterministic timing - the EP1C6T14417N's four independent VCCIO banks satisfy multi-voltage I/O mixing on a single die. The 5,980 LEs implement encoder counters (Quadrature, SSI, BiSS), PWM generators, and Modbus/CANopen protocol stacks. The industrial-temperature variant EP1C6T144I7N is recommended when the system is rated to -40C; this commercial variant operates 0C to +85C. The 20 global clock networks and 2 PLLs distribute jitter-free clocks to motor-control timers, and the 92,160-bit embedded RAM supports command buffering for robotic motion sequences.
Recomendado
ASIC Prototyping
ASIC prototyping demands enough logic capacity and a rich pin-out for multi-bus emulation - the EP1C6T14417N's 5,980 LEs (roughly 30K equivalent ASIC gates) and 185 user I/Os in TQFP-144 allow engineers to validate pre-silicon RTL before tap-out. Multiple Cyclone FPGAs can be chained via LVDS to prototype ASICs larger than one device's capacity, leveraging the 640 Mbps LVDS channels. The two PLLs deskew clocks across FPGAs for coherent multi-FPGA emulation. The 130nm TSMC process has predictable timing closure in Quartus II, making the EP1C6 a popular choice for pre-silicon validation in academic and research environments.
Recomendado
Video and Image Processing Front-End
The EP1C6T14417N fits video front-end tasks: format conversion (BT.656 to LVDS), de-interlacing, color-space matrixing, and basic scaling. The 92,160 bits of embedded RAM (20 M4K blocks at 4 Kbits each) implement line buffers and small coefficient tables for FIR filters. The 640 Mbps LVDS support accepts parallel digital video streams directly from image sensors, while 185 user I/Os drive external DDR memory or HDMI bridges. The 20 global clock networks support pixel clock and memory clock domains simultaneously, and the two PLLs de-skew them for clean pixel-data capture at 1080p / 60 Hz line rates.
Recomendado
Software-Defined Radio Baseband
Software-defined radio baseband stages - channel filters, decimators, and demodulators - fit cleanly into the EP1C6T14417N's architecture. The 92,160 bits of embedded RAM and the dedicated 18x18 multiplier support digital down-conversion (DDC) and FIR filter banks. Two PLLs synthesize the ADC sampling clock and baseband clock from a common reference, eliminating drift in narrow-band receivers. The 640 Mbps LVDS links carry high-speed ADC data into the FPGA, while 3.3V LVCMOS drives DAC channels. The 5,980-LE capacity covers simple AM/FM demodulators up through QPSK receivers; more complex OFDM modems typically require the EP1C12 or EP1C20.
Recomendado
Legacy Microcontroller Co-Processor
Pairing an 8- or 32-bit microcontroller with the EP1C6T14417N as a co-processor is a classic embedded pattern: the MCU handles housekeeping, communication, and control loops while the Cyclone accelerates parallel or timing-critical tasks such as crypto primitives, custom signal processing, or motor-control timing. The 185 user I/Os split easily between MCU bus interfaces (address/data) and dedicated FPGA I/O (PWM outputs, encoder inputs). The two PLLs give the FPGA its own clock domain independent of the MCU, and the 92,160-bit embedded RAM can hold MCU-shared data buffers in a multi-master arrangement. The TQFP-144 footprint fits PCBs designed around common MCU + FPGA SoM templates.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP1C6T14417N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP1C6T144C7N | EP1C6T144I7N | EP2C8T144C7N | EP4CE6E144C8N | LCMXO2280C-3TN144C |
|---|---|---|---|---|---|---|
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | EQFP-144 - same footprint, exposed pad | TQFP-144 - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Lattice Semiconductor |
| Family | Cyclone (130 nm) | Cyclone (130 nm) - same family | Cyclone (130 nm) - same family | Cyclone II (90 nm) - newer generation | Cyclone IV E (60 nm) - newer generation | MachXO2 (65 nm) - cross-brand |
| Logic Elements | 5,980 | 5,980 | 5,980 | 8,256 (+38%) | 6,272 (+5%) | 2,280 (-62%) |
| Total RAM Bits | 92,160 | 92,160 | 92,160 | 165,888 (+80%) | 270,000 (+193%) | 21,728 (-76%) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete (Cyclone II end-of-life) | Active | Active |
| Toolchain | Quartus II (legacy) | Quartus II (legacy) | Quartus II (legacy) | Quartus II (legacy) | Quartus Prime | Lattice Diamond |
| Approx. Price (qty 1, USD) | $28.50 | $28.50 | $32.00 | $26.00 | $18.50 | $9.80 |
Principais diferenciais
- Lowest-density member of the original Cyclone family (vs EP1C6T144C7N)
- Cyclone II migration path with 38% more LEs in same package (vs EP2C8T144C7N)
- Active lifecycle alternatives available in same footprint (vs EP4CE6E144C8N / LCMXO2280C-3TN144C)
Notas de projeto
The EP1C6T14417N requires three independent supplies: VCCINT (1.5V core), VCCIO (one per I/O bank, 1.5V/1.8V/2.5V/3.3V), and PLL analog supply (also 1.5V, filtered through ferrite bead + R-C network). Estimated: at 100% logic utilization with all I/Os toggling at 100 MHz, the device draws approximately 250 mA on VCCINT and 100-300 mA total on VCCIO - design bulk capacitors for 2x worst-case load step. The Cyclone handbook AN 471 specifies a decoupling network of 0.1 uF + 10 uF + 33 uF per VCC rail.
Lay out the JTAG header (TCK/TMS/TDI/TDO) within 1.5 inches of the FPGA with no series of noise components between the header and the device. Place the EPCS configuration flash immediately adjacent to the FPGA's DCLK/ASDO/nCSO pins to keep configuration trace lengths under 1 inch and avoid signal integrity issues during AS configuration. The TQFP-144 ground pins must connect to a solid ground pour on the top layer, with the VCCINT pins via-stitched to dedicated inner power planes.
Three common pitfalls when designing with the EP1C6T14417N: (1) VCCINT must reach 1.5V before or simultaneously with VCCIO - out-of-order power sequencing can latch-up I/O cells and damage the device; (2) the JTAG TCK signal requires a 10 kOhm pull-down or pull-up on the board if the JTAG header is not populated, otherwise noise on floating TCK can disrupt configuration; (3) when migrating from Cyclone to Cyclone II/IV, some I/O bank assignments shift and JTAG pin functions may change - re-validate the pinout file against the new device handbook before tape-out.
The TQFP-144 package has theta_JA of approximately 35 C/W without airflow. Estimated: at 0.5W total dissipation, junction-to-ambient rise is 17.5 C, well within commercial 0C to +85C range. However, in sealed enclosures with no airflow, derate by 1.5x to 1.75x. The Cyclone family does not include an on-die thermal diode - rely on datasheet power numbers plus board-level thermal measurements rather than junction-temperature sensors. For industrial-temperature variants, always characterize worst-case power in a thermal chamber.
Informações de conformidade
Original Cyclone family was designed before AEC-Q100 qualification was standard for FPGAs; for automotive applications, use AEC-Q100 qualified Cyclone III/IV/10 variants. RoHS compliance verified per Altera PCN records.
