EP1K100FC256-1N - 100K Gates 49Kbit SRAM ACEX-1K FPGA | Altera | BGA-256
Référence : EP1K100FC256-1N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $28.9 | $2 890,00 |
| 250 | $25.4 | $6 350,00 |
| 500 | $22.1 | $11 050,00 |
EP1K100FC256-1N Présentation
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that the designer can reconfigure after manufacturing to implement arbitrary digital logic. FPGAs sit in the programmable logic hierarchy beneath CPLDs (which are simpler, non-volatile, and lower density) and above fixed-function ASICs, occupying the niche where fast time-to-market, in-system reprogrammability, and parallel hardware acceleration outweigh the per-unit cost advantage of masked ASICs.
Key features of the EP1K100FC256-1N include 624 logic array blocks (LABs) each containing 8 LEs, dedicated dual-port EAB (Embedded Array Block) memory supporting true dual-port RAM, ROM, and FIFO functions, built-in JTAG IEEE 1149.1 boundary-scan support, and 2.5 V core operation with multi-voltage I/O supporting 1.5 V, 1.8 V, 2.5 V, and 3.3 V interfaces through configurable I/O standards including LVTTL, LVCMOS, PCI, and SSTL. The device is configured via Altera's serial or parallel configuration scheme using a passive serial (PS), passive parallel synchronous (PPS), or passive parallel asynchronous (PPA) configuration mode driven by an external PROM or microcontroller.
Typical applications include glue-logic replacement for multiple 74-series TTL parts, low-volume prototype-to-production bridge designs, peripheral bus controllers (PCI bridges, ISA-to-PCI converters), serial protocol bridges (UART, SPI, I2C), digital signal processing front-ends, industrial control logic, and education/training platforms where low cost and Quartus II software support are essential. Its 256-ball BGA package enables dense PCB layouts but requires careful fan-out routing on at least a 4-layer board.
When designing with the EP1K100FC256-1N, ensure adequate decoupling (0.1 µF per VCC pin plus 10 µF bulk), controlled-impedance routing for clock traces, and a robust configuration circuit because SRAM-based FPGAs lose their configuration on every power cycle and must be reconfigured at boot. Designers should also verify supply ramp time falls within the datasheet limits to avoid configuration latch-up.
This page synthesizes distributor pricing, ACEX-1K family drop-in alternatives, and practical BGA layout design notes not consolidated in any single manufacturer document.
Alternatives de remplacement direct pour EP1K100FC256-1N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1K100FC256-1N (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Process Technology, Total RAM Bits, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1K100FC256-1
✅ Remplacement direct✓ En stock
$53.2 / unité
Voir la fiche technique →EP1K100FC256-2N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$78.1951 / unité
Voir la fiche technique →EP1K100FC256-3N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →EP1K100FI256-2N
✅ Remplacement direct✓ En stock
$55.8 / unité
Voir la fiche technique →EP1K100FI256-2
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$92 / unité
Voir la fiche technique →EP1K100FI256-1N
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EP1K100FC256-1N Valeurs maximales et caractéristiques électriques
| Family | ACEX-1K |
| Logic Elements | 4,992 |
| Typical Gates | 100,000 |
| Maximum User I/O | 186 |
| Embedded SRAM | 49,152 bits |
| Logic Array Blocks (LABs) | 624 |
| Embedded Array Blocks (EABs) | 12 |
| Boîtier | 256-ball FineLine BGA |
| Process Technology | 0.18 µm SRAM-based |
| Core Voltage | 2.5 V |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, SSTL (1.5 V / 1.8 V / 2.5 V / 3.3 V) |
| Operating Temperature (Commercial) | 0 °C to +70 °C |
| Speed Grade | -1 |
| Configuration Mode | Passive Serial / Passive Parallel (Synchronous & Asynchronous) |
| JTAG Support | IEEE 1149.1 Boundary-Scan |
| Lead-Free (N suffix) | Yes (Pb-free BGA) |
Guide de configuration des broches du EP1K100FC256-1N 256-ball fineline bga
Configuration des broches du EP1K100FC256-1N (boîtier 256-ball fineline bga). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP1K100FC256-1N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP1K100FC256-1N convient pour 6 applications: Glue-Logic Replacement, Industrial Control Logic, Peripheral Bus Bridge (PCI / ISA), Serial Protocol Bridge, Digital Signal Processing Front-End, Education and Training Platform.
Glue-Logic Replacement
The EP1K100FC256-1N replaces multiple discrete 74-series TTL/CMOS logic packages with a single reprogrammable device, simplifying PCB layout and BOM cost. Its 4,992 LEs and 624 LABs comfortably absorb the gate-equivalent of 20-30 SSI/MSI packages per chip. The SRAM-based architecture allows design changes via JTAG without board rework, ideal for evolving glue logic. With 186 user I/Os and multi-voltage I/O banks, the device bridges 3.3 V peripherals to 2.5 V or 1.8 V cores. Power consumption is typically 0.5-1.5 W depending on toggle rate, making it suitable for fanless industrial chassis.
Recommandé
Industrial Control Logic
The EP1K100FC256-1N implements state machines, PID controllers, and motor-control timing logic in industrial automation equipment. Its 49,152 bits of dual-port SRAM on-chip supports high-speed lookup tables and waveform storage without external memory. The 256-ball BGA allows dense I/O routing for encoder inputs, PWM outputs, and fieldbus interfaces. Designers favor this part for legacy PLC I/O expansion cards because the Quartus II toolchain remains free and well-supported. Industrial users should choose the EP1K100FI256-2 variant for the wider -40 C to +85 C temperature window.
Recommandé
Peripheral Bus Bridge (PCI / ISA)
The EP1K100FC256-1N was widely adopted as a PCI-to-ISA or PCI-to-local-bus bridge in legacy add-in cards and embedded motherboards. Its 624 LABs handle the 33 MHz PCI target or master state machine, while the 12 EABs implement FIFOs for bus posting and posted-write buffers. The device's 2.5 V core and 3.3 V-tolerant I/O banks interface directly to PCI 2.2 signaling without external level translators. The 186 user I/O count provides ample headroom for secondary buses such as IDE, USB 1.1, or parallel ATA. Engineers reading old PCI reference designs will find numerous Quartus II example projects targeting this exact part.
Recommandé
Serial Protocol Bridge
The EP1K100FC256-1N implements UART, SPI, I2C, and CAN bridges between microcontrollers and legacy peripherals in test equipment and instrumentation. Its 49 Kbit dual-port SRAM acts as a hardware FIFO for high-speed UARTs up to 10 Mbaud or CAN 2.0B streams. Multi-voltage I/O banks allow direct connection to 1.8 V MCUs and 5 V peripherals without level shifters, provided the VCCIO banks are configured correctly. Engineers can implement a 4-channel UART bridge (16C554-compatible) in approximately 1,200 LEs, leaving the remainder for custom protocol conversion. The part's JTAG support simplifies in-field firmware updates via Quartus II Programmer.
Recommandé
Digital Signal Processing Front-End
The EP1K100FC256-1N is suitable for DSP front-end tasks such as FIR filtering, FFT preprocessing, and data acquisition gating in moderate-bandwidth (under 50 MSPS) applications. Its 12 EABs can be cascaded to build shift-register-based FIR filters up to 64 taps with 8-bit coefficients. The 49 Kbit dual-port SRAM stores time-domain sample windows for spectral analysis. For audio-rate DSP (44.1 kSPS to 192 kSPS), the device easily implements custom sample-rate converters and digital crossovers. Higher-speed DSP tasks (above 100 MSPS) require modern Cyclone IV or Stratix families; the ACEX-1K is best for cost-sensitive legacy audio and instrumentation.
Recommandé
Education and Training Platform
Universities and technical institutes continue to use the EP1K100FC256-1N on legacy Altera development boards (e.g., Nios development kits, University Program boards) for teaching digital logic and embedded design. The free Quartus II Web Edition supports the entire ACEX-1K family, making the part attractive for cost-sensitive classroom deployments. Students learn VHDL/Verilog, finite-state-machine design, and timing analysis on a real 100K-gate device rather than a simulator-only environment. The 256-ball BGA exposes students to high-density PCB layout techniques and signal-integrity considerations. Although Altera recommends Cyclone IV for new curricula, the EP1K100FC256-1N remains in service on hundreds of donated lab kits.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1K100FC256-1N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1K100FC256-1 | EP1K100FC256-2N | EP1K100FC256-3N | EP1K100FI256-2N | EP1K100FI256-1N |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Package | 256-ball FineLine BGA | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same |
| Logic Elements | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 |
| Speed Grade | -1 | -1 | -2 (faster) | -3 (slowest, lowest power) | -2 (faster) | -1 |
| Temperature Grade | Commercial (0 C to +70 C) | Commercial | Commercial | Commercial | Industrial (-40 C to +85 C) | Industrial (-40 C to +85 C) |
| Embedded SRAM | 49,152 bits | 49,152 bits | 49,152 bits | 49,152 bits | 49,152 bits | 49,152 bits |
| Maximum User I/O | 186 | 186 | 186 | 186 | 186 | 186 |
| BGA Ball Finish | Lead-free (N suffix) | SnPb (leaded) | Lead-free | Lead-free | Lead-free | Lead-free |
Principaux différenciateurs
- Lead-free ball finish (RoHS compliant) (vs EP1K100FC256-1)
- Fastest speed grade in the family (vs EP1K100FC256-3N)
- Commercial temperature window for cost-sensitive designs (vs EP1K100FI256-2N)
Notes de conception
Estimated: The 256-ball FineLine BGA has a 1.0 mm ball pitch, which requires a 4-layer PCB minimum with laser-drilled microvias or 6-layer stack-up with conventional 0.2 mm vias for reliable fan-out. Per the ACEX-1K datasheet, route all VCCINT and VCCIO pins to power planes, not traces, and place one 0.1 µF 0402 ceramic decoupling capacitor within 2 mm of every VCC pin. Add 10 µF X5R bulk capacitors per power rail near the package perimeter. Maintain a continuous ground plane beneath the BGA to control return-current paths for the 186 user I/Os.
Because the EP1K100FC256-1N is SRAM-based, it loses its configuration on every power-down and must be reconfigured at boot via an external EPC2-series configuration PROM or a microcontroller. Per the Altera ACEX-1K datasheet, the nCONFIG pin must be held low until VCCINT and VCCIO rails reach their minimum thresholds (2.375 V and 1.35 V respectively), then pulsed high to initiate configuration. A poorly designed reset sequence can leave the device in an undefined state where outputs drive random patterns - always sequence the reset after the configuration PROM is ready (nSTATUS high, CONF_DONE low).
Estimated: For BGA-256 fan-out, use a dog-bone or via-in-pad pattern with 0.5 mm via pads and 0.2 mm drill. Keep signal trace length matching to within 1 mm for clock and global signal pairs. Place the configuration EPC2 or EPCS device within 50 mm of the FPGA DATA/DCLK pins to minimize skew. If your design uses JTAG for boundary-scan test, place 10 kΩ pull-ups on TCK, TMS, TDI and leave TDO unterminated per IEEE 1149.1. The 49 Kbit embedded SRAM should be backed by read-only parity or ECC for safety-critical applications.
Estimated: Power dissipation scales with toggle rate and output loading; typical commercial designs at 50 MHz toggle rate and 50 pF loads dissipate 0.8-1.5 W. The FineLine BGA has a theta-JA of approximately 18 °C/W with a standard 4-layer JEDEC test board, so a 1.5 W load produces a 27 °C temperature rise above ambient - well within the 70 °C commercial limit. For industrial designs using the EP1K100FI256-2 variant, ensure worst-case junction temperature stays below 100 °C to maintain timing margins.
Informations de conformité
RoHS compliance confirmed by 'N' suffix on MPN denoting Pb-free BGA ball finish. AEC-Q100 not applicable - this is an FPGA, not a power semiconductor. Halogen-free and conflict-minerals declarations not stated in the verified web data; set to 'unknown'.
