EP2A40B724I-8 - APEX II FPGA, 38,400 LEs, 724-BGA | Altera
Référence : EP2A40B724I-8 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $425 | $425,00 |
| 10 | $380 | $3 800,00 |
| 100 | $340 | $34 000,00 |
| 500 | $305 | $152 500,00 |
| 1 000 | $280 | $280 000,00 |
EP2A40B724I-8 Présentation
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that combines the density of an ASIC with the flexibility of in-system reprogrammability. FPGAs sit higher in the programmable-logic hierarchy than simple CPLDs: they provide fine-grained look-up tables (LUTs), embedded RAM blocks, DSP multipliers, and high-speed I/O that together implement complex datapaths, protocol controllers, and even soft processor cores. The APEX II architecture, released in the late 1990s, pioneered MultiCore interconnect and combines LUT-based logic with embedded RAM and CAM blocks - the engineering lineage that ultimately evolved into today's Stratix, Cyclone, and Arria device families.
Key features of the EP2A40 include 38,400 logic elements organized into 3,840 logic array blocks (LABs), a hierarchical memory architecture (ESBs - Embedded System Blocks) totaling 655 Kbits, and 540 user I/O pins enabling wide parallel buses and multiple high-speed interfaces. The device supports LVTTL, LVCMOS, PCI, GTL+, and other popular I/O standards, and integrates 4 PLLs for clock management. The 724-BGA FineLine BGA package is a surface-mount, wire-bond BGA with a fine-pitch ball grid suitable for high-I/O-count designs.
The APEX II architecture uses a MultiCore interconnect that links LABs to ESBs via direct and row/column interconnect lines, supporting pipelined datapath operation at hundreds of MHz internally. The device operates from a 1.5 V core supply and supports multiple I/O voltage banks. Because APEX II predates modern serial transceivers, high-speed parallel I/O and external clocking are the standard integration path.
Typical applications include telecommunications line cards and protocol engines, ASIC prototyping, custom DSP pipelines, high-speed data acquisition front-ends, and industrial control systems. The 540 user I/Os and large RAM/CAM blocks also make the EP2A40 attractive for deep-packet inspection and ATM/Sonet networking designs.
When designing with this FPGA, verify the Quartus version compatibility: APEX II is supported by Quartus II (legacy toolchains), and Intel currently maintains it as a mature device for legacy re-designs. Power sequencing, decoupling, and JTAG configuration topology follow the standard Altera BGA guidelines in the device handbook.
This page synthesizes sourced distributor inventory, APEX II family context, and drop-in family variants not consolidated in any single manufacturer datasheet, providing engineers with a single decision view for legacy redesign work.
Alternatives de remplacement direct pour EP2A40B724I-8 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2A40B724I-8 (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Speed Grade, Process Technology, Configuration Mode.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP2A40B724I-7
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$158 / unité
Voir la fiche technique →EP2A40B724CP
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$71 / unité
Voir la fiche technique →EP2A40B724C9
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$395.38 / unité
Voir la fiche technique →EP2A40B724C8
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$615 / unité
Voir la fiche technique →EP2A40B724C7
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$650 / unité
Voir la fiche technique →EP2A40B724I-8 Valeurs maximales et caractéristiques électriques
| Family | APEX II |
| Logic Elements (LEs) | 38,400 |
| Logic Array Blocks (LABs) | 3,840 |
| Embedded System RAM | 655,360 bits (655 Kbits) |
| Maximum User I/O | 540 |
| Boîtier | 724-ball FineLine BGA |
| Package Code | HBGA / S-PBGA-B724 |
| Speed Grade | -8 |
| Température de fonctionnement | -40C to +100C (Industrial) |
| Core Supply Voltage | 1.5 V (1.425 V to 1.575 V) |
| PLLs | 4 |
| Type de montage | Surface Mount |
| Configuration Mode | JTAG / passive serial / passive parallel |
Guide de configuration des broches du EP2A40B724I-8 hbga / s-pbga-b724
Configuration des broches du EP2A40B724I-8 (boîtier hbga / s-pbga-b724). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP2A40B724I-8.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP2A40B724I-8 convient pour 6 applications: Telecommunications Line Cards, ASIC Prototyping, High-Speed Data Acquisition, Custom DSP Pipelines, Industrial Control Systems, Deep Packet Inspection / Networking.
Telecommunications Line Cards
The EP2A40B724I-8 fits telecom line-card applications because it combines 38,400 logic elements with 655 Kbits of embedded RAM and 540 user I/Os - enough density and pin count to implement UTOPIA, POS-PHY, or custom cell/ATM framers alongside payload processing. The 724-ball BGA exposes up to 540 user I/Os that can be split across multiple 8-bit/16-bit parallel bus interfaces, allowing direct connection to network processors, TCAMs, and PHY devices without external glue logic. APEX II's ESB blocks also support CAM mode for fast table lookup in route lookup or QoS classification paths. Industrial temperature rating enables deployment in outdoor DSLAM or aggregation cabinets.
Recommandé
ASIC Prototyping
For ASIC prototyping the EP2A40B724I-8 offers 38,400 LEs and 655 Kbits of RAM that can be partitioned across synthesized ASIC blocks via the Quartus II LogicLock flow. The MultiCore interconnect allows high-fanout signal routing critical for ASIC emulation, and the 540 user I/Os enable breakout to test fixtures for early silicon bring-up. Industrial temperature grade supports prototype validation under aggressive environmental stress. Quartus II's design-partitioning features let teams move IP blocks between FPGAs incrementally as the ASIC shrinks in area.
Recommandé
High-Speed Data Acquisition
The EP2A40B724I-8 suits high-speed data-acquisition front-ends because its 540 user I/Os can be configured as parallel LVTTL/LVCMOS inputs to capture ADC output data at hundreds of MSPS aggregate rate. The 655 Kbits of embedded RAM is configurable as FIFO depths of up to 32K x 16, which is sufficient to buffer multiple ADC frames before forwarding to a downstream processor. The four on-chip PLLs provide deskew and clock multiplication needed for source-synchronous ADC capture. Industrial temperature rating is advantageous for outdoor or rugged industrial sensor systems.
Recommandé
Custom DSP Pipelines
For custom DSP pipelines, the EP2A40B724I-8 fits because its ESB blocks can be configured as multiplier accumulators (MAC) and as RAM/ROM lookup tables for coefficient storage. APEX II supports signed multiplier inference through MegaWizard plug-ins in Quartus II, allowing FIR, polyphase, and FFT implementations at audio and baseband rates. The industrial temperature rating makes the part suitable for industrial DSP applications such as vibration analysis or motor-control loops. 540 user I/Os permit direct connection to multi-channel ADC front-ends.
Recommandé
Industrial Control Systems
The EP2A40B724I-8 supports industrial control applications where deterministic response, parallel I/O, and ruggedized temperature rating are required. 540 user I/Os map directly to multi-axis motion controllers or sensor aggregators with PWM, quadrature encoder, and GPIO functions in a single device. The 1.5 V core and 3.3 V I/O are compatible with legacy industrial backplanes. Industrial temperature rating covers -40C to +100C operation typical of factory-floor and outdoor cabinet installations.
Recommandé
Deep Packet Inspection / Networking
Deep-packet inspection requires pattern matching against thousands of rules with deterministic throughput, and the EP2A40B724I-8's 655 Kbits of CAM-capable ESB blocks enable hardware-accelerated rule lookup at wire speed. The 38,400 LEs allow tightly pipelined parsers to process 10+ Gbps across 540 user I/Os segmented into multiple network interfaces. APEX II's industrial temperature rating suits outdoor aggregation switches. The four PLLs provide flexible clocking for multi-rate Ethernet and SONET interfaces. Lower-density APEX II variants can be used for per-port offload engines.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2A40B724I-8 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2A40B724I-7 | EP2A40B724CP | EP2A40B724C9 | EP2A40B724C8 | EP2A40B724C7 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 724-ball FineLine BGA | 724-ball FineLine BGA (same) | 724-ball FineLine BGA (same) | 724-ball FineLine BGA (same) | 724-ball FineLine BGA (same) | 724-ball FineLine BGA (same) |
| Logic Elements | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 |
| Embedded RAM (Kbits) | 655 | 655 | 655 | 655 | 655 | 655 |
| Maximum User I/Os | 540 | 540 | 540 | 540 | 540 | 540 |
| Speed Grade | -8 | -7 (faster) | -P (slower, power-optimized) | -9 (slower) | -8 (same) | -7 (faster) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to 85C) | Commercial (0C to 85C) | Commercial (0C to 85C) | Commercial (0C to 85C) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
Principaux différenciateurs
- Fastest industrial-grade APEX II option at the 724-ball BGA pitch (vs EP2A40B724I-7)
- Industrial temperature rating vs commercial-grade siblings (vs EP2A40B724C9 / EP2A40B724C8 / EP2A40B724C7)
- Standard speed/power grade vs power-optimized variant (vs EP2A40B724CP)
Notes de conception
The 724-ball BGA exposes the silicon through a flip-chip or wire-bond thermal slug; in dense line-card layouts, attach a heatsink via the top-side thermal pad to keep junction temperature within industrial -40C to +100C limits. Estimated: at VCCINT = 1.5 V, all 38,400 LEs toggling, and typical APEX II junction thermal resistance (~0.7 C/W with heatsink), the device dissipates ~3-5 W steady state - plan copper pour or airflow accordingly.
Use 0.1 uF decoupling on every VCCINT pin and 0.01 uF on every VCCIO pin placed within 100 mils of the BGA ball; add bulk 47-100 uF tantalum or polymer caps per voltage rail at the PCB edge. Matched-length routing for JTAG TCK/TMS/TDO/TDI within 100 mils preserves boundary-scan integrity. Use the Altera-provided 724-ball land pattern and matched-stackup impedance control for LVDS or source-synchronous interfaces.
Distribute IO banks across the BGA so each I/O voltage group is concentrated in a contiguous region of the ball map, simplifying plane-splitting. Place configuration and clock pins on outer ball rows for shorter escape traces. APEX II benefits from 4-layer minimum stackup (sig/gnd/vcc/sig) with continuous ground plane under the BGA; stitched ground vias around the package perimeter improve thermal and EMI performance.
Quartus II 13.0sp1 is the final release with APEX II device support; subsequent Quartus Prime versions drop the family. Retain a Quartus II install for any future debug or recompile. The APEX II family does NOT support modern serial transceivers or hard PCIe IP - any such interface must be implemented through soft IP and external PHY. JTAG chain should be verified in isolation before loading configuration data.
Informations de conformité
RoHS/REACH compliance depends on date code; APEX II parts were originally non-RoHS. Contact franchised distributor (Rochester Electronics) for the specific CoC. AEC-Q100 is not applicable because FPGAs are not automotive qualified at the silicon level; system-level qualification is the integrator's responsibility.
