EP1M120B484C5 - Mercury FPGA, 120K Gates, BGA-484 | Intel / Altera
Référence : EP1M120B484C5 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $95 | $95,00 |
| 10 | $88.5 | $885,00 |
| 100 | $78 | $7 800,00 |
| 250 | $72 | $18 000,00 |
| 500 | $65 | $32 500,00 |
EP1M120B484C5 Présentation
What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor device containing programmable logic blocks, interconnect, and I/O resources that can be configured by the end user after manufacture. FPGAs sit in the broader category of programmable logic devices (PLDs), which includes CPLDs and older PAL/GAL devices. Within Intel's product hierarchy, the Mercury family is positioned between the APEX family and the Stratix family, optimized for high-speed LVDS and HSTL I/O with embedded multiplier support for DSP pipelines.
Key specifications include 120,000 typical gates, 4,800 logic elements, 4 PLLs, and up to 303 user I/O pins. The Mercury architecture includes embedded system blocks that combine dedicated dual-port RAM, true-LVDS circuitry, and high-speed I/O capable of transferring data at 840 Mbps per channel. The device supports multiple I/O standards including LVTTL, LVCMOS, SSTL, HSTL, LVDS, and LVPECL.
The Mercury family uses a continuous, hierarchical interconnect fabric driven by row and column routing resources. Logic elements contain a 4-input look-up table (LUT), a programmable register, and dedicated carry and cascade chains for arithmetic operations. The 0.18-micron CMOS process allows the device to operate with a core voltage of 1.8V while supporting 1.5V, 1.8V, 2.5V, and 3.3V I/O banks through selectable reference voltages.
Typical applications include high-speed serial backplane interfaces, SONET/SDH framer cards, network switch fabrics, DSP co-processing for baseband designs, and instrumentation data acquisition. The integrated LVDS channels make the EP1M120B484C5 particularly well-suited for designs requiring low-jitter differential signaling between FPGAs and external analog-to-digital converters.
When designing with this device, engineers should note that the Mercury family is a legacy product line now serviced under Intel's product longevity program. Modern designs should consider Cyclone IV/V or MAX 10 for new platforms, but existing Mercury designs remain supported for long-lifecycle industrial and aerospace programs.
This page synthesizes distributor pricing, drop-in alternatives from the same Mercury family, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour EP1M120B484C5 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1M120B484C5 (même facteur de forme et même empreinte) — différant par Package, Family, Speed Grade, Logic Elements, Mounting Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1M120F484C5
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$110 / unité
Voir la fiche technique →EP1M120F484I5
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$189 / unité
Voir la fiche technique →EP1M120F484C6
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$198 / unité
Voir la fiche technique →EP1K100FI484-2
✅ Remplacement direct✓ En stock
$118 / unité
Voir la fiche technique →EP1K100FC484-2
✅ Remplacement direct✓ En stock
$33.4 / unité
Voir la fiche technique →EP1M120B484C5 Valeurs maximales et caractéristiques électriques
| Family | Mercury (EP1M) |
| Logic Elements | 4,800 |
| Typical Gates | 120,000 |
| Maximum User I/O | 303 |
| Boîtier | FineLine BGA-484 (19 mm x 19 mm, 1.0 mm pitch) |
| Température de fonctionnement | 0C to +85C (commercial) |
| Speed Grade | 5 (slowest) |
| Core Voltage | 1.8 V |
| Process Technology | 0.18 um CMOS |
| PLLs | 4 |
| Embedded RAM Bits | 49,152 |
| True LVDS Channels | Up to 34 pairs |
| Maximum LVDS Data Rate | 840 Mbps per channel |
| Configuration Scheme | Passive serial, passive parallel synchronous, passive parallel asynchronous, JTAG |
| Peak Reflow Temperature | 220 C |
| Lead-Free / RoHS | SnPb ball finish (non-RoHS by default) |
| Multipliers | Embedded in system blocks for DSP |
| Type de montage | Surface Mount |
Guide de configuration des broches du EP1M120B484C5 fineline bga-484 (19 mm x 19 mm, 1.0 mm pitch)
Configuration des broches du EP1M120B484C5 (boîtier fineline bga-484 (19 mm x 19 mm, 1.0 mm pitch)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP1M120B484C5.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP1M120B484C5 convient pour 6 applications: SONET/SDH Framer Card, High-Speed ADC Data Capture, DSP Co-Processor for Baseband, Network Switch Fabric Interface, Industrial Test Instrumentation, Aerospace and Defense Avionics Bus.
SONET/SDH Framer Card
The EP1M120B484C5 fits SONET/SDH framer designs because of its true-LVDS channels at 840 Mbps per pair and its 4 PLLs that synthesize the multiple clock domains required by STS-1/STM-1 payload mapping. Its 4,800 logic elements and 49,152 bits of embedded dual-port RAM provide buffering for payload pointers and overhead bytes without external memory in many line-card designs. The 303 user I/O pins accommodate the 16-bit LVDS framer bus plus overhead serial links and backplane interfaces.
Recommandé
High-Speed ADC Data Capture
The EP1M120B484C5 is well matched to 12-14 bit ADC capture boards sampling at 100-200 MSPS, where the LVDS pairs deliver serialized ADC data directly into the embedded system blocks. The 4 PLLs generate per-channel sampling clocks with programmable phase shift, and the dual-port RAM blocks act as deep FIFOs to absorb bus bursts into a downstream processor. Estimated: at 200 MSPS across 8 LVDS pairs (1.6 Gbps aggregate), the FPGA's 4,800 logic elements sustain simple digital down-conversion and triggering.
Recommandé
DSP Co-Processor for Baseband
Embedded multiplier blocks in the EP1M120B484C5 support single-cycle MAC operations for FIR filters, correlators, and QAM demodulators, making the device a useful baseband co-processor paired with a host DSP or PowerPC. The 120K-gate capacity allows multi-channel equalization for narrowband radio links, and the LVDS I/O streams digitised IF data from front-end ADCs at line rates up to 840 Mbps. The 4 PLLs provide independent sampling and symbol clocks for synchronous demodulation.
Recommandé
Network Switch Fabric Interface
The EP1M120B484C5 sits well between a network switch ASIC and its line cards, handling serial-to-parallel conversion, ingress/egress buffering, and link-layer management. With up to 34 LVDS pairs at 840 Mbps, the device can aggregate multiple gigabit Ethernet or RapidIO channels onto a wider switch fabric bus. The 49,152 bits of embedded RAM serve as packet buffers for cut-through or store-and-forward switching modes.
Recommandé
Industrial Test Instrumentation
The EP1M120B484C5's combination of LVDS, multipliers, and 303 user I/O suits multi-channel test instruments such as logic analyzers, protocol testers, and ATE pin electronics. Engineers can route stimulus patterns to dozens of DUT pins while acquiring high-speed response waveforms through the LVDS pairs. Industrial temperature variants (suffix I5) extend operation to -40C to +100C, enabling deployment in factory-floor and outdoor test fixtures.
Recommandé
Aerospace and Defense Avionics Bus
The EP1M120B484C5 supports legacy avionics databuses such as MIL-STD-1553 and ARINC 429 bridges, ARINC 664 (AFDX) packetizers, and Fibre Channel recorders where the LVDS pairs map directly to high-speed serial links. Industrial/extended temperature grades and the rugged BGA-484 package are favored for vibration-prone airframes. The Mercury family's long-term support program makes it attractive for avionics platforms with 20-30 year service lifetimes.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1M120B484C5 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1M120F484C5 | EP1M120F484I5 | EP1M120F484C6 | EP1K100FI484-2 | EP1K100FC484-2 |
|---|---|---|---|---|---|---|
| Package | BGA-484 | BGA-484 - same | BGA-484 - same | BGA-484 - same | BGA-484 - same | BGA-484 - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Family | Mercury (EP1M) | Mercury (EP1M) | Mercury (EP1M) | Mercury (EP1M) | ACEX 1K | ACEX 1K |
| Typical Gates | 120,000 | 120,000 | 120,000 | 120,000 | 100,000 | 100,000 |
| Logic Elements | 4,800 | 4,800 | 4,800 | 4,800 | 4,992 | 4,992 |
| Maximum User I/O | 303 | 303 | 303 | 303 | 333 | 333 |
| Speed Grade | 5 (slowest) | 5 | 5 | 6 | -2 | -2 |
| Embedded Multipliers | Yes (system blocks) | Yes (system blocks) | Yes (system blocks) | Yes (system blocks) | No | No |
| True LVDS | Yes (840 Mbps) | Yes (840 Mbps) | Yes (840 Mbps) | Yes (840 Mbps) | Limited (311 Mbps) | Limited (311 Mbps) |
| Operating Temperature | 0C to +85C | 0C to +85C | -40C to +100C | 0C to +85C | -40C to +100C | 0C to +85C |
Principaux différenciateurs
- Speed grade -5 (slowest) vs faster Mercury siblings (vs EP1M120F484C5)
- Mercury true-LVDS at 840 Mbps vs ACEX 1K limited LVDS (vs EP1K100FI484-2)
- Embedded multipliers for DSP (vs EP1K100FC484-2)
- BGA-484 footprint shared across Mercury family (vs EP1M120F484I5)
Notes de conception
Estimated: at typical 1.8 V core and 100 MHz operation with 50% logic utilization, the EP1M120B484C5 dissipates roughly 1.0-1.5 W. The BGA-484 package's small footprint limits convection cooling, so use a 4-layer PCB with an unbroken ground plane directly under the package and stitch the thermal balls (VCCINT GND) to inner planes with 8-12 vias each. For sealed industrial enclosures, consider a small clip-on heatsink or thermal pad interface material.
Use 1.0 mm-pitch BGA fan-out with microvia technology (laser-drilled 0.1 mm vias) on a high-Tg FR-4 or low-loss PCB material. Escape the inner balls on the top layer with dog-bone fan-out, then route signals on inner layers referenced to solid ground/power planes. Maintain 50 ohm single-ended and 100 ohm differential impedance for LVDS pairs; length-match within 150 mil to preserve 840 Mbps signal integrity.
Do not hot-plug the EP1M120B484C5 - always sequence VCCINT (1.8 V) before VCCIO (1.5/1.8/2.5/3.3 V) to prevent I/O latch-up. Configure unused user I/O pins as tri-stated inputs with weak pull-ups via the Quartus II device options. For JTAG programming, ensure TCK has a 1-10 kohm pull-down and TMS has a 1-10 kohm pull-up to avoid spurious configuration during board reset.
Place decoupling capacitors on the bottom side of the BGA directly under adjacent power/ground balls, using 0.1 uF X7R ceramics for high-frequency and 10 uF tantalum or polymer capacitors for bulk. Estimated: target 1 bulk cap per 4 power pins and 1 high-frequency cap per 2 power pins. Keep the PLL analog supply (VCC_PLL) isolated with a ferrite bead and decoupled with 0.1 uF and 10 uF caps for low-jitter operation.
Informations de conformité
Mercury family ships with SnPb (tin-lead) BGA balls by default, making standard parts non-RoHS. A Pb-free variant may be available by special order. REACH compliance status inferred from Intel product stewardship disclosures; verify with the manufacturer before EU-market shipment.
