EP1S20B672C6 - Stratix FPGA 18,460 LEs 672-BGA | Intel / Altera
Référence : EP1S20B672C6 ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $742.27 | $742,27 |
| 10 | $668.04 | $6 680,40 |
| 100 | $594.5 | $59 450,00 |
| 500 | $535 | $267 500,00 |
| 1 000 | $489.5 | $489 500,00 |
EP1S20B672C6 Présentation
A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected via programmable interconnect, allowing hardware designers to implement custom digital circuits after manufacturing. Within the broader taxonomy, an FPGA belongs to programmable logic devices (PLD), which sit between application-specific integrated circuits (ASICs) and general-purpose processors in terms of flexibility and performance. The Stratix family, introduced in 2002, was the first Intel/Altera FPGA family to embed TriMatrix memory, DSP blocks, and high-speed transceiver resources on-chip.
Key features of the EP1S20B672C6 include 18,460 logic elements, dedicated DSP blocks for high-throughput arithmetic, embedded RAM blocks (TriMatrix memory architecture), up to 426 user I/O pins supporting multiple I/O standards (LVTTL, LVCMOS, LVDS, HSTL, SSTL), and integrated PLLs for clock management. The device also supports configuration via passive serial (PS), passive parallel synchronous (PPS), passive parallel asynchronous (PPA), and JTAG modes, enabling flexible in-system programming.
The EP1S20B672C6 utilizes a 130 nm SRAM-based configuration cell with a 1.5 V core supply and separate VCCIO banks supporting 1.5 V, 1.8 V, 2.5 V, and 3.3 V I/O standards. Its high logic density and embedded memory make it well suited for data-path-intensive designs, while the DSP blocks accelerate FIR filters, FFT engines, and video processing pipelines. The 672-ball FineLine BGA package measures 35 mm x 35 mm with a 1.27 mm ball pitch, providing high I/O density for complex board-level integration.
Typical applications include high-speed data acquisition systems, telecommunications baseband processing, video broadcast and image processing, military/aerospace signal processing, and ASIC prototyping. The combination of logic density, DSP throughput, and abundant I/O makes the EP1S20B672C6 a strong fit for parallel-processing architectures that require deterministic latency.
When designing with this device, pay close attention to power sequencing of VCCINT and VCCIO rails, signal integrity on high-speed LVDS pairs, and thermal management under sustained switching activity. Use the Quartus II design software for synthesis, place-and-route, and timing closure; legacy Stratix designs require Quartus II version 13.0 or earlier for full device support.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not aggregated on any single manufacturer or distributor page, giving procurement and FPGA design engineers a single decision-ready reference.
Alternatives de remplacement direct pour EP1S20B672C6 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1S20B672C6 (même facteur de forme et même empreinte) — différant par Operating Temperature, Speed Grade, Package, Family, Configuration Method.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1S20B672C7N
✅ Remplacement direct✓ En stock
$320 / unité
Voir la fiche technique →EP1S20B672C5N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP1S20F672C6
✅ Remplacement direct✓ En stock
$470 / unité
Voir la fiche technique →EP1S20B672I6
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP1S20B672C7
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP1S20B672C6 Valeurs maximales et caractéristiques électriques
| Family | Stratix |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements | 18,460 |
| Embedded Memory Bits | 1,669,248 |
| User I/O Count | 426 |
| Boîtier | 672-ball FineLine BGA (672-BBGA) |
| Package Dimensions | 35 mm x 35 mm |
| Ball Pitch | 1.27 mm |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage (VCCINT) | 1.5 V |
| I/O Supply Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Speed Grade | C6 |
| Température de fonctionnement | 0 C to 85 C (commercial) |
| Maximum Internal Frequency | 450.05 MHz |
| Logic Family | CMOS |
| Configuration Method | PS / PPS / PPA / JTAG |
Guide de configuration des broches du EP1S20B672C6 35 mm x 35 mm
Configuration des broches du EP1S20B672C6 (boîtier 35 mm x 35 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP1S20B672C6.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP1S20B672C6 convient pour 6 applications: High-Speed Data Acquisition Systems, Telecommunications Baseband Processing, Video Broadcast and Image Processing, ASIC Prototyping and Emulation, Military and Aerospace Signal Processing, Industrial Control and Factory Automation.
High-Speed Data Acquisition Systems
The EP1S20B672C6 fits multi-channel data acquisition front-ends because its 18,460 logic elements and embedded DSP blocks deliver parallel sample processing at high sample rates. The 426 user I/O pins support wide LVDS or LVTTL parallel buses that connect directly to multi-channel ADCs without external bus multiplexers, while TriMatrix embedded memory (1,669,248 bits) buffers incoming sample bursts before DSP downconversion. The 450.05 MHz internal clock rate enables real-time FIR filtering and decimation chains in a single device, replacing multi-ASIC solutions and shortening FPGA design cycles. Use the device between the ADC bank and a host processor or DMA engine to offload channelization, FFT, and threshold detection work, reducing host CPU load.
Recommandé
Telecommunications Baseband Processing
In telecom baseband designs, the EP1S20B672C6 maps efficiently to channel cards that require parallel symbol-rate processing, scrambling, and FEC encoding. Its DSP blocks accelerate Viterbi, Turbo, and Reed-Solomon decoder kernels used in 3G/4G modem subsystems, while 426 user I/O pins connect to standard OBSAI/CPRI framer interfaces and backplane SERDES links. The 1.5 V core supply and C6 speed grade meet commercial telecom card thermal envelopes, and Quartus II synthesis supports existing telecom IP cores. Use it where deterministic per-symbol latency is critical and where DSP block count is the gating resource.
Recommandé
Video Broadcast and Image Processing
The EP1S20B672C6 is well suited to SD/HD video processing pipelines, where its 18,460 logic elements implement de-interlacers, scalers, color-space converters, and overlay compositors in a single device. Embedded TriMatrix memory holds multiple video frame buffers or line stores without external SRAM, and the 426 I/O pins interface to BT.656, BT.1120, DVI, or HDMI bridges. Its DSP blocks accelerate 2D convolution kernels for image filtering and edge detection. Place it between the video decoder ASIC and the display controller to handle real-time processing at 148.5 MHz pixel clock for HD-SDI workflows.
Recommandé
ASIC Prototyping and Emulation
For ASIC prototyping, the EP1S20B672C6 hosts partitioned RTL of mid-complexity ASICs, allowing software teams to develop firmware before tape-out. Its 18,460 logic elements represent roughly 1-2 million gates of synthesized logic, sufficient for many networking or storage controller ASICs, while 1,669,248 bits of embedded memory model large register files and FIFOs. The 672-ball BGA exposes 426 I/O pins to map almost any ASIC pinout via a prototyping PCB. Use multiple EP1S20B672C6 devices in a multi-FPGA partitioning flow to scale capacity up to full ASIC complexity.
Recommandé
Military and Aerospace Signal Processing
Stratix devices in the same family and package, including industrial-temperature grades, are used in military and aerospace signal processing applications where mature silicon and long-term configuration bitstream stability matter. The EP1S20B672C6 forms the processing heart of radar front-ends, electronic warfare subsystems, and avionics data buses; its DSP blocks implement pulse compression, MTI filtering, and beamforming kernels, and its 426 I/O pins connect to high-speed ADC and DAC converters. Use the I-grade variant for deployed military platforms, but validate the EP1S20B672C6 commercial grade in lab and development environments.
Recommandé
Industrial Control and Factory Automation
In factory automation systems, the EP1S20B672C6 implements high-speed motion controllers, multi-axis servo loops, and protocol bridges (EtherCAT, PROFINET, EtherNet/IP). Its DSP blocks execute PID loops and state-space controllers at microsecond cycle times, while 426 I/O pins handle encoder feedback, limit switches, and discrete I/O expansion. The TriMatrix embedded memory captures motion profile trajectories without external memory access. Industrial users benefit from the long-life silicon revisions of mature Stratix devices that have been qualified across thousands of deployed machine builders.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1S20B672C6 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1S20B672C7N | EP1S20B672C5N | EP1S20F672C6 | EP1S20B672I6 | EP1S20B672C7 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 672-ball FineLine BGA (35x35mm, 1.27mm pitch) | 672-ball FineLine BGA - same | 672-ball FineLine BGA - same | 672-ball FineLine BGA - same | 672-ball FineLine BGA - same | 672-ball FineLine BGA - same |
| Logic Elements | 18,460 | 18,460 | 18,460 | 18,460 | 18,460 | 18,460 |
| Embedded Memory Bits | 1,669,248 | 1,669,248 | 1,669,248 | 1,669,248 | 1,669,248 | 1,669,248 |
| User I/O Count | 426 | 426 | 426 | 426 | 426 | 426 |
| Speed Grade | C6 | C7 (faster) | C5 (slower) | F6 (faster family) | I6 (industrial temp) | C7 (faster) |
| Operating Temperature | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | -40 C to 100 C (industrial) | 0 C to 85 C (commercial) |
| Core Voltage (VCCINT) | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
Principaux différenciateurs
- High logic density in a 130 nm mature-process FPGA (vs EP1S10F672C7 (10k LE variant))
- C6 speed grade balances performance and yield (vs EP1S20B672C7N)
- Commercial temperature range with Stratix silicon maturity (vs EP1S20B672I6)
Notes de conception
Estimated: Stratix EP1S20 family devices require multi-rail power sequencing - VCCINT (1.5 V core) must reach 1.0 V before VCCIO banks are energized, and VCCIO must not exceed VCCINT + 0.3 V at any time to avoid latch-up. Use a dedicated FPGA power sequencer IC and add a 1 ms to 10 ms delay between VCCINT and VCCIO ramps. Decoupling: place 100 nF X7R ceramics on every VCCINT/VCCIO pin pair within 5 mm trace length, plus bulk 330 uF tantalum or polymer capacitors at the regulator outputs. Without proper sequencing, inrush current on VCCIO can forward-bias internal ESD structures.
Estimated: at 100% logic utilization with sustained 200 MHz clock activity, an EP1S20 can dissipate 5 W to 8 W. The 672-ball FineLine BGA has theta_JA around 12 C/W with a standard 4-layer JEDEC test board, giving a junction-to-ambient rise of 60 C to 100 C above ambient. For enclosed chassis designs, attach a heatsink with thermal interface material and force 200 LFM to 400 LFM airflow across the BGA. Industrial-temperature variants have a 100 C junction limit; commercial C6 parts must keep Tj below 85 C for proper operation.
Use a minimum 8-layer PCB stack-up with continuous GND and VCCINT planes directly under the BGA. BGA breakout: 1.27 mm pitch requires 0.2 mm (8 mil) trace width with 0.2 mm spaces through the BGA fanout area; via-in-pad (0.25 mm microvias) is recommended for inner-row signal escapes. Match LVDS pair lengths within 0.5 mm (20 mil) and route each pair on a 100 ohm differential impedance. Keep high-speed SERDES-grade signals (GXB, if used) on the top two layers with adjacent GND reference.
Stratix configuration bitstreams are NOT compatible with Stratix II, III, or later families - do not attempt to load a Cyclone or newer bitstream onto the EP1S20. Always regenerate programming files in Quartus II 13.0 SP1 or earlier; newer Quartus Prime releases removed legacy Stratix support. JTAG chain order matters: place JTAG-configured devices with TDI-to-TDO in the correct sequence or use a boundary-scan chain re-order. Finally, do not assume all 426 user I/O pins are simultaneously usable - bank VCCIO selection constrains which I/O standards are simultaneously supported.
Informations de conformité
Compliance data was not present in the verified web data; RoHS/REACH/lead-free status for the EP1S20B672C6 is marked unknown. AEC-Q100 is not applicable because this is an FPGA, not an automotive-grade discrete or analog IC.
