EP20K400GC655-2 - 400K Gates APEX-20KC FPGA 655-BCPGA | Altera
Référence : EP20K400GC655-2 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $127.5 | $127,50 |
| 10 | $115 | $1 150,00 |
| 100 | $99 | $9 900,00 |
| 500 | $88 | $44 000,00 |
| 1 000 | $80 | $80 000,00 |
EP20K400GC655-2 Présentation
An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells, allowing hardware designers to implement arbitrary digital logic that is re-programmable in the field. FPGAs sit hierarchically between simple programmable logic devices (PALs, GALs, CPLDs) and fixed-function ASICs, and APEX-20KC devices occupy the high-density end of that hierarchy by combining LUT-based logic, product-term logic, and embedded system blocks (ESBs) that double as dual-port RAM, CAM, or ROM.
Key differentiating specifications include MultiCore™ architecture integrating LUT logic, product-term logic, and embedded memory in a single fabric; high-speed LVDS I/O pairs for chip-to-chip serial links; 4 PLLs for clock conditioning and skew management; and embedded CAM for high-speed table lookup. The MultiVolt I/O interface allows direct connection to 1.8 V, 2.5 V, and 3.3 V buses without external level shifters, simplifying mixed-voltage board design.
Typical applications include telecommunications line cards, custom DSP datapaths, network protocol bridging, and embedded control for industrial automation where deterministic logic and high I/O count outweigh the cost of an ASIC. The ceramic CPGA package is preferred for high-reliability and military-temperature programs because of its hermeticity and superior thermal performance over plastic BGAs.
When designing with this device, allocate at least four PCB layers for controlled-impedance routing, provide decoupling of 0.1 µF + 10 µF near every VCCINT/VCCIO pin pair, and configure unused I/O pins as tri-state inputs with internal pull-up to minimize leakage. Because the APEX-20KC family has been EOL'd by Intel, plan second-source or migration to Cyclone/Stratix equivalents early in the design cycle.
This page synthesizes distributor pricing, pin-compatible same-family alternatives, and practical design notes not consolidated in the original APEX-20KC datasheet - useful for engineers maintaining legacy systems or qualifying alternate sources under PCN constraints.
Alternatives de remplacement direct pour EP20K400GC655-2 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP20K400GC655-2 (même facteur de forme et même empreinte) — différant par Package Type, Mounting Type, Family, Process Technology, Package.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP20K400GC655-1X
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$193.04 / unité
Voir la fiche technique →EP20K400GC655-1V
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$555 / unité
Voir la fiche technique →EP20K400GC655-1
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$135 / unité
Voir la fiche technique →EP20K400GC652-1XV
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$190 / unité
Voir la fiche technique →EP20K400GC655-2 Valeurs maximales et caractéristiques électriques
| Series | APEX-20KC |
| Family | APEX 20K |
| Device Type | FPGA (Field Programmable Gate Array) |
| System Gates | 400,000 |
| Logic Cells / Elements | 16,640 |
| Total RAM Bits | 212,992 |
| Maximum Internal Frequency | 200 MHz |
| Speed Grade | -2 |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage | 2.5 V |
| I/O Supply Voltage | 1.71 V to 1.89 V (MultiVolt) |
| LVDS Support | Yes |
| PLLs | 4 |
| Nombre de broches | 655 |
| Package Type | 655-BCPGA (CPGA-655) |
| Package Dimensions | 62.48 x 62.48 mm |
| Type de montage | Through-Hole (CPGA) |
Guide de configuration des broches du EP20K400GC655-2 62.48 x 62.48 mm
Configuration des broches du EP20K400GC655-2 (boîtier 62.48 x 62.48 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP20K400GC655-2.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP20K400GC655-2 convient pour 6 applications: Telecommunications Line Cards, Custom DSP Datapaths, Network Protocol Bridging, Industrial Control & Automation, High-Reliability / Military Embedded Computing, Embedded System-on-Programmable-Chip (SOPC) Integration.
Telecommunications Line Cards
The EP20K400GC655-2 is well-suited to legacy telecom line-card designs requiring high-density programmable logic in a hermetic CPGA package. Its 16,640 logic cells and 212,992 bits of embedded dual-port memory support custom framer/mapper datapaths, while the 200 MHz internal clock enables high-throughput STS/STM processing. The ceramic CPGA package withstands the higher operating temperatures and long service-life requirements of central-office equipment where plastic BGA parts may fail prematurely. Pair with serializer/deserializer companion chips for multi-gigabit backplane links.
Recommandé
Custom DSP Datapaths
With 200 MHz fabric and 16,640 logic elements, the EP20K400GC655-2 implements custom multi-channel DSP datapaths for baseband processing, FFT engines, and FIR filters. Embedded system blocks (ESBs) double as coefficient ROM or dual-port sample buffers, eliminating external SRAM in many designs. The MultiCore architecture allows mixing LUT-based datapath logic with product-term control logic in the same fabric. Designers can implement radix-4 or radix-8 FFT pipelines running at 100-150 MSPS in this part while still leaving logic headroom for control-plane processing.
Recommandé
Network Protocol Bridging
The EP20K400GC655-2 bridges between legacy telecom protocols (PDH, SDH/SONET) and modern Ethernet backplanes, supporting custom 8B/10B or 64B/66B encode/decode, framing, and rate adaptation. Four on-chip PLLs provide independent clock domains for the bridge, and the LVDS-capable MultiVolt I/O directly connects to 1.8 V PHY devices without level shifting. The 212,992 bits of embedded RAM are sufficient for elastic store buffers handling rate mismatches up to +/-100 ppm.
Recommandé
Industrial Control & Automation
The EP20K400GC655-2 implements deterministic motor-control, PLC, and process-control logic in industrial-automation systems. The -2 speed grade provides timing margin for synchronous I/O handling, and the ceramic CPGA package tolerates vibration and thermal cycling in factory-floor environments. Embedded memory blocks serve as deterministic lookup tables for PID controllers and PWM generation, while LUT logic implements custom fieldbus protocols (PROFIBUS, Modbus, CANopen) on the same fabric.
Recommandé
High-Reliability / Military Embedded Computing
The ceramic CPGA package makes the EP20K400GC655-2 a strong fit for high-reliability programs and military embedded computing where plastic BGAs are disqualified by hermeticity requirements. The 400K-gate density supports single-board computer (SBC) and signal-processing subsystems for avionics, naval, and ground-vehicle applications. Logic capacity is sufficient for MIL-STD-1553 bus controllers, radar front-end preprocessing, and secure-radio baseband. Designers should verify the operating temperature grade and MIL-STD screening with the distributor before procurement.
Recommandé
Embedded System-on-Programmable-Chip (SOPC) Integration
As one of the first PLDs marketed with system-on-a-programmable-chip integration, the EP20K400GC655-2 combines a Nios or custom soft-core processor with peripheral logic, memory controllers, and custom accelerators in a single fabric. The MultiCore architecture lets designers implement register-intensive control logic in LUT fabric while moving wide datapaths into product-term blocks, optimizing both area and timing. Embedded system blocks can be configured as dual-port RAM for processor data/cache scratchpad, providing 212,992 bits of single-cycle access memory.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP20K400GC655-2 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP20K400GC655-1X | EP20K400GC655-1V | EP20K400GC655-1 | EP20K400GC652-1XV |
|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 655-BCPGA (CPGA-655) | 655-BCPGA - same | 655-BCPGA - same | 655-BCPGA - same | 652-BGA - related family |
| System Gates | 400,000 | 400,000 | 400,000 | 400,000 | 400,000 |
| Logic Cells | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 |
| Total RAM Bits | 212,992 | 212,992 | 212,992 | 212,992 | 212,992 |
| Speed Grade | -2 | -1X (slower, -15%) | -1V (industrial temp, slower) | -1 (base speed) | -1XV (industrial, slower) |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Hermetic ceramic CPGA package for high-reliability programs (vs EP20K400FC672-2 (672-FBGA))
- -2 speed grade for faster timing closure (vs EP20K400GC655-1 (base -1 speed grade))
- MultiCore architecture with embedded system blocks (vs EP20K400EBC652-2 (APEX-20KE BGA))
Notes de conception
The 655-CPGA package requires a through-hole socket or solder-mount receptacle with 62.48 x 62.48 mm PCB footprint. Allocate at least four PCB layers for controlled-impedance routing of LVDS pairs. Place 0.1 µF and 10 µF decoupling capacitors within 5 mm of every VCCINT and VCCIO pin pair to minimize power-rail noise. Use a continuous ground plane on layer 2 directly beneath the CPGA to control return-current paths and reduce EMI on high-speed I/O.
Estimated: at a typical APEX-20KC junction-to-ambient thermal resistance of approximately 8-10 C/W for the CPGA-655 with a socketed heatsink, a 5 W dissipation would yield a 40-50 C junction temperature rise. In commercial enclosed systems, design for forced airflow of at least 200 LFM across the heatsink to maintain junction temperature below 100 C. The ceramic CPGA package has lower theta_JC than equivalent plastic BGAs, but the socket interface typically dominates overall thermal resistance.
Three common pitfalls for the EP20K400GC655-2: (1) do not assume the -2 speed grade supports every timing constraint - verify with Quartus timing analysis before committing to layout; (2) configure unused I/O pins as tri-state inputs with internal pull-up to minimize leakage and prevent floating inputs; (3) LVDS I/O pairs require 100-ohm differential termination at the receiver end - missing termination degrades signal integrity dramatically. Plan second-source or migration to Cyclone/Stratix equivalents early since the APEX-20KC family is end-of-life.
Informations de conformité
Compliance data not found in verified web sources. The CPGA-655 ceramic package and APEX-20KC family predate many modern compliance standards; verify with franchised distributor (Rochester Electronics) for specific program compliance requirements.
