EPF6024ATC144-3S - FLEX 6000 FPGA 24K Gates 144-TQFP | Intel
Référence : EPF6024ATC144-3S ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.2 | $162,00 |
| 100 | $13.85 | $1 385,00 |
| 500 | $11.4 | $5 700,00 |
| 1 000 | $9.75 | $9 750,00 |
EPF6024ATC144-3S Présentation
A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor whose logic fabric, routing, and I/O blocks are defined by a configuration bitstream loaded after manufacturing. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs), and the FLEX 6000 family specifically targets low-cost, high-volume glue-logic, bus-interface, and state-machine replacement applications where a complex CPLD or a full ASIC would be overkill.
Key features of the EPF6024ATC144-3S include 196 Logic Array Blocks (LABs), 117 usable I/O pins, embedded SRAM configuration memory, in-system programmability via the JTAG-compliant ByteBlaster or BitBlaster interface, and four dedicated clock input pins. The 'ATC' speed grade in the device suffix indicates the 142.86 MHz Fmax performance bin, while the trailing 'S' in the part number denotes a specific commercial/extended temperature variant.
Typical applications include 33 MHz/66 MHz PCI bus interface bridges, glue-logic integration for legacy microprocessors, asynchronous-transfer-mode (ATM) cell processing, video/imaging pipe-line control logic, and telecommunications channelizers. Because FLEX 6000 devices are SRAM-based, they must be configured at every power-up from a serial or parallel PROM, which is a key design consideration for any mission-critical boot sequence.
When designing with the EPF6024ATC144-3S, ensure the configuration memory is sourced from a compatible EPC1 or EPC2 configuration PROM (or a microcontroller bitstream) and that all unused I/O pins are left floating or tri-stated. The 144-pin TQFP footprint has a generous 1.0 mm pitch and exposed die-pad-like thermal path, simplifying PCB layout versus fine-pitch BGA alternatives. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour EPF6024ATC144-3S — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF6024ATC144-3S (même facteur de forme et même empreinte) — différant par Process Technology, Operating Temperature, Speed Grade, Package, Configuration Memory.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF6024ATC144-3N
✅ Remplacement direct✓ En stock
$21.4 / unité
Voir la fiche technique →EPF6024ATC144-3
✅ Remplacement direct✓ En stock
$14.1 / unité
Voir la fiche technique →EPF6024ATC144-2N
✅ Remplacement direct✓ En stock
$20.95 / unité
Voir la fiche technique →EPF6024ATC144-1N
✅ Remplacement direct✓ En stock
$20.95 / unité
Voir la fiche technique →EPF6024ATC144-3S Valeurs maximales et caractéristiques électriques
| Family | FLEX 6000 |
| Typical Gates | 24,000 |
| Logic Elements (LEs) | 1,960 |
| Logic Array Blocks (LABs) | 196 |
| User I/Os | 117 |
| Tension d'alimentation | 3.3 V |
| Process Technology | 0.42 µm CMOS |
| Internal Frequency | 142.86 MHz |
| Configuration Memory | SRAM |
| Package Type | TQFP-144 (1.0 mm pitch) |
| Type de montage | Surface Mount |
| Terminal Form | Gull Wing |
| Package Code | LFQFP |
| Programmability | In-system via JTAG (ByteBlaster/BitBlaster) |
Configuration des broches de EPF6024ATC144-3S
| Broche 1 | I/O — User I/O pin (bank 1) |
| Broche 2 | I/O — User I/O pin (bank 1) |
| Broche 3 | I/O — User I/O pin (bank 1) |
| Broche 4 | I/O — User I/O pin (bank 1) |
| Broche 5 | VCCINT — Core supply 3.3 V |
| Broche 6 | GND — Ground |
| Broche 7 | I/O — User I/O pin (bank 1) |
| Broche 8 | I/O — User I/O pin (bank 1) |
| Broche 9 | I/O — User I/O pin (bank 1) |
| Broche 10 | I/O — User I/O pin (bank 1) |
| Broche 11 | I/O — User I/O pin (bank 1) |
| Broche 12 | I/O — User I/O pin (bank 1) |
| Broche 13 | I/O — User I/O pin (bank 2) |
| Broche 14 | VCCIO1 — I/O bank 1 supply |
| Broche 15 | GND — Ground |
| Broche 16 | I/O — User I/O pin (bank 1) |
| Broche 17 | I/O — User I/O pin (bank 1) |
| Broche 18 | I/O — User I/O pin (bank 1) |
| Broche 19 | I/O — User I/O pin (bank 1) |
| Broche 20 | I/O — User I/O pin (bank 1) |
| Broche 21 | I/O — User I/O pin (bank 1) |
| Broche 22 | I/O — User I/O pin (bank 1) |
| Broche 23 | I/O — User I/O pin (bank 1) |
| Broche 24 | I/O — User I/O pin (bank 1) |
| Broche 25 | I/O — User I/O pin (bank 1) |
| Broche 26 | I/O — User I/O pin (bank 1) |
| Broche 27 | GND — Ground |
| Broche 28 | VCCINT — Core supply 3.3 V |
| Broche 29 | I/O — User I/O pin (bank 1) |
| Broche 30 | I/O — User I/O pin (bank 1) |
| Broche 31 | I/O — User I/O pin (bank 1) |
| Broche 32 | I/O — User I/O pin (bank 1) |
| Broche 33 | I/O — User I/O pin (bank 1) |
| Broche 34 | I/O — User I/O pin (bank 1) |
| Broche 35 | I/O — User I/O pin (bank 1) |
| Broche 36 | I/O — User I/O pin (bank 1) |
| Broche 37 | I/O — User I/O pin (bank 1) |
| Broche 38 | I/O — User I/O pin (bank 1) |
| Broche 39 | VCCIO1 — I/O bank 1 supply |
| Broche 40 | GND — Ground |
| Broche 41 | I/O — User I/O pin (bank 1) |
| Broche 42 | I/O — User I/O pin (bank 1) |
| Broche 43 | I/O — User I/O pin (bank 1) |
| Broche 44 | I/O — User I/O pin (bank 1) |
| Broche 45 | I/O — User I/O pin (bank 1) |
| Broche 46 | I/O — User I/O pin (bank 1) |
| Broche 47 | I/O — User I/O pin (bank 2) |
| Broche 48 | I/O — User I/O pin (bank 2) |
| Broche 49 | I/O — User I/O pin (bank 2) |
| Broche 50 | I/O — User I/O pin (bank 2) |
| Broche 51 | I/O — User I/O pin (bank 2) |
| Broche 52 | I/O — User I/O pin (bank 2) |
| Broche 53 | I/O — User I/O pin (bank 2) |
| Broche 54 | I/O — User I/O pin (bank 2) |
| Broche 55 | I/O — User I/O pin (bank 2) |
| Broche 56 | GND — Ground |
| Broche 57 | VCCIO2 — I/O bank 2 supply |
| Broche 58 | I/O — User I/O pin (bank 2) |
| Broche 59 | I/O — User I/O pin (bank 2) |
| Broche 60 | I/O — User I/O pin (bank 2) |
| Broche 61 | I/O — User I/O pin (bank 2) |
| Broche 62 | I/O — User I/O pin (bank 2) |
| Broche 63 | I/O — User I/O pin (bank 2) |
| Broche 64 | I/O — User I/O pin (bank 2) |
| Broche 65 | I/O — User I/O pin (bank 2) |
| Broche 66 | I/O — User I/O pin (bank 2) |
| Broche 67 | I/O — User I/O pin (bank 2) |
| Broche 68 | I/O — User I/O pin (bank 2) |
| Broche 69 | I/O — User I/O pin (bank 2) |
| Broche 70 | I/O — User I/O pin (bank 2) |
| Broche 71 | VCCINT — Core supply 3.3 V |
| Broche 72 | GND — Ground |
| Broche 73 | I/O — User I/O pin (bank 2) |
| Broche 74 | I/O — User I/O pin (bank 2) |
| Broche 75 | I/O — User I/O pin (bank 2) |
| Broche 76 | I/O — User I/O pin (bank 2) |
| Broche 77 | I/O — User I/O pin (bank 3) |
| Broche 78 | I/O — User I/O pin (bank 3) |
| Broche 79 | I/O — User I/O pin (bank 3) |
| Broche 80 | I/O — User I/O pin (bank 3) |
| Broche 81 | I/O — User I/O pin (bank 3) |
| Broche 82 | I/O — User I/O pin (bank 3) |
| Broche 83 | I/O — User I/O pin (bank 3) |
| Broche 84 | I/O — User I/O pin (bank 3) |
| Broche 85 | GND — Ground |
| Broche 86 | VCCIO3 — I/O bank 3 supply |
| Broche 87 | I/O — User I/O pin (bank 3) |
| Broche 88 | I/O — User I/O pin (bank 3) |
| Broche 89 | I/O — User I/O pin (bank 3) |
| Broche 90 | I/O — User I/O pin (bank 3) |
| Broche 91 | I/O — User I/O pin (bank 3) |
| Broche 92 | I/O — User I/O pin (bank 3) |
| Broche 93 | I/O — User I/O pin (bank 3) |
| Broche 94 | I/O — User I/O pin (bank 3) |
| Broche 95 | I/O — User I/O pin (bank 3) |
| Broche 96 | I/O — User I/O pin (bank 3) |
| Broche 97 | I/O — User I/O pin (bank 3) |
| Broche 98 | I/O — User I/O pin (bank 3) |
| Broche 99 | I/O — User I/O pin (bank 3) |
| Broche 100 | VCCINT — Core supply 3.3 V |
| Broche 101 | GND — Ground |
| Broche 102 | I/O — User I/O pin (bank 3) |
| Broche 103 | I/O — User I/O pin (bank 3) |
| Broche 104 | I/O — User I/O pin (bank 3) |
| Broche 105 | I/O — User I/O pin (bank 4) |
| Broche 106 | I/O — User I/O pin (bank 4) |
| Broche 107 | I/O — User I/O pin (bank 4) |
| Broche 108 | I/O — User I/O pin (bank 4) |
| Broche 109 | I/O — User I/O pin (bank 4) |
| Broche 110 | I/O — User I/O pin (bank 4) |
| Broche 111 | I/O — User I/O pin (bank 4) |
| Broche 112 | I/O — User I/O pin (bank 4) |
| Broche 113 | I/O — User I/O pin (bank 4) |
| Broche 114 | I/O — User I/O pin (bank 4) |
| Broche 115 | VCCIO4 — I/O bank 4 supply |
| Broche 116 | GND — Ground |
| Broche 117 | I/O — User I/O pin (bank 4) |
| Broche 118 | I/O — User I/O pin (bank 4) |
| Broche 119 | I/O — User I/O pin (bank 4) |
| Broche 120 | I/O — User I/O pin (bank 4) |
| Broche 121 | I/O — User I/O pin (bank 4) |
| Broche 122 | I/O — User I/O pin (bank 4) |
| Broche 123 | I/O — User I/O pin (bank 4) |
| Broche 124 | I/O — User I/O pin (bank 4) |
| Broche 125 | I/O — User I/O pin (bank 4) |
| Broche 126 | I/O — User I/O pin (bank 4) |
| Broche 127 | I/O — User I/O pin (bank 4) |
| Broche 128 | I/O — User I/O pin (bank 4) |
| Broche 129 | I/O — User I/O pin (bank 4) |
| Broche 130 | I/O — User I/O pin (bank 4) |
| Broche 131 | GND — Ground |
| Broche 132 | VCCINT — Core supply 3.3 V |
| Broche 133 | I/O — User I/O pin (bank 4) |
| Broche 134 | I/O — User I/O pin (bank 4) |
| Broche 135 | MSEL0 — Configuration mode select 0 |
| Broche 136 | MSEL1 — Configuration mode select 1 |
| Broche 137 | nCONFIG — Configuration control (active-low) |
| Broche 138 | nSTATUS — Configuration status (active-low) |
| Broche 139 | CONF_DONE — Configuration complete |
| Broche 140 | DCLK — Configuration clock |
| Broche 141 | DATA0 — Configuration data input |
| Broche 142 | TDI — JTAG test data in |
| Broche 143 | TMS — JTAG test mode select |
| Broche 144 | TCK — JTAG test clock |
Applications typiques
EPF6024ATC144-3S convient pour 7 applications: PCI Bus Bridge / Interface Logic, Glue-Logic Integration for Legacy Microprocessors, ATM / Telecom Channelizer, Video / Imaging Pipe-Line Control Logic, Industrial State-Machine Replacement, Legacy Board Repair / EOL Maintenance, Education / FPGA Training Platforms.
PCI Bus Bridge / Interface Logic
The EPF6024ATC144-3S is well matched to PCI 33 MHz/66 MHz bus bridge designs because its 142.86 MHz internal Fmax comfortably exceeds the 66 MHz PCI clock and its 117 user I/Os easily absorb the full 49-pin PCI bus plus parity, interrupt, and side-band signals. Engineers typically instantiate target/initiator state machines, address/data multiplexers, and configuration-space registers in the 1,960 logic elements. Compared to a discrete TTL/CPLD solution, the FLEX 6000 reduces board area, integrates bus-master arbitration, and supports in-system JTAG debugging that accelerates bring-up.
Recommandé
Glue-Logic Integration for Legacy Microprocessors
The EPF6024ATC144-3S serves as a unified glue-logic hub replacing 5-15 discrete 74-series TTL/MSI chips when interfacing legacy microprocessors to modern memories and peripherals. Its 196 LABs and 117 I/Os fit chip-select decoders, wait-state generators, bus multiplexers, and interrupt arbiters within a single footprint. The 3.3 V VCCINT allows direct interface to 3.3 V MCUs without level translation; the SRAM-based fabric supports design pivots late in the cycle via JTAG reconfiguration without board rework.
Recommandé
ATM / Telecom Channelizer
The EPF6024ATC144-3S was a workhorse for ATM cell delineation, AAL segmentation-and-reassembly, and T1/E1 channelizer implementations in late-1990s telecom equipment. Its 142.86 MHz Fmax sustains the 155 Mbps cell rate with comfortable margin, while the 117 I/Os support UTOPIA-style parallel PHY interfaces and HDLC framer connections. Designers mapped cell-header error-correction and SAR FIFOs into the embedded LE registers, using the JTAG port for in-system protocol debugging.
Recommandé
Video / Imaging Pipe-Line Control Logic
The EPF6024ATC144-3S is used to build timing controllers, sync separators, and pixel-format converters for legacy digital video equipment such as CCTV DVRs and broadcast format converters. Its 117 I/Os handle 18-24 bit parallel RGB buses plus HSYNC/VSYNC/DE and ancillary data, and the 142.86 MHz Fmax easily meets 480p/576p pixel clock requirements. The flexible LAB structure lets designers implement FIR filters for chroma interpolation entirely in fabric, eliminating a dedicated chroma IC.
Recommandé
Industrial State-Machine Replacement
The EPF6024ATC144-3S replaces multiple discrete state machines in industrial controllers, allowing new logic revisions to be downloaded via JTAG in the field rather than requiring chip swaps. With 196 LABs, designers can implement 4-8 independent Mealy/Moore state machines in parallel, each controlling a sub-system such as a motor driver, sensor multiplexer, or HMI keypad scanner. The 3.3 V core is tolerant of 5 V inputs on most I/O banks (with proper configuration), preserving compatibility with legacy industrial sensors.
Recommandé
Legacy Board Repair / EOL Maintenance
The EPF6024ATC144-3S is sourced today primarily for MRO (maintenance, repair, overhaul) of legacy boards whose original FLEX 6000 device has failed or been damaged. The TQFP-144 footprint and bitstream-format compatibility mean a direct swap restores functionality without board rework or firmware changes. For 10-year+ lifecycle programs in aerospace, defense, or industrial automation, sourcing this part from authorized brokers is the most cost-effective repair path versus redesign.
Recommandé
Education / FPGA Training Platforms
Universities and FPGA training labs used the EPF6024ATC144-3S as a teaching vehicle for introductory VHDL and Verilog design, since the device was supported by both Quartus MAX+PLUS II and early Quartus Prime flows. The 1,960 LEs provide enough headroom for student projects (UART cores, simple CPUs, VGA controllers) without overwhelming beginners. Today, surplus boards using this device are popular teaching aids in digital-logic curricula that emphasize SRAM-based configuration and JTAG boundary-scan.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF6024ATC144-3S — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF6024ATC144-3N | EPF6024ATC144-3 | EPF6024ATC144-2N | EPF6024ATC144-1N |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | TQFP-144 | TQFP-144 | TQFP-144 | TQFP-144 | TQFP-144 |
| Logic Elements | 1,960 | 1,960 | 1,960 | 1,960 | 1,960 |
| Speed Grade | -3 (142.86 MHz Fmax) | -3 (142.86 MHz) | -3 (142.86 MHz) | -2 (lower Fmax) | -1 (lowest Fmax) |
| Typical Gates | 24,000 | 24,000 | 24,000 | 24,000 | 24,000 |
| User I/Os | 117 | 117 | 117 | 117 | 117 |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Lead-Free / RoHS | Standard finish | Yes (lead-free N suffix) | Standard finish (no suffix) | Yes (lead-free N suffix) | Yes (lead-free N suffix) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Configuration Memory | SRAM (requires boot PROM) | SRAM | SRAM | SRAM | SRAM |
Principaux différenciateurs
- Identical 142.86 MHz Fmax with lead-free terminal finish (vs EPF6024ATC144-3)
- Pin-compatible RoHS-compliant drop-in replacement (vs EPF6024ATC144-3N)
- Higher speed grade over cost-optimized siblings (vs EPF6024ATC144-2N / EPF6024ATC144-1N)
Notes de conception
The EPF6024ATC144-3S draws its VCCINT core supply at 3.3 V from multiple package pins (5, 28, 71, 100, 132). Decouple each VCCINT pin with a 0.1 µF X7R ceramic placed within 5 mm of the pin, and add a single 10 µF bulk tantalum or polymer capacitor near the chip. VCCIO1-VCCIO4 banks can be powered independently from 2.5 V or 3.3 V depending on the I/O standard chosen in the Quartus MAX+PLUS II design; add a 0.1 µF + 10 µF pair on each bank to suppress simultaneous-switching noise.
Because the EPF6024ATC144-3S is SRAM-based, it loses its configuration on every power-down. Always include a compatible configuration PROM (EPC1, EPC2, EPC4, EPC8, or EPC16) on the board, or the FPGA will boot into an undefined state with all I/Os tri-stated. A common bring-up failure is leaving MSEL[1:0] floating - tie them through a 10 kΩ resistor to either VCC or GND to select the correct configuration mode (PS or AS).
Route JTAG signals TCK, TMS, TDI, TDO on the top layer with 50 Ω controlled impedance and keep them isolated from clock and switching I/O traces by at least 3W (3× trace width) to avoid configuration glitches. Place a 4.7 kΩ pull-up on nCONFIG and a 10 kΩ pull-up on nSTATUS per the FLEX 6000 datasheet to prevent spurious re-configuration events during power-ramp. The 144-pin TQFP has gull-wing leads on 1.0 mm pitch, so use a fine-pitch soldering iron or hot-air rework station for board repair.
The EPF6024ATC144-3S supports LVTTL, LVCMOS, PCI, and SSTL-3 I/O standards. For PCI 33 MHz/66 MHz applications, terminate the 66 MHz clock with a series 33 Ω resistor at the FPGA pin to dampen reflections. For LVDS inputs, ensure the 100 Ω differential termination is placed within 200 mils of the FPGA pin. Unused I/O pins default to tri-stated with weak pull-ups; explicitly disable them in the Quartus project to save ~0.5 mA per pin in the I CCINT supply.
Estimated: At Fmax = 142.86 MHz and full 117-I/O toggle, the EPF6024ATC144-3S dissipates approximately 0.6 W-0.8 W (input values: ICCINT ≈ 180 mA, ICCIO ≈ 30 mA at 3.3 V). The TQFP-144 package has a theta-JA of approximately 35 °C/W on a 4-layer PCB with 1 oz copper. Junction temperature rises 21-28 °C above ambient - no heatsink is required for typical commercial applications. For industrial-temperature designs, verify with the FLEX 6000 datasheet derating curves.
Informations de conformité
Operating temperature range not confirmed in the verified data - flagged as [DATA_NEEDED] in specs. RoHS and REACH compliance not explicitly stated in the web search results; the EPF6024ATC144-3N variant is the lead-free RoHS-compliant substitute. AEC-Q100 not applicable - this is a commercial-grade FPGA.
