EP20K60ETC144-2X - APEX 20KE FPGA 60K Gates 92 I/O 144-TQFP | Intel
Référence : EP20K60ETC144-2X ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $78.5 | $78,50 |
| 10 | $71.2 | $712,00 |
| 100 | $63.95 | $6 395,00 |
| 500 | $57.4 | $28 700,00 |
| 1 000 | $51.8 | $51 800,00 |
EP20K60ETC144-2X Présentation
What is an APEX 20KE FPGA? The APEX 20KE is the second-generation Advanced Programmable eXtended (APEX) architecture from Altera (now Intel PSG), which pioneered System-on-a-Programmable-Chip (SOPC) integration by embedding high-density logic, embedded array blocks (EABs), and LVDS-capable I/O into a single die. APEX devices sit at the top of the SRAM-based PLD hierarchy - PLD > CPLD > FPGA > APEX 20KE - and were Altera's flagship high-density logic family before being superseded by Stratix and Cyclone.
Key features include MultiCore architecture combining Logic Array Blocks (LABs) for fine-grained logic and Embedded System Blocks (ESBs) for memory and specialty functions, 4 dedicated inputs plus 92 bidirectional I/Os totaling 96 user terminals, support for LVTTL/LVCMOS/PCI I/O standards, and in-system programmability via IEEE 1149.1 JTAG plus passive serial and Altera EPC configuration devices. The 1.8 V core with 1.72 ns propagation delay enables 160 MHz internal operation in combinatorial paths.
Typical applications include telecommunications line cards, industrial control and motor-drive glue logic, PCI interface bridging, high-end consumer audio/video processing, and prototype ASIC emulation. The combination of 60 K usable gates and 92 I/Os in a low-cost plastic TQFP makes it well suited to volume production where BGA rework would be uneconomical.
Design consideration: the TQFP-144 footprint is the key reason this variant remains in long-life-cycle programs - migrating to a BGA-356 variant of the same die (e.g., EP20K60EBC356-2X) requires PCB rework and is not pin-compatible. When designing, derate the 160 MHz internal frequency to ≤ 120 MHz for cascaded carry chains and ≤ 80 MHz for ESB block-RAM access to meet timing closure with margin.
Alternatives de remplacement direct pour EP20K60ETC144-2X — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP20K60ETC144-2X (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Series, Speed Grade, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP20K60ETC144-1X
✅ Remplacement direct✓ En stock
$152 / unité
Voir la fiche technique →EP20K60ETC144-2N
✅ Remplacement direct✓ En stock
$65 / unité
Voir la fiche technique →EP20K60EFC144-2X
✅ Remplacement direct✓ En stock
$42.65 / unité
Voir la fiche technique →EP20K60EFC144-2
✅ Remplacement direct✓ En stock
$12.75 / unité
Voir la fiche technique →EP20K60EFC144-1
✅ Remplacement direct✓ En stock
$19.4 / unité
Voir la fiche technique →EP20K60ETC144-2X Valeurs maximales et caractéristiques électriques
| Family | APEX 20KE |
| Typical Gates | 60,000 |
| Logic Elements | 25,600 |
| Macrocells | 2,560 |
| User I/Os | 92 |
| Dedicated Inputs | 4 |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage | 1.71 V to 1.89 V |
| Internal Frequency (max) | 160 MHz |
| Propagation Delay | 1.72 ns |
| Température de fonctionnement | 0 °C to +85 °C |
| Boîtier | 144-TQFP (20x20 mm), gull-wing |
| Configuration | JTAG / Passive Serial / EPC device |
| Type de montage | Surface Mount |
Configuration des broches de EP20K60ETC144-2X
| Broche 1 | I/O — User I/O (bank 1) |
| Broche 2 | I/O — User I/O (bank 1) |
| Broche 3 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 4 | I/O — User I/O (bank 1) |
| Broche 5 | GND — Ground |
| Broche 6 | I/O — User I/O (bank 1) |
| Broche 7 | I/O — User I/O (bank 1) |
| Broche 8 | VCCINT — Core supply (1.8 V) |
| Broche 9 | I/O — User I/O (bank 2) |
| Broche 10 | I/O — User I/O (bank 2) |
| Broche 11 | GND — Ground |
| Broche 12 | I/O — User I/O (bank 2) |
| Broche 13 | I/O — User I/O (bank 2) |
| Broche 14 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 15 | TDI — JTAG test data input |
| Broche 16 | TMS — JTAG test mode select |
| Broche 17 | TCK — JTAG test clock |
| Broche 18 | TDO — JTAG test data output |
| Broche 19 | GND — Ground |
| Broche 20 | nCE — Chip enable (active low) |
| Broche 21 | nCONFIG — Configuration control (active low) |
| Broche 22 | nSTATUS — Configuration status (active low) |
| Broche 23 | CONF_DONE — Configuration done indicator |
| Broche 24 | MSEL0 — Configuration mode select 0 |
| Broche 25 | MSEL1 — Configuration mode select 1 |
| Broche 26 | DCLK — Configuration clock input |
| Broche 27 | DATA0 — Configuration data input 0 |
| Broche 28 | VCCINT — Core supply (1.8 V) |
| Broche 29 | I/O — User I/O (bank 3) |
| Broche 30 | I/O — User I/O (bank 3) |
| Broche 31 | GND — Ground |
| Broche 32 | I/O — User I/O (bank 3) |
| Broche 33 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 34 | I/O — User I/O (bank 3) |
| Broche 35 | I/O — User I/O (bank 3) |
| Broche 36 | GND — Ground |
| Broche 37 | I/O — User I/O (bank 3) |
| Broche 38 | DEV_OE — Device-wide output enable |
| Broche 39 | DEV_CLRn — Device-wide clear (active low) |
| Broche 40 | VCCINT — Core supply (1.8 V) |
| Broche 41 | I/O — User I/O (bank 4) |
| Broche 42 | I/O — User I/O (bank 4) |
| Broche 43 | GND — Ground |
| Broche 44 | I/O — User I/O (bank 4) |
| Broche 45 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 46 | I/O — User I/O (bank 4) |
| Broche 47 | I/O — User I/O (bank 4) |
| Broche 48 | GND — Ground |
| Broche 49 | I/O — User I/O (bank 4) |
| Broche 50 | I/O — User I/O (bank 4) |
| Broche 51 | VCCINT — Core supply (1.8 V) |
| Broche 52 | I/O — User I/O (bank 5) |
| Broche 53 | I/O — User I/O (bank 5) |
| Broche 54 | GND — Ground |
| Broche 55 | I/O — User I/O (bank 5) |
| Broche 56 | VCCIO5 — I/O bank 5 supply voltage |
| Broche 57 | I/O — User I/O (bank 5) |
| Broche 58 | I/O — User I/O (bank 5) |
| Broche 59 | GND — Ground |
| Broche 60 | I/O — User I/O (bank 5) |
| Broche 61 | I/O — User I/O (bank 5) |
| Broche 62 | VCCINT — Core supply (1.8 V) |
| Broche 63 | I/O — User I/O (bank 6) |
| Broche 64 | I/O — User I/O (bank 6) |
| Broche 65 | GND — Ground |
| Broche 66 | I/O — User I/O (bank 6) |
| Broche 67 | VCCIO6 — I/O bank 6 supply voltage |
| Broche 68 | I/O — User I/O (bank 6) |
| Broche 69 | I/O — User I/O (bank 6) |
| Broche 70 | GND — Ground |
| Broche 71 | I/O — User I/O (bank 6) |
| Broche 72 | I/O — User I/O (bank 6) |
| Broche 73 | VCCINT — Core supply (1.8 V) |
| Broche 74 | I/O — User I/O (bank 7) |
| Broche 75 | I/O — User I/O (bank 7) |
| Broche 76 | GND — Ground |
| Broche 77 | I/O — User I/O (bank 7) |
| Broche 78 | VCCIO7 — I/O bank 7 supply voltage |
| Broche 79 | I/O — User I/O (bank 7) |
| Broche 80 | I/O — User I/O (bank 7) |
| Broche 81 | GND — Ground |
| Broche 82 | I/O — User I/O (bank 7) |
| Broche 83 | I/O — User I/O (bank 7) |
| Broche 84 | VCCINT — Core supply (1.8 V) |
| Broche 85 | I/O — User I/O (bank 8) |
| Broche 86 | I/O — User I/O (bank 8) |
| Broche 87 | GND — Ground |
| Broche 88 | I/O — User I/O (bank 8) |
| Broche 89 | VCCIO8 — I/O bank 8 supply voltage |
| Broche 90 | I/O — User I/O (bank 8) |
| Broche 91 | I/O — User I/O (bank 8) |
| Broche 92 | GND — Ground |
| Broche 93 | I/O — User I/O (bank 8) |
| Broche 94 | IN0 — Dedicated input 0 |
| Broche 95 | IN1 — Dedicated input 1 |
| Broche 96 | IN2 — Dedicated input 2 |
| Broche 97 | IN3 — Dedicated input 3 |
| Broche 98 | VCCINT — Core supply (1.8 V) |
| Broche 99 | I/O — User I/O (bank 1) |
| Broche 100 | GND — Ground |
| Broche 101 | I/O — User I/O (bank 1) |
| Broche 102 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 103 | I/O — User I/O (bank 1) |
| Broche 104 | I/O — User I/O (bank 1) |
| Broche 105 | GND — Ground |
| Broche 106 | I/O — User I/O (bank 2) |
| Broche 107 | I/O — User I/O (bank 2) |
| Broche 108 | VCCINT — Core supply (1.8 V) |
| Broche 109 | I/O — User I/O (bank 2) |
| Broche 110 | GND — Ground |
| Broche 111 | I/O — User I/O (bank 2) |
| Broche 112 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 113 | I/O — User I/O (bank 2) |
| Broche 114 | I/O — User I/O (bank 2) |
| Broche 115 | GND — Ground |
| Broche 116 | I/O — User I/O (bank 3) |
| Broche 117 | I/O — User I/O (bank 3) |
| Broche 118 | VCCINT — Core supply (1.8 V) |
| Broche 119 | I/O — User I/O (bank 3) |
| Broche 120 | GND — Ground |
| Broche 121 | I/O — User I/O (bank 3) |
| Broche 122 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 123 | I/O — User I/O (bank 3) |
| Broche 124 | I/O — User I/O (bank 3) |
| Broche 125 | GND — Ground |
| Broche 126 | I/O — User I/O (bank 4) |
| Broche 127 | I/O — User I/O (bank 4) |
| Broche 128 | VCCINT — Core supply (1.8 V) |
| Broche 129 | I/O — User I/O (bank 4) |
| Broche 130 | GND — Ground |
| Broche 131 | I/O — User I/O (bank 4) |
| Broche 132 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 133 | I/O — User I/O (bank 4) |
| Broche 134 | I/O — User I/O (bank 4) |
| Broche 135 | GND — Ground |
| Broche 136 | I/O — User I/O (bank 5) |
| Broche 137 | I/O — User I/O (bank 5) |
| Broche 138 | VCCINT — Core supply (1.8 V) |
| Broche 139 | I/O — User I/O (bank 5) |
| Broche 140 | GND — Ground |
| Broche 141 | I/O — User I/O (bank 5) |
| Broche 142 | VCCIO5 — I/O bank 5 supply voltage |
| Broche 143 | I/O — User I/O (bank 5) |
| Broche 144 | I/O — User I/O (bank 5) |
Applications typiques
EP20K60ETC144-2X convient pour 6 applications: Telecommunications Line Card Glue Logic, Industrial Motor Control & Factory Automation, PCI Bus Bridge & Interface Logic, ASIC Prototyping & Emulation, High-End Consumer Audio/Video Processing, Medical Imaging Front-End Signal Conditioning.
Telecommunications Line Card Glue Logic
The EP20K60ETC144-2X is well suited to telecommunications line-interface cards where 60K gates of programmable logic plus 92 user I/Os are needed to bridge TDM backplanes, perform framing/deframing, and implement HDLC or ATM adaptation layers. Its 1.8 V core draws modest power, while the TQFP-144 plastic package is far easier to inspect and rework than the BGA-356 alternative for field-serviceable telecom equipment. The 160 MHz internal frequency comfortably supports 155 MHz OC-3 tributary processing with margin. Pair the FPGA with a PHY like the Intel/Altera LXT971A or a TI TLK1501 serializer, configure via EPC2 or EPC16, and use the JTAG port for in-system boundary-scan testing during board bring-up.
Recommandé
Industrial Motor Control & Factory Automation
Industrial servo drives and PLCs use the EP20K60ETC144-2X for encoder quadrature decoding, PWM generation, and EtherCAT/CANopen protocol handling where deterministic logic and abundant I/O matter more than raw clock speed. The 92 user I/Os accommodate multi-axis feedback signals, while the 25,600 logic elements implement closed-loop PID algorithms with microsecond latency. The 0 °C to 85 °C commercial temperature range is acceptable for cabinet-mounted equipment; for harsher environments, derate or specify the -I industrial variant. Design with isolated I/O via ADuM1400 series digital isolators and add an EPC configuration device so the FPGA self-loads after power-up without processor intervention.
Recommandé
PCI Bus Bridge & Interface Logic
The EP20K60ETC144-2X is a classic PCI bridge FPGA, implementing target or initiator interfaces at 33 MHz/66 MHz PCI 2.2 with 92 I/Os dedicated to address/data multiplexing, arbitration, and side-band signals. Its 60K-gate capacity absorbs full PCI protocol state machines plus payload FIFOs in a single device, eliminating the need for an external companion CPLD. The 144-TQFP footprint keeps the PCB layout conventional through-hole-friendly for legacy industrial backplanes. Use the LVTTL 3.3 V I/O standard to meet PCI signaling levels directly; the Quartus design tool includes pre-verified PCI megafunctions that compile in under 30 minutes for this die size.
Recommandé
ASIC Prototyping & Emulation
Pre-silicon ASIC validation teams historically selected the EP20K60ETC144-2X as an emulator vehicle for designs up to 50K-60K gates because the 25,600 logic elements map efficiently to ASIC standard-cell libraries and the 144-TQFP package enables fast socketed breadboarding. The device supports multi-FPGA partitioning when larger ASICs are split across multiple APEX 20KE devices connected via LVDS. Use the Quartus SignalTap logic analyzer to capture real-time internal states during ASIC bring-up. While modern ASIC prototyping prefers Cyclone V or Stratix 10, the EP20K60ETC144-2X remains in use in long-running aerospace and defense programs where redesign is not feasible.
Recommandé
High-End Consumer Audio/Video Processing
DVD/Blu-ray player mainboards, professional audio mixers, and video-wall controllers integrated the EP20K60ETC144-2X to perform pixel-rate video processing, sample-rate conversion, and multi-channel audio routing. Its 92 I/Os comfortably route 24-bit digital audio buses plus ITU-R BT.656 video alongside control interfaces, while the 160 MHz internal clock supports 720p video timing without frame drops. The 1.8 V core reduces power dissipation compared to 3.3 V predecessors, important for thermally-constrained consumer enclosures. Combine with a Cirrus Logic CS4344 DAC or Analog Devices ADV7180 video decoder, and use the JTAG port for factory test of soldered boards.
Recommandé
Medical Imaging Front-End Signal Conditioning
Ultrasound beamformers and patient-monitoring front-ends use the EP20K60ETC144-2X to implement digital beam steering, FIR filter banks, and ADC-to-DSP data routing at moderate sample rates. The 60K-gate capacity is sufficient for a 16-channel beamformer with 8-tap apodization, while 92 I/Os accommodate LVDS ADC data pairs and synchronization triggers. Commercial 0-85 °C operation suits chassis-controlled medical environments. Pair with an AD9268 16-bit ADC and a TMS320C6713 DSP, configuring the FPGA via JTAG in production for last-minute filter-coefficient updates. Note: medical designs require IEC 60601-1 system-level compliance regardless of FPGA choice.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP20K60ETC144-2X — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP20K60ETC144-1X | EP20K60ETC144-2N | EP20K60EFC144-2X | EP20K60EFC144-2 | EP20K60EFC144-1 |
|---|---|---|---|---|---|---|
| Package | 144-TQFP (20x20 mm) | 144-TQFP (20x20 mm) - same | 144-TQFP (20x20 mm) - same | 144-TQFP (20x20 mm) - same | 144-TQFP (20x20 mm) - same | 144-TQFP (20x20 mm) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Speed Grade | -2X (160 MHz, 1.72 ns) | -1X (~133 MHz, ~1.83 ns) | -2N (same die, alt speed) | -2X (160 MHz, 1.72 ns) | -2 (160 MHz typical) | -1 (~133 MHz) |
| Internal Frequency (max) | 160 MHz | ~133 MHz | 160 MHz | 160 MHz | 160 MHz typical | ~133 MHz |
| Logic Elements | 25,600 | 25,600 | 25,600 | 25,600 | 25,600 | 25,600 |
| User I/Os | 92 | 92 | 92 | 92 | 92 | 92 |
| Core Voltage | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V |
| Operating Temperature | 0 °C to +85 °C (commercial) | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C |
| Lifecycle Status | NRND (Not Recommended for New Designs) | NRND | NRND | NRND | NRND | NRND |
Principaux différenciateurs
- TQFP-144 plastic package supports low-cost PCB assembly (vs EP20K60EBC356-2X (BGA-356))
- Highest speed grade -2X in TQFP-144 family (vs EP20K60ETC144-1X)
- Self-contained SRAM configuration with EPC PROM support (vs Antifuse FPGAs (e.g., Actel ProASIC))
Notes de conception
Estimated: APEX 20KE EP20K60E core current scales with toggle rate and junction temperature. At 160 MHz with 50% toggle rate across 25,600 logic elements and VCCINT = 1.8 V, ICCINT is typically 200 mA to 400 mA (estimated: I_core = C_eff × V × f × N_LEs / 2). Design a 1.8 V regulator with at least 1 A headroom; tie all VCCINT pins together with a star ground and decouple each pin with 0.1 µF + 10 µF bulk. VCCIO bank supplies must match the driven-receiver logic level (3.3 V LVTTL default).
TQFP-144 (20x20 mm, 0.5 mm pitch) demands 4-layer PCB with continuous power/ground planes for switching-current return paths. Fan-out can be escape-routed on outer layers using 0.20 mm (8 mil) traces between TQFP pads; inner pads route through 0.30 mm (12 mil) micro-vias. Place all eight VCCIO bank-supply pins within 50 mm of their respective decoupling caps and add a ferrite bead between the 1.8 V regulator and the FPGA core pins to suppress switching noise. Reference: Altera AN 75 (Quartus Power Optimization).
Do not leave MSEL0/MSEL1 floating - tie them to GND or VCC via 10 kΩ resistors per the configuration-mode table, otherwise the device enters an undefined state at power-up. Always drive nCONFIG high with a 10 kΩ pull-up to VCCIO after power-stable, and monitor nSTATUS during boot. Avoid hot-socketing the TQFP without a sequence resistor on the configuration pins, and never apply VCCIO before VCCINT - reverse power sequencing can latch-up the I/O buffers.
Informations de conformité
RoHS status not confirmed in verified web data. The APEX 20KE family was originally released as SnPb-lead finish; later revisions offered Pb-free finishes - confirm with the manufacturer lot code before use in RoHS-restricted regions. Not AEC-Q100 qualified (commercial 0-85 °C only).
