EP1K100FC484-2 - 100K-Gate ACEX-1K FPGA, 484-BGA, 2.5V | Altera
Référence : EP1K100FC484-2 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $65 | $65,00 |
| 10 | $58.5 | $585,00 |
| 100 | $48.2 | $4 820,00 |
| 500 | $39.8 | $19 900,00 |
| 1 000 | $33.4 | $33 400,00 |
EP1K100FC484-2 Présentation
An FPGA (Field‑Programmable Gate Array) is a reprogrammable semiconductor device that lets engineers implement custom digital logic, memory blocks and arithmetic functions without the cost of an ASIC. Within the programmable logic hierarchy, the ACEX‑1K family belongs to the low‑cost CPLD‑replacement tier of SRAM‑based FPGAs, sitting between classic PLDs and higher‑density families such as APEX or Cyclone. Its architecture combines logic array blocks (LABs), embedded array blocks (EABs) for dual‑port RAM and ROM, and a continuous interconnect, which makes it suitable for glue‑logic, bus‑interface and DSP‑frontend functions.
The EP1K100FC484-2 uses an enhanced embedded array with 624 LABs and 4,992 logic elements, supported by 49,152 RAM bits organized into EABs. Each EAB provides up to 4,096 RAM bits and is configurable as dual‑port RAM, ROM, or logic. Combined with multi‑volt I/O support, this enables seamless bridging between legacy 5 V tolerant buses and 3.3 V or 2.5 V processors. The 484‑BGA package exposes 333 user I/O pins, allowing wide parallel buses, multiple UARTs, and high‑pin‑count memory interfaces on a compact board footprint.
Typical applications include telecommunications line cards, industrial control and factory‑automation controllers, low‑cost DSP preprocessing, peripheral bridges for PC/104 and VME systems, and high‑speed glue logic. Its 2.5 V core and on‑chip EAB memory make it well suited to data‑path and protocol‑conversion designs. Designers should note that this part is now in the Altera/Intel legacy lifecycle; long‑term availability is limited and the design should consider newer Cyclone or MAX families for new projects.
When designing with the EP1K100FC484-2, place decoupling capacitors as close as possible to every VCCINT/VCCIO ball, follow the FineLine BGA fan‑out rules for a 1.0 mm pitch, and use the Quartus II design suite (legacy version supporting ACEX‑1K) for synthesis, place‑and‑route, and timing closure. This page synthesizes distributor pricing, same‑family drop‑in alternatives, and practical design notes not collected on any single manufacturer datasheet.
Alternatives de remplacement direct pour EP1K100FC484-2 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1K100FC484-2 (même facteur de forme et même empreinte) — différant par Process Technology, Package, Configuration Method, Speed Grade, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1K100FC484-2N
✅ Remplacement direct✓ En stock
$58.4 / unité
Voir la fiche technique →EP1K100FC484-3N
✅ Remplacement direct✓ En stock
$65.1 / unité
Voir la fiche technique →EP1K100FI484-2
✅ Remplacement direct✓ En stock
$118 / unité
Voir la fiche technique →EP1K100FC484-1
✅ Remplacement direct✓ En stock
$52.1 / unité
Voir la fiche technique →EP1K100FC484-1N
✅ Remplacement direct✓ En stock
$58.4 / unité
Voir la fiche technique →EP1K100FC484-2P
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP1K100FC484-2 Valeurs maximales et caractéristiques électriques
| Series | ACEX-1K |
| Family | ACEX 1K |
| Logic Elements / Cells | 4992 |
| Total RAM Bits | 49152 |
| Number of LABs/CLBs | 624 |
| Number of User I/O | 333 |
| System Gates (typical) | 100000 |
| Number of Gates | 257000 |
| Operating Supply Voltage (Core) | 2.5 V (2.375 V to 2.625 V) |
| I/O Supply Voltage | 1.8 V / 2.5 V / 3.3 V (multi-volt I/O) |
| Maximum Internal Clock Frequency | 250 MHz |
| Process Technology | 0.22 µm CMOS |
| Plage de température de fonctionnement | 0 °C to 70 °C (Commercial, TA) |
| Boîtier | 484-BBGA (FineLine BGA, 1.0 mm pitch) |
| Type de montage | Surface Mount (SMD) |
| Embedded Memory Type | Dual-port RAM / ROM (EABs) |
| Statut du cycle de vie | Obsolete (EOL) |
Configuration des broches de EP1K100FC484-2
| Broche 1 | I/O — User I/O (bank-dependent assignment per datasheet) |
| Broche 2 | I/O — User I/O |
| Broche 3 | I/O — User I/O |
| Broche 4 | VCCIO — I/O supply voltage (bank-specific 1.8/2.5/3.3 V) |
| Broche 5 | GND — Ground |
| Broche 6 | I/O — User I/O |
| Broche 7 | I/O — User I/O |
| Broche 8 | I/O — User I/O |
| Broche 9 | VCCINT — Core supply 2.5 V |
| Broche 10 | I/O — User I/O |
| Broche 11 | I/O — User I/O |
| Broche 12 | GND — Ground |
| Broche 13 | TCK — JTAG test clock |
| Broche 14 | TMS — JTAG test mode select |
| Broche 15 | TDO — JTAG test data out |
| Broche 16 | TDI — JTAG test data in |
| Broche 17 | nSTATUS — Configuration status indicator |
| Broche 18 | nCONFIG — Configuration control (active low) |
| Broche 19 | CONF_DONE — Configuration complete indicator |
| Broche 20 | MSEL0 — Configuration mode select 0 |
| Broche 21 | MSEL1 — Configuration mode select 1 |
| Broche 22 | DCLK — Configuration clock |
| Broche 23 | DATA0 — Configuration data input 0 |
| Broche 24 | nCE — Chip enable (active low) |
Applications typiques
EP1K100FC484-2 convient pour 6 applications: Telecommunications Line Cards, Industrial Control and Factory Automation, DSP Preprocessing and Front-End Logic, Legacy Peripheral Bridges (PCI / VME / ISA), High-Speed Glue Logic and Bus Multiplexing, Legacy Prototyping and Education Platforms.
Telecommunications Line Cards
The EP1K100FC484-2 fits telecom line-card designs through its combination of approximately 100,000 system gates, 49,152 bits of dual-port embedded RAM, and 333 user I/O pins. The EABs can be configured as 32×9 or 64×4 dual-port RAM blocks for framer/elastomer buffers, while the high I/O count allows parallel bus multiplexing, TDM bus routing, and glue logic between network processors and PHYs. At the -2 speed grade the device closes timing on 155 Mbps UTOPIA / POS-PHY interfaces and on multi-channel HDLC framers typical of legacy SONET/SDH and E1/T1 line cards. The 2.5 V core with selectable 1.8/2.5/3.3 V I/O lets it bridge 5 V tolerant legacy buses without external level shifters.
Recommandé
Industrial Control and Factory Automation
In factory-automation controllers, the EP1K100FC484-2 is used to implement custom motion-control state machines, encoder interfaces, and multi-axis PWM generators. Its 624 LABs and 4,992 logic elements support dozens of independent PID loops, while the embedded RAM provides lookup tables for non-linear compensation curves. The 333 I/O pins allow direct connection to multi-axis servo drives, stepper drivers, and isolated digital I/O racks. For industrial deployments the EP1K100FI484-2 (industrial -40 °C to 85 °C variant) is preferred, since it is pin-to-pin compatible with the EP1K100FC484-2 footprint and supports harsh-environment cabinets and outdoor enclosures.
Recommandé
DSP Preprocessing and Front-End Logic
The EP1K100FC484-2 acts as a DSP frontend in sonar, instrumentation, and SDR applications by performing high-speed data acquisition, decimation filtering, and FFT preprocessing in the embedded EAB memory blocks. The 250 MHz internal clock rate (at the -2 speed grade) is sufficient to drive FIR filter chains, moving-average windows, and quadrature demodulators in real time. The dual-port EAB RAM supports simultaneous read/write access for sample buffering while another block performs the next filter pass. Designers targeting higher sample rates can choose the EP1K100FC484-3N (-3 speed grade) as a drop-in replacement on the same 484-BGA footprint for an extra 20 % timing margin.
Recommandé
Legacy Peripheral Bridges (PCI / VME / ISA)
The EP1K100FC484-2 is widely deployed as a peripheral bridge between legacy PCI, VME, and ISA buses and modern processors in industrial PCs and military/aerospace subsystems. Its 333 user I/O pins comfortably host 32-bit parallel buses, multiple DMA channels, and interrupt controllers on a single device. The 2.5 V core combined with multi-volt I/O lets the FPGA talk directly to 3.3 V processors and 5 V tolerant bus transceivers without glue logic. Designers maintaining such bridges should choose the EP1K100FI484-2 industrial variant when the chassis requires -40 °C to 85 °C operation; it shares the same 484-BGA footprint and pinout for direct swap.
Recommandé
High-Speed Glue Logic and Bus Multiplexing
The EP1K100FC484-2 is well suited to high-speed glue-logic applications that exceed the capacity of a CPLD but do not need an entire processor subsystem. Typical uses include multi-master bus arbiters, custom crossbar switches, address/data multiplexers for external SRAM/SDRAM, and protocol converters (UART/SPI/I-C to proprietary buses). The 333 I/O pins and 4,992 logic elements support wide parallel interfaces and complex state machines, while the embedded EABs hold translation tables and FIFO buffers. The -2 speed grade maintains setup/hold margins at 100 MHz+ bus speeds, making it a long-time workhorse for board-level integration.
Recommandé
Legacy Prototyping and Education Platforms
University digital-design labs and FPGA training platforms often use the EP1K100FC484-2 because of its mature ACEX-1K toolchain support in legacy Quartus II versions, predictable timing at 250 MHz, and 333 I/O pins for connection to lab peripherals (switches, LEDs, VGA, seven-segment displays, ADCs). Students can implement CPUs, custom peripherals, and DSP pipelines without paying for the largest modern FPGA. Because the part is now obsolete, instructors should confirm availability before deploying in new lab kits, or migrate to the Cyclone-series dev boards while keeping ACEX-1K design examples for archival reference.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1K100FC484-2 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1K100FC484-2N | EP1K100FC484-3N | EP1K100FI484-2 | EP1K100FC484-1 | EP1K100FC484-1N | EP1K100FC484-2P |
|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 484-BBGA (FineLine BGA) | 484-BBGA (FineLine BGA) - same | 484-BBGA (FineLine BGA) - same | 484-BBGA (FineLine BGA) - same | 484-BBGA (FineLine BGA) - same | 484-BBGA (FineLine BGA) - same | 484-BBGA (FineLine BGA) - same |
| Logic Elements / Cells | 4992 | 4992 | 4992 | 4992 | 4992 | 4992 | 4992 |
| Total RAM Bits | 49152 | 49152 | 49152 | 49152 | 49152 | 49152 | 49152 |
| User I/O Count | 333 | 333 | 333 | 333 | 333 | 333 | 333 |
| Speed Grade | -2 (~250 MHz) | -2 (~250 MHz) | -3 (~300 MHz, faster) | -2 (~250 MHz) | -1 (~200 MHz, slower) | -1 (~200 MHz, slower) | -2 (~250 MHz) |
| Temperature Range | 0 °C to 70 °C (Commercial) | 0 °C to 70 °C (Commercial) | 0 °C to 70 °C (Commercial) | -40 °C to 85 °C (Industrial) | 0 °C to 70 °C (Commercial) | 0 °C to 70 °C (Commercial) | 0 °C to 70 °C (Commercial) |
| RoHS Compliance | Not confirmed | Compliant (Pb-free) | Compliant (Pb-free) | Not confirmed | Not confirmed | Compliant (Pb-free) | Compliant (Pb-free) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Industrial-temperature drop-in option exists (vs EP1K100FI484-2)
- RoHS-compliant same-footprint variants are available (vs EP1K100FC484-2N)
- Faster speed grade available on the same footprint (vs EP1K100FC484-3N)
- Slower speed grade available for cost-sensitive designs (vs EP1K100FC484-1)
Notes de conception
The EP1K100FC484-2 requires a low-noise 2.5 V core regulator (VCCINT) with at least 500 mA of headroom, plus independent VCCIO rails for each I/O bank at 1.8 V, 2.5 V, or 3.3 V. Place 0.1 µF and 10 µF decoupling capacitors as close as possible to every VCCINT/VCCIO ball pair, and use a ground plane on layer 2 for return-current continuity. Estimated core current at full toggle of 333 I/O at 250 MHz is 250-400 mA, depending on utilization.
The 484-FineLine BGA uses a 1.0 mm pitch, which requires microvia or via-in-pad PCB technology for reliable breakout. Use a 4-to-6 layer stack-up with continuous power and ground planes, escape BGA signals on the top layer to inner layers through microvias, and route at least 8 mil trace/space. Maintain 50 Ω controlled impedance for high-speed clocks and JTAG, and provide a solid copper pour under the BGA for thermal dissipation.
Group JTAG pins (TCK, TMS, TDO, TDI) and configuration pins (nSTATUS, nCONFIG, CONF_DONE, DCLK, DATA0, MSEL0/MSEL1, nCE) on a dedicated connector or header for in-system programming. Keep JTAG traces short (<50 mm) and route TCK with a ground guard to avoid noise coupling. Use pull-up resistors on nCONFIG and pull-down on nCE per the ACEX-1K configuration handbook to ensure clean configuration at power-up.
Do not mix EP1K100FC484-2 (commercial, non-RoHS) and EP1K100FC484-2N (RoHS/Pb-free) on the same assembly: their thermal profiles and reflow temperatures differ, and RoHS solder joints can be damaged by leaded reflow. Also, when migrating between -1, -2 and -3 speed grades, re-run Quartus II timing analysis - the slower -1 grade may not close timing on a design that fit at -2.
Informations de conformité
RoHS and lead-free status for the EP1K100FC484-2 is not confirmed in the verified distributor data. The N-suffix same-family variants (EP1K100FC484-2N, EP1K100FC484-3N, EP1K100FC484-1N) are listed as Pb-free/RoHS-compliant on DigiKey and Mouser per their product pages. AEC-Q100 is not applicable for FPGAs; users requiring automotive-grade logic should consider Cyclone or other modern automotive-qualified families.
