EP1K100FC256-3N - ACEX 1K FPGA 100K Gates | Altera
MPN: EP1K100FC256-3N ✗ End of Life| Qty | Unit Price | Extended |
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Drop-in alternatives for EP1K100FC256-3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EP1K100FC256-2N
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View Datasheet →EP1K100FC256-3N Maximum Ratings & Electrical Characteristics
| Product Family | ACEX 1K |
| Programmable Logic Type | FPGA (Field Programmable Gate Array) |
| Number of Logic Elements/Cells | 4992 |
| Number of LABs | 624 |
| Total RAM Bits | 49152 |
| Number of User I/Os | 186 |
| Typical Gate Count | 100000 |
| Core Supply Voltage (VCCINT) | 2.5 V |
| Process Technology | 0.22 um |
| Package | 256-BGA (FBGA) |
| Number of Pins/Terminals | 256 |
| Mounting Type | Surface Mount |
| Terminal Form | BALL |
| Package Code | BGA |
| Speed Grade | -3 (commercial) |
| Operating Temperature Grade | Commercial (per Partstack listing) |
EP1K100FC256-3N bga Pin Configuration Guide
Complete pinout information for EP1K100FC256-3N (bga package) with 256 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1K100FC256-3N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 256 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1K100FC256-3N is suitable for 6 applications: Digital Signal Processing Front-End, Legacy Telecommunication Line Card Bridging, Industrial Machine Control and HMI Panel Prototyping, Medical Monitoring Instrumentation Glue Logic, Audio DSP and Effects Prototyping, University FPGA Laboratory and Legacy FPGA Education.
Digital Signal Processing Front-End
The EP1K100FC256-3N suits DSP pre-processing because its ACEX 1K fabric combines 4,992 LUT-based logic elements with 49,152 EAB RAM bits. DSP chains typically need multipliers, delay lines, FIFOs, and coefficient ROM; EABs can hold these memories locally and avoid external SRAM. The FPGA can implement an FIR filter tap chain or FFT twiddle ROM while maintaining 186 user I/Os for parallel ADCs and DACs. Designers should not expect the density of a modern Cyclone or Stratix device, but for a 100K-gate-class 2.5 V system the ACEX 1K is a proven architecture. Use the -3N at modest clock rates and obtain a timing report for the actual DSP data path; if throughput must rise, choose a faster -2N or -1N speed-grade variant. The embedded RAM reduces board count and power compared with discrete FIFOs, making this a compact DSP glue-logic solution.
Recommended
Legacy Telecommunication Line Card Bridging
A line card often needs parallel bus translation and packet FIFO between TDM buses and a host CPU. EP1K100FC256-3N has 186 user I/Os, enough to capture a full 8/16-bit parallel interface, while 49,152 RAM bits form dual-port packet FIFOs or elastic buffers. The EABs implement dual-port RAM and FIFO without external memory controllers. The -3 speed grade is generally enough for 50-100 MHz bus interfaces, and the 2.5 V core consumes less dynamic power than mature 3.3 V programmable logic. The N lead-free package and commercial temperature grade make it suitable for indoor wired network environments. Because legacy line cards may require exact BOM and bitstream compatibility, EP1K100FC256-2N is a drop-in spares option with modest design margin while remaining in the same 12x12? 256-ball footprint.
Recommended
Industrial Machine Control and HMI Panel Prototyping
Industrial HMIs and machine controllers use glue logic to interface microcontrollers, encoders, pushbuttons, and communication controllers. The EP1K100FC256-3N can integrate address decoding, simple state machines, and scan logic, reducing part count in such systems. Its 186 user I/Os and 624 LABs provide enough logic to manage many LEDs, buttons, and relay interfaces through shift registers. EAB RAM can buffer display frames, calibration tables, and command FIFOs. Note that this part is commercial-temperature per the Partstack listing; for environments above 70 C, use an industrial ACEX 1K variant and confirm thermal design. The -3 speed grade is suited to asynchronous handshakes and 100 MHz-class synchronous logic, and the N finish supports lead-free assembly flows.
Recommended
Medical Monitoring Instrumentation Glue Logic
Benchtop and portable medical monitors need custom timing generation, ADC sample-clock sequencing, display control, and supervisory logic without high device costs. EP1K100FC256-3N can consolidate these functions in one 256-ball FBGA. Its EABs can hold look-up tables for transducer linearization, alarm thresholds, and display memory; its 4,992 logic elements can implement UART or SPI bridges and watchdog state machines. The 2.5 V core reduces dynamic power relative to 3.3 V logic and is compatible with many mixed-voltage systems when MultiVolt I/O levels are correctly configured. The 186 I/Os leave enough pins to connect an ADC parallel bus and an LCD controller simultaneously. For medical applications, confirm the component's lifecycle, temperature grade, and long-term availability with the manufacturer before design release.
Recommended
Audio DSP and Effects Prototyping
Audio effects commonly use FIR filters, chorus/delay lines, wave shapers, and metering logic. EP1K100FC256-3N can implement delay buffers with its 49,152 RAM bits; EABs can act as dual-port RAM so a delay read and write pointer can operate simultaneously. The 4,992 LUT elements are sufficient for a compact 8-channel mixer, bit-crushing effect, and control interface. The 2.5 V core and N lead-free package make it convenient for modern PCB assembly workflows. A typical design might run audio sample clocks from 44.1 kHz to 192 kHz at modest logic speeds, so the -3 grade has ample timing margin in the audio domain. The 186 I/Os allow connection to external codecs, digital pots, and MIDI UARTs.
Recommended
University FPGA Laboratory and Legacy FPGA Education
University digital-design courses often prefer a mature, well-documented FPGA family for teaching state machines, datapath, and memory. EP1K100FC256-3N provides 624 LABs and 49,152 RAM bits, which are enough for student projects such as simple processors, UARTs, VGA controllers, and ALU designs. The Altera/Quartus tool flow supports ACEX 1K synthesis and place-and-route, so educational material can be reused from classic Altera curricula. The 256-ball BGA requires a carrier board or BGA adapter, but the 2.5 V core, external configuration PROM, and 186 I/O make it an instructive introduction to FPGA power, config, and I/O design. Because the part is legacy, it is best used for teaching fundamental logic design rather than production-oriented high-performance applications.
Recommended
Recommended Products Summary
Engineering reference data for EP1K100FC256-3N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1K100FC256-2N | EP1K100FC256-3 | EP1K100FC256-2 | EP1K100FC256-1N | EP1K100FC256-1 |
|---|---|---|---|---|---|---|
| Family | ACEX 1K | ACEX 1K | ACEX 1K | ACEX 1K | ACEX 1K | ACEX 1K |
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Package | 256-BGA (FBGA) | 256-BGA (FBGA) - same | 256-BGA (FBGA) - same | 256-BGA (FBGA) - same | 256-BGA (FBGA) - same | 256-BGA (FBGA) - same |
| Logic Elements | 4992 | 4992 | 4992 | 4992 | 4992 | 4992 |
| Total RAM Bits | 49152 | 49152 | 49152 | 49152 | 49152 | 49152 |
| User I/Os | 186 | 186 | 186 | 186 | 186 | 186 |
| Core Voltage (VCCINT) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Speed Grade | -3 | -2 (faster) | -3 | -2 (faster) | -1 (fastest) | -1 (fastest) |
| Lead-Free Finish Indication | N lead-free | N lead-free | Non-N, tin-lead likely | Non-N, tin-lead likely | N lead-free | Non-N, tin-lead likely |
Key Differentiators
- Lead-free N-finish variant of the ACEX 1K -3 speed grade (vs EP1K100FC256-3)
- Lowest common speed grade with commercial temperature and standard 186 I/O count (vs EP1K100FC256-2N)
- 256-ball FBGA package is a drop-in base for faster speed-grade migration (vs EP1K100FC256-2 and EP1K100FC256-2N)
Design Notes
The EP1K100FC256-3N is an SRAM-based ACEX 1K FPGA, so it is volatile and must be configured at every power-up. Use an Altera EPC configuration device, a download cable, or a controller that writes the configuration bitstream immediately after the 2.5 V core supply stabilizes. The exact configuration mode select pins and DATA/DCLK connections should be taken from the ACEX 1K datasheet. A very common failure is resetting or removing the configuration source while VCCINT is still below the recommended operating range; do not release the device from configuration until core voltage is within the 2.5 V specification.
Estimated: ACEX 1K power consumption depends on I/O count, clock rate, and toggle rate; the 2.5 V core lowers dynamic power but a 256-ball BGA still needs low-impedance power delivery. Place 0.1 uF ceramic capacitors close to each VCCINT and VCCIO ball, and use a bulk capacitor near the FPGA supply pins. MultiVolt I/O means VCCIO can be different from VCCINT, so confirm each I/O bank's voltage before layout. For legacy boards, verify that any 3.3 V I/O interface does not exceed the absolute maximum ratings on the bank when VCCIO transitions during power sequencing.
A 256-ball fine-pitch BGA depends on the PCB for heat spreading. Provide a solid ground plane under the center of the package, multiple thermal vias to inner ground layers, and a copper pour area that is at least as large as the BGA body. ACEX 1K commercial-temperature devices are rated for indoor 0 to 70 C environments, not extended industrial ranges. If the system is placed in an enclosure without airflow, estimate the junction temperature from the datasheet theta-JA and keep it below the manufacturer maximum. For solder reliability, follow the recommended stencil and reflow profile for a lead-free N-finish package.
Compliance Information
N suffix is conventionally lead-free in Altera's ordering scheme, but no material declaration or RoHS certificate appears in the fetched web data. Confirm with Intel/Altera documentation before making regulatory claims.
