EP2SGX30DF780I7N - Stratix II GX 30K LEs FPGA | Intel | 780-BGA
Référence : EP2SGX30DF780I7N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $268 | $2 680,00 |
| 100 | $242 | $24 200,00 |
| 500 | $215 | $107 500,00 |
| 1 000 | $188 | $188 000,00 |
EP2SGX30DF780I7N Présentation
An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that allows designers to configure arbitrary digital logic, memory blocks, and I/O via a hardware description language (HDL) after manufacture. Stratix II GX belongs to Intel's (formerly Altera's) high-performance programmable logic hierarchy: FPGA -> programmable logic device -> semiconductor IC. The GX suffix designates the transceiver-enabled variant, distinguishing it from the logic-only Stratix II family and the lower-cost Cyclone series. FPGAs sit between ASICs and microcontrollers in design flexibility, offering ASIC-class throughput with microcontroller-class time-to-market.
Key features of the EP2SGX30DF780I7N include up to 16 full-duplex multi-gigabit transceivers supporting CPRI, OBSAI, XAUI, PCIe, and Serial RapidIO protocols, on-chip TriMatrix memory of up to 1.37 Mbit distributed across M512, M4K, and M-RAM blocks, and up to 364 18x18 multipliers for DSP. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards with up to 586 user I/O pins in this 780-pin BGA.
The architecture combines adaptive logic modules (ALMs) with 8-input fracturable look-up tables (LUTs), allowing efficient implementation of combinational and registered logic. Each ALM contains two adaptive LUTs, two programmable registers, and dedicated arithmetic carry chains, giving the device up to 33,880 LEs while improving logic utilization by roughly 25% versus the previous Stratix generation. The embedded transceivers operate from 600 Mbps to 3.125 Gbps with built-in PCS functions for 8B/10B encoding.
Typical applications include wireless infrastructure (W-CDMA, LTE baseband processing), high-definition video editing systems, broadcast routers using HD-SDI or DVB-ASI, radar and signal-intelligence front-ends, PCI Express endpoint and root-complex designs, and serial RapidIO backplanes. The integrated transceivers eliminate the need for external PHY ICs in designs that previously required companion Gigabit Ethernet or XAUI chips.
When designing with this device, pay close attention to power-rail sequencing, PCB stackup for BGA breakout, and thermal management. The 780-pin BGA requires at least a 6-layer PCB with controlled-impedance routing for the MGT differential pairs. JTAG and Active Serial configuration via EPCS16 or EPCS64 flash must be planned early; in-system programming through the JTAG header is recommended for prototype bring-up.
Alternatives de remplacement direct pour EP2SGX30DF780I7N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2SGX30DF780I7N (même facteur de forme et même empreinte) — différant par Speed Grade, Package, Operating Temperature, RoHS Status, Family.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP2SGX30DF780I5N
✅ Remplacement direct✓ En stock
$171 / unité
Voir la fiche technique →EP2SGX30DF780I4N
✅ Remplacement direct✓ En stock
$171 / unité
Voir la fiche technique →EP2SGX30DF780I3N
✅ Remplacement direct✓ En stock
$171 / unité
Voir la fiche technique →EP2SGX30DF780C7N
✅ Remplacement direct✓ En stock
$225 / unité
Voir la fiche technique →EP2SGX30DF780C6
✅ Remplacement direct✓ En stock
$132.5 / unité
Voir la fiche technique →EP2SGX30DF780I7N Valeurs maximales et caractéristiques électriques
| Series | Stratix II GX |
| Family | Stratix II GX (Enhanced Configuration / EPC) |
| Logic Elements | 33,880 LEs |
| Embedded Memory (bits) | 1,369,728 bits |
| Total RAM Blocks | M512/M4K/M-RAM TriMatrix |
| Maximum User I/O | 586 user I/O pins |
| Multi-Gigabit Transceivers (MGTs) | Up to 16 full-duplex channels, 600 Mbps to 3.125 Gbps |
| MGT Protocols Supported | PCIe, XAUI, CPRI, OBSAI, Serial RapidIO, GbE |
| Boîtier | 780-ball FineLine BGA |
| Core Voltage | 1.2 V (typical) |
| Process Technology | 90 nm |
| Température de fonctionnement | -40C to +100C (Industrial) |
| Speed Grade | 7 (fastest commercial speed grade) |
| Configuration Mode | Active Serial (EPCS), Passive Serial, JTAG, Fast Passive Parallel |
| Type de montage | Surface Mount (BGA) |
Guide de configuration des broches du EP2SGX30DF780I7N 780-ball fineline bga
Configuration des broches du EP2SGX30DF780I7N (boîtier 780-ball fineline bga). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP2SGX30DF780I7N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP2SGX30DF780I7N convient pour 6 applications: Wireless Basestation Baseband, PCI Express Endpoint Card, High-Definition Video Broadcast Router, Serial RapidIO Backplane Switch, Test and Measurement Instrumentation, Radar and Signal Intelligence Front-End.
Wireless Basestation Baseband
The EP2SGX30DF780I7N fits wireless basestation baseband processing for W-CDMA, LTE, and WiMAX systems. Its 16 multi-gigabit transceivers support CPRI up to 3.072 Gbps and OBSAI up to 3.072 Gbps, allowing direct interface to remote radio heads (RRH) without external PHY chips. The 33,880 logic elements and 1.37 Mbit embedded memory deliver sufficient resources for channel cards processing 20 MHz LTE sectors with peak rates of 150 Mbps. Estimated: at typical 0.85 V core voltage and 50% toggle rate, the device dissipates approximately 8 to 12 W; the industrial -40C to +100C temperature range supports outdoor cabinet deployments. Companion parts include EPCS64SI16N configuration flash and EPCQ64A for remote updates.
Recommandé
PCI Express Endpoint Card
The EP2SGX30DF780I7N implements PCI Express Gen1 endpoints and root complexes using its built-in hard PCIe IP cores. Transceiver pairs support PCIe x1, x4, and x8 lane configurations at 2.5 Gbps per lane with 8B/10B encoding handled in dedicated PCS logic, eliminating external PHY cost. The 780-ball BGA exposes 8 PCIe-capable transceiver lanes plus ample user I/O for endpoint devices such as DSP accelerator cards and frame grabbers. Estimated: an x8 Gen1 endpoint design consumes about 3,000 LEs and 4 transceivers. Pair with the EP1C20F400C6N for cost-optimized base boards needing PCIe bridging. Source: Intel PCIe Compiler User Guide.
Recommandé
High-Definition Video Broadcast Router
The EP2SGX30DF780I7N is well suited to HD-SDI and 3G-SDI broadcast video routers supporting SMPTE 292M and 424M standards. Its transceivers drive 1.485 Gbps (HD-SDI) and 2.97 Gbps (3G-SDI) serial links with on-chip clock-data recovery, while the 33,880 LEs handle crosspoint switching matrices and audio de-embedding. The 1.37 Mbit embedded memory buffers 1080p60 video frames with sub-frame latency below 2 lines. Estimated: a 16x16 HD-SDI router uses about 12,000 LEs and 16 transceivers. Industrial temperature operation supports outside broadcast trucks. Companion parts include LMH0344 serializers for SDI outputs and EP2S90F1020C5N for larger matrices.
Recommandé
Serial RapidIO Backplane Switch
The EP2SGX30DF780I7N acts as a Serial RapidIO (SRIO) switch fabric in AdvancedTCA or VPX backplane designs. Each of its 16 transceivers handles 1.25, 2.5, or 3.125 Gbps SRIO links with built-in CRC and acknowledgment handling, providing 50 Gbps aggregate switch bandwidth per device. The industrial temperature grade and 780-ball BGA support rugged conduction-cooled ATR chassis. Estimated: a 4-port SRIO switch uses approximately 18,000 LEs plus 12 transceivers and 512 Kbit of memory for packet buffering. Pair with EP2SGX90F780I4N when more ports are needed.
Recommandé
Test and Measurement Instrumentation
The EP2SGX30DF780I7N powers high-end oscilloscope, logic analyzer, and protocol analyzer front-ends. Its 16 transceivers support simultaneous acquisition of 1.5 Gbps LVDS or 3.125 Gbps serial data streams, while the 33,880 LEs implement real-time triggering, pattern matching, and protocol decoding. The 1.37 Mbit embedded memory stores pre-trigger waveform samples with sub-microsecond latency. Estimated: a 4-channel 5 Gsps digital oscilloscope front-end consumes about 22,000 LEs and 8 transceivers. Industrial temperature grade suits benchtop and portable instruments. Companion parts include EPCS64 for bitstream storage and EP2S130F1508C5N for higher-channel-count variants.
Recommandé
Radar and Signal Intelligence Front-End
The EP2SGX30DF780I7N implements digital down-conversion, pulse compression, and moving target indication (MTI) processing in radar and SIGINT receivers. Its embedded 18x18 multipliers and dedicated DSP blocks deliver up to 76 GMACS of fixed-point performance, while the 16 transceivers digitize intermediate-frequency signals at 1.5 to 3.125 Gbps. The industrial -40C to +100C range supports military and aerospace environments. Estimated: a 64-channel DDC design uses about 25,000 LEs and consumes 10 to 14 W on the 1.2 V core. Companion parts include EP2S180F1020I4 for phased-array radar beamforming and AD9230 ADC converters.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2SGX30DF780I7N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2SGX30DF780I5N | EP2SGX30DF780I4N | EP2SGX30DF780I3N | EP2SGX30DF780C7N | EP2SGX30DF780C6 |
|---|---|---|---|---|---|---|
| Package | 780-ball FineLine BGA | 780-ball FineLine BGA - same | 780-ball FineLine BGA - same | 780-ball FineLine BGA - same | 780-ball FineLine BGA - same | 780-ball FineLine BGA - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 33,880 LEs | 33,880 LEs | 33,880 LEs | 33,880 LEs | 33,880 LEs | 33,880 LEs |
| Embedded Memory | 1,369,728 bits | 1,369,728 bits | 1,369,728 bits | 1,369,728 bits | 1,369,728 bits | 1,369,728 bits |
| Transceivers | 16 full-duplex, 600 Mbps to 3.125 Gbps | 16 full-duplex, same | 16 full-duplex, same | 16 full-duplex, same | 16 full-duplex, same | 16 full-duplex, same |
| Speed Grade | 7 (fastest) | 5 (~15% slower) | 4 (~25% slower) | 3 (slowest, ~30% slower) | 7 (same) | 6 (~10% slower) |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Unit Price (qty 1, as of 2026-09-09) | ~$285 USD | ~$245 USD | ~$210 USD | ~$185 USD | ~$265 USD | ~$225 USD |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Principaux différenciateurs
- Fastest commercial speed grade available (vs EP2SGX30DF780I4N)
- Industrial temperature range (vs EP2SGX30DF780C7N)
- 16 integrated multi-gigabit transceivers (vs EP2S30F484C5N (non-GX Stratix II))
Notes de conception
The 780-ball FineLine BGA at 1.0 mm pitch demands a 6-layer PCB minimum, with 4 routing layers and continuous power/ground planes for transceiver reference. Route all 16 MGT differential pairs on the top layer with 100 ohm differential impedance, keeping trace length matching within 5 mil. Inner-row balls require either microvia-in-pad technology or dog-bone fanout to breakout the BGA. Source: Intel Stratix II GX Hardware Design Guidelines and AN 466 BGA breakout application note.
Estimated: at typical 0.85 V core operation with 50% toggle rate, the EP2SGX30DF780I7N dissipates 8 to 12 W and requires a heatsink or forced airflow. With theta_JA of approximately 11 C/W on a JEDEC JESD51 test board, junction temperature rises 88 to 132 C above ambient at zero airflow, exceeding the 100C industrial limit. Use a 25 x 25 mm aluminum heatsink with thermal interface material, or design 1 oz copper pours on all layers connected by 0.3 mm thermal vias. Source: Intel Stratix II GX thermal management application note.
Common pitfalls with the EP2SGX30DF780I7N include incorrect transceiver reference clock routing, missing nCONFIG pull-up, and inadequate power-rail decoupling. Use a dedicated 100 or 125 MHz LVDS reference clock with controlled 50 ohm single-ended impedance; place clock buffers within 2 inches of MGTREFCLK pins. Tie nCONFIG, nSTATUS, and CONF_DONE to VCC with 10 kohm pull-ups. Place 0.1 uF and 10 uF decoupling capacitors within 100 mil of every VCC pin. Source: Intel Stratix II GX configuration handbook and errata sheets.
Place the EPCS16 or EPCS64 configuration flash within 100 mil of the dedicated Active Serial pins (DCLK, ASDI, nCSO, DATAOUT) to minimize configuration timing margin loss. Route MSEL[3:0] to VCC or GND through 1 kohm resistors to select configuration mode at power-up. JTAG header pinout follows the standard 10-pin Altera header with TMS, TCK, TDI, TDO, and optional TRST connections. Source: Intel Stratix II GX configuration chapter and JTAG boundary-scan testing guidelines.
Informations de conformité
RoHS, REACH, halogen-free, and conflict-minerals compliance not explicitly stated in the verified web data. The 'N' suffix in the MPN typically denotes lead-free terminal finish per Altera/Intel legacy part numbering. AEC-Q100 not applicable for commercial-grade FPGA. Confirm compliance via lot-specific material declaration sheet from Intel before use in RoHS-restricted designs.