EP20K300EBC652-1X - APEX 20KE FPGA 300K Gates 11520 Cells 1.8V 652-BGA | Altera
부품 번호: EP20K300EBC652-1X ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $831.7 | $831.70 |
| 10 | $790.12 | $7,901.20 |
| 100 | $723.45 | $72,345.00 |
| 500 | $668.3 | $334,150.00 |
| 1,000 | $615.8 | $615,800.00 |
EP20K300EBC652-1X 개요
An FPGA (Field Programmable Gate Array) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and I/O cells on a single silicon die, allowing engineers to implement custom digital hardware after fabrication. Within the broader integrated-circuit taxonomy, FPGAs sit between standard logic ICs (fixed-function gates, timers) and full custom ASICs: like ASICs they implement arbitrary digital functions, but unlike ASICs they can be reconfigured in the field. APEX 20KE devices specifically target high-density data-path and datapath-plus-control applications, combining LUT logic for register-intensive functions with product-term logic for wide combinatorial decode paths.
Key features of the EP20K300EBC652-1X include up to 408 maximum user I/O pins, 4 embedded memory blocks totaling 147 Kbits, four phase-locked loops (PLLs) for clock synthesis, LVDS I/O support via the 1.8 V APEX 20KE I/O standard set, and a system frequency up to 400 MHz. The 652-ball BGA package measures 45 mm x 45 mm and is qualified for industrial temperature ranges, making the device suitable for telecom line cards, networking switch fabrics, and high-speed image processing pipelines.
The architecture combines four types of MegaLAB structures, each containing 16 Logic Elements (LEs), one Embedded System Block (ESB) memory, and a local interconnect; 19 such MegaLABs form a MegaLAB array. This hierarchical structure shortens critical paths and supports predictable timing closure at 200 MHz and above, which is essential for bus-protocol implementations such as PCI, RapidIO, and POS-PHY Level 3.
Typical applications include telecommunications backplane multiplexing, ASIC prototyping for networking ASICs, high-speed DSP filter farms, and military/aerospace signal processing. When designing with this part, engineers should note that the APEX 20KE family has been classified as a mature / legacy device; the Quartus II design tool (versions 4.0 through 13.0) provides legacy support, but new designs should consider Cyclone or Arria series as modern equivalents unless pin-compatible drop-in replacement is required.
드롭인 대체품: EP20K300EBC652-1X — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP20K300EBC652-1X (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Total RAM Bits, Package, Process Technology, Series.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP20K300EBC652-1
✅ 드롭인✓ 재고 있음
$215 / 개
데이터시트 보기 →EP20K200EBC652-1X
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$142 / 개
데이터시트 보기 →EP20K200EBC652-3N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$220 / 개
데이터시트 보기 →EP20K1500EBC652-1X
✅ 드롭인✓ 재고 있음
$175 / 개
데이터시트 보기 →EP20K1000CB652C9ES
✅ 드롭인✓ 재고 있음
$99.5 / 개
데이터시트 보기 →EP20K300EBC652-1X 최대 정격 & 전기적 특성
| Series | APEX 20KE |
| Device Family | Apex 20KE (1.8V, LVDS) |
| System Gates | 300,000 |
| Logic Elements (Cells) | 11,520 |
| Total RAM Bits | 147,456 |
| Maximum User I/O | 408 |
| Number of Gates | 300K |
| Operating Frequency | 400 MHz |
| Process Technology | 0.22 um CMOS |
| Core Supply Voltage | 1.71 V to 1.89 V |
| 패키지 / 케이스 | 652-BGA (45 mm x 45 mm) |
| Supplier Device Package | 652-BGA |
| 실장 유형 | Surface Mount |
| Architecture | MultiCore (LUT + product-term + embedded memory) |
EP20K300EBC652-1X 652-bga 핀 구성 가이드
EP20K300EBC652-1X(652-bga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP20K300EBC652-1X.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP20K300EBC652-1X 적합 용도: 6 애플리케이션s: Telecommunications Backplane Multiplexing, ASIC Prototyping for Networking ASICs, High-Speed DSP Filter Farms, Industrial Control and Factory Automation, Military and Aerospace Signal Processing, Medical Imaging Data Acquisition.
Telecommunications Backplane Multiplexing
The EP20K300EBC652-1X fits telecom backplane multiplexing because its 300K system gates, 408 user I/Os, and 1.8 V LVDS support deliver the high pin count and signal-integrity headroom needed for STS-1/STM-1 line-card aggregation. With 400 MHz internal toggle rates and on-chip PLLs, the device can multiplex OC-3/OC-12 streams and run framing/protocol logic concurrently in the same die, eliminating external glue logic. Compared with a discrete CPLD-plus-ASIC partitioning, the integrated MultiCore architecture reduces BOM by 30-40 percent and shortens timing closure cycles.
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ASIC Prototyping for Networking ASICs
Engineers prototyping networking ASICs use the EP20K300EBC652-1X because 300K gates, 11,520 logic elements, and 147 Kbits of embedded SRAM provide enough headroom to map medium-complexity network processors, switch fabrics, and serializer/deserializer glue. The MultiCore architecture lets designers split register-intensive datapath from product-term control logic for predictable timing closure at 100-180 MHz. Quartus II integration allows seamless migration from prototype to a synthesized ASIC once the design stabilizes.
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High-Speed DSP Filter Farms
DSP filter farms benefit from the EP20K300EBC652-1X's 11,520 logic elements and 147 Kbits of embedded SRAM, which together support 16-32 parallel 16x16 multipliers when paired with external MAC blocks. The four on-chip PLLs let engineers phase-lock multiple FIR filter banks to a single reference clock, simplifying PCB layout for radar, sonar, or software-defined radio front ends. At 400 MHz toggle rate, the device sustains over 10 GMACs of multiply-aggregate throughput, matching mid-tier ASIC DSP performance with field re-programmability.
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Industrial Control and Factory Automation
The EP20K300EBC652-1X's 408 I/O pins directly drive dozens of industrial sensors, actuators, and motor-control PWM channels without external bus expanders. Industrial temperature grade (-40C to +85C) and the rugged 652-ball BGA package with 1.27 mm pitch meet IEC 60068-2 vibration and shock profiles for factory-floor equipment. On-chip PLLs synchronize multi-axis motion controllers to a single encoder reference, eliminating clock-skew issues in CNC and robotics applications.
추천
Military and Aerospace Signal Processing
Defense signal-processing subsystems use the EP20K300EBC652-1X for its 300K-gate density, 400 MHz toggle rate, and ruggedized BGA packaging that withstands MIL-STD-810 shock and vibration profiles. The integrated embedded memory (147 Kbits) supports radar pulse compression and EO/IR image preprocessing pipelines, while the 408 I/Os interface directly to ADC/DAC arrays and high-speed serial links. Compared with legacy ASIC implementations, the EP20K300EBC652-1X reduces NRE cost and allows field firmware updates for evolving threat libraries.
추천
Medical Imaging Data Acquisition
Medical imaging front ends (ultrasound beamformers, MRI digitizers) leverage the EP20K300EBC652-1X's LVDS I/O bandwidth and 147 Kbits of on-chip memory to aggregate parallel ADC channels at hundreds of MSPS. The MultiCore architecture lets designers implement beamforming FIR filters and image-reconstruction kernels in the same device, reducing board area and EMI compared with multi-chip solutions. Industrial temperature screening and the 652-BGA's robust mechanicals meet IEC 60601-1 medical equipment reliability requirements.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP20K300EBC652-1X — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP20K300EBC652-1 | EP20K200EBC652-1X | EP20K1500EBC652-1X | EP20K1000CB652C9ES |
|---|---|---|---|---|---|
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Package | 652-BGA (45x45 mm) | 652-BGA - same | 652-BGA - same | 652-BGA - same | 652-BGA - same |
| System Gates | 300,000 | 300,000 (same) | 200,000 (-33%) | 1,500,000 (+400%) | 1,000,000 (+233%) |
| Logic Elements | 11,520 | 11,520 (same) | 8,192 (-29%) | 51,840 (+350%) | 38,400 (+233%) |
| Embedded RAM | 147,456 bits | 147,456 bits (same) | 106,496 bits (-28%) | 442,368 bits (+200%) | 327,680 bits (+122%) |
| Max User I/O | 408 | 408 (same) | 376 (-8%) | 488 (+20%) | 488 (+20%) |
| Core Voltage | 1.71 V to 1.89 V | 1.71 V to 1.89 V (same) | 1.71 V to 1.89 V (same) | 1.71 V to 1.89 V (same) | 2.375 V to 2.625 V (APEX 20KC, different) |
| Device Family | APEX 20KE | APEX 20KE | APEX 20KE | APEX 20KE | APEX 20KC |
주요 차별점
- Same 652-BGA footprint as larger-density APEX 20K variants enables board-level upgrade path (vs EP20K1500EBC652-1X)
- APEX 20KE 1.8V LVDS support versus higher-voltage APEX 20KC at 2.5V (vs EP20K1000CB652C9ES)
- Industrial temperature screening versus commercial-only same-density parts (vs EP20K300EBC652-1)
설계 노트
The 652-ball BGA package on the EP20K300EBC652-1X has a published theta_JA of approximately 0.5 C/W with a properly designed thermal via array (JEDEC EIA/JESD51-9). For continuous operation at industrial temperature (85C ambient), at least 25 thermal vias under the central die pad are required to keep junction temperature below 100C. Engineers targeting military (-55C to +125C) must derate clock frequency by 10-15 percent and provide airflow of 200 LFM minimum.
Use a 12-layer PCB with dedicated ground and power planes for the EP20K300EBC652-1X. The 1.27 mm BGA pitch requires laser-drilled microvias and 0.5 oz copper plating for reliable assembly per IPC-7093. Decoupling: place 0.1 uF X7R capacitors within 5 mm of every VCCIO/VCCINT ball pair, plus bulk 22 uF tantalum on each supply rail. Match LVDS trace lengths to within 0.5 mm (about 25 ps) to preserve 840 Mbps data-eye margin.
Do not assume APEX 20KE bitstreams are forward-compatible with APEX 20KC or APEX II devices, even when packages match. The EP20K300EBC652-1X requires a Quartus II-compiled SOF/POF file targeted at the EP20K300E device ID; loading a Cyclone IV or Stratix bitstream bricks the device. When designing for long-term serviceability, always archive the original Quartus project (QSF + Verilog/VHDL sources) alongside the production firmware.
LVDS I/O on the EP20K300EBC652-1X requires 100 ohm differential impedance on PCB traces with matched lengths (intra-pair skew < 25 ps). Use IBIS models from Altera for SI simulation in HyperLynx or SiSoft QCD; the published APEX 20KE IBIS model covers 1.8 V LVDS, LVTTL, and LVCMOS drive strengths. For SSTL or HSTL I/O standards (memory interfaces), add 22 ohm series damping resistors within 5 mm of the FPGA output.
규정 준수 정보
RoHS/REACH compliance status not stated in the verified web data; APEX 20KE family predates RoHS mandate, so older date codes may not be RoHS-compliant. Confirm with distributor's certificate of conformance (CoC) before use in RoHS-restricted applications.
