EP2S15F672C3 - Stratix II FPGA 15K LE, 672-FBGA | Intel / Altera
Référence : EP2S15F672C3 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $224.4 | $224,40 |
| 10 | $198.5 | $1 985,00 |
| 100 | $175.2 | $17 520,00 |
| 500 | $156.8 | $78 400,00 |
| 1 000 | $142.3 | $142 300,00 |
EP2S15F672C3 Présentation
A field-programmable gate array (FPGA) is a reconfigurable integrated circuit whose logic resources, routing, and I/O cells can be programmed by the end user to implement custom digital functions, glue logic, DSP pipelines, or even complete processor subsystems. Stratix II devices sit in the hierarchy of programmable logic devices (PLD), and are designed for high-throughput parallel processing, high-speed serial connectivity, and large embedded memory footprints.
Key features of the EP2S15F672C3 include 156 18-bit x 18-bit dedicated multipliers, twelve global clock networks, up to twelve phase-locked loops (PLLs), and 366 maximum user I/O pins supporting multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The device also integrates high-speed transceivers in higher-density Stratix II variants, though the EP2S15 in the 672-pin package focuses on parallel I/O density. Adaptive logic modules (ALMs) are used instead of 4-input LUTs to improve logic efficiency.
The Stratix II architecture combines a TriMatrix memory hierarchy of three block RAM sizes (M512, M4K, M-RAM) to balance distributed and large memory needs, and supports the Nios II embedded soft processor for system-on-chip designs. The 90 nm process delivers maximum internal clock frequencies above 450 MHz, while the device is offered in commercial, industrial, and military temperature grades.
Typical applications include high-speed digital signal processing in communications infrastructure, video and image processing pipelines, prototyping of ASIC designs, industrial automation controllers, and military/aerospace embedded systems. The large logic capacity also makes the EP2S15 suitable for protocol bridging and high-performance bus interface aggregation.
When designing with this device, careful attention must be paid to power distribution network design because of the 1.2 V core current peaks, and to thermal management for hot-spot control in sealed enclosures. The 672-FBGA requires a multi-layer PCB with controlled-impedance traces and matched-length routing for LVDS pairs.
This page consolidates distributor pricing, drop-in same-package alternatives from the Stratix II family, and practical design notes that complement the manufacturer datasheet.
Alternatives de remplacement direct pour EP2S15F672C3 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2S15F672C3 (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Operating Temperature, Configuration Method, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP2S15F672C3N
✅ Remplacement direct✓ En stock
$142.75 / unité
Voir la fiche technique →EP2S15F672C4
✅ Remplacement direct✓ En stock
$235 / unité
Voir la fiche technique →EP2S15F672C5
✅ Remplacement direct✓ En stock
$199 / unité
Voir la fiche technique →EP2S15F672I4
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$365 / unité
Voir la fiche technique →EP2S15F672C4N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$195 / unité
Voir la fiche technique →EP2S15F672C5N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$121.9 / unité
Voir la fiche technique →EP2S15F672C3 Valeurs maximales et caractéristiques électriques
| Family | Stratix II |
| Logic Elements | 15,600 |
| Embedded Memory (bits) | 419,328 |
| DSP Blocks (18-bit multipliers) | 156 |
| Maximum User I/O | 366 |
| Core Voltage | 1.2 V |
| Process Technology | 90 nm CMOS |
| Boîtier | 672-ball FC-FBGA |
| Type de montage | Surface Mount |
| Operating Temperature Grade | Commercial (C3 suffix) |
| Speed Grade | C3 (third commercial speed bin) |
Guide de configuration des broches du EP2S15F672C3 672-ball fc-fbga
Configuration des broches du EP2S15F672C3 (boîtier 672-ball fc-fbga). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP2S15F672C3.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP2S15F672C3 convient pour 6 applications: Wireless Baseband DSP Processing, Video and Image Processing Pipelines, ASIC Prototyping and Emulation, Industrial Automation Controllers, Software-Defined Radio Baseband, Military and Aerospace Embedded Systems.
Wireless Baseband DSP Processing
The EP2S15F672C3 is well suited for wireless baseband DSP processing where 156 dedicated 18-bit x 18-bit hardware multipliers deliver the throughput needed for real-time FFT, channelization, and modulation pipelines. Its 419,328 bits of TriMatrix embedded memory provide on-chip buffering for sample streams without external SRAM, reducing system BOM. The 366 user I/O pins aggregate wide parallel data paths to ADCs and DACs while LVDS support enables direct connection to high-speed data converters.
Recommandé
Video and Image Processing Pipelines
For video and image processing, the EP2S15F672C3's 15,600 logic elements and 156 hardware multipliers can implement multi-tap filters, motion estimation, and JPEG/MPEG codecs in real time. The 1.2 V core and 90 nm process keep dynamic power manageable at high clock rates, while the 672-FBGA package exposes enough LVDS pairs for direct camera-sensor and HDMI/DVI interface bridging. The 419 Kbit embedded RAM is sufficient for line buffers in HD video pipelines.
Recommandé
ASIC Prototyping and Emulation
The EP2S15F672C3 serves as a mid-density ASIC prototyping and emulation vehicle, allowing validation of 1- to 2-million-gate designs before committing to mask production. The 366 user I/O pins provide enough connectivity for prototype daughter-card integration, and JTAG-based configuration simplifies incremental bring-up. The 156 hardware multipliers allow fast iteration on DSP-heavy ASIC architectures while preserving the same logic fabric as larger Stratix II variants.
Recommandé
Industrial Automation Controllers
In industrial automation, the EP2S15F672C3 hosts high-speed motion control loops, EtherCAT or Profibus interface logic, and deterministic state machines in a single device. The 12 I/O banks support mixed-voltage interfacing to 3.3 V, 2.5 V, and 1.8 V logic domains common in motor drives and PLC backplanes. Its 90 nm process and 1.2 V core deliver the reliability required for 24/7 factory-floor operation when paired with industrial-grade power and thermal design.
Recommandé
Software-Defined Radio Baseband
The EP2S15F672C3 is widely deployed in software-defined radio (SDR) baseband processing, where its 156 hardware multipliers execute FFT, FIR filtering, and channel equalization at sample rates above 100 MSPS. The 419,328-bit embedded RAM supports multiple buffer stages in the receiver chain, and the 366 user I/O pins aggregate digitized IF or baseband streams from multiple ADC channels. Stratix II's deterministic latency aids in meeting tight SDR timing budgets.
Recommandé
Military and Aerospace Embedded Systems
With its industrial and military temperature grade options (suffix I4, M3), the EP2S15F672C3 supports embedded avionics, signal intelligence, and ruggedized communications systems. The 672-FBGA package is ruggedized for vibration and thermal cycling environments when paired with underfill and proper PCB stiffener design. The 90 nm process and Stratix II fabric are well documented in defense COTS programs, simplifying qualification paperwork for new platforms.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2S15F672C3 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2S15F672C3N | EP2S15F672C4 | EP2S15F672C5 | EP2S15F672I4 | EP2S15F672C4N | EP2S15F672C5N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-ball FC-FBGA | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same |
| Logic Elements | 15,600 | 15,600 | 15,600 | 15,600 | 15,600 | 15,600 | 15,600 |
| Embedded Memory (bits) | 419,328 | 419,328 | 419,328 | 419,328 | 419,328 | 419,328 | 419,328 |
| Speed Grade | C3 (fastest commercial) | C3 | C4 (slower) | C5 (slowest) | I4 (industrial) | C4 | C5 |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Commercial | Commercial | Industrial (-40C to +100C) | Commercial | Commercial |
| Lead-Free / RoHS | Tin-lead (non-N) | Yes (Pb-free) | Tin-lead (non-N) | Tin-lead (non-N) | Tin-lead (non-N) | Yes (Pb-free) | Yes (Pb-free) |
| DSP Blocks | 156 | 156 | 156 | 156 | 156 | 156 | 156 |
Principaux différenciateurs
- Same die as C3 with RoHS-compliant Pb-free balls (vs EP2S15F672C3N)
- Lower-cost C4 speed grade on the same 672-FBGA footprint (vs EP2S15F672C4)
- Extended industrial temperature range on identical pinout (vs EP2S15F672I4)
Notes de conception
The EP2S15F672C3 requires a low-noise 1.2 V core supply capable of delivering transient currents above 3 A during logic toggling bursts. Intel recommends a buck regulator with at least 30 A peak capability for full utilization, paired with a pi-filter network of 22 uF bulk plus 0.1 uF and 10 nF ceramic decoupling on each VCCINT pin. Estimated at 50% toggle rate with 15,600 LE switching, the 90 nm core can draw 2-4 A continuous, so thermal vias under the BGA thermal pad are mandatory.
The 672-ball FC-FBGA requires a high-density PCB stack-up with microvia or via-in-pad construction for proper breakout. Each I/O bank should have its own reference voltage (VREF) plane to maintain signal integrity on SSTL/HSTL memory interfaces, and LVDS pairs must be routed with 100 ohm differential impedance and matched within 150 mil length. Decoupling capacitors should be placed on the BGA side opposite to the device to minimize loop inductance on the 1.2 V core.
Estimated: with 2 W typical core dissipation at room temperature, the 672-FBGA junction-to-ambient thermal resistance of approximately 12 C/W (with proper thermal vias and 1 oz copper) yields 24 C temperature rise. For hot-spot control in industrial designs where ambient can reach 70 C, add a heatsink or forced-air cooling to keep the junction below 100 C. Commercial-grade C3 silicon has a maximum junction of 125 C.
Configuration mode selection (AS, AP, PS, FPP, JTAG) must match the chosen configuration device and PCB layout; using passive serial (PS) mode without a proper MSEL[2:0] pull-up configuration is a common bring-up failure. The CONF_DONE and nSTATUS pins must each have a 10 kohm pull-up to 3.3 V to allow proper Quartus programmer handshaking. Reconfiguration after power glitches often requires a full POR cycle, so design the reset supervisor accordingly.
Informations de conformité
EP2S15F672C3 ships with tin-lead ball finish (non-N suffix). RoHS status not explicitly stated in verified web data - the EP2S15F672C3N variant is the RoHS-compliant alternative. AEC-Q100 not applicable for FPGAs.