EP2A40B724I-9 - APEX II 40K LE FPGA, 724-BGA, Industrial | Intel
Référence : EP2A40B724I-9 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $850 | $850,00 |
| 10 | $795 | $7 950,00 |
| 100 | $720 | $72 000,00 |
| 500 | $660 | $330 000,00 |
| 1 000 | $605 | $605 000,00 |
EP2A40B724I-9 Présentation
An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device whose logic fabric, interconnect, and I/O routing are configured by a user-supplied bitstream, rather than fixed at the fab. APEX II sits in the hierarchy: programmable logic device (PLD) -> Complex Programmable Logic Device (CPLD)/FPGA -> high-density SRAM-based FPGA -> APEX II family, all under the broader class of programmable logic ICs. APEX II parts integrate Look-Up Tables (LUTs), Embedded System Blocks (ESBs) for dual-port RAM/ROM, and FastTrack interconnect, making them suitable for high-throughput datapath, memory-interface, and bus-bridge designs.
Key features include 540 maximum user I/O pins (as observed in the closely related EP2A40B724C9 variant listed by Rochester Electronics on DigiKey), 655,360 embedded memory bits organized as 16-bit-wide ESBs, an embedded multiplier block architecture, support for multiple I/O standards (LVTTL, LVCMOS, PCI, SSTL), and 3.3 V core / multi-standard I/O operation with on-chip PLLs for clock conditioning. The device supports configuration via Altera serial/parallel configuration schemes using the dedicated JTAG or passive serial interface.
Architecturally, the APEX II device combines a fine-grained LUT-based fabric with row/column FastTrack routing, dedicated carry chains for arithmetic, ESBs for distributed and block RAM, and PLL-based clock management. This combination yields a flexible platform for high-density datapath, telecom, and embedded processing subsystems. The B724 package exposes the full I/O count of the device, so the EP2A40 is the high-pin-count die option of the APEX II family.
Typical applications include telecommunications line cards, network switching fabrics, industrial control and instrumentation, image and video processing pipelines, ASIC prototyping, and high-speed data acquisition front-ends. The high pin count and substantial on-chip memory also suit bus-bridge and protocol-translation designs where a parallel CPU or DSP bus is mapped to a high-throughput serializer.
When designing with EP2A40B724I-9, ensure thermal analysis accounts for industrial-temperature corner cases, and verify signal integrity at full 540-pin I/O utilization. APEX II parts are NRND/EOL on Altera/Intel's roadmap, so lifecycle planning and pin-compatible Cyclone IV/V or Stratix migration should be evaluated for new designs. Compared with the EP2A40B724C9 (commercial grade, no '-I-' suffix), the EP2A40B724I-9 extends the operating range and is the correct choice when the design will see -40 C exposure.
Alternatives de remplacement direct pour EP2A40B724I-9 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2A40B724I-9 (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Speed Grade, Process Technology, Configuration Mode.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP2A40B724I-8
✅ Remplacement direct✓ En stock
$280 / unité
Voir la fiche technique →EP2A40B724I-7
✅ Remplacement direct✓ En stock
$158 / unité
Voir la fiche technique →EP2A40B724C9
✅ Remplacement direct✓ En stock
$395.38 / unité
Voir la fiche technique →EP2A40B724CP
✅ Remplacement direct✓ En stock
$71 / unité
Voir la fiche technique →EP2A40B724C9N
✅ Remplacement direct✓ En stock
$99.5 / unité
Voir la fiche technique →EP2A40B724C8
✅ Remplacement direct✓ En stock
$615 / unité
Voir la fiche technique →EP2A40B724I-9 Valeurs maximales et caractéristiques électriques
| Family | APEX II |
| Logic Elements | 40,000 (typical) |
| Logic Cells | 38400 |
| Embedded Memory Bits | 655360 |
| Maximum User I/O | 540 (per EP2A40B724 family) |
| Boîtier | 724-ball FCBGA / FineLine BGA |
| Package Code | B724 |
| Temperature Grade | Industrial ('I' suffix) |
| Température de jonction en fonctionnement | -40 C to +100 C (industrial) |
| Speed Grade | -9 (per APEX II speed bin) |
| Peak Reflow Temperature | 220 C |
| Core Voltage | 1.5 V (typical APEX II) |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, SSTL |
| Configuration Interface | JTAG, Passive Serial |
| PLL | On-chip (per APEX II architecture) |
Guide de configuration des broches du EP2A40B724I-9 b724
Configuration des broches du EP2A40B724I-9 (boîtier b724). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP2A40B724I-9.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP2A40B724I-9 convient pour 6 applications: Telecommunications Line Cards, Network Switching Fabric and Routers, Industrial Automation and Control, Image and Video Processing Pipelines, ASIC Prototyping and Emulation, High-Speed Data Acquisition Front-Ends.
Telecommunications Line Cards
The EP2A40B724I-9 fits telecom line cards because it integrates approximately 40,000 logic elements, 655,360 embedded memory bits, and 540 user I/O pins on a single 724-ball BGA package. Telecom line cards require protocol bridging, packet header inspection, and per-port state-machine logic - all of which map efficiently to the APEX II LUT fabric and 16-bit-wide Embedded System Blocks. The industrial -40 C to +100 C operating range tolerates outdoor cabinet and unconditioned central-office environments. Compared to ASIC implementations, the EP2A40B724I-9 allows late-stage protocol updates via bitstream reload, valuable for multi-standard interfaces (T1/E1, Ethernet, SDH).
Recommandé
Network Switching Fabric and Routers
The EP2A40B724I-9 is well-suited to switching-fabric and router datapath designs that demand high I/O count and substantial on-chip buffering. With 540 user I/Os the device can drive parallel UTOPIA/SPI-3/POS-PHY interfaces at full width, and the 655,360 bits of ESB memory absorb packet-header lookups and FIFO stage storage without external SRAM. The on-chip PLL simplifies clock-domain crossing between line-rate clocks and backplane serials. Industrial-grade operation makes the EP2A40B724I-9 acceptable for outdoor router enclosures and hardened networking equipment.
Recommandé
Industrial Automation and Control
The EP2A40B724I-9 suits industrial automation controllers where reprogrammability, high I/O count, and -40 C to +100 C operation are mandatory. APEX II LUTs implement PLC scan logic, motion-control state machines, and fieldbus protocol interpreters (PROFIBUS, Modbus, EtherCAT). The 540 user I/Os interface directly to multi-axis servo drives, parallel encoder inputs, and digital I/O racks without external buffers. Compared to a microcontroller-only architecture, the EP2A40B724I-9's parallel datapath handles multi-axis trajectory generation deterministically, and bitstream reload supports field upgrades over the PLC's service interface.
Recommandé
Image and Video Processing Pipelines
The EP2A40B724I-9 is appropriate for image-processing pipelines where pixel-rate datapath and on-chip memory bandwidth dominate. The 655,360 bits of ESB memory serve as line buffers and frame-window RAM, while the 38400 logic cells support Sobel, FFT, and motion-estimation kernels in parallel. The 540 user I/Os accommodate parallel RGB/YCbCr video buses, BT.656, and Camera Link interfaces without external bus switching. Industrial-grade operation extends deployment into outdoor machine-vision, traffic-monitoring, and military imaging systems.
Recommandé
ASIC Prototyping and Emulation
The EP2A40B724I-9 is a typical FPGA target for ASIC prototyping where full RTL observability and incremental bring-up matter more than unit cost. Designers partition their ASIC RTL into LUT-friendly blocks, map them to APEX II logic, and use the 540 I/Os to expose internal probe points and ASIC boundary-scan chains. Compared to ASIC fabrication cycles, FPGA-based prototyping compresses verification from months to weeks. The industrial temperature range also supports at-speed validation in production-equivalent environmental chambers.
Recommandé
High-Speed Data Acquisition Front-Ends
The EP2A40B724I-9 fits high-speed data-acquisition front-ends where ADC/DAC digital back-ends, DMA engines, and protocol framing all converge. The 540 user I/Os accept parallel LVDS ADC/DAC buses, the 655,360 bits of ESB memory implement deep sample-rate FIFOs, and the on-chip PLLs retime ADC clocks and serialize links. Industrial-grade operation supports test-and-measurement chassis and field-deployable instrumentation. The bitstream-reload feature also allows the same PCB to host multiple firmware personalities for different acquisition modes.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2A40B724I-9 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2A40B724I-8 | EP2A40B724I-7 | EP2A40B724C9 | EP2A40B724CP |
|---|---|---|---|---|---|
| Package | 724-ball FCBGA (B724) | 724-ball FCBGA (B724) - same | 724-ball FCBGA (B724) - same | 724-ball FCBGA (B724) - same | 724-ball FCBGA (B724) - same |
| Brand | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 40,000 | 40,000 (same die) | 40,000 (same die) | 40,000 (same die) | 40,000 (same die) |
| Speed Grade | -9 (slowest) | -8 (one grade faster, ~10% Fmax up) | -7 (two grades faster, ~20% Fmax up) | -9 (same speed grade) | CP bin |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (same) | Industrial (same) | Commercial (0C to +85C) - NOT drop-in for cold-start | Commercial |
| Embedded Memory Bits | 655,360 | 655,360 (same die) | 655,360 (same die) | 655,360 (same die) | 655,360 (same die) |
| User I/O Pins | 540 | 540 | 540 | 540 | 540 |
| Lifecycle Status | NRND | NRND | NRND | NRND (Rochester stock) | NRND |
Principaux différenciateurs
- Full 540-I/O APEX II die on industrial temperature grade (vs EP2A40B724C9)
- Two speed-bin upgrade paths without PCB rework (vs EP2A40B724I-8 and EP2A40B724I-7)
- 655,360 bits ESB memory and 38400 logic cells on the high-pin-count APEX II die (vs EP2A25B724C9)
Notes de conception
Estimated: at full I/O utilization and high toggle rate, an APEX II EP2A40 device in the BGA-724 package can dissipate 2-4 W. With the manufacturer's typical theta_JA in the 14-20 C/W range (still air), junction temperature rise can exceed 60 C above ambient - leaving margin for the +100 C industrial ceiling is critical. Use a multi-layer PCB with continuous inner-plane thermal vias beneath the BGA and consider a thermal pad spreader. Always run a junction-temperature analysis using Altera PowerPlay early in the design.
The 724-ball FCBGA package requires 4-6 PCB layers with controlled-impedance routing for LVTTL/LVCMOS/PCI buses. Maintain matched trace lengths within each bus group (typically 50 mil tolerance for parallel buses at 100 MHz). Provide at least 4 thermal vias per BGA corner connected to inner ground planes. Decouple every power pin with a 0.1 uF ceramic plus a 10 uF bulk cap; place decoupling caps on the opposite side of the PCB directly under the BGA pads using via-in-pad to minimize loop inductance.
1) Do not assume newer Quartus Prime versions support APEX II - the last support is Quartus II 13.0sp1; modern Quartus Prime (15.0+) drops APEX II device support entirely. 2) The 'B724' suffix indicates 724-BGA, NOT 724 pins in a QFP - schematic symbol mistakes cause PCB rework. 3) Industrial (-40 C) parts require bias-graded warm-up to avoid condensation-induced leakage; commercial parts will fail at cold-start. 4) APEX II is NRND/EOL on Intel's roadmap - design with a Cyclone IV/V or Stratix migration path in mind.
Use SSTL Class I/II for DDR-interface speeds above 100 MHz, and LVDS via external bus transceivers for any point-to-point links exceeding 100 MHz. APEX II PLLs support output frequencies up to 300 MHz but practical Fmax for general fabric paths is lower; refer to APEX II timing-model .lib files for the -9 speed grade. Place clock buffers centrally and route clocks first to minimize skew; keep all clocks referenced to a single global clock network where possible.
Informations de conformité
RoHS/REACH/lead-free status not present in verified web data for EP2A40B724I-9 specifically; marked as unknown per Data Authenticity Rules. Industrial temperature grade (I suffix) is to -40 C/+100 C junction; AEC-Q100 (automotive) is not_applicable for this industrial-spec part. Rochester Electronics is listed as the authorized continuing-supply distributor for the EP2A40 family.
