EP1S40F1020C7N - Stratix 41K LE FPGA, 1020-FBGA | Intel
Référence : EP1S40F1020C7N ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1323.97 | $1 323,97 |
| 10 | $1191.57 | $11 915,70 |
| 100 | $1059.18 | $105 918,00 |
| 500 | $992.98 | $496 490,00 |
| 1 000 | $926.78 | $926 780,00 |
EP1S40F1020C7N Présentation
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose logic function is defined by the user after manufacturing, consisting of an array of programmable logic elements, configurable I/O blocks, programmable interconnect, and dedicated hardware blocks such as block RAM and DSP multipliers. FPGAs sit in the programmable-logic branch of the broader semiconductor taxonomy (FPGA -> programmable logic -> digital IC -> integrated circuit) and are commonly deployed as hardware accelerators, prototyping platforms, and glue-logic bridges between processors and high-speed peripherals.
Key device features for the EP1S40F1020C7N include 3,423,744 embedded RAM bits distributed across TriMatrix memory blocks, embedded DSP blocks with hardware multipliers, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL through dedicated I/O banks. The device includes dedicated high-speed serial interface channels, an internal configuration controller that supports multiple passive and active configuration schemes, and on-chip PLLs for clock management. Maximum internal operating frequency is specified at 420.17 MHz.
Architecturally the Stratix family combines a hierarchical routing fabric with 8-input adaptive look-up tables, fast cluster interconnects, and a row/column structure that supports efficient placement of wide datapaths. The 130 nm process node and 1.5 V core supply keep dynamic power moderate for the era, while the 1020-ball FC-FBGA package provides the I/O density and signal-integrity margin required for high-performance board designs.
Typical applications include telecommunications line cards, DSP co-processing, ASIC prototyping, high-speed serial protocol bridging, and military/aerospace signal processing. The combination of block RAM, embedded multipliers, and high I/O count makes the part particularly well-suited to wide datapath designs and parallel processing.
When designing with this part, ensure the PCB uses controlled-impedance routing for high-speed I/O banks, follow Intel Stratix hardware reference design guidelines for power-plane decoupling, and verify the configuration scheme (PS, AS, JTAG) against the chosen configuration memory density.
This page synthesizes distributor pricing, same-family drop-in alternatives, lifecycle observations, and practical design notes not found in the original Stratix datasheet, providing a single reference for engineers evaluating the EP1S40F1020C7N for new designs or as a long-term replacement target.
Alternatives de remplacement direct pour EP1S40F1020C7N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1S40F1020C7N (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, RoHS Status, Family, Speed Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1S40F1020C6N
✅ Remplacement direct✓ En stock
$695 / unité
Voir la fiche technique →EP1S40F1020C5N
✅ Remplacement direct✓ En stock
$280 / unité
Voir la fiche technique →EP1S40F1020C6
✅ Remplacement direct✓ En stock
$1380 / unité
Voir la fiche technique →EP1S40F1020C5
✅ Remplacement direct✓ En stock
$165 / unité
Voir la fiche technique →EP1S30F1020C7N
✅ Remplacement direct✓ En stock
$215 / unité
Voir la fiche technique →EP1S30F1020C7
✅ Remplacement direct✓ En stock
$575 / unité
Voir la fiche technique →EP1S40F1020C7N Valeurs maximales et caractéristiques électriques
| Family | Stratix |
| Logic Elements | 41,250 |
| Logic Array Blocks (LABs) | 4,125 |
| User I/O Pins | 773 |
| Embedded Memory (bits) | 3,423,744 |
| Supply Voltage (Core) | 1.5 V |
| Maximum Operating Frequency | 420.17 MHz |
| Process Technology | 130 nm CMOS |
| Boîtier | 1020-ball FC-FBGA (33 x 33 mm, 1 mm pitch) |
| Plage de température de fonctionnement | 0 C to 85 C (Commercial) |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| Configuration Schemes | PS, AS, JTAG |
| On-chip PLLs | Yes |
| Type de montage | Surface Mount (BGA) |
| Statut RoHS | Compliant (verify on quote) |
Guide de configuration des broches du EP1S40F1020C7N 1020-ball fc-fbga (33 x 33 mm, 1 mm pitch)
Configuration des broches du EP1S40F1020C7N (boîtier 1020-ball fc-fbga (33 x 33 mm, 1 mm pitch)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP1S40F1020C7N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP1S40F1020C7N convient pour 6 applications: Telecommunications Line Card Processing, ASIC Prototyping and Emulation, High-Speed DSP Co-Processing, Industrial High-Speed Data Acquisition, Military and Aerospace Signal Processing, High-Speed Protocol Bridging and Glue Logic.
Telecommunications Line Card Processing
The EP1S40F1020C7N suits telecom line-card designs where 41,250 logic elements and 3.4 Mbit of embedded TriMatrix memory provide parallel packet-processing datapaths without external SRAM. Its 773 user I/O pins support multiple SFI/SPI-like interfaces, while embedded DSP blocks accelerate Viterbi or Reed-Solomon encoding at the 420.17 MHz internal clock. The 1.5 V core and 130 nm node keep power manageable for 10-15 W line-card budgets.
Recommandé
ASIC Prototyping and Emulation
The EP1S40F1020C7N is widely used to prototype multi-million-gate ASIC designs before tape-out because its 41K LE capacity maps cleanly onto partitioned ASIC blocks. The Quartus II flow supports Verilog and VHDL synthesis with timing-driven placement, while the 1020-ball FC-FBGA exposes enough user I/O to bring out wide ASIC buses. The C7 speed grade provides the timing margin needed for accurate worst-case ASIC verification at 420.17 MHz.
Recommandé
High-Speed DSP Co-Processing
The EP1S40F1020C7N's embedded multiplier blocks accelerate fixed-point DSP workloads such as FFTs, FIR filters, and radar pulse compression in radar and signal-intelligence systems. The 3.4 Mbit of embedded memory enables deep sample buffering without external SRAM, and the 420.17 MHz Fmax supports sample rates up to several hundred megasamples per second across parallel channels. The 130 nm process node gives predictable latency for synchronous DSP pipelines.
Recommandé
Industrial High-Speed Data Acquisition
The EP1S40F1020C7N functions as the central processing element in industrial data-acquisition systems, where 773 user I/O pins interface to multiple high-speed ADCs and DACs across LVDS and LVCMOS banks. Embedded block RAM buffers high-rate sample streams before downstream DSP, and on-chip PLLs generate the multiple clock domains needed for synchronous acquisition. The commercial 0-85 C operating range suits most factory-floor enclosures.
Recommandé
Military and Aerospace Signal Processing
The EP1S40F1020C7N's parallel DSP blocks and 41K LE capacity support radar, electronic-warfare, and software-defined-radio subsystems where deterministic latency and on-chip memory are required. Multiple I/O banks enable simultaneous connection to RF ADCs, DACs, and high-speed transceivers while preserving signal integrity. Designers pair the device with companion Stratix-II or radiation-tolerant parts for upgrade paths, using the same 1020-FBGA footprint where possible.
Recommandé
High-Speed Protocol Bridging and Glue Logic
The EP1S40F1020C7N serves as a programmable bridge between heterogeneous processor buses, network PHYs, and storage controllers where fixed ASSPs cannot match the required interface mix. The 773 user I/O pins support many parallel and serial protocols simultaneously, while embedded TriMatrix memory implements FIFOs and translation buffers between clock domains. The 1.5 V core supply and 130 nm node keep system power budgets reasonable for multi-rail platforms.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1S40F1020C7N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1S40F1020C6N | EP1S40F1020C5N | EP1S40F1020C6 | EP1S40F1020C5 | EP1S30F1020C7N |
|---|---|---|---|---|---|---|
| Package | 1020-ball FC-FBGA (33 x 33 mm) | 1020-ball FC-FBGA (33 x 33 mm) | 1020-ball FC-FBGA (33 x 33 mm) | 1020-ball FC-FBGA (33 x 33 mm) | 1020-ball FC-FBGA (33 x 33 mm) | 1020-ball FC-FBGA (33 x 33 mm) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 33,000 |
| Speed Grade | C7 (fastest) | C6 | C5 | C6 | C5 | C7 |
| User I/O Pins | 773 | 773 | 773 | 773 | 773 | 773 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) |
Principaux différenciateurs
- Fastest speed grade in the EP1S40F1020 family (vs EP1S40F1020C6N)
- Highest logic capacity in the original Stratix family at 41K LE (vs EP1S30F1020C7N)
- Same pinout across speed grades simplifies BOM management (vs EP1S25F1020C7N)
Notes de conception
Estimated: at 1.5 V core and 2 A core current, the EP1S40F1020C7N dissipates roughly 3 W internally, plus additional IO bank power; total worst-case package power can reach 8-10 W. Use thermal vias under the 33 x 33 mm FC-FBGA exposed pad to a multilayer copper ground plane. Without a thermal spreader, the 130 nm process die can exceed 100 C junction at 25 C ambient, derating Fmax. Add airflow or a heat spreader for production deployments.
The 1020-ball FC-FBGA at 1.0 mm pitch demands a high-density PCB stackup with microvia or via-in-pad construction; standard 8/8 mil via designs cannot reliably break out the inner balls. Plan for at least 6 PCB layers to provide solid reference planes for the high-speed LVDS and SSTL I/O banks. Follow the Altera Stratix hardware reference design guidelines for power-plane decoupling, placing 0.1 uF and 0.01 uF capacitors within 100 mil of every power pin.
Use controlled-impedance routing (typically 50 ohm single-ended, 100 ohm differential) for all LVDS and SSTL I/O bank traces, with length matching within 25 mil for differential pairs. The 773 user I/O pins are organized into multiple banks, each with its own VCCIO rail; isolate clocks and high-speed buses from switching I/O by dedicating separate banks. Series-termination resistors on LVTTL outputs help reduce overshoot when driving long PCB traces back to companion ASICS.
Do not confuse the EP1S40F1020C7N with the older EP1S40B956 or smaller EP1S25 variants: the 1020-FBGA pinout is unique to the -40F1020 family. Mixing configuration modes (PS, AS, JTAG) without proper MSEL pin strapping can leave the device unconfigured. Verify the configuration memory density (EPCS16, EPCS64, etc.) supports the compressed bitstream size generated by Quartus II for your design before board bring-up.
Informations de conformité
Compliance status not stated in the verified distributor listings; confirm with the manufacturer or your distributor at quote time. AEC-Q100 is not applicable because the part is a commercial-grade FPGA, not an automotive-qualified IC.