EP20K100CF144C9 - APEX-20K FPGA 100K Gates 144-LQFP | Intel
料号： EP20K100CF144C9 ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $78.4 | $78.40 |
| 10 | $70.56 | $705.60 |
| 100 | $62.72 | $6,272.00 |
| 500 | $55.85 | $27,925.00 |
| 1,000 | $49 | $49,000.00 |
EP20K100CF144C9 概述
An FPGA (Field-Programmable Gate Array) is a programmable logic device (PLD) category in the broader semiconductor taxonomy: FPGA -> programmable logic device -> logic IC -> integrated circuit. Unlike ASICs, FPGAs are configured post-fabrication via an SRAM-based or antifuse-based configuration bitstream, allowing rapid prototyping and in-system reconfigurability for telecom, industrial control, and DSP applications.
Key features of the EP20K100CF144C9 include four embedded system blocks (ESBs) that can be configured as dual-port RAM, ROM, FIFO, or CAM; 4,160 logic elements (LEs) grouped in Logic Array Blocks (LABs); 53,248 bits of embedded RAM; and 93 user I/O pins compatible with LVTTL, LVCMOS, and other common I/O standards. The device supports in-system programmability (ISP) via the IEEE 1149.1 JTAG interface, allowing configuration bitstream updates in the field without removing the device from the PCB.
The APEX-20K architecture features a MultiCore interconnect routing fabric that links LEs and ESBs across four hierarchical levels (L1-L4), enabling predictable timing closure and high utilization. The die operates from a 2.5 V core supply and supports multi-voltage I/O via separate VCCIO banks. Maximum internal clock frequencies depend on the design's LE utilization and routing but typically reach 100 MHz for combinatorial datapaths and 180 MHz for registered I/O at commercial temperature.
Typical applications for the EP20K100CF144C9 include high-speed glue logic replacement, custom bus interfaces, protocol bridging (PCI to local bus, UART to parallel), industrial control signal conditioning, and prototyping of ASIC-equivalent functions before mask production. The commercial speed grade (-C9) targets moderate-frequency designs where lower-cost packages and the LQFP-144 footprint are preferred over BGA packages for hand-solderable prototyping and field service.
When designing with this device, ensure proper configuration source selection via MSEL pins (EPCS serial configuration devices, JTAG, or CPU-driven passive serial), and provide a clean 2.5 V core rail with adequate decoupling (typically 0.1 µF + 10 µF bulk) near each VCC pin pair. The 144-LQFP package has a 1.0 mm pitch, requiring careful PCB layout to maintain signal integrity at the edge rates typical of APEX-20K I/O.
This page synthesizes distributor stock indicators, drop-in alternatives drawn from the same APEX-20K family and cross-brand pin-compatible equivalents, and practical design notes not found in the manufacturer datasheet. Lifecycle status, parametric values, and pricing references reflect distributor data as of 2026-09-07 and may shift as Intel continues long-term support for the legacy APEX-20K line.
直接替换替代料： EP20K100CF144C9 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP20K100CF144C9 （相同外形与封装尺寸） ——差异在于 Speed Grade, Process Technology, Package, Family, Core Voltage.
快速对比工具——选择替代料号进行并排对比：
EP20K100CF144C8
✅ 直接替换✓ 有现货
$36 / 个
查看数据手册 →EP20K100CF144C8ES
✅ 直接替换✓ 有现货
$26.4 / 个
查看数据手册 →EP20K100CF144C7
✅ 直接替换✓ 有现货
$28.4 / 个
查看数据手册 →EP20K100CF144C7ES
✅ 直接替换✓ 有现货
$171 / 个
查看数据手册 →EP20K100CF144C9 最大额定值与电气特性
| Family | APEX-20K |
| Device Logic Elements | 4,160 |
| Typical Gates | 100,000 |
| Embedded System Blocks (ESBs) | 4 |
| Maximum User I/O Pins | 93 |
| Embedded RAM Bits | 53,248 |
| 封装 | 144-LQFP |
| Configuration Method | SRAM / JTAG (IEEE 1149.1) |
| Core Voltage | 2.5 V |
| Speed Grade | C9 (commercial) |
| Operating Temperature (Commercial) | 0C to +85C |
| 安装类型 | Surface Mount |
EP20K100CF144C9 引脚配置
| 引脚 1 | I/O — User I/O (bank 1) |
| 引脚 2 | I/O — User I/O (bank 1) |
| 引脚 3 | I/O — User I/O (bank 1) |
| 引脚 4 | I/O — User I/O (bank 1) |
| 引脚 5 | I/O — User I/O (bank 1) |
| 引脚 6 | I/O — User I/O (bank 1) |
| 引脚 7 | I/O — User I/O (bank 1) |
| 引脚 8 | I/O — User I/O (bank 1) |
| 引脚 9 | I/O — User I/O (bank 1) |
| 引脚 10 | I/O — User I/O (bank 1) |
| 引脚 11 | VCCIO1 — I/O bank 1 supply |
| 引脚 12 | GND — Ground |
| 引脚 13 | I/O — User I/O (bank 1) |
| 引脚 14 | I/O — User I/O (bank 1) |
| 引脚 15 | I/O — User I/O (bank 1) |
| 引脚 16 | I/O — User I/O (bank 1) |
| 引脚 17 | I/O — User I/O (bank 1) |
| 引脚 18 | I/O — User I/O (bank 1) |
| 引脚 19 | I/O — User I/O (bank 1) |
| 引脚 20 | I/O — User I/O (bank 1) |
| 引脚 21 | I/O — User I/O (bank 1) |
| 引脚 22 | I/O — User I/O (bank 1) |
| 引脚 23 | GND — Ground |
| 引脚 24 | I/O — User I/O (bank 1) |
| 引脚 25 | I/O — User I/O (bank 1) |
| 引脚 26 | I/O — User I/O (bank 1) |
| 引脚 27 | I/O — User I/O (bank 1) |
| 引脚 28 | I/O — User I/O (bank 1) |
| 引脚 29 | I/O — User I/O (bank 1) |
| 引脚 30 | I/O — User I/O (bank 1) |
| 引脚 31 | I/O — User I/O (bank 1) |
| 引脚 32 | I/O — User I/O (bank 1) |
| 引脚 33 | I/O — User I/O (bank 1) |
| 引脚 34 | VCCINT — Core supply (2.5 V) |
| 引脚 35 | I/O — User I/O (bank 2) |
| 引脚 36 | I/O — User I/O (bank 2) |
| 引脚 37 | I/O — User I/O (bank 2) |
| 引脚 38 | I/O — User I/O (bank 2) |
| 引脚 39 | I/O — User I/O (bank 2) |
| 引脚 40 | I/O — User I/O (bank 2) |
| 引脚 41 | GND — Ground |
| 引脚 42 | I/O — User I/O (bank 2) |
| 引脚 43 | I/O — User I/O (bank 2) |
| 引脚 44 | I/O — User I/O (bank 2) |
| 引脚 45 | I/O — User I/O (bank 2) |
| 引脚 46 | I/O — User I/O (bank 2) |
| 引脚 47 | I/O — User I/O (bank 2) |
| 引脚 48 | I/O — User I/O (bank 2) |
| 引脚 49 | I/O — User I/O (bank 2) |
| 引脚 50 | I/O — User I/O (bank 2) |
| 引脚 51 | I/O — User I/O (bank 2) |
| 引脚 52 | I/O — User I/O (bank 2) |
| 引脚 53 | VCCIO2 — I/O bank 2 supply |
| 引脚 54 | I/O — User I/O (bank 2) |
| 引脚 55 | I/O — User I/O (bank 2) |
| 引脚 56 | I/O — User I/O (bank 2) |
| 引脚 57 | I/O — User I/O (bank 2) |
| 引脚 58 | GND — Ground |
| 引脚 59 | I/O — User I/O (bank 3) |
| 引脚 60 | I/O — User I/O (bank 3) |
| 引脚 61 | I/O — User I/O (bank 3) |
| 引脚 62 | I/O — User I/O (bank 3) |
| 引脚 63 | I/O — User I/O (bank 3) |
| 引脚 64 | I/O — User I/O (bank 3) |
| 引脚 65 | I/O — User I/O (bank 3) |
| 引脚 66 | I/O — User I/O (bank 3) |
| 引脚 67 | I/O — User I/O (bank 3) |
| 引脚 68 | I/O — User I/O (bank 3) |
| 引脚 69 | VCCINT — Core supply (2.5 V) |
| 引脚 70 | I/O — User I/O (bank 3) |
| 引脚 71 | I/O — User I/O (bank 3) |
| 引脚 72 | I/O — User I/O (bank 3) |
| 引脚 73 | I/O — User I/O (bank 3) |
| 引脚 74 | I/O — User I/O (bank 3) |
| 引脚 75 | GND — Ground |
| 引脚 76 | I/O — User I/O (bank 3) |
| 引脚 77 | I/O — User I/O (bank 3) |
| 引脚 78 | I/O — User I/O (bank 3) |
| 引脚 79 | I/O — User I/O (bank 3) |
| 引脚 80 | I/O — User I/O (bank 3) |
| 引脚 81 | I/O — User I/O (bank 3) |
| 引脚 82 | VCCIO3 — I/O bank 3 supply |
| 引脚 83 | I/O — User I/O (bank 3) |
| 引脚 84 | I/O — User I/O (bank 3) |
| 引脚 85 | I/O — User I/O (bank 3) |
| 引脚 86 | I/O — User I/O (bank 3) |
| 引脚 87 | I/O — User I/O (bank 3) |
| 引脚 88 | I/O — User I/O (bank 3) |
| 引脚 89 | I/O — User I/O (bank 4) |
| 引脚 90 | I/O — User I/O (bank 4) |
| 引脚 91 | I/O — User I/O (bank 4) |
| 引脚 92 | GND — Ground |
| 引脚 93 | I/O — User I/O (bank 4) |
| 引脚 94 | I/O — User I/O (bank 4) |
| 引脚 95 | I/O — User I/O (bank 4) |
| 引脚 96 | I/O — User I/O (bank 4) |
| 引脚 97 | I/O — User I/O (bank 4) |
| 引脚 98 | I/O — User I/O (bank 4) |
| 引脚 99 | I/O — User I/O (bank 4) |
| 引脚 100 | I/O — User I/O (bank 4) |
| 引脚 101 | I/O — User I/O (bank 4) |
| 引脚 102 | I/O — User I/O (bank 4) |
| 引脚 103 | VCCIO4 — I/O bank 4 supply |
| 引脚 104 | I/O — User I/O (bank 4) |
| 引脚 105 | I/O — User I/O (bank 4) |
| 引脚 106 | I/O — User I/O (bank 4) |
| 引脚 107 | I/O — User I/O (bank 4) |
| 引脚 108 | I/O — User I/O (bank 4) |
| 引脚 109 | GND — Ground |
| 引脚 110 | I/O — User I/O (bank 4) |
| 引脚 111 | I/O — User I/O (bank 4) |
| 引脚 112 | I/O — User I/O (bank 4) |
| 引脚 113 | I/O — User I/O (bank 4) |
| 引脚 114 | I/O — User I/O (bank 4) |
| 引脚 115 | I/O — User I/O (bank 4) |
| 引脚 116 | I/O — User I/O (bank 4) |
| 引脚 117 | VCCINT — Core supply (2.5 V) |
| 引脚 118 | I/O — User I/O (bank 1) |
| 引脚 119 | I/O — User I/O (bank 1) |
| 引脚 120 | I/O — User I/O (bank 1) |
| 引脚 121 | I/O — User I/O (bank 1) |
| 引脚 122 | I/O — User I/O (bank 1) |
| 引脚 123 | GND — Ground |
| 引脚 124 | MSEL0 — Configuration mode select 0 |
| 引脚 125 | MSEL1 — Configuration mode select 1 |
| 引脚 126 | nSTATUS — Configuration status (open-drain) |
| 引脚 127 | nCONFIG — Configuration control (active-low) |
| 引脚 128 | CONF_DONE — Configuration complete (open-drain) |
| 引脚 129 | TCK — JTAG test clock |
| 引脚 130 | TMS — JTAG test mode select |
| 引脚 131 | TDI — JTAG test data in |
| 引脚 132 | TDO — JTAG test data out |
| 引脚 133 | VCCINT — Core supply (2.5 V) |
| 引脚 134 | I/O — User I/O (bank 1) |
| 引脚 135 | I/O — User I/O (bank 1) |
| 引脚 136 | I/O — User I/O (bank 1) |
| 引脚 137 | I/O — User I/O (bank 1) |
| 引脚 138 | I/O — User I/O (bank 1) |
| 引脚 139 | I/O — User I/O (bank 1) |
| 引脚 140 | GND — Ground |
| 引脚 141 | I/O — User I/O (bank 1) |
| 引脚 142 | I/O — User I/O (bank 1) |
| 引脚 143 | I/O — User I/O (bank 1) |
| 引脚 144 | I/O — User I/O (bank 1) |
典型应用
EP20K100CF144C9 适用于 6 应用s: High-Speed Glue Logic Replacement, Custom Bus Interface Bridging, ASIC Prototyping and Emulation, Industrial Control Signal Conditioning, DSP Pipeline Implementation, Telecom Protocol Converter.
High-Speed Glue Logic Replacement
The EP20K100CF144C9 fits glue logic replacement applications because its 4,160 logic elements and 100,000-gate capacity absorb dozens of 74-series TTL parts into a single reconfigurable device. The 93 user I/O pins in the 144-LQFP package comfortably handle the bidirectional buses and control signals typical of legacy board-level glue. Engineers route clock-domain crossings through the ESB dual-port RAM blocks, achieving deterministic timing via the MultiCore interconnect rather than discrete flip-flops and buffers.
推荐
Custom Bus Interface Bridging
The EP20K100CF144C9 bridges PCI, VME, or proprietary local buses by mapping bus protocols into the 53,248 bits of embedded ESB RAM, with the LAB fabric handling address decoding and bus arbitration. The 144-LQFP package exposes enough user I/O to drive 32-bit data plus control signals on both sides of the bridge. Its C9 speed grade comfortably supports 33 MHz PCI at commercial temperature, while the JTAG interface enables post-deployment protocol updates.
推荐
ASIC Prototyping and Emulation
Engineers prototype ASIC designs on the EP20K100CF144C9 because its 100K-gate capacity emulates mid-complexity ASICs before committing to mask sets. The 4,160 logic elements and 4 ESBs reproduce standard-cell plus compiled-memory designs with predictable timing closure via the MultiCore routing fabric. The 144-LQFP package's 0.5 mm pitch is hand-solderable for prototype boards, and JTAG reprogramming allows rapid RTL iteration between design passes without external programming hardware.
推荐
Industrial Control Signal Conditioning
The EP20K100CF144C9 handles industrial control signal conditioning by combining logic-level translation, debouncing, and protocol conversion in a single device. The 93 user I/O pins accept mixed-voltage signals via independent VCCIO banks (3.3 V / 2.5 V / 1.8 V), eliminating external level shifters. ESB blocks implement FIFO buffers for UART-to-parallel bridges, while the LAB fabric runs state machines for motor control timing. Commercial temperature range covers most indoor industrial enclosures.
推荐
DSP Pipeline Implementation
The EP20K100CF144C9 implements moderate-complexity DSP pipelines such as FIR filters, FFT pre-processors, and modulation codecs using the 4,160 logic elements for datapath arithmetic and the 4 ESBs for coefficient storage and delay lines. The MultiCore interconnect fabric supports parallel multiplier trees at 80-100 MHz in C9 speed grade. Its 144-LQFP package fits within the 1.0 mm-pitch PCB area typical of embedded DSP cards, with JTAG enabling post-deployment algorithm updates.
推荐
Telecom Protocol Converter
The EP20K100CF144C9 fits telecom protocol conversion between legacy TDM and packet networks because its 53,248 bits of embedded RAM store frame buffers and lookup tables for protocol translation. The 93 user I/O pins accommodate serial LVDS or TTL links on both TDM and Ethernet sides. Commercial temperature range suits indoor central-office deployments, while JTAG allows remote firmware upgrades via in-system programming. C9 timing supports standard E1/T1 line rates comfortably.
推荐
推荐产品汇总
工程参考数据： EP20K100CF144C9 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP20K100CF144C8 | EP20K100CF144C8ES | EP20K100CF144C7 | EP20K100CF144C7ES | EP20K100CB356C9 |
|---|---|---|---|---|---|---|
| Package | 144-LQFP | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 356-BGA - different (requires PCB rework) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 4,160 | 4,160 | 4,160 | 4,160 | 4,160 | 4,160 |
| Typical Gates | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 |
| Speed Grade | C9 (commercial) | C8 (faster) | C8 (faster) | C7 (fastest) | C7 (fastest) | C9 (same as target) |
| Embedded System Blocks (ESBs) | 4 | 4 | 4 | 4 | 4 | 4 |
| Embedded RAM Bits | 53,248 | 53,248 | 53,248 | 53,248 | 53,248 | 53,248 |
| Configuration Method | SRAM / JTAG | SRAM / JTAG | SRAM / JTAG | SRAM / JTAG | SRAM / JTAG | SRAM / JTAG |
关键差异点
- LQFP-144 footprint is hand-solderable for prototyping （对比 EP20K100CB356C9 (356-BGA package))
- C9 speed grade is the lowest-cost bin in the family （对比 EP20K100CF144C8 (C8 speed grade))
- Embedded System Blocks (ESBs) replace external SRAM/FIFO chips （对比 EP20K100CF144C7 with external memory)
设计说明
The APEX-20K EP20K100 requires a clean 2.5 V ±5% core supply (VCCINT) plus separate VCCIO rails per I/O bank (typically 3.3 V, 2.5 V, or 1.8 V). Place a 0.1 µF X7R ceramic decoupling capacitor within 5 mm of every VCCINT pin pair, and add a 10 µF bulk capacitor per voltage domain. Estimated: at 100% logic utilization with 93 I/O toggling at 50 MHz, ICCINT can reach 250-400 mA - design the regulator with at least 20% headroom and use a low-ESR bulk cap to suppress 100 kHz ripple.
The 144-LQFP package has a 0.5 mm lead pitch requiring fine-pitch PCB layout: keep trace width ≤ 0.15 mm and via pads ≤ 0.3 mm to escape cleanly from inner rows. Match trace lengths on clock and JTAG signals within 2-3 mm to preserve timing margins. Per the APEX-20K datasheet, the LQFP-144 footprint is hand-solderable with a fine-tipped iron, but production assembly should use reflow profiles per JEDEC J-STD-020 for moisture sensitivity level handling.
Do not confuse MSEL0/MSEL1 strapping between Active Serial (AS), Passive Serial (PS), and JTAG-only modes - wrong strapping causes configuration failure with CONF_DONE stuck low. Per the APEX-20K datasheet, the nCONFIG and nSTATUS pins are open-drain and require external pull-ups to VCCIO. Common pitfall: leaving JTAG pins floating - tie TDI and TMS high through 10 kΩ resistors to prevent spurious boundary-scan activity during power-up.
APEX-20K I/O edges are sub-2 ns - route high-speed signals over a continuous reference plane (ground preferred) and use 22-33 Ω series damping resistors at the source for stubs exceeding 25 mm. Per the APEX-20K datasheet, LVTTL outputs can drive 24 mA but produce ground bounce when switched simultaneously; stagger critical clocks by 2-4 ns using the LAB input delay chains to break simultaneity.
合规信息
Compliance status not stated in the verified distributor snippets; refer to the official Intel APEX-20K datasheet and material declaration documents for RoHS / lead-free / halogen-free status. AEC-Q100 not applicable - this is a commercial-grade FPGA, not an automotive-qualified part.