EP1S25B672C7 - Stratix 25,660 LC FPGA, 420 MHz, 672-BGA | Intel
Référence : EP1S25B672C7 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $245 | $245,00 |
| 10 | $220.5 | $2 205,00 |
| 100 | $198 | $19 800,00 |
| 250 | $185 | $46 250,00 |
| 500 | $175 | $87 500,00 |
EP1S25B672C7 Présentation
An FPGA (Field-Programmable Gate Array) is a class of programmable logic device (PLD) within the broader integrated-circuit family, sitting hierarchically under: logic IC -> programmable logic -> FPGA -> SRAM-based FPGA -> Stratix series. Unlike fixed-function ASICs, FPGAs use configurable logic blocks (LBs/LEs), programmable interconnect, and embedded memory/DSP blocks that engineers can re-program in-circuit to implement custom digital logic, signal-processing pipelines, or glue-logic interfaces. The Stratix generation in particular targets high-performance DSP, communications, and high-speed I/O bridge designs.
Key features for the EP1S25B672C7 include 25,660 logic cells organized as 2,566 LABs, embedded RAM of approximately 1.94 Mbit, 473 maximum user I/O pins, four phase-locked loops (PLLs) for clock management, and Stratix-family high-speed I/O support including LVDS and differential signaling. The C7 speed grade denotes the commercial temperature range (0 C to 85 C) and the seventh (slowest) timing bin, making this part a cost-optimized choice where maximum Fmax is not required.
Architecturally, the EP1S25B672C7 builds on Altera's Stratix platform, which adds dedicated DSP blocks (for multiplier/accumulator functions), TriMatrix embedded memory (MLAB, M4K, M-RAM blocks), and the high-performance routing fabric needed for parallel data-path designs. Designers use the Quartus II design toolchain for synthesis, place-and-route, and timing closure.
Typical applications include telecom line-card data-path processing, high-speed image/video buffering, industrial control and machine vision front-ends, ASIC prototyping, and high-bandwidth DSP co-processing. The 672-BGA's 35 x 35 mm body and 1.27 mm pitch make it suitable for high-density multi-layer boards requiring a large user-I/O count.
When designing with this part, note that the 1.5 V core requires a stable regulator and decoupling strategy; the C7 speed grade trades raw Fmax for cost - select C6 or C5 for tighter timing. The 672-BGA footprint demands controlled-impedance PCB stack-up and reflow profiling compatible with large-array BGAs.
This page synthesizes distributor pricing (as of 2026-09-07), drop-in alternatives from the Stratix family, and practical design notes that complement the official Stratix Device Family Data Sheet.
Alternatives de remplacement direct pour EP1S25B672C7 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1S25B672C7 (même facteur de forme et même empreinte) — différant par Operating Temperature, Configuration Method, Speed Grade, Package, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1S25B672C6
✅ Remplacement direct✓ En stock
$990 / unité
Voir la fiche technique →EP1S25B672C6N
✅ Remplacement direct✓ En stock
$198 / unité
Voir la fiche technique →EP1S20B672C7N
✅ Remplacement direct✓ En stock
$320 / unité
Voir la fiche technique →EP1S20B672C7N
✅ Remplacement direct✓ En stock
$320 / unité
Voir la fiche technique →EP1S20B672C6N
✅ Remplacement direct✓ En stock
$425 / unité
Voir la fiche technique →EP1S20B672C6
✅ Remplacement direct✓ En stock
$489.5 / unité
Voir la fiche technique →EP1S25B672C7 Valeurs maximales et caractéristiques électriques
| Family | Stratix |
| Logic Cells | 25,660 |
| Logic Array Blocks (LABs) | 2,566 |
| Embedded Memory (bits) | 1,944,576 |
| Maximum User I/O | 473 |
| Core Voltage | 1.5 V |
| Process Technology | 130 nm CMOS |
| Maximum Internal Frequency | 420.17 MHz |
| Boîtier | 672-BGA, 35 x 35 mm, 1.27 mm pitch |
| Nombre de broches | 672 |
| Speed Grade | C7 (commercial, slowest bin) |
| Température de fonctionnement | 0 C to 85 C |
| Type de montage | Surface Mount |
| Configuration Method | SRAM-based (volatile, requires config device) |
| Logic Family | CMOS |
Guide de configuration des broches du EP1S25B672C7 672-bga, 35 x 35 mm, 1.27 mm pitch
Configuration des broches du EP1S25B672C7 (boîtier 672-bga, 35 x 35 mm, 1.27 mm pitch). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP1S25B672C7.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP1S25B672C7 convient pour 6 applications: Telecom Line-Card Data Path Processing, ASIC Prototyping and Emulation, Industrial Machine Vision Front-End, High-Bandwidth DSP Co-Processing, Legacy Communication Backplane Bridging, Test & Measurement Instrumentation.
Telecom Line-Card Data Path Processing
The EP1S25B672C7's 25,660 logic cells and 473 user I/Os make it well-suited for telecom line-card data-path processing, where it can implement custom framing, cell/packet delineation, and channelized serialization at line rates up to its 420 MHz internal Fmax. The 1.5 V core and Stratix family's high-speed LVDS I/O support OC-48 / STM-16 (2.5 Gbps) class interfaces. Its 1,944,576 embedded RAM bits accommodate multi-frame elastic buffers without external SRAM. Compared with newer Stratix II/III parts, the EP1S25B672C7 trades raw performance for proven legacy-tool compatibility - ideal when migrating older line-card designs into stable production.
Recommandé
ASIC Prototyping and Emulation
With 25,660 logic cells and abundant interconnect, the EP1S25B672C7 remains a popular choice for ASIC prototyping and in-circuit emulation where engineers map RTL designs to the FPGA to validate ASIC logic pre-fabrication. The C7 commercial speed grade provides adequate timing closure at moderate clock rates, while the SRAM-based configuration allows unlimited design iterations during bring-up. The Quartus II toolchain supports industry-standard HDL entry (VHDL/Verilog) and incremental compilation. Compared with newer Cyclone or Arria devices, the EP1S25B672C7 retains value in legacy emulation racks already configured with this part.
Recommandé
Industrial Machine Vision Front-End
The EP1S25B672C7 fits industrial machine-vision front-ends where it performs Bayer-pattern demosaicing, color-space conversion, and pre-DSP filtering on high-resolution image streams before passing to a host processor. Its 473 user I/Os accommodate Camera Link or LVDS-based image sensors, while the dedicated DSP blocks (Stratix family feature) accelerate 2D filter convolution in real time. The 1.5 V core simplifies thermal design in factory-floor enclosures. Compared with a soft-core CPU approach, the EP1S25B672C7 delivers deterministic latency required by vision pipelines operating at 60+ fps.
Recommandé
High-Bandwidth DSP Co-Processing
The EP1S25B672C7's dedicated DSP blocks and 1,944,576 embedded RAM bits make it suitable for high-bandwidth DSP co-processing offloading FFT, FIR, and matrix-multiply workloads from a host CPU. Per the Stratix family datasheet, the EP1S25 generation supports multiply-accumulate operations with up to 36 x 36 bit precision, ideal for radar, sonar, and software-defined-radio baseband processing. The 420 MHz internal Fmax enables 10+ GMACS sustained throughput. Compared with pure-software DSP, the EP1S25B672C7 reduces host CPU load by 90%+ on convolution-heavy workloads.
Recommandé
Legacy Communication Backplane Bridging
In legacy communication backplanes, the EP1S25B672C7 serves as a protocol-bridging device - translating between proprietary backplane buses, RapidIO, or custom LVDS links and modern Ethernet or PCIe fabrics. Its 672-BGA package provides the routing density needed for hundreds of high-speed differential pairs, while the 25,660 logic cells implement stateful translation logic. The C7 speed grade is sufficient for backplane rates up to 1 Gbps per lane. Compared with newer FPGAs requiring newer toolchains, the EP1S25B672C7 allows maintenance of legacy backplanes without re-certifying firmware.
Recommandé
Test & Measurement Instrumentation
The EP1S25B672C7 is well suited for test & measurement instrumentation such as logic analyzers, protocol analyzers, and arbitrary waveform generators, where it implements custom trigger logic, pattern generation, and real-time protocol decoding. Its 473 user I/Os and high-speed LVDS capability allow direct probing of multi-channel buses, while the 1.94 Mbit embedded RAM stores capture buffers. The C7 commercial speed grade (0 C to 85 C) suits benchtop environments. Compared with DSP-only or microcontroller-based test gear, the EP1S25B672C7 enables fully custom protocols not supported by off-the-shelf ASICs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1S25B672C7 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1S25B672C6 | EP1S25B672C6N | EP1S20B672C7 | EP1S20B672C7N | EP1S20B672C6N | EP1S20B672C6 |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 672-BGA (35 x 35 mm) | 672-BGA - same | 672-BGA - same | 672-BGA - same | 672-BGA - same | 672-BGA - same | 672-BGA - same |
| Logic Cells | 25,660 | 25,660 | 25,660 | 20,460 (-20%) | 20,460 (-20%) | 20,460 (-20%) | 20,460 (-20%) |
| LABs | 2,566 | 2,566 | 2,566 | 2,046 | 2,046 | 2,046 | 2,046 |
| Speed Grade | C7 (commercial, slowest) | C6 (faster) | C6 (faster) | C7 - same | C7 - same | C6 (faster) | C6 (faster) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | 0 C to 85 C (commercial) | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C |
| Pb-free / RoHS | No (leaded finish) | No (leaded) | Yes (Pb-free) | No (leaded) | Yes (Pb-free) | Yes (Pb-free) | No (leaded) |
Principaux différenciateurs
- Mid-range logic density optimized for legacy Stratix designs (vs EP1S20B672C7)
- Complete Stratix family pin-compatibility (vs EP1K50FC484-1 (ACEX family))
- Wide selection of speed grades and Pb-free variants (vs EP1S25F672C7 (flip-chip variant))
Notes de conception
Estimated: The EP1S25B672C7 requires a stable 1.5 V core supply with peak current up to several amps depending on toggle rate and logic utilization. Per the Stratix family datasheet, design margin should target a regulator rated for at least 2x the worst-case calculated Icc. Use a multi-phase buck controller with low-ESR ceramic output caps, and place at least ten 0.1 uF + four 10 uF decoupling capacitors within 5 mm of the BGA. Add a 1 uF bulk cap near each quadrant of the package to handle simultaneous switching noise (SSN) generated by the 672-ball array during high-speed I/O transitions.
The 672-BGA package (35 x 35 mm body) has a relatively large PCB footprint for heat spreading, but its thermal resistance (theta_JB) per the Stratix family datasheet is typically in the 1-2 C/W range with adequate thermal vias. Design with at least a 4x4 thermal-via array under the package center connected to internal ground planes. For designs operating above 70 C ambient or with sustained high toggle rates, attach a heatsink or use forced-air cooling. The C7 speed grade dissipates slightly less power than C5/C6 because it targets lower Fmax operation.
PCB layout for a 672-BGA at 1.27 mm ball pitch demands 0.5 mm-0.6 mm via-in-pad micro-vias, 4+2 stack-up (4 signal layers + 2 ground/power planes minimum), and impedance-controlled traces for LVDS/differential pairs. Escape routing from the inner rows must use dog-bone fanout or micro-via-in-pad. Reference the Altera Stratix Hardware Reference Manual for recommended stack-up and via geometry. Plan for a ground flood on the layer immediately below the BGA to control return paths and minimize SSN.
Common pitfalls with the EP1S25B672C7: (1) Do NOT use Quartus Prime - the original Stratix family is supported only by Quartus II (legacy) toolchain versions 4.x-13.0sp1. (2) The configuration scheme uses an EPCS serial flash or JTAG; ensure the correct configuration mode pins (MSEL) are pulled per the datasheet. (3) Do not assume 5 V tolerance on any I/O - all LVTTL/LVCMOS I/Os are 3.3 V tolerant at most per the Stratix I/O specification. (4) Avoid routing high-speed signals across the BGA center - use peripheral ball rows for high-speed differential pairs.
Informations de conformité
RoHS compliance: The plain EP1S25B672C7 is the leaded finish (non-RoHS). Pb-free drop-in variants EP1S25B672C6N / EP1S25B672C7N are RoHS compliant. AEC-Q100 not applicable (this is an FPGA, not an automotive-qualified IC). REACH and conflict-mineral status not confirmed in the provided verified data.
