EP2SGX90FF1152 - 90K LE Stratix II GX FPGA, 1152-BGA | Altera
Référence : EP2SGX90FF1152 ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1850 | $1 850,00 |
| 10 | $1750 | $17 500,00 |
| 100 | $1650 | $165 000,00 |
| 500 | $1525 | $762 500,00 |
| 1 000 | $1425 | $1 425 000,00 |
EP2SGX90FF1152 Présentation
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit based on a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. Within the IC hierarchy, an FPGA sits below Application-Specific Integrated Circuits (ASICs) but above general-purpose microcontrollers in terms of performance and flexibility. The Stratix II GX family specifically targets high-speed serial connectivity by embedding dedicated transceiver hard IP blocks alongside the programmable fabric.
Key features of the EP2SGX90FF1152 include 4,548 Logic Array Blocks (LABs), 4,520,448 RAM bits, embedded multiplier blocks (18x18), and adaptive logic modules (ALMs) per LAB. The device supports multiple I/O standards including LVDS, LVCMOS, LVTTL, and HSTL/SSTL for memory interfacing. Transceivers operate up to 6.375 Gbps, supporting protocols such as PCI Express, Serial RapidIO, XAUI, and Gigabit Ethernet without external PHY devices.
Architecturally, the Stratix II GX employs a true 8-input fracturable ALM structure that improves logic packing density over the previous Stratix generation. Embedded transceivers use hard PCS (Physical Coding Sublayer) blocks with on-chip PLLs and clock-data recovery, reducing FPGA fabric usage for serial protocols. The 1.2 V core voltage with dedicated transceiver supply rails is typical for the 90 nm process node used in this family.
Typical applications include high-end telecommunications line cards, high-speed data acquisition systems, digital video broadcasting equipment, and wireline backplane designs. The combination of transceivers, abundant memory, and high logic capacity also suits it for ASIC prototyping and signal processing subsystems.
When designing with this FPGA, ensure your PCB BGA layout supports the 1152-ball flip-chip package with proper microvia stack-up and matched-length transceiver routing. Decoupling must follow Altera's Stratix II GX pin connection guidelines, and configuration scheme selection (AS, PS, JTAG) should be finalized before PCB layout finalization.
This page consolidates distributor pricing, drop-in same-package alternatives from the Stratix II GX family, and practical design considerations beyond the datasheet to help engineers select and source this mature FPGA for long-lifecycle designs.
Alternatives de remplacement direct pour EP2SGX90FF1152 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2SGX90FF1152 (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Speed Grade, Family, Transceivers.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP2SGX90EF1152C4N
✅ Remplacement direct✓ En stock
$695 / unité
Voir la fiche technique →EP2SGX90EF1152C5N
✅ Remplacement direct✓ En stock
$1380 / unité
Voir la fiche technique →EP2SGX90EF1152I4N
✅ Remplacement direct✓ En stock
$1550 / unité
Voir la fiche technique →EP2SGX90EF1152C3N
✅ Remplacement direct✓ En stock
$1280 / unité
Voir la fiche technique →EP2SGX90EF1152I5N
✅ Remplacement direct✓ En stock
$1320 / unité
Voir la fiche technique →EP2SGX90FF1152C3
✅ Remplacement direct✓ En stock
$320 / unité
Voir la fiche technique →EP2SGX90FF1152 Valeurs maximales et caractéristiques électriques
| Series | Stratix II GX |
| Family | FPGA |
| Logic Elements (LE) | 90,960 |
| Logic Array Blocks (LABs) | 4,548 |
| Embedded Memory (RAM bits) | 4,520,448 |
| User I/Os | 558 |
| Transceivers | Up to 20 channels |
| Transceiver Data Rate | Up to 6.375 Gbps |
| Core Voltage | 1.2 V |
| Process Node | 90 nm |
| Boîtier | 1152-ball FC-FBGA (Flip-Chip) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
Guide de configuration des broches du EP2SGX90FF1152 1152-ball fc-fbga (flip-chip)
Configuration des broches du EP2SGX90FF1152 (boîtier 1152-ball fc-fbga (flip-chip)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP2SGX90FF1152.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP2SGX90FF1152 convient pour 6 applications: High-Speed Telecommunications Line Cards, ASIC Prototyping and Emulation, Digital Video Broadcasting Equipment, Wireline Backplane Aggregation, High-Speed Data Acquisition Systems, Military and Aerospace Signal Processing.
High-Speed Telecommunications Line Cards
The EP2SGX90FF1152's 20 embedded transceivers at up to 6.375 Gbps make it ideal for telecom line cards handling multi-protocol serial traffic. Its 90,960 logic elements and 4,520,448 RAM bits enable on-chip packet processing and buffering. Placed as the central fabric between framer/phy devices and network processor ASICs, it eliminates external glue logic. Trade-off: 90 nm process yields higher power per channel than modern 28 nm Stratix V, but lifecycle maturity suits telecom refresh cycles.
Recommandé
ASIC Prototyping and Emulation
The EP2SGX90FF1152's high logic capacity (90,960 LEs) and abundant interconnect make it well-suited to ASIC prototyping platforms. Engineers can partition large ASIC RTL into multiple FPGAs via the Stratix II GX native multi-FPGA partitioning flow. The 4,520,448 embedded RAM bits provide ample trace memory for debug. Unlike ASICs, the prototype is fully re-programmable, enabling fast iteration. Trade-off: ASIC frequency is 3-5x faster than FPGA prototypes, so timing closure requires careful synthesis constraints.
Recommandé
Digital Video Broadcasting Equipment
The EP2SGX90FF1152 supports HD-SDI and 3G-SDI serial video interfaces via its embedded transceivers at 1.485 Gbps and 2.97 Gbps respectively. Its DSP blocks accelerate video processing functions such as scaling, de-interlacing, and color space conversion. The 558 user I/Os allow direct connection to DDR2 memory and video ADCs/DACs. Placed as the central video pipeline processor, it eliminates multiple ASSPs. Trade-off: video processing latency is deterministic but higher than purpose-built video SoCs.
Recommandé
Wireline Backplane Aggregation
The EP2SGX90FF1152's transceivers support XAUI (4x3.125 Gbps), Serial RapidIO, and PCIe Gen1/Gen2 for wireline backplane aggregation across ATCA or AdvancedMC shelves. The hard PCS implements 8b/10b encoding without consuming fabric logic, freeing LEs for switching and queuing functions. 4,520,448 RAM bits provide packet buffering at line rate. Trade-off: backplane routing requires careful signal integrity design; consult the Stratix II GX board design guidelines.
Recommandé
High-Speed Data Acquisition Systems
The EP2SGX90FF1152's transceivers connect directly to high-speed ADCs and DACs via JESD204B (subclass support depends on soft IP) or LVDS interfaces. The embedded 18x18 multipliers and DSP blocks accelerate FFT, FIR, and digital down-conversion in software-defined radio pipelines. 558 I/Os allow direct parallel LVDS ADC connection up to 1 Gsps. Placed between the analog front-end and host processor, it performs real-time DSP. Trade-off: 90 nm static power is higher than modern 28/20 nm FPGAs.
Recommandé
Military and Aerospace Signal Processing
The EP2SGX90FF1152 (industrial temperature grade variants) is suitable for military and aerospace signal processing subsystems including radar, electronic warfare, and satellite communications. Its transceivers handle high-speed data links to RF converters, and abundant logic supports beamforming and channelization algorithms. Long lifecycle support makes it suited to programs with 10-15 year deployment horizons. Trade-off: full MIL-PRF screening is not available; commercial/industrial grade only.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2SGX90FF1152 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2SGX90EF1152C4N | EP2SGX90EF1152C5N | EP2SGX90EF1152I4N | EP2SGX90EF1152C3N | EP2SGX90EF1152I5N |
|---|---|---|---|---|---|---|
| Package | 1152-ball FC-FBGA | 1152-ball FC-FBGA - same | 1152-ball FC-FBGA - same | 1152-ball FC-FBGA - same | 1152-ball FC-FBGA - same | 1152-ball FC-FBGA - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 90,960 | 90,960 | 90,960 | 90,960 | 90,960 | 90,960 |
| Embedded Memory (RAM bits) | 4,520,448 | 4,520,448 | 4,520,448 | 4,520,448 | 4,520,448 | 4,520,448 |
| User I/Os | 558 | 558 | 558 | 558 | 558 | 558 |
| Speed Grade | unspecified (default) | C4 (mid) | C5 (fast) | I4 (industrial) | C3 (slow) | I5 (industrial fast) |
| Temperature Grade | unspecified (default commercial) | Commercial | Commercial | Industrial | Commercial | Industrial |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
| Transceiver Channels | Up to 20 | Up to 20 | Up to 20 | Up to 20 | Up to 20 | Up to 20 |
| Transceiver Max Data Rate | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps |
Principaux différenciateurs
- Drop-in compatible speed grade and temperature options (vs EP2SGX90EF1152C4N)
- Industrial temperature range availability in same package (vs EP2SGX90EF1152I4N)
- Six available drop-in speed/temperature bins for supply flexibility (vs EP2SGX90EF1152C5N)
Notes de conception
The 1152-ball FC-FBGA package requires high-density PCB interconnect with microvia stack-up (typically 8-12 layers). Use 0.4mm or 0.5mm pitch BGA escape routing with via-in-pad or dog-bone fanout. Maintain 50 ohm controlled impedance for transceiver channels and matched-length routing within the tolerances specified in the Stratix II GX Device Handbook. Decoupling requires dozens of 0.1 uF and 10 uF ceramic capacitors placed as close to power balls as possible to suppress transient current demand during logic switching.
Estimated: Stratix II GX devices at 90 nm have core current of several amps at 1.2 V plus separate transceiver and I/O supply rails. Use a multi-rail power distribution network with bulk decoupling on each rail and follow Altera's power distribution network (PDN) design guidelines. Include power-on-reset sequencing to ensure proper rail ramp order and avoid latch-up. Estimated total power dissipation under typical utilization can reach 10-20 W, requiring thermal management.
Transceiver channels operating at 6.375 Gbps require pre-emphasis and equalization configuration. Use the Altera Quartus II Transceiver Toolkit to characterize channel performance and tune pre-emphasis, VOD (voltage output differential), and receiver CTLE settings. Reference clock jitter must be below the value specified in the Stratix II GX datasheet for the chosen protocol. Maintain 100 ohm differential impedance on transceiver pairs with matched P/N lengths within 150 mil.
Do not leave unused transceiver channels floating - tie per the Stratix II GX pin connection guidelines. Configuration mode (AS/PS/JTAG) must be selected via MSEL pins and matches the chosen configuration device (e.g., EPCS64). Avoid using I/O standards without checking voltage compatibility with bank VCCIO supplies. When migrating from other FPGA families, recompile all RTL in Quartus II; do not assume bitstream compatibility.
Informations de conformité
RoHS compliant per Altera/Intel product page. AEC-Q100 not applicable for FPGAs. Halogen-free status not explicitly stated in the verified web data.
